A package inspection device for chip processing

Abstract

The utility model relates to chip packaging technical field, and disclose a kind of packaging detection device for chip processing, including electron microscope body, the bottom of electron microscope body is fixedly installed with bottom plate, the top both sides position of bottom plate is fixedly installed with horizontal carrier, and horizontal carrier is slidably installed with vertical carrier, vertical carrier is slidably installed with the loading plate of vertical carrier, the horizontal adjustment assembly including horizontal extension shaft and dial frame is set between two horizontal carriers, and the vertical adjustment assembly including extension shaft and dial plate is set on vertical carrier. The utility model is provided with horizontal adjustment assembly and vertical adjustment assembly, and operator will appear jam once when pulling dial frame, and once finished is reflected substrate column direction adjustment by jam, indicating that substrate vertical direction is once adjusted, when chip packaging detection, the distance of adjusting chip is limited in horizontal vertical direction, avoid the problem that moving distance excessively affects overall detection efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a packaging and testing device for chip processing. Background Technology

[0002] Chip packaging is the process of encapsulating exposed semiconductor wafers into individual devices using specific processes, which directly affects the chip's performance, reliability, and cost. Chips are typically interconnected with PCB circuitry via leads / solder balls. Multi-chip modules, on the other hand, integrate multiple unpackaged bare chips onto the same substrate, which are then packaged and soldered onto the PCB. When inspecting multi-chip modules after packaging, manual visual inspection is required first. During inspection, the substrate is manually placed on an electron microscope, and the substrate is magnified multiple times to observe packaging defects. However, because the microscope has a high magnification, even a small movement can affect the magnified position, making it difficult to adjust and align the position during inspection.

[0003] Therefore, we propose a packaging and testing device for chip processing. Utility Model Content

[0004] The present invention aims to solve the technical problems existing in the prior art and provide a packaging and testing device for chip processing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a chip processing packaging and testing device, comprising an electron microscope body, a base plate fixedly installed at the bottom of the electron microscope body, a transverse carrier fixedly installed on both sides of the top of the base plate, a longitudinal carrier slidably installed on the transverse carrier, a material carrier plate slidably installed on the longitudinal carrier, a transverse adjustment assembly including a transverse extension shaft and a lever is provided between the two transverse carriers, and a longitudinal adjustment assembly including an extension shaft and a lever is provided on the longitudinal carrier; The two transverse extension shafts are fixedly installed on the longitudinal frame at positions corresponding to the transverse frame on both sides. A lever is fixedly installed between the two transverse extension shafts. Two transverse partition shafts are fixedly installed on the side of the lever near the transverse frame. An installation box is fixedly installed on the side of the transverse frame near the lever. A locking component is provided inside the installation box. The longitudinal extension shaft is fixedly installed on one side of the carrier plate. A lever plate is fixedly installed on the end of the longitudinal extension shaft away from the carrier plate. A longitudinal partition shaft is fixedly installed on the lever plate. A mounting box is also fixedly installed on the side of the longitudinal carrier frame near the lever plate. A locking component is also provided inside the mounting box on the longitudinal carrier frame.

[0006] Preferably, an inner connecting plate is fixedly installed inside the material carrier plate, and scale lines are marked on the middle position of both the material carrier plate and the cross support frame.

[0007] Preferably, the horizontal dividing axis is provided with dividing openings evenly, and the vertical dividing axis is also provided with dividing openings evenly.

[0008] Preferably, the horizontal carrier has a mounting groove at one end near the lever, one end of the horizontal partition shaft extends into the inside of the mounting groove, the horizontal partition shaft is slidably mounted inside the mounting groove, the horizontal carrier has a notch, and the mounting box is fixedly mounted inside the notch.

[0009] Preferably, the longitudinal support frame is also provided with a mounting groove, one end of the longitudinal partition shaft extends into the interior of the mounting groove, the longitudinal partition shaft is slidably mounted inside the mounting groove, and the longitudinal support frame is also provided with a notch for mounting the mounting box.

[0010] Preferably, the locking assembly includes a separator ball that is slidably mounted inside the mounting box. A spring is fixedly mounted inside the mounting box, with one end of the spring fixedly connected to the separator ball.

[0011] Preferably, the locking assembly further includes a short sleeve shaft, which is fixedly installed inside the mounting box, and is sleeved with a separator ball and a spring.

[0012] This invention provides a chip packaging and inspection device, which has the following improvements and advantages compared with the prior art: By setting up a horizontal adjustment component and a vertical adjustment component, during chip packaging and inspection, the carrier plate and the inner plate limit the initial position of the substrate. During subsequent horizontal row direction adjustment and inspection, pulling the lever moves the horizontal separator axis, which compresses the separator balls during movement. When the separator balls switch and engage between adjacent separator openings, the operator will experience a pause when pulling the lever. This pause indicates that the substrate row direction adjustment is complete, signifying that the substrate horizontal direction adjustment is complete. Simultaneously, pulling the lever moves the vertical separator axis, which compresses the separator balls during movement. When the separator balls switch and engage between adjacent separator openings, the operator will experience a pause when pulling the lever. This pause indicates that the substrate column direction adjustment is complete, signifying that the substrate vertical direction adjustment is complete. During chip packaging and inspection, the chip adjustment distance is limited in both the horizontal and vertical directions, avoiding excessive movement distance that could affect overall inspection efficiency. Attached Figure Description

[0013] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0014] Figure 1 A schematic diagram of the structure of a chip processing packaging and testing device proposed in this utility model; Figure 2 A schematic diagram of the lateral adjustment component in a chip processing packaging and testing device proposed in this utility model; Figure 3 A schematic diagram of the longitudinal adjustment component in a chip processing packaging and testing device proposed in this utility model; Figure 4 A schematic diagram of the installation of the locking component in a chip processing packaging and testing device proposed in this utility model; Figure 5 for Figure 4 Enlarged diagram of point A in the middle.

[0015] Legend: 1. Electron microscope body; 2. Base plate; 3. Horizontal support frame; 4. Material carrier plate; 5. Inner plate; 6. Horizontal extension shaft; 7. Paddle; 8. Horizontal partition shaft; 9. Mounting box; 10. Partition opening; 11. Longitudinal support frame; 12. Longitudinal partition shaft; 13. Paddle; 14. Longitudinal extension shaft; 15. Partition ball; 16. Short sleeve shaft; 17. Spring. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] A packaging and inspection device for chip processing, such as Figure 1 - Figure 5As shown, the device includes an electron microscope body 1, with a base plate 2 fixedly mounted on its bottom. When inspecting chip packages, the substrate containing the packaged chip is placed on the base plate 2, and the electron microscope body 1 is used to observe and inspect pin defects, solder ball defects, delamination, and other defects of the chip. Horizontal carriers 3 are fixedly mounted on both sides of the top of the base plate 2, and are threadedly connected to the base plate 2 with bolts. A vertical carrier 11 is slidably mounted on the horizontal carrier 3, and a material carrier plate 4 is slidably mounted on the vertical carrier 11. An internal connecting plate 5 is fixedly mounted inside the material carrier plate 4. Scale lines are marked on the middle of both the material carrier plate 4 and the horizontal carrier 3. Initially, after the chip is placed on the internal connecting plate 5, it is necessary to ensure that the material carrier plate 4 and the horizontal carrier 3 are properly aligned. The scale lines on the chip are aligned. A horizontal adjustment component is provided between the two horizontal carriers 3. The horizontal adjustment component can limit the horizontal movement distance each time the chip moves horizontally, ensuring that the next row can be switched for observation and testing after one horizontal movement. A vertical adjustment component is provided on the vertical carrier 11. The vertical adjustment component can limit the adjustment distance each time the chip moves vertically, ensuring that the next column can be switched for observation and testing after one vertical movement. By providing a carrier plate 4, during chip packaging and testing, the carrier plate 4 and the inner plate 5 limit the substrate placement area, ensuring that the substrate placement position is accurate in the initial state. At the same time, the horizontal adjustment component and the vertical adjustment component can limit the movement distance of the substrate during chip testing, ensuring the adjustment effect.

[0018] Furthermore, the lateral adjustment assembly includes two lateral extension shafts 6, which are fixedly installed on the longitudinal support frame 11 at positions corresponding to the transverse support frame 3 on both sides. A lever 7 is fixedly installed between the two lateral extension shafts 6. Two lateral partition shafts 8 are fixedly installed on the side of the lever 7 near the transverse support frame 3. The lateral partition shafts 8 are fixedly installed on the lever 7 at positions corresponding to the transverse support frame 3. Partition openings 10 are evenly opened on the lateral partition shafts 8. The partition openings 10 are grooves with annular cross-sections. The number of partition openings 10 is corresponding to the number of rows on the substrate. A mounting groove is opened at one end of the transverse support frame 3 near the lever 7. One end of the lateral partition shaft 8 extends into the interior of the mounting groove. The lateral partition shaft 8 is slidably installed inside the mounting groove. A mounting box 9 is fixedly installed on the side of the transverse support frame 3 near the lever 7. A notch is opened on the transverse support frame 3. The mounting box 9 is fixedly installed inside the notch. A locking assembly is provided inside the mounting box 9. The locking assembly includes a partition ball 15. The partition ball 15 is slidably installed inside the mounting box 9. 5 is a spherical structure. The separator ball 15 can be inserted into the interior of the separator opening 10. A short sleeve shaft 16 is fixedly installed inside the mounting box 9. The short sleeve shaft 16 is sleeved with the separator ball 15. A spring 17 is fixedly installed inside the mounting box 9. The spring 17 is sleeved with the short sleeve shaft 16. One end of the spring 17 is fixedly connected to the separator ball 15. By setting a lateral adjustment component, during chip packaging inspection, the carrier plate 4 and the inner plate 5 limit the initial position of the substrate. During subsequent lateral row direction adjustment inspection, by pulling the lever 7, the lever 7 drives the horizontal separator shaft 8 to move. During the movement of the horizontal separator shaft 8, the separator ball 15 is squeezed. When the separator ball 15 switches between adjacent separator openings 10, the operator will experience a pause when pulling the lever 7. The pause indicates that the substrate row direction adjustment is completed once, indicating that the substrate lateral direction adjustment is completed once. During chip packaging inspection, the adjustment distance of the substrate in the lateral direction is limited to avoid the problem of excessive movement distance affecting the overall inspection efficiency.

[0019] Furthermore, the longitudinal adjustment assembly includes a longitudinal extension shaft 14, which is fixedly mounted on one side of the carrier plate 4. A lever 13 is fixedly mounted on the end of the longitudinal extension shaft 14 away from the carrier plate 4, and a longitudinal partition shaft 12 is fixedly mounted on the lever 13. The longitudinal carrier frame 11 also has a mounting groove, and one end of the longitudinal partition shaft 12 extends into the interior of the mounting groove. The longitudinal partition shaft 12 is slidably mounted inside the mounting groove. Partition openings 10 are also evenly distributed on the longitudinal partition shaft 12, and the number of partition openings 10 corresponds to the number of columns on the substrate. A mounting box 9 is also fixedly mounted on the side of the longitudinal carrier frame 11 near the lever 7. The longitudinal carrier frame 11 also has a recess for mounting the mounting box 9. The mounting box 9 also has a locking component inside; by setting a longitudinal adjustment component, the carrier plate 4 and the inner plate 5 limit the initial position of the chip. After the lateral adjustment is in place, when the longitudinal column direction adjustment is detected, by pulling the lever 13, the lever 13 drives the longitudinal partition shaft 12 to move. During the movement of the longitudinal partition shaft 12, the partition ball 15 is squeezed. When the partition ball 15 switches between adjacent partition openings 10, the operator will experience a pause when pulling the lever 7. The pause reflects that the substrate column direction adjustment is completed once, indicating that the substrate longitudinal direction adjustment is completed once. During chip packaging detection, the chip adjustment distance in the longitudinal direction is limited to avoid the problem of excessive movement distance affecting the overall detection efficiency.

[0020] The working principle of this utility model is as follows: When the chip is being tested, the substrate is placed on the inner plate 5, and the carrier plate 4 is moved until the scale line in the middle position is aligned with the scale line on the horizontal carrier 3. The electron microscope body 1 is then used to magnify and visually inspect the chip packaging. During testing, when a row direction switch is required, pull the lever 7. As the lever 7 moves, it causes the horizontal partition shaft 8 to slide on the horizontal carrier 3. When the horizontal partition shaft 8 slides, it presses the partition ball 15, and the partition ball 15 retracts into the mounting box 9. When switching to the next row of the substrate, the partition ball 15 simultaneously switches to the next partition opening 10 on the horizontal partition shaft 8. At this time, the partition ball 15 is stuck into the next partition opening 10 under the elastic force of the spring 17. At this time, the operator will experience a jam when pulling the lever 7, which indicates that the row switch has been completed once. When column direction switching is required, pull the lever 13. When the lever 13 moves, it causes the longitudinal partition shaft 12 to slide on the longitudinal carrier 11. When the longitudinal partition shaft 12 slides, it squeezes the partition ball 15. The partition ball 15 retracts into the mounting box 9. When switching to the next row of the substrate, the partition ball 15 simultaneously switches to the next partition opening 10 on the longitudinal partition shaft 12. At this time, the partition ball 15 is stuck into the next partition opening 10 under the elastic force of the spring 17. At this time, the operator will experience a jam when pulling the lever 7. This indicates that the column switching is completed once.

[0021] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A chip processing packaging and inspection device, comprising an electron microscope body (1), wherein a base plate (2) is fixedly mounted on the bottom of the electron microscope body (1), characterized in that: A horizontal support frame (3) is fixedly installed on both sides of the top of the base plate (2). A longitudinal support frame (11) is slidably installed on the horizontal support frame (3). A material plate (4) is slidably installed on the longitudinal support frame (11). A transverse adjustment assembly including a transverse extension shaft (6) and a lever (7) is provided between the two horizontal support frames (3). A longitudinal adjustment assembly including an extension shaft (14) and a lever (13) is provided on the longitudinal support frame (11). Two horizontal extension shafts (6) are fixedly installed on the longitudinal frame (11) at positions corresponding to the horizontal frame (3) on both sides. A lever (7) is fixedly installed between the two horizontal extension shafts (6). Two horizontal partition shafts (8) are fixedly installed on the side of the lever (7) near the horizontal frame (3). A mounting box (9) is fixedly installed on the side of the horizontal frame (3) near the lever (7). A locking component is provided inside the mounting box (9). The longitudinal extension shaft (14) is fixedly installed on one side of the material carrier plate (4). A lever plate (13) is fixedly installed on the end of the longitudinal extension shaft (14) away from the material carrier plate (4). A longitudinal partition shaft (12) is fixedly installed on the lever plate (13). A mounting box (9) is also fixedly installed on the side of the longitudinal frame (11) close to the lever (7). A locking component is also provided inside the mounting box (9) on the longitudinal frame (11).

2. The packaging and testing device for chip processing according to claim 1, characterized in that: The material carrier plate (4) is fixedly installed with an inner connecting plate (5). The material carrier plate (4) and the horizontal support frame (3) are marked with scale lines in the middle position.

3. The chip processing packaging and testing device according to claim 1, characterized in that: The horizontal dividing axis (8) is provided with evenly spaced dividing openings (10), and the vertical dividing axis (12) is also provided with evenly spaced dividing openings (10).

4. The packaging and testing device for chip processing according to claim 1, characterized in that: The horizontal support frame (3) has an installation groove at one end near the lever frame (7), and one end of the horizontal partition shaft (8) extends into the interior of the installation groove. The horizontal partition shaft (8) is slidably installed inside the installation groove. The horizontal support frame (3) has a notch, and the installation box (9) is fixedly installed inside the notch.

5. The packaging and testing device for chip processing according to claim 1, characterized in that: The longitudinal support frame (11) is also provided with an installation groove, and one end of the longitudinal partition shaft (12) extends into the interior of the installation groove. The longitudinal partition shaft (12) is slidably installed inside the installation groove. The longitudinal support frame (11) is also provided with a notch for installing the installation box (9).

6. The packaging and testing device for chip processing according to claim 1, characterized in that: The locking assembly includes a separator ball (15), which is slidably installed inside the mounting box (9). A spring (17) is fixedly installed inside the mounting box (9), and one end of the spring (17) is fixedly connected to the separator ball (15).

7. The chip processing packaging and testing device according to claim 6, characterized in that: The locking assembly also includes a short sleeve shaft (16), which is fixedly installed inside the mounting box (9). The short sleeve shaft (16) is sleeved with the separator ball (15), and the spring (17) is sleeved with the short sleeve shaft (16).

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