A test probe for reducing breakage of LED lamp beads

Abstract

The utility model relates to test probe technical field, concretely relates to a kind of test probe for reducing LED lamp pearl breakage, including four probe bases, four probe base bottom end middle part are uniformly fixed with base spring, it is characterized in that, four probe base top corner position are uniformly fixed with limit component, the probe end is set into telescopic elastic structure innovatively, buffer effect is played, reduce the force of probe and material contact, avoid the phenomenon that LED lamp pearl is caused breakage by heavy impact, simultaneously, when probe end and LED lamp pearl contact, the impact force generated by probe end and LED lamp pearl contact is buffered multiple times, avoid the phenomenon that the single buffering mechanism causes that buffering effect is not obvious, simultaneously, also guarantee the stability of moving direction in probe end buffering process, avoid the probe end to appear inclination to make the contact part of probe end and LED lamp pearl produce deviation collision, to avoid the condition of LED lamp pearl damage.

Description

Technical Field

[0001] This utility model relates to the field of test probe technology, and in particular to a test probe that reduces damage to LED beads. Background Technology

[0002] LED chips, with their advantages of energy saving and long lifespan, are widely used in lighting, display, and other fields. As market demand grows, their quality inspection becomes crucial, and test probes have become key tools for ensuring product performance. Early LED chip testing relied heavily on manual observation; operators checked the light emission after the circuit board was powered on, resulting in low efficiency, poor accuracy, and difficulty in accurately determining parameters such as light intensity and wavelength. The emergence of contact test probes improved some of these issues, but many shortcomings remain in practical applications. Circuit board displacement can easily damage the probes, and the probe tips are easily stuck together by encapsulation adhesive, leading to poor contact and affecting test accuracy. External light interference can also reduce measurement accuracy. Today, test probe technology is constantly evolving. Flexible micropillar array probe systems can gently conform to the wafer surface for precise measurements; other probes have improved lifespan and test accuracy through optimized structural design and improved materials, and supporting intelligent testing systems are also continuously being improved.

[0003] In application number 201620094460.X, a testing device for LED beads is disclosed. The device tests several rows of LED beads on the test plate by repeatedly contacting the test probe with the test plate on the sliding plate. This can effectively improve the efficiency of testing LED beads and reduce labor costs.

[0004] However, with existing test probes, since the LED beads are fixed on the nozzle, the test probes perform direct contact point testing. During the point testing process, due to wear of the moving parts of the probe or displacement of the LED bead, the metal probe may strike the LED bead, causing damage to the LED bead's colloid / leads. Utility Model Content

[0005] The purpose of this invention is to provide a test probe that reduces LED chip breakage. This invention solves the problem that with existing test probes, where the LED chip is fixed on the nozzle and the test probe performs direct contact testing, the metal probe may strike the LED chip during the testing process due to wear of the probe's moving parts or displacement of the LED chip, causing damage to the LED chip's colloid / leads.

[0006] To achieve the above objectives, this utility model provides a test probe for reducing LED bead breakage, comprising four probe bases, a base spring fixedly installed at the bottom center of each of the four probe bases, a limit component fixedly installed at the top corner of each of the four probe bases, a probe end fixedly connected to the top of each of the four probe bases through the limit component, and a limit post fixedly installed at the four corners of the bottom of each probe end.

[0007] Preferably, the limiting assembly includes a sliding column, a limiting ring, a fixed plate, a buffer spring, a connecting rod, a slider, a buffer pad, a limiting frame, and a fixed cylinder;

[0008] Each of the four probe bases has a fixed cylinder embedded at its top corner. A sliding column is embedded in the middle of the top of each fixed cylinder. A limit ring is fixedly sleeved on the top of the outer side of each sliding column. A fixed plate is fixedly welded to the bottom of each sliding column. A buffer spring is fixedly connected to the middle of the bottom of the fixed plate. A connecting rod is rotatably connected to the middle of each of the four sides of the fixed plate.

[0009] Preferably, a slider is rotatably connected to one end of the connecting rod, and buffer pads are fixedly bonded to both sides of the bottom end of the slider.

[0010] Preferably, a limit frame is fixedly installed at the position on the outer side of the slider corresponding to the top of the inner side of the fixed cylinder.

[0011] Preferably, the outer side of the limiting ring is slidably connected to the top of the inner side of the fixed cylinder, and one end of the buffer spring is fixedly connected to the bottom of the inner side of the fixed cylinder.

[0012] Preferably, when the buffer spring is in a relaxed state, the outer surface of the limiting ring fixedly sleeved on the outer top of the slide column can contact the inner top surface of the fixed cylinder.

[0013] Preferably, the slider is slidably connected to the inner side of the limiting frame, the outer side of the slider is slidably connected to the inner surface of the fixed cylinder, and one side surface of the slider is curved.

[0014] Preferably, the buffer pad is located directly above the bottom of the inner side of the limiting frame, and one side of the limiting frame is limited and connected to the outer surface of the slider.

[0015] Preferably, a limiting groove is formed inside the top of the probe base at the position corresponding to the limiting post.

[0016] Preferably, the limiting post is slidably connected to the inside of the limiting groove.

[0017] This invention provides a test probe for reducing LED chip breakage. It innovatively designs the probe tip as a telescopic elastic structure, which acts as a buffer, reducing the force of contact between the probe and the material. This prevents the LED chip from being damaged by strong impacts. Simultaneously, it can buffer the impact force generated when the probe tip contacts the LED chip multiple times, avoiding the ineffectiveness of a single buffer mechanism. Furthermore, it ensures the stability of the probe tip's movement direction during the buffering process, preventing tilting of the probe tip and offset collision at the contact point with the LED chip, thus avoiding damage to the LED chip. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0019] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model.

[0020] Figure 2 This is a schematic diagram of the installation structure of the limiting post according to an embodiment of the present utility model.

[0021] Figure 3 This is a schematic diagram of the limiting component structure according to an embodiment of the present utility model.

[0022] Figure 4 This is a schematic diagram of the buffer pad installation structure according to an embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of the limiting frame structure according to an embodiment of the present utility model.

[0024] 1. Probe base; 2. Base spring; 3. Limiting assembly; 301. Sliding column; 302. Limiting ring; 303. Fixing plate; 304. Buffer spring; 305. Connecting rod; 306. Sliding block; 307. Buffer pad; 308. Limiting frame; 309. Fixing cylinder; 4. Probe end; 5. Limiting post; 6. Limiting groove. Detailed Implementation

[0025] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0026] Please see Figures 1-5 As shown, a test probe for reducing LED chip breakage includes four probe bases 1. A base spring 2 is fixedly installed at the center of the bottom of each of the four probe bases 1. A limiting component 3 is fixedly installed at the corner of the top of each of the four probe bases 1. A probe end 4 is fixedly connected to the top of each of the four probe bases 1 through the limiting component 3. A limiting post 5 is fixedly installed at the four corners of the bottom of the probe end 4. A limiting groove 6 is formed inside the top of the probe base 1 corresponding to the position of the limiting post 5. The limiting post 5 is slidably connected to the inside of the limiting groove 6, which can limit the movement direction of the probe end 4.

[0027] The limiting assembly 3 includes a sliding column 301, a limiting ring 302, a fixed plate 303, a buffer spring 304, a connecting rod 305, a slider 306, a buffer pad 307, a limiting frame 308, and a fixed cylinder 309;

[0028] Each of the four probe bases 1 has a fixed cylinder 309 embedded and fixedly installed at its top corner. A sliding column 301 is slidably connected to the top center of each fixed cylinder 309, which limits the movement direction of the sliding column 301 and prevents positional deviation during movement. A limiting ring 302 is fixedly sleeved on the outer top of the sliding column 301. The outer side of the limiting ring 302 is slidably connected to the inner top of the fixed cylinder 309, which limits the movement distance of the limiting ring 302, thereby preventing separation between the sliding column 301 and the fixed cylinder 309. A fixed plate 303 is fixedly welded to the bottom of the 01. A buffer spring 304 is fixedly connected to the middle of the bottom of the fixed plate 303. One end of the buffer spring 304 is fixedly connected to the bottom of the inner side of the fixed cylinder 309. When the buffer spring 304 is relaxed, the outer surface of the limiting ring 302 fixedly sleeved on the top of the outer side of the slide column 301 can contact the top surface of the inner side of the fixed cylinder 309. In this way, the movement distance of the slide column 301 can be limited when the probe end 4 collides with the LED lamp bead. Connecting rods 305 are rotatably connected to the middle of the four sides of the fixed plate 303.

[0029] A slider 306 is rotatably connected to one end of the connecting rod 305. The outer side of the slider 306 is slidably connected to the inner surface of the fixed cylinder 309, and one side of the slider 306 is curved, so that one side of the slider 306 matches the inner surface of the fixed cylinder 309, avoiding the phenomenon of shaking during the movement of the slider 306. Buffer pads 307 are fixedly bonded to both sides of the bottom of the slider 306. The buffer pads 307 are located directly above the bottom of the inner side of the limiting frame 308, which can ensure that the buffer pads 307 and the inner side of the limiting frame 308 can buffer the force generated by the movement of the connecting rod 305 when they collide. Limiting frames 308 are fixedly installed on the top inner side of the fixed cylinder 309 at the position corresponding to the outer side of the slider 306. One side of the limiting frame 308 is limitedly connected to the outer surface of the slider 306, and the slider 306 is slidably connected to the inner side of the limiting frame 308, avoiding the phenomenon of positional deviation of the slider 306 when it moves, and ensuring the accuracy of the movement direction of the slider 306.

[0030] When the probe tip 4 contacts the LED bead, an impact force is generated. At this time, the limiting post 5, which is fixedly connected to the bottom of the probe tip 4, is slidably connected to the inner side of the limiting groove 6 opened inside the top of the probe base 1, which can limit the movement direction of the probe tip 4. During the movement of the probe tip 4, the bottom of the probe tip 4 is fixedly connected to the sliding post 301, which allows the position of the fixed plate 303 fixedly connected to the bottom of the sliding post 301 to move. During the movement of the fixed plate 303, the buffer spring 304 fixedly connected to the bottom of the fixed plate 303 acts elastically, and one end of the buffer spring 304 is fixedly connected to the bottom of the inner side of the fixed cylinder 309 to prevent the position of the buffer spring 304 from shifting when it deforms, thereby enabling the probe tip to move. When the probe tip 4 comes into contact with the LED bead, it generates an initial impact force, which is then buffered. Simultaneously, the fixed plate 303 is rotatably connected to the connecting rod 305 on all four sides, allowing the slider 306, which is rotatably connected to one end of the connecting rod 305, to move. During the movement of the slider 306, it is slidably connected to the inner side of the limiting frame 308, which limits the direction of movement of the slider 306. The buffer pad 307, which is fixedly bonded to the bottom of the slider 306, contacts the limiting frame 308. Under the elastic action of the buffer pad 307, it provides a secondary buffering treatment for the impact force generated when the probe tip 4 comes into contact with the LED bead, thereby preventing the LED bead from being damaged due to excessive impact force when the probe tip 4 comes into contact with the LED bead.

[0031] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A test probe for reducing LED chip breakage, comprising four probe bases, each of the four probe bases having a base spring fixedly installed at the center of its bottom end, characterized in that, Limiting components are fixedly installed at the top corners of the four probe bases, and probe ends are fixedly connected to the top of the four probe bases through the limiting components. Limiting posts are fixedly installed at the four corners of the bottom of the probe ends.

2. The test probe for reducing LED chip breakage as described in claim 1, characterized in that, The limiting assembly includes a sliding column, a limiting ring, a fixed plate, a buffer spring, a connecting rod, a slider, a buffer pad, a limiting frame, and a fixed cylinder; Each of the four probe bases has a fixed cylinder embedded at its top corner. A sliding column is embedded in the middle of the top of each fixed cylinder. A limit ring is fixedly sleeved on the top of the outer side of each sliding column. A fixed plate is fixedly welded to the bottom of each sliding column. A buffer spring is fixedly connected to the middle of the bottom of the fixed plate. A connecting rod is rotatably connected to the middle of each of the four sides of the fixed plate.

3. The test probe for reducing LED chip breakage as described in claim 2, characterized in that, One end of the connecting rod is rotatably connected to a slider, and buffer pads are fixedly glued to both sides of the bottom end of the slider.

4. The test probe for reducing LED chip breakage as described in claim 2, characterized in that, Limiting frames are fixedly installed at the top inner side of the fixed cylinder, corresponding to the outer side of the slider.

5. A test probe for reducing LED chip breakage as described in claim 2, characterized in that, The outer side of the limiting ring is slidably connected to the top of the inner side of the fixed cylinder, and one end of the buffer spring is fixedly connected to the bottom of the inner side of the fixed cylinder.

6. The test probe for reducing LED chip breakage as described in claim 2, characterized in that, When the buffer spring is in a relaxed state, the outer surface of the limiting ring fixedly sleeved on the outer top of the slide column can contact the inner top surface of the fixed cylinder.

7. The test probe for reducing LED chip breakage as described in claim 3, characterized in that, The slider is slidably connected to the inner side of the limiting frame, the outer side of the slider is slidably connected to the inner surface of the fixed cylinder, and one side of the slider surface is curved.

8. The test probe for reducing LED chip breakage as described in claim 3, characterized in that, The buffer pad is located directly above the bottom of the inner side of the limiting frame, and one side of the limiting frame is limited and connected to the outer surface of the slider.

9. The test probe for reducing LED chip breakage as described in claim 1, characterized in that, A limiting groove is provided inside the top of the probe base at the position corresponding to the limiting post.

10. A test probe for reducing LED chip breakage as described in claim 9, characterized in that, The limiting post is slidably connected to the inside of the limiting groove.

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