A copper bar pressure joint control management device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN YUANLICHUANG TECH CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-08-07
AI Technical Summary
[0004]本实用新型提供了一种铜排压接控制管理装置，以解决目前的功率半导体模块的老化测试设备无法保证功率半导体模块与铜排间的压接是否安全以及对其进行控制管理的问题
[0004] This invention provides a copper busbar crimping control and management device to solve the problem that current power semiconductor module aging test equipment cannot guarantee the safety of the crimping between the power semiconductor module and the copper busbar, nor can it control and manage it.
Smart Images
Figure CN224609225U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power semiconductor module testing technology, and in particular to a copper busbar crimping control and management device. Background Technology
[0002] Power semiconductor modules are modular products that combine and package power semiconductor devices (such as IGBTs, MOSFETs, thyristors, etc.) according to specific functions. Power semiconductor modules are not only widely used in general frequency inverters, uninterruptible power supplies, servo motor control, machine tools, elevators, etc., but also have an increasingly wide range of applications with the emergence of power electronic devices such as new energy electric vehicles, solar energy, wind power and fuel cell power generation systems.
[0003] To meet the performance and reliability testing requirements of power semiconductor modules, aging test equipment for power semiconductor modules has emerged. This equipment can simulate high-current aging under various operating conditions to screen power semiconductor modules during production. In particular, in copper busbar crimping testing, ensuring the safety of the crimping between the power semiconductor module and the copper busbar is crucial for controlling and managing the copper busbar crimping. Therefore, providing corresponding copper busbar crimping control and management devices for the high-current copper busbar crimping tests of power semiconductor module aging test equipment is indispensable. Utility Model Content
[0004] This invention provides a copper busbar crimping control and management device to solve the problem that current power semiconductor module aging test equipment cannot guarantee the safety of the crimping between the power semiconductor module and the copper busbar, nor can it control and manage it.
[0005] According to one aspect of the present invention, a copper busbar crimping control and management device is provided, including an industrial computer, a copper busbar crimping control module and a PLC controller, wherein the copper busbar crimping control module includes a conductive copper busbar.
[0006] The copper busbar crimping control module communicates with the PLC controller, which controls the crimping of the conductive copper busbar with the power semiconductor module.
[0007] The industrial computer is connected to both the copper busbar crimping control module and the PLC controller. The industrial computer is used to apply the required current to the conductive copper busbar crimped to the power semiconductor module. It is also used to obtain the temperature of the conductive copper busbar crimped to the power semiconductor module and generate a crimping abnormality signal based on the temperature. Based on the crimping abnormality signal, the PLC controller is used to control the conductive copper busbar to separate from the power semiconductor module.
[0008] Optionally, the copper busbar crimping control and management device may also include a motion mechanism;
[0009] The motion mechanism is connected to the copper busbar crimping control module and the PLC controller respectively, and is used to receive drive signals from the PLC controller and control the conductive copper busbar to crimp with the power semiconductor module.
[0010] Optionally, the PLC controller is used to receive the crimping abnormality signal transmitted by the industrial computer, and drive the motion mechanism to separate the conductive copper busbar from the power semiconductor module based on the crimping abnormality signal.
[0011] Optionally, the copper busbar crimping control and management device may also include a current drive board;
[0012] The current drive board is communicatively connected to the industrial control computer and electrically connected to the copper busbar crimping control module. It is used to apply the required current to the conductive copper busbar crimped to the power semiconductor module based on the required current corresponding to the conductive copper busbar crimped to the power semiconductor module as preset by the industrial control computer.
[0013] Optionally, the current drive board is also used to cut off the current applied to the conductive copper busbar when it receives a crimping abnormality signal transmitted by the industrial control computer.
[0014] Optionally, the copper busbar crimping control and management device may also include a temperature acquisition module;
[0015] The temperature acquisition module is connected to the industrial control computer to transmit the acquired temperature corresponding to the conductive copper busbar that is pressed against the power semiconductor module back to the industrial control computer.
[0016] Optionally, the copper busbar crimping control and management device may also include a communication module;
[0017] The communication module is connected to both the industrial control computer and the temperature acquisition module, and is used to send the temperature corresponding to the conductive copper busbar that is pressed against the power semiconductor module, which is acquired by the temperature acquisition module, to the industrial control computer.
[0018] Optionally, the copper busbar crimping control and management device may also include a cooling fan;
[0019] The cooling fan is located at the crimping point between the conductive copper busbar and the power semiconductor module. It is connected to the PLC controller to receive the cooling signal from the PLC controller and cool the crimping point.
[0020] Optionally, the copper busbar crimping control and management device may also include a display module;
[0021] The display module is electrically connected to the PLC controller and is used to display crimping abnormality information corresponding to the crimping abnormality signal.
[0022] Optionally, the copper busbar crimping control and management device may also include an alarm module;
[0023] The alarm module is electrically connected to the PLC controller and is used to generate corresponding crimping alarm information based on the crimping abnormality information.
[0024] The technical solution of this utility model embodiment includes a copper busbar crimping control and management device comprising an industrial computer, a copper busbar crimping control module, and a PLC controller. The copper busbar crimping control module includes a conductive copper busbar. The copper busbar crimping control module is communicatively connected to the PLC controller, which controls the conductive copper busbar to crimp with a power semiconductor module to achieve control of high-current copper busbar crimping tests. The industrial computer is communicatively connected to both the copper busbar crimping control module and the PLC controller. The industrial computer applies the required current to the conductive copper busbar crimped with the power semiconductor module to ensure that the power semiconductor module meets the required performance. It is also used to acquire the temperature corresponding to the conductive copper busbar crimped with the power semiconductor module and generate a crimping abnormality signal based on the temperature. Based on the crimping abnormality signal, the PLC controller controls the conductive copper busbar to separate from the power semiconductor module to ensure copper busbar crimping safety. In case of abnormality, it promptly notifies those skilled in the art and takes appropriate action to meet the safety standards required by the power semiconductor module, thereby achieving management of high-current copper busbar crimping tests.
[0025] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description
[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0027] Figure 1 This is a schematic diagram of the structure of a copper busbar crimping control and management device according to an embodiment of the present utility model;
[0028] Figure 2 This is a structural schematic diagram of a copper busbar crimping control and management device according to an embodiment of the present utility model. Detailed Implementation
[0029] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.
[0030] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a system, product, or device that includes units is not necessarily limited to those explicitly listed, but may include units not explicitly listed or inherent to such products or devices.
[0031] Figure 1 This utility model provides a schematic diagram of a copper busbar crimping control and management device. This embodiment is applicable to situations where copper busbar crimping control and management is implemented for high-current testing of power semiconductor modules.
[0032] like Figure 1 As shown, the copper busbar crimping control and management device includes an industrial computer 100, a copper busbar crimping control module 300, and a PLC controller 200. The copper busbar crimping control module 300 includes a conductive copper busbar 301.
[0033] The copper busbar crimping control module 300 is communicatively connected to the PLC controller 200. The PLC controller 200 is used to control the crimping of the conductive copper busbar 301 with the power semiconductor module 400.
[0034] The industrial computer 100 is communicatively connected to the copper busbar crimping control module 300 and the PLC controller 200. The industrial computer 100 is used to apply the required current to the conductive copper busbar 301 crimped to the power semiconductor module 400; it is also used to obtain the temperature corresponding to the conductive copper busbar 301 crimped to the power semiconductor module 400, and generate a crimping abnormality signal based on the temperature, so as to control the conductive copper busbar 301 to separate from the power semiconductor module 400 through the PLC controller 200 based on the crimping abnormality signal.
[0035] Among them, the conductive copper busbar 301 is a high-current conductive product. The bonding between the conductive copper busbar 301 and the power semiconductor module 400 can ensure the completion of high-current testing of the power semiconductor module 400.
[0036] The power semiconductor module 400 is a high-efficiency power electronic component that integrates and packages multiple power semiconductor devices according to a specific circuit topology. In this embodiment, the power semiconductor module 400 may be, but is not limited to, an IGBT module, which can be a copper busbar crimp control and management system for high-current testing of IGBT modules.
[0037] Specifically, during the crimping process between the conductive copper busbar 301 and the power semiconductor module 400, the PLC controller 200 sends a drive signal to the copper busbar crimping control module 300 to control the crimping of the conductive copper busbar 301 and the power semiconductor module 400. The specific form of the drive signal can be implemented by using existing drive circuits or control circuits configured in the PLC controller 200. This embodiment does not impose any restrictions on this.
[0038] Furthermore, after the conductive copper busbar 301 and the power semiconductor module 400 are pressed into place, the industrial control computer 100 can select and set the current required for testing the power semiconductor module 400 according to the need for high current testing of the power semiconductor module 400. The specific current value can be determined according to the high current testing requirements, and this embodiment does not impose any special restrictions on it.
[0039] As can be seen, the conductive copper busbar 301 and the power semiconductor module 400 are crimped together by crimping their corresponding terminals. The industrial control computer 100 obtains the temperature of the conductive copper busbar 301 crimped with the terminals of the power semiconductor module 400. Based on this temperature, it can determine whether there is an abnormality in the crimping. After determining that there is an abnormality in the crimping, the industrial control computer 100 generates a crimping abnormality signal. The crimping abnormality signal can be used to control the conductive copper busbar 301 and the power semiconductor module 400 to separate them using the PLC controller 200, so as to ensure the safety of the crimping between the conductive copper busbar 301 and the power semiconductor module 400.
[0040] It should be noted that the temperature is used to determine whether there is an abnormality in the crimping process. If the temperature exceeds the set temperature value, the crimping is considered abnormal, and the industrial control computer 100 generates a crimping abnormality signal. Conversely, if the temperature does not exceed the set temperature value, the crimping is considered normal. The set temperature value can be selected and set according to the actual crimping situation. This embodiment does not impose any special restrictions on the specific value of the set temperature.
[0041] See also Figure 1 and Figure 2 As shown above, in order to successfully complete the crimping of the conductive copper busbar 301 and the power semiconductor module 400, a motion mechanism 500 for controlling the crimping and separation of the two is required. Therefore, the copper busbar crimping control and management device also includes the motion mechanism 500. The motion mechanism 500 is connected to the copper busbar crimping control module 300 and the PLC controller 200 respectively, and is used to receive the drive signal from the PLC controller 200 and control the conductive copper busbar 301 and the power semiconductor module 400 to crimp.
[0042] The aforementioned motion mechanism 500 has the functions of pressing the conductive copper busbar 301 to the power semiconductor module 400 and separating the conductive copper busbar 301 from the power semiconductor module 400. The specific form and implementation means of the motion mechanism 500 are not limited here.
[0043] Based on the above, after receiving the drive signal from the PLC controller 200, the motion mechanism 500 causes the terminals of the conductive copper busbar 301 to be crimped with the terminals of the power semiconductor module 400.
[0044] Furthermore, after the industrial control computer 100 detects a crimping abnormality, in order to ensure crimping safety, the industrial control computer 100 transmits the crimping abnormality signal to the PLC controller 200 through the network switch. After receiving the crimping abnormality signal transmitted by the industrial control computer 100, the PLC controller 200 drives the motion mechanism 500 to separate the conductive copper busbar 301 from the power semiconductor module 400.
[0045] See also Figure 1 and Figure 2 As shown, based on the above, the copper busbar crimping control and management device also includes a current drive board 110; the current drive board 110 is communicatively connected to the industrial control computer 100 and electrically connected to the copper busbar crimping control module 300, and is used to apply the required current to the conductive copper busbar 301 crimped to the power semiconductor module 400 based on the required current corresponding to the crimped conductive copper busbar 301 crimped to the power semiconductor module 400 preset by the industrial control computer 100.
[0046] Specifically, after the conductive copper busbar 301 is pressed into place with the power semiconductor module 400, the current drive board 110 can output a constant current to the conductive copper busbar 301 pressed into the power semiconductor module 400, providing a stable large current to the conductive copper busbar 301.
[0047] Furthermore, after determining the crimping abnormality, in order to protect the power semiconductor module 400, the current applied to the conductive copper busbar 301 crimped to the power semiconductor module 400 is cut off. The industrial control computer 100 can transmit the crimping abnormality signal to the current drive board 110, so that the current drive board 110 can promptly cut off the current applied to the conductive copper busbar 301 upon receiving the crimping abnormality signal transmitted by the industrial control computer 100.
[0048] See also Figure 1 and Figure 2 As shown above, based on the temperature judgment to determine whether the crimping is safe, at least one temperature acquisition module 120 is required. Therefore, the copper busbar crimping control and management device also includes a temperature acquisition module 120. The temperature acquisition module 120 is communicatively connected to the industrial control computer 100 and is used to feed back the acquired temperature corresponding to the conductive copper busbar 301 crimped with the power semiconductor module 400 to the industrial control computer 100.
[0049] To save costs, this embodiment may use a temperature acquisition module 120 to acquire the temperature of the conductive copper busbar 301 that is pressed against the power semiconductor module 400. The temperature acquisition module 120 may, but is not limited to, use a current sensor or other current acquisition device to achieve its current acquisition function. This embodiment does not impose any restrictions on its specific functional module.
[0050] In this embodiment, the conductive copper busbar 301 is considered as a component. The temperature acquisition module 120 can acquire the temperature corresponding to the conductive copper busbar 301 that is pressed against the power semiconductor module 400. If we consider that the terminals of the conductive copper busbar 301 are pressed against the terminals of the power semiconductor module 400 in this embodiment, the temperature acquisition module 120 can acquire the temperature of any or each terminal of the conductive copper busbar 301.
[0051] Based on this, it should be noted that in this embodiment, the temperature is used to determine whether there is an abnormality in the crimping. This temperature can be the temperature of a certain conductive copper busbar 301 terminal, the temperature of the entire conductive copper busbar 301, or the average value obtained after collecting the temperature of each conductive copper busbar 301 terminal. This embodiment does not impose any restrictions on this.
[0052] See also Figure 1 and Figure 2 As shown, based on the above, the copper busbar crimping control and management device also includes a communication module 130; the communication module 130 is connected to the industrial control computer 100 and the temperature acquisition module 120 respectively, and is used to send the temperature of the conductive copper busbar 301 crimped with the power semiconductor module 400, which is acquired by the temperature acquisition module 120, to the industrial control computer 100.
[0053] The communication module 130 can be implemented by selecting a suitable communication card or device, taking into account the communication protocol between the industrial control computer 100 and the temperature acquisition module 120. Optionally, the communication module 130 can be a CAN communication card.
[0054] Specifically, the temperature of the conductive copper busbar 301 that is pressed against the power semiconductor module 400, collected by the temperature acquisition module 120, is sent to the industrial control computer 100 through the communication module 130 to ensure real-time transmission of temperature data, thereby enabling timely control and management of the copper busbar pressing and ensuring pressing safety.
[0055] See also Figure 2As shown, the communication connection between the current drive board 110 and the industrial control computer 100 can be achieved using the communication module 130. When the current drive board 110 is connected to the communication module 130, the industrial control computer 100 transmits the pre-set current corresponding to the conductive copper busbar 301 of the power semiconductor module 400 to the current drive board 110 through the communication module 130, thereby enabling the current drive board 110 to apply the required current to the conductive copper busbar 301 of the power semiconductor module 400.
[0056] See also Figure 1 and Figure 2 As shown above, in order to ensure the smooth connection between the conductive copper busbar 301 and the power semiconductor module 400, heat dissipation is required at the connection point. Therefore, the copper busbar connection control and management device also includes a cooling fan 210. The cooling fan 210 is located at the connection point between the conductive copper busbar 301 and the power semiconductor module 400, and is communicatively connected to the PLC controller 200. It is used to receive the heat dissipation signal of the connection point transmitted by the PLC controller 200 and to dissipate heat at the connection point.
[0057] The heat dissipation signal at the crimping position is used to start the cooling fan 210, so that the cooling fan 210 dissipates heat at the crimping position between the conductive copper busbar 301 and the power semiconductor module 400. Specifically, during the crimping process between the conductive copper busbar 301 and the power semiconductor module 400, the PLC controller 200 sends the heat dissipation signal at the crimping position to the cooling fan 210, so that the cooling fan 210 dissipates heat at the crimping position.
[0058] Based on the above, in order to ensure the normal operation of the cooling fan 210, the PLC controller 200 detects in real time whether the cooling fan 210 is stalled after starting the cooling fan 210. Specifically, it can be determined by whether the cooling fan 210 feeds back a stall signal. If the PLC controller 200 receives a stall signal from the cooling fan 210, it is considered that the cooling fan 210 is stalled and needs to be maintained by those skilled in the art in a timely manner. Otherwise, it is considered that the cooling fan 210 is working normally.
[0059] See also Figure 1 and Figure 2 As shown, based on the above, in order to facilitate those skilled in the art to promptly detect and handle crimping abnormalities after the control conductive copper busbar 301 is separated from the power semiconductor module 400, the copper busbar crimping control and management device also includes a display module 220; the display module 220 is electrically connected to the PLC controller 200 and is used to display crimping abnormality information corresponding to the crimping abnormality signal.
[0060] The abnormal crimping information may be, but is not limited to, an abnormal warning message, such as a brief word like "abnormal", or a more explicit message indicating that the crimping between the conductive copper busbar 301 and the power semiconductor module 400 is unsafe, or that there is an abnormality in the crimping between the conductive copper busbar 301 and the power semiconductor module 400. This embodiment does not impose any special restrictions on this.
[0061] The display module 220 may be, but is not limited to, a terminal device connected to the PLC controller 200. The terminal device may be an additional monitor, a computer, or a tablet. This embodiment does not impose any restrictions on this. Optionally, the display module 220 may be a human-machine interface.
[0062] Specifically, the display module 220 can display the crimping abnormality signal to those skilled in the art in real time so that they can handle it in a timely manner.
[0063] See also Figure 1 and Figure 2 As shown, based on the above, the copper busbar crimping control and management device also includes an alarm module 230; the alarm module 230 is electrically connected to the PLC controller 200 and is used to generate corresponding crimping alarm information based on crimping abnormal information.
[0064] The crimping alarm information is the information that activates the alarm module 230. The crimping alarm information is triggered by the sound and / or indicator lights of the alarm module 230.
[0065] The alarm module 230 can provide an alarm through sound and / or indicator lights. The alarm module 230 can be a buzzer to provide an audible warning, or a single-color or multi-color indicator light to provide an audible warning, or an indicator light with a buzzer to provide an audible warning and an illuminated indicator light to enhance the warning effect. This embodiment does not impose any special restrictions on this.
[0066] Optionally, the alarm module 230 can sound an alarm by emitting different volumes or frequencies of sound through a buzzer; for example, the indicator light can be a three-color light, that is, it can issue a warning by flashing or keeping three colors on.
[0067] The technical solution of this utility model embodiment includes a copper busbar crimping control and management device comprising an industrial computer, a copper busbar crimping control module, and a PLC controller. The copper busbar crimping control module includes a conductive copper busbar. The copper busbar crimping control module is communicatively connected to the PLC controller, which controls the crimping of the conductive copper busbar with the power semiconductor module. The industrial computer is communicatively connected to both the copper busbar crimping control module and the PLC controller. The industrial computer applies the required current to the conductive copper busbar crimped with the power semiconductor module. It also acquires the temperature corresponding to the conductive copper busbar crimped with the power semiconductor module and generates a crimping abnormality signal based on the temperature. Based on the crimping abnormality signal, the PLC controller controls the separation of the conductive copper busbar from the power semiconductor module. This utility model embodiment solves the problem that current aging test equipment for power semiconductor modules cannot guarantee the safety of the crimping between the power semiconductor module and the copper busbar, nor can it control and manage this connection. It achieves control and management of high-current copper busbar crimping tests, ensuring copper busbar crimping safety, and thus ensuring that the power semiconductor module meets the required performance and safety standards.
[0068] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.
Claims
1. A copper busbar crimping control and management device, characterized in that, It includes an industrial computer, a copper busbar crimping control module, and a PLC controller, wherein the copper busbar crimping control module includes conductive copper busbars; The copper busbar crimping control module is communicatively connected to the PLC controller, and the PLC controller is used to control the crimping of the conductive copper busbar with the power semiconductor module. The industrial control computer is communicatively connected to the copper busbar crimping control module and the PLC controller. The industrial control computer is used to apply the required current to the conductive copper busbar crimped to the power semiconductor module; it is also used to obtain the temperature corresponding to the conductive copper busbar crimped to the power semiconductor module, and generate a crimping abnormality signal based on the temperature, so as to control the conductive copper busbar to separate from the power semiconductor module through the PLC controller based on the crimping abnormality signal.
2. The copper busbar crimping control and management device according to claim 1, characterized in that, The copper busbar crimping control and management device also includes a motion mechanism; The motion mechanism is connected to the copper busbar crimping control module and the PLC controller respectively, and is used to receive the drive signal from the PLC controller and control the conductive copper busbar to crimp with the power semiconductor module.
3. The copper busbar crimping control and management device according to claim 2, characterized in that, The PLC controller is used to receive the crimping abnormality signal transmitted by the industrial computer, and drive the motion mechanism to separate the conductive copper busbar from the power semiconductor module based on the crimping abnormality signal.
4. The copper busbar crimping control and management device according to claim 1, characterized in that, The copper busbar crimping control and management device also includes a current drive board; The current drive board is communicatively connected to the industrial control computer and electrically connected to the copper busbar crimping control module. It is used to apply the required current to the conductive copper busbar crimped to the power semiconductor module based on the required current corresponding to the conductive copper busbar crimped to the power semiconductor module as preset by the industrial control computer.
5. The copper busbar crimping control and management device according to claim 4, characterized in that, The current drive board is also used to cut off the current applied to the conductive copper busbar when it receives the crimping abnormality signal transmitted by the industrial control computer.
6. The copper busbar crimping control and management device according to claim 1, characterized in that, The copper busbar crimping control and management device also includes a temperature acquisition module; The temperature acquisition module is connected to the industrial control computer and is used to feed back the acquired temperature corresponding to the conductive copper busbar that is pressed against the power semiconductor module to the industrial control computer.
7. The copper busbar crimping control and management device according to claim 6, characterized in that, The copper busbar crimping control and management device also includes a communication module; The communication module is connected to the industrial computer and the temperature acquisition module respectively, and is used to send the temperature of the conductive copper busbar that is pressed against the power semiconductor module, which is acquired by the temperature acquisition module, to the industrial computer.
8. The copper busbar crimping control and management device according to claim 1, characterized in that, The copper busbar crimping control and management device also includes a cooling fan; The cooling fan is located at the crimping point between the conductive copper busbar and the power semiconductor module, and is communicatively connected to the PLC controller. It is used to receive the cooling signal of the crimping point transmitted by the PLC controller and to cool the crimping point.
9. The copper busbar crimping control and management device according to claim 1, characterized in that, The copper busbar crimping control and management device also includes a display module; The display module is electrically connected to the PLC controller and is used to display crimping abnormality information corresponding to the crimping abnormality signal.
10. The copper busbar crimping control and management device according to claim 9, characterized in that, The copper busbar crimping control and management device also includes an alarm module; The alarm module is electrically connected to the PLC controller and is used to generate corresponding crimping alarm information based on the crimping abnormality information.