High frequency cantilever probe

Abstract

The utility model discloses high frequency cantilever type probe, including cantilever probe main part and reinforcing part, wherein the cantilever probe main part includes needle bar and needle tip of one-piece structure, the reinforcing part is made of easy welding material, the reinforcing part is circular ring structure, and is embedded in the tail end of needle bar, the reinforcing part is projected in needle bar outside, the reinforcing part's outer diameter size is greater than the welding hole inner diameter size of pad on substrate 1 / 10~1 / 8. The utility model discloses the design scheme of the tail end embedding of cantilever probe main part has the reinforcing part greater than the welding hole size, in the process of welding, can through the non-standard clamp and press the reinforcing part on the pad, can increase the binding force between reinforcing part and pad, and the problem of false welding does not appear in the process of welding, secondly, since the reinforcing part is also made of fluxing material, a firm welding spot can be formed after welding, and the welding is more stable and reliable.

Description

Technical Field

[0001] This utility model relates to the field of probe technology, and in particular to a high-frequency cantilever probe. Background Technology

[0002] High-frequency cantilever probes are precision contact probes specifically designed for high-frequency testing of semiconductor chips (such as RF chips, high-speed processors, and image sensor chips), and are a core component of chip test probe cards. In use, one end of the probe on the probe card directly contacts the PAD point on the product under test, while the other end is soldered to the PAD point on the PCB board. It connects to the testing device via an adapter on the PCB board, thus forming a pathway for testing. Due to the small overall size of the cantilever probe, assembling it onto the probe card is a highly precise manufacturing process.

[0003] The current common probe assembly method involves using a fixture to clamp the probe and assemble it onto the pre-reserved pads on the ceramic substrate. Then, welding equipment (such as laser welding equipment) is used for welding. After welding, other probes are assembled sequentially. During the welding process, the focused beam simultaneously irradiates the probe tip and the substrate pad, causing the local metal to melt and fuse instantly, forming a solder joint. However, in actual operation, it has been found that the connection between the probe tip and the pad is not tight enough when the probe is clamped to the corresponding solder hole position by the fixture, which easily leads to the problem of cold solder joints. Secondly, relying solely on the melting of the pad as the fixing part during the welding process also affects the strength of the weld position. Furthermore, during the clamping process, because the probe body is cylindrical, there may be a problem of probe body misalignment during clamping. This results in a large cumulative error in the flatness of the probe tip positions on both sides after welding multiple probes, making it difficult to achieve the required coplanarity among multiple probes, and the defect rate of the assembled probe card is relatively high.

[0004] Therefore, this application provides a high-frequency cantilever probe. Utility Model Content

[0005] This invention provides a high-frequency cantilever probe, which can solve the problem of insufficient welding strength between traditional probes and substrates.

[0006] This utility model provides a high-frequency cantilever probe, including a cantilever probe body and a reinforcing member; wherein the cantilever probe body includes a needle rod and a needle tip with an integrally formed structure, the reinforcing member is made of a solderable material, the reinforcing member has a circular structure and is embedded at the tail end of the needle rod, the reinforcing member protrudes out of the needle rod, and the outer diameter of the reinforcing member is 1 / 10 to 1 / 8 larger than the inner diameter of the solder hole of the pad on the substrate.

[0007] In a high-frequency cantilever probe according to one embodiment of the present invention, the reinforcing member is integrally formed with the needle rod as an insert in the mold, and the outer wall of the tail end of the needle rod is recessed inward to form an annular groove that satisfies the embedding of the reinforcing member.

[0008] In a high-frequency cantilever probe according to one embodiment of the present invention, the end of the reinforcement facing the needle tip is a frustum shape that is narrow at the front and wide at the back.

[0009] In a high-frequency cantilever probe according to an embodiment of the present invention, the outer diameter of the probe rod is the same as the inner diameter of the solder hole of the solder pad, and a guide platform is integrally provided on the tail end face of the probe rod. The guide platform is in the shape of a frustum that is wider at the front and narrower at the back, and the maximum outer diameter of the guide platform is the same as the inner diameter of the solder hole of the solder pad.

[0010] In a high-frequency cantilever probe according to one embodiment of the present invention, the outer wall of the probe bar is recessed inward to form at least one positioning groove, which corresponds to the positioning protrusion in the non-standard fixture.

[0011] In a high-frequency cantilever probe according to one embodiment of the present invention, the positioning groove is one of the following shapes: square, trapezoidal, polygonal, elliptical, and triangular.

[0012] In a high-frequency cantilever probe according to one embodiment of the present invention, an insulating component is provided on the outer wall of the probe shaft. The insulating component includes an insulating layer and an outer protective layer coated on the probe shaft from the inside to the outside.

[0013] In a high-frequency cantilever probe according to one embodiment of the present invention, the insulating layer is formed by coating with polyimide coating, and the outer protective layer is formed by coating with polyphenylsulfone coating.

[0014] In a high-frequency cantilever probe according to one embodiment of the present invention, the tip is a conical structure, and the diameter of the tip gradually decreases from the front end to the tail end.

[0015] In a high-frequency cantilever probe according to one embodiment of the present invention, the needle tip is bent at 95° to 105° relative to the needle rod.

[0016] The technical solution provided in this application embodiment may include the following beneficial effects: a reinforcement part larger than the weld hole size is embedded at the tail end of the cantilever probe body. During the welding process, the reinforcement part can be pressed against the solder pad by a non-standard fixture, which can increase the bonding force between the reinforcement part and the solder pad. It is not easy to have a cold solder joint during the welding process. Secondly, since the reinforcement part itself is also made of flux material, it can form a firm solder joint after welding, which is more stable and reliable after welding.

[0017] In addition, a positioning groove is reserved on the needle bar, and a positioning protrusion corresponding to the positioning groove is set on the non-standard fixture. During the clamping process, the positioning groove and the positioning protrusion can be inserted and positioned to achieve stable clamping of the cantilever probe body, ensuring that all probe tips are on the same plane, which can ensure the yield rate of probe card manufacturing.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a three-dimensional structural schematic diagram of a high-frequency cantilever probe provided in an embodiment of this application;

[0021] Figure 2 yes Figure 1 Enlarged structural diagram at point A;

[0022] Figure 3 This is a schematic diagram of the planar structure of a high-frequency cantilever probe provided in an embodiment of this application;

[0023] Figure 4 It is a simplified cross-sectional planar structural diagram of the needle bar and insulating components.

[0024] Figure 5 This is a partial cross-sectional planar structural diagram of the needle bar held by a non-standard fixture.

[0025] Figure 6 This is a partial cross-sectional planar structural diagram of the needle bar when it is assembled on the substrate. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0029] like Figures 1 to 6 As shown, this application provides a high-frequency cantilever probe, including a cantilever probe body 100 and a reinforcement 300; wherein the cantilever probe body 100 includes a needle bar 120 and a needle tip 110, which are integrally formed; the reinforcement 300 is made of a solderable material, the reinforcement 300 has a ring-shaped structure and is embedded in the tail end of the needle bar 120; the reinforcement 300 protrudes out of the needle bar 120; the outer diameter of the reinforcement 300 is 1 / 10 to 1 / 8 larger than the inner diameter of the solder hole of the pad 510 on the substrate 500.

[0030] After adopting the above technical solution, during the welding process, the reinforcement 300 can be pressed against the solder pad 510 by the non-standard fixture 400, which can increase the bonding force between the reinforcement 300 and the solder pad 510. The problem of cold solder joint is not easy to occur during the welding process. Secondly, since the reinforcement 300 itself is also made of flux material, it can form a firm solder joint after welding, making the welding more stable and reliable.

[0031] Specifically, the reinforcement component 300 can be made of tin-silver alloy, tin-copper alloy, etc., and there is no limitation here.

[0032] In one alternative implementation, please refer to Figure 2 and Figure 6As shown, the reinforcement 300 is integrally formed with the needle bar 120 in the mold as an insert. The outer wall of the tail end of the needle bar 120 is recessed inward to form an annular groove that satisfies the insertion of the reinforcement 300. The above design can ensure the bonding strength between the reinforcement 300 and the needle bar 120, and can also ensure the consistency of the thickness of the reinforcement 300 compared with the traditional electroplating method.

[0033] In addition, the annular groove formed after welding can also serve as an aid in relieving welding stress.

[0034] In one alternative implementation, please refer to Figure 2 As shown, the end of the reinforcement 300 facing the pin tip 110 is a frustum shape that is narrow at the front and wide at the back. The design of the reinforcement 300 shape can press against the pad 510 without increasing the overall thickness of the reinforcement 300 too much, making it easier to perform rapid soldering operations.

[0035] In one alternative implementation, please refer to Figure 2 As shown, the outer diameter of the needle bar 120 is the same as the inner diameter of the solder hole of the pad. The tail end face of the needle bar 120 is integrally provided with a guide platform 121. The guide platform 121 is a frustum shape that is wider at the front and narrower at the back. The maximum outer diameter of the guide platform 121 is the same as the inner diameter of the solder hole of the pad 510510. The shape of the guide platform 121 can facilitate the insertion of the end of the needle bar 120 into the solder hole and can play an auxiliary guiding role during insertion.

[0036] In one alternative implementation, please refer to Figure 1 and Figure 3 As shown, the outer wall of the needle bar 120 is recessed inward to form at least one positioning groove 122. The positioning groove 122 is reserved on the needle bar 120. The positioning groove 122 corresponds to the positioning protrusion 410 in the non-standard fixture 400. At the same time, the non-standard fixture 400 is provided with positioning protrusion 410 corresponding to the positioning groove 122. During the clamping process, the positioning groove 122 and the positioning protrusion 410 can be inserted and positioned to achieve stable clamping of the cantilever probe body 100, ensuring that all probe tips are on the same plane after welding, which can ensure the yield rate of probe card manufacturing.

[0037] It should be noted that the non-standard fixture 400 is similar to an electric gripper structure (which may be equipped with an industrial camera), and an additional robotic arm can be added to the end of the electric gripper to assist in the handling and clamping of the cantilever probe body 100.

[0038] Specifically, in this embodiment, the number of positioning grooves 122 is one. In other embodiments, there may be two, four, etc. When there are two, they can be symmetrically distributed at both ends of the non-standard fixture. This is not limited here.

[0039] In one optional embodiment, the positioning groove 122 is shaped as a square, trapezoid, polygon, ellipse, or triangle. With these shapes, after the positioning protrusion 410 is inserted into the positioning groove 122, there will be no self-rotation of the needle bar 120 relative to the positioning protrusion 410, further improving the stability after clamping. Of course, it is understood that in other embodiments, the positioning groove 122 may also adopt irregular shapes, etc., and this is not limited here.

[0040] In one alternative implementation, please refer to Figure 4 As shown, an insulating component 200 is provided on the outer wall of the needle bar 120. The insulating component 200 includes an insulating layer 220 and an outer protective layer 210 coated sequentially from the inside to the outside on the needle bar 120. The insulating layer 220 is formed by coating with polyimide paint, and the outer protective layer 210 is formed by coating with polyphenylsulfone paint. The outer protective layer 210 and the insulating layer 220 can play a role in protecting against signal interference. In addition, due to the material properties of the polyphenylsulfone paint itself, it can also play a certain role in corrosion prevention and wear resistance protection.

[0041] In an alternative embodiment, the needle tip 110 is bent at 95° to 105° relative to the needle bar 120.

[0042] In one alternative embodiment, the needle tip 110 has a conical structure, and the diameter of the needle tip 110 gradually decreases from the front end to the rear end. The conical structure of the needle tip 110 facilitates the crimping operation of the product PAD point.

[0043] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0044] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0045] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0046] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0047] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A high-frequency cantilever probe, characterized in that, The device includes a cantilever probe body and a reinforcing member; wherein the cantilever probe body includes a needle bar and a needle tip, which are integrally formed; the reinforcing member is made of a solderable material; the reinforcing member has a ring-shaped structure and is embedded at the tail end of the needle bar; the reinforcing member protrudes out of the needle bar; and the outer diameter of the reinforcing member is 1 / 10 to 1 / 8 larger than the inner diameter of the solder hole of the pad on the substrate.

2. The high-frequency cantilever probe according to claim 1, characterized in that, The reinforcing component is integrally formed with the needle bar as an insert in the mold, and the outer wall of the tail end of the needle bar is recessed inward to form an annular groove that allows the reinforcing component to be embedded.

3. The high-frequency cantilever probe according to claim 2, characterized in that, The end of the reinforcement facing the needle tip is a frustum shape, narrow at the front and wide at the back.

4. The high-frequency cantilever probe according to claim 3, characterized in that, The outer diameter of the needle bar is the same as the inner diameter of the solder hole of the solder pad. The tail end face of the needle bar is integrally provided with a guide platform. The guide platform is a frustum shape that is wider at the front and narrower at the back. The maximum outer diameter of the guide platform is the same as the inner diameter of the solder hole of the solder pad.

5. The high-frequency cantilever probe according to claim 1, characterized in that, The outer wall of the needle bar is recessed inward to form at least one positioning groove, which corresponds to the positioning protrusion in the non-standard fixture.

6. The high-frequency cantilever probe according to claim 5, characterized in that, The positioning groove is one of the following shapes: square, trapezoidal, polygonal, elliptical, and triangular.

7. The high-frequency cantilever probe according to claim 6, characterized in that, An insulating component is provided on the outer wall of the needle bar, the insulating component comprising an insulating layer and an outer protective layer coated sequentially from the inside to the outside on the needle bar.

8. The high-frequency cantilever probe according to claim 7, characterized in that, The insulating layer is formed by coating with polyimide paint, and the outer protective layer is formed by coating with polyphenylsulfone paint.

9. The high-frequency cantilever probe according to claim 1, characterized in that, The needle tip has a conical structure, and the diameter of the needle tip gradually decreases from the front end to the tail end.

10. The high-frequency cantilever probe according to claim 9, characterized in that, The needle tip is bent at 95°~105° relative to the needle shaft.

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