Electronic component inspection apparatus

CN224608982UActive Publication Date: 2026-08-07SUZHOU JIERUISI INTELLIGENT TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU JIERUISI INTELLIGENT TECH CO LTD
Filing Date
2025-06-25
Publication Date
2026-08-07

AI Technical Summary

Technical Problem

然而,这种检测方式存在明显的效率瓶颈:由于需要依次触发多个相机拍摄,并等待图像处理和拼接,单次检测耗时较长,难以满足现代生产线高速节拍的需求

Benefits of technology

[0017] In summary, the electronic component testing equipment of this utility model, by setting up a first rotating module and a second rotating module, can simultaneously test different surfaces of multiple test components during the transmission of the test components, thereby improving testing efficiency.

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Patent Text Reader

Abstract

The utility model discloses an electronic component detection equipment carries out detection to the six surfaces of the component to be measured. Electronic component detection equipment includes: first rotation module, equal angle is provided with a plurality of first detection station, and each first detection station on first rotation module is provided with a first fixture respectively, second rotation module, equal angle is provided with a plurality of second detection station, and each second detection station on second rotation module is provided with a second fixture respectively, wherein, one first detection station of first rotation module, second detection station of second rotation module coincides and is provided, and the outside of first detection station, second detection station is provided with a plurality of visual inspection components. The utility model electronic component detection equipment is through setting first rotation module and second rotation module, can detect the different surface of a plurality of components to be measured simultaneously in the process of conveying the component to be measured, improves detection efficiency.
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Description

Technical Field

[0001] This utility model belongs to the field of testing equipment, and in particular relates to an electronic component testing device. Background Technology

[0002] In the production of electronic components, surface defect detection is a crucial step in ensuring product quality. Currently, detection equipment typically uses multiple fixed industrial cameras to capture images of a stationary electronic component from different angles. However, this method has a significant efficiency bottleneck: because it requires sequentially triggering multiple cameras to capture images and waiting for image processing and stitching, a single inspection takes a long time, making it difficult to meet the high-speed requirements of modern production lines. Utility Model Content

[0003] The purpose of this invention is to provide an electronic component testing device that improves testing efficiency.

[0004] To achieve the above objectives, the electronic component testing equipment of this utility model includes:

[0005] The first rotating module has multiple first detection stations set at equal angles, and each first detection station on the first rotating module is respectively equipped with a first fixture.

[0006] The second rotating module has multiple second detection stations set at equal angles, and each second detection station on the second rotating module is respectively equipped with a second fixture.

[0007] In this configuration, the first detection station and the second detection station of the first rotation module and the second rotation module are arranged to overlap, and multiple visual inspection components are arranged on the outside of the first detection station and the second detection station.

[0008] In one embodiment of the electronic component testing equipment of this utility model, the first clamp fixes the component to be tested from below, and the second clamp fixes the component to be tested from above.

[0009] In one embodiment of the electronic component testing equipment of this utility model, the first fixture of the first rotating module is driven to rotate 90 degrees every time it changes position.

[0010] In one embodiment of the electronic component testing equipment of this utility model, the plurality of first testing stations are set to at least eight, namely, feeding station, pressing station, first surface testing station, top surface testing station, second surface testing station, third surface testing station, fourth surface testing station, and transfer station.

[0011] In one embodiment of the electronic component testing equipment of this utility model, a first inclined surface testing position is provided between the third surface testing position and the fourth surface testing position, and a second inclined surface testing position is provided between the fourth surface testing position and the material transfer position.

[0012] In one embodiment of the electronic component testing equipment of this utility model, at least four second testing stations are provided, namely, a material transfer station, a bottom surface testing station, a defective product unloading station, and a good product unloading station.

[0013] In one embodiment of the electronic component testing equipment of this utility model, a lead wire bending detection position and an inner lead wire detection position are provided between the material transfer position and the bottom surface detection position, and an outer lead wire detection position is provided between the bottom surface detection position and the defective product unloading position.

[0014] In one embodiment of the electronic component testing equipment of this utility model, the defective product unloading station can be set to multiple locations.

[0015] In one embodiment of the electronic component testing equipment of this utility model, the visual inspection components of the first surface inspection position, the second surface inspection position, the third surface inspection position, the fourth surface inspection position, the first inclined surface inspection position, and the second inclined surface inspection position are respectively disposed on the outside of the first rotating module, and the visual inspection component of the top surface inspection position is disposed above the first rotating module.

[0016] In one embodiment of the electronic component testing equipment of this utility model, the visual inspection components of the lead bending detection position, the inner lead detection position, and the outer lead detection position are respectively disposed on the outside of the second rotating module, and the visual inspection component of the bottom surface detection position is disposed below the second rotating module.

[0017] In summary, the electronic component testing equipment of this utility model, by setting up a first rotating module and a second rotating module, can simultaneously test different surfaces of multiple test components during the transmission of the test components, thereby improving testing efficiency. Attached Figure Description

[0018] Figure 1 This is a top view of an embodiment of the present utility model;

[0019] Figure 2 This is a structural diagram of an embodiment of the present utility model;

[0020] In the diagram: 100, First rotating module; 110, First inspection station; 111, Loading station; 112, Pressing station; 113, First surface inspection station; 114, Top surface inspection station; 115, Second surface inspection station; 116, Third surface inspection station; 117, Fourth surface inspection station; 118, Transfer station; 119, First inclined surface inspection station; 1191, Second inclined surface inspection station; 120, First clamp; 130, Pressing module; 140, Curved plate; 200. Second rotating module; 210, second inspection station; 211, bottom surface inspection station; 212, defective product unloading station; 213, good product unloading station; 214, lead wire bending inspection station; 215, inner lead wire inspection station; 216, outer lead wire inspection station; 220, second clamp; 221, guide rod; 222, mechanical spring; 230, downward pressure cylinder; 300, vision inspection component; 310, camera; 320, light source; 400, worktable; 410, mounting bracket. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0022] This invention discloses an electronic component testing device for inspecting the outer surface of electronic components. In this embodiment, the electronic component includes a main body and leads. Defects on six surfaces of the main body and the leads need to be inspected. The six surfaces of the main body include a first surface and a second surface, a third surface and a fourth surface, and a top surface and a bottom surface, all arranged opposite each other. In other embodiments, defects on only six surfaces of the electronic component may be inspected, depending on the actual condition of the electronic component.

[0023] like Figure 1As shown in the figure, in one embodiment of the present invention, the electronic component testing equipment includes two rotating modules, namely a first rotating module 100 and a second rotating module 200, which can be driven to rotate and sequentially pass the component under test through multiple visual inspection components 300 for appearance inspection. The two rotating modules are staggered in height, so that the component under test can be transferred from the first rotating module 100 to the second rotating module 200. The first rotating module 100 has multiple first inspection stations 110 arranged at equal angles. Each first inspection station 110 on the first rotating module 100 is provided with a first clamp 120, which fixes the component under test from below. The second rotating module 200 has multiple second inspection stations 210 arranged at equal angles. Each second inspection station 210 on the second rotating module 200 is provided with a second clamp 220, which fixes the component under test from above. The first inspection station 110 and the second inspection station 210 of the first rotation module 100 and the second rotation module 200 are arranged to overlap, allowing the component under test to be transferred from the first fixture 120 to the second fixture 220 via the overlapping first inspection station 110 and second inspection station 210. Multiple vision inspection components 300 are provided on the outer side of both the first inspection station 110 and the second inspection station 210, for sequentially inspecting the component under test during repositioning. This arrangement not only allows for more rational placement of the multiple vision inspection components but also enables precise inspection of different surfaces of the component under test. Furthermore, the first rotation module 100 and the second rotation module 200 can simultaneously transport and inspect multiple components under test, improving inspection efficiency.

[0024] Each time the first rotating module 100 changes position, the first fixture 120 is driven to rotate 90 degrees, thereby causing the component under test to rotate around its own axis. While revolving around the center of the first rotating module 100, the component under test can rotate around its own axis, so that different surfaces of the component under test can face the outside of the first rotating module 100. Multiple vision inspection components 300 can be placed on the outside of the first rotating module 100 to avoid space constraints or interference between the vision inspection components 300 and the first rotating module 100.

[0025] At least eight first inspection stations 110 are configured, namely, loading station 111, pressing station 112, first surface inspection station 113, top surface inspection station 114, second surface inspection station 115, third surface inspection station 116, fourth surface inspection station 117, and transfer station 118. Each first inspection station 110 is fixed in position relative to the first rotating module 100; only the first clamp 120 rotates with the first rotating module 100, changing position to a different first inspection station 110. Loading station 111 is used to receive the component under test; pressing station 112 is used to position the component under test; first surface inspection station 113, top surface inspection station 114, second surface inspection station 115, third surface inspection station 116, and fourth surface inspection station 117 are used to inspect five different surfaces of the component under test, respectively. The transfer station 118 coincides with the second detection station 210 of one of the second rotating modules 200, and is used to transfer the component to be tested from the first rotating module 100 to the second rotating module 200. Since the second clamp 220 fixes the component to be tested from above, the component to be tested is detected on the bottom surface under the drive of the second rotating module 200.

[0026] At least four second inspection stations 210 are configured, namely a transfer station 118, a bottom surface inspection station 211, a defective product unloading station 212, and a good product unloading station 213. Each second inspection station 210 is fixed in position relative to the second rotating module 200; only the second fixture 220 rotates with the second rotating module 200, moving to different second inspection stations 210. The transfer station 118 is an overlapping inspection station of the first rotating module 100 and the second rotating module 200, used to receive the component under test transferred from the first rotating module 100; the bottom surface inspection station 211 is used to inspect the bottom surface of the component under test; the defective product unloading station 212 and the good product unloading station 213 are used to unload defective and good products, respectively.

[0027] In this embodiment, there are 12 first inspection stations 110 and 12 second inspection stations 210. The first rotation module 100, the second rotation module 200, and the first fixture 120 are all driven to rotate clockwise. This not only adapts to the production cycle, but also adds multiple other first inspection stations 110 and second inspection stations to improve inspection accuracy and classify defective products for unloading.

[0028] A first inclined detection position 119 is provided between the third detection position 116 and the fourth detection position 117, and a second inclined detection position 1191 is provided between the fourth detection position 117 and the transfer position 118. The other two first detection positions 110 after the transfer position 118 of the first rotating module 100 are empty.

[0029] The loading position 111 is used to receive the component under test (DUT). A loading robot (not shown in the figure) loads the DUT onto the first clamp 120 of the loading position 111. The first clamp 120 holds the lead wire of the DUT. A pressing position 112, located above the first clamp 120, is provided with a pressing module 130. The pressing module 130 is used to press the DUT firmly against the first clamp 120 from above to prevent the DUT from being improperly clamped and causing testing errors. The visual inspection components 300 of the first surface inspection position 113, the second surface inspection position 115, the third surface inspection position 116, the fourth surface inspection position 117, the first inclined surface inspection position 119, and the second inclined surface inspection position 1191 are respectively disposed on the outside of the first rotating module 100. Since the component under test can rotate around its own axis while revolving around the center of the first rotating module 100, the aforementioned multiple visual inspection components 300 can respectively correspond to the first surface, second surface, third surface, fourth surface, first edge, and second edge of the component under test. Since the visual inspection components 300 are all facing the surface to be inspected when the surface is defective, some defects cannot be identified. The visual inspection components 300 of the first inclined surface inspection position 119 and the second inclined surface inspection position 1191 inspect the surface of the component under test from the first edge and the second edge, and inspect the surface of the component under test from the inclined direction, which can detect defects that cannot be identified when facing the inspection surface directly, thereby improving the inspection quality. The visual inspection component 300 of the top surface inspection position 114 is located above the first rotating module 100 and is capable of detecting defects on the top surface of the component under test.

[0030] Between the transfer station 118 and the bottom detection station 211, there is an empty material station, a lead wire bending detection station 214, and an inner lead wire detection station 215. Between the bottom detection station 211 and the defective product unloading station 212, there is an outer lead wire detection station 216.

[0031] The vision inspection components for lead wire bending detection position 214, inner lead wire detection position 215, and outer lead wire detection position 216 are respectively located on the outside of the second rotating module 200. The next station after the material transfer position 118 of the second rotating module 200 is set as an empty material position to facilitate the setting of the vision inspection component for lead wire bending detection position 214 and avoid overcrowding.

[0032] Since the second clamp 220 of the second rotating module 200 cannot rotate, cameras need to be positioned from different directions to inspect the inner and outer surfaces of the lead wire. The second clamp 220 fixes the component under test from above, facilitating the placement of the camera on the lower inner side of the second rotating module 200. The visual inspection components 300 of both the inner lead wire detection position 215 and the outer lead wire detection position 216 include a camera 310 and a light source 320. The camera 310 of the inner lead wire detection position 215 is positioned on the lower inner side of the second rotating module 200, and the light source 320 of the inner lead wire detection position 215 is positioned on the outer side of the second rotating module 200. The camera 310 of the outer lead wire detection position 216 is positioned on the outer side of the second rotating module 200, and the light source 320 of the outer lead wire detection position 216 is positioned on the lower inner side of the second rotating module 200.

[0033] The visual inspection component 300 of the bottom surface inspection position 211 is located below the second rotating module 200 and can detect defects on the bottom surface of the component under test.

[0034] The defective product unloading position 212 can be set to multiple positions, and the products are unloaded according to the type of defect. In this embodiment, there are five defective product unloading positions 212, which are located between the external lead detection position 216 and the good product unloading position 213. The good products that have passed the inspection are finally unloaded from the good product unloading position 213.

[0035] like Figure 2 As shown, since multiple vision inspection components 300 are arranged in a ring on the outside of the first rotating module 100, in order to prevent other components from interfering with the inspection when multiple vision inspection components 300 are inspecting the component under test, an arc plate 140 is provided on the first rotating module 100 between the first surface inspection position 113 and the transfer position 118.

[0036] The first rotating module 100 is disposed on the upper surface of the worktable 400, and the second rotating module 200 is supported by the mounting bracket 410 and mounted on the worktable 400. The first rotating module 100 and the second rotating module 200 are staggered so that the second clamp 220 at the transfer position 118 can pick up the component to be tested from above the first clamp 120. Multiple second clamps 220 are slidably mounted on the second rotating module 200 by guide rods 221 and mechanical springs 222. The mounting bracket 410 is provided with a pressing cylinder 230 at the transfer position 118. At the transfer position 118, the pressing cylinder 230 drives the second clamps 220 to press down and pick up the component to be tested from the first clamp 120.

[0037] Refer again Figure 1 As shown, the working process of the electronic component testing equipment in this embodiment is as follows:

[0038] The first clamp 120 at loading position 111 receives the component under test;

[0039] The first rotating module 100 rotates and changes position, the first clamp 120 rotates to the pressing position 112, and at the same time, the first clamp 120 rotates 90 degrees, and the pressing module 130 presses down and positions the component to be tested.

[0040] The first rotating module 100 rotates and changes position, the first clamp 120 rotates to the first surface detection position 113, and at the same time, the first clamp 120 rotates 90 degrees, so that the first surface of the component under test faces the vision detection component 300, and detects and records the defects.

[0041] The first rotating module 100 rotates and changes position, the first clamp 120 rotates to the top surface detection position 114, and at the same time, the first clamp 120 rotates 90 degrees, and the vision detection component 300 above the component under test detects and records the defects on the top surface.

[0042] The first rotating module 100 rotates and changes position, the first clamp 120 rotates to the second surface detection position 115, and at the same time, the first clamp 120 rotates 90 degrees, so that the second surface of the component under test faces the vision detection component 300, detects defects and records them;

[0043] The first rotating module 100 rotates and changes position, the first clamp 120 rotates to the third surface detection position 116, and at the same time, the first clamp 120 rotates 90 degrees, so that the third surface of the component under test faces the vision detection component 300, detects defects and records them;

[0044] The first rotating module 100 rotates and changes position, the first clamp 120 rotates to the first inclined detection position 119, and at the same time, the first clamp 120 rotates 90 degrees, so that the first edge of the component under test faces the vision detection component 300, and the oblique detection defect is recorded.

[0045] The first rotating module 100 rotates and changes position, the first clamp 120 rotates to the fourth surface detection position 117, and at the same time, the first clamp 120 rotates 90 degrees, so that the fourth surface of the component under test faces the vision detection component 300, and detects and records the defects.

[0046] The first rotating module 100 rotates and changes position, the first clamp 120 rotates to the second inclined detection position 1191, and at the same time, the first clamp 120 rotates 90 degrees, so that the second edge of the component under test faces the vision detection component 300, and the oblique detection defect is recorded.

[0047] The first rotating module 100 rotates and changes position, the first clamp 120 rotates to the transfer position 118, and at the same time, the first clamp 120 rotates 90 degrees, and the second clamp 220 of the second rotating module 200 picks up the component to be tested at the transfer position 118.

[0048] The second rotating module 200 rotates and changes position, and the second clamp 220 rotates to the empty material position of the second rotating module 200;

[0049] The second rotating module 200 rotates and changes position, the second clamp 220 rotates to the lead wire bending detection position 214, and the vision inspection component 300 detects and records the defects of the lead wire.

[0050] The second rotating module 200 rotates and changes position, the second clamp 220 rotates to the inner lead detection position 215, and the vision inspection component 300 detects and records the defects on the lead surface near the spindle side of the second rotating module 200.

[0051] The second rotating module 200 rotates and changes position, the second fixture 220 rotates to the bottom surface detection position 211, and the vision inspection component 300 under the component under test detects and records the defects on the top surface.

[0052] The second rotating module 200 rotates and changes position, the second clamp 220 rotates to the outer lead detection position 216, and the vision inspection component 300 detects and records the defects on the lead surface on the side away from the spindle of the second rotating module 200.

[0053] The second rotating module 200 rotates and changes position, passing through five defective product unloading positions and one good product unloading position in sequence, and releases the test component according to the recorded status of the test component.

[0054] The above embodiments are merely preferred embodiments provided to fully illustrate the present utility model, and the protection scope of the present utility model is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present utility model are all within the protection scope of the present utility model. The protection scope of the present utility model is defined by the claims.

Claims

1. An electronic component testing device for testing six sides of the component to be tested, characterized in that, include: The first rotating module has multiple first detection stations set at equal angles, and each first detection station on the first rotating module is respectively equipped with a first fixture. The second rotating module has multiple second detection stations set at equal angles, and each second detection station on the second rotating module is respectively equipped with a second fixture. In this configuration, the first detection station and the second detection station of the first rotation module and the second rotation module are arranged to overlap, and multiple visual inspection components are arranged on the outside of the first detection station and the second detection station.

2. The electronic component testing equipment as described in claim 1, characterized in that, The first clamp holds the component under test from below, and the second clamp holds the component under test from above.

3. The electronic component testing equipment as described in claim 1, characterized in that, The first fixture is driven to rotate 90 degrees every time the first rotating module changes position to a different station.

4. The electronic component testing equipment as described in claim 1, characterized in that, The plurality of first inspection stations are set to at least eight, namely, loading station, pressing station, first surface inspection station, top surface inspection station, second surface inspection station, third surface inspection station, fourth surface inspection station, and transfer station.

5. The electronic component testing equipment as described in claim 4, characterized in that, A first inclined detection position is provided between the third detection position and the fourth detection position, and a second inclined detection position is provided between the fourth detection position and the material transfer position.

6. The electronic component testing equipment as described in claim 1, characterized in that, The number of the second inspection stations shall be set to at least four, namely, the material transfer station, the bottom inspection station, the defective product unloading station, and the good product unloading station.

7. The electronic component testing equipment as described in claim 6, characterized in that, A lead wire bending detection position and an inner lead wire detection position are provided between the material transfer position and the bottom surface detection position, and an outer lead wire detection position is provided between the bottom surface detection position and the defective product unloading position.

8. The electronic component testing equipment as described in claim 6, characterized in that, The defective product unloading point can be set to multiple.

9. The electronic component testing equipment as described in claim 5, characterized in that, The visual detection components of the first surface detection position, the second surface detection position, the third surface detection position, the fourth surface detection position, the first inclined surface detection position, and the second inclined surface detection position are respectively disposed on the outside of the first rotating module, and the visual detection component of the top surface detection position is disposed above the first rotating module.

10. The electronic component testing equipment as described in claim 7, characterized in that, The visual detection components for the lead wire bending detection position, inner lead wire detection position, and outer lead wire detection position are respectively located on the outside of the second rotating module, and the visual detection component for the bottom surface detection position is located below the second rotating module.