Electronic package

Abstract

An electronic package is designed with a support area on a carrier structure and an electronic component is disposed thereon. A circuit structure is formed on the electronic component and a support member is disposed in the support area. An optical communication component having a connecting section is disposed on the circuit structure such that the connecting section is located on the support area and the support member supports the connecting section. Thus, the connecting section of the optical communication component is prevented from being broken when the optical communication component is subjected to an external force caused by a cable being shaken or pulled.

Description

Technical Field

[0001] This application relates to a semiconductor packaging technology, and more particularly to an electronic package that can improve reliability. Background Technology

[0002] The application of fifth-generation (5G) communication technology has expanded to various fields, including the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. With the expansion of applications, a massive amount of data is generated that needs to be efficiently transmitted, processed, and stored. The demand for data transmission, in particular, has surged, leading industries to replace electricity with light as the data transmission medium to improve transmission capacity, efficiency, and distance, while reducing energy consumption. Against this backdrop, silicon photonics components and their applications, as well as co-packaged optics, have become the future trend in semiconductor and packaging technologies.

[0003] Therefore, the industry has developed an optical packaging structure that forms an optical module on a substrate. The optical module includes an electrically driven chip formed in the packaging structure and an optical chip attached to the packaging structure. It is then connected to a fiber optic array unit (FAU) via optical fiber so that optical signals can be transmitted to the optical module for communication.

[0004] Figure 1A This is a cross-sectional schematic diagram of a semiconductor package 1 for existing co-packaged optics. (See diagram below.) Figure 1A As shown, an electronic integrated circuit (EIC) element 11A, an electronic component 11B, and a photonic integrated circuit (PIC) element 12 bonded above the EIC element 11A are respectively disposed on the substrate 10 of the semiconductor package 1. One end of the photonic integrated circuit element 12 is connected to an optical fiber 70, and a shelf 13 is disposed below the junction of the photonic integrated circuit element 12 and the optical fiber 70.

[0005] In the aforementioned existing semiconductor package 1, the photonic integrated circuit element 12, in order to connect with the optical fiber 70, must have its end connected to the optical fiber 70 adjacent to or even protruding from the side of the substrate 10. However, although a support 13 is provided below the connection point, the support 13 is located outside the semiconductor package 1 and is suspended, lacking stable support, making its structure quite fragile. In this situation, when subjected to external forces such as shaking or pulling of the connected optical fiber 70, the area of ​​the photonic integrated circuit element 12 adjacent to its connection with the optical fiber 70 is easily damaged. Figure 1B The fractures shown generally result in reduced reliability and lifespan. Furthermore, because the photonic integrated circuit element 12 protrudes slightly from the substrate 10, the semiconductor package 1 may be damaged during manufacturing due to impacts or other reasons, thus reducing its process yield.

[0006] Therefore, overcoming the problems of the existing technologies mentioned above has become a pressing issue that the industry urgently needs to address. Utility Model Content

[0007] In view of the various deficiencies of the prior art, this application provides an electronic package, comprising: a carrier structure having a wiring layer defining a support area; an electronic component disposed on the carrier structure; a plurality of conductive pillars disposed on the carrier structure and electrically connected to the wiring layer; a cover layer disposed on the carrier structure to cover the electronic component and the conductive pillars, wherein the cover layer is not formed on the support area; a circuit structure disposed on the cover layer and electrically connecting the conductive pillars and the electronic component; a support member disposed on the support area of ​​the carrier structure; an optical communication element having a connection segment disposed on the circuit structure such that the connection segment protrudes from the side of the cover layer and is located on the support area, so that the support member supports the connection segment; and a transmission member connected to the connection segment of the optical communication element.

[0008] This application also provides a method for manufacturing an electronic package, comprising: providing a carrier structure having a wiring layer, defining a support area; disposing an electronic component on the carrier structure and forming a plurality of conductive pillars on the carrier structure, and electrically connecting the plurality of conductive pillars to the wiring layer; forming an overlay layer on the carrier structure to cover the electronic component and the conductive pillars, wherein the overlay layer is not formed on the support area; forming a circuit structure on the overlay layer, and the circuit structure electrically connecting the plurality of conductive pillars and the electronic component; disposing a support member on the support area of ​​the carrier structure; disposing an optical communication element having a connection segment on the circuit structure, such that the connection segment protrudes from the side of the overlay layer and is located on the support area, so that the support member supports the connection segment; and connecting a transmission element to the connection segment of the optical communication element.

[0009] In the aforementioned electronic package and its manufacturing method, the carrier structure is disposed on the circuit board through multiple conductive elements.

[0010] In the aforementioned electronic packaging components and their manufacturing methods, the support component is constructed as a virtual wafer, a metal block, or a ceramic block.

[0011] In the aforementioned electronic packaging components and their manufacturing methods, the optical communication element is a photonic chip or an optical module.

[0012] In the aforementioned electronic packaging components and their manufacturing methods, the transmission component is a fiber optic array element.

[0013] In the aforementioned electronic package and its manufacturing method, the transmission component has a ribbon cable. For example, the ribbon cable is an optical fiber.

[0014] The aforementioned electronic packaging components and their manufacturing methods also include forming a heat sink on the optical communication element.

[0015] As can be seen from the above, the electronic package of this application mainly uses the support area designed in the bearing structure to support the support member, and the support member supports the optical communication element and the ribbon cable, avoiding the optical communication element and the ribbon cable being suspended. Therefore, compared with the prior art, the electronic package of this application can prevent the connection section from breaking when the optical communication element is subjected to external force caused by the ribbon cable shaking or pulling, thus improving reliability.

[0016] Furthermore, the electronic package can be manufactured using existing semiconductor packaging process materials and equipment, thus eliminating the need to develop new processes or purchase new equipment, thereby avoiding significant additional costs. Therefore, the manufacturing method of this application not only reduces the production cost of the final product but also greatly improves feasibility. Attached Figure Description

[0017] Figure 1A This is a cross-sectional schematic diagram of an existing semiconductor package.

[0018] Figure 1B This is a cross-sectional schematic diagram of the defective condition of an existing semiconductor package.

[0019] Figures 2A to 2H This is a cross-sectional schematic diagram illustrating the manufacturing method of the electronic package of this application.

[0020] Figure 3 This is a cross-sectional schematic diagram of another embodiment of the electronic package of this application.

[0021] Explanation of reference numerals in the attached figures

[0022] 1 Semiconductor package

[0023] 10 substrate

[0024] 11A Electronic Integrated Circuit Components

[0025] 11B,21 Electronic components

[0026] 12 Photonic Integrated Circuit Components

[0027] 13 stents

[0028] 2,3 Electronic packages

[0029] 20. Circuit Structure

[0030] 200 dielectric layers

[0031] 201 Line Layer

[0032] 21a Working surface

[0033] 21b Non-operating surface

[0034] 210 Electrode Pad

[0035] 211 Conductor

[0036] 212 Protective Film

[0037] 22 Bonding Layer

[0038] 23 Conductive pillars

[0039] 24 Load-bearing structure

[0040] 240 insulation layer

[0041] 241 Wiring Layer

[0042] 25 coating layers

[0043] 25a First Surface

[0044] 25b Second Surface

[0045] 26 Optical communication components

[0046] 26a Connecting section

[0047] 260 conductive bumps

[0048] 27 Conductive elements

[0049] 28 Packaging Material

[0050] 29 Support components

[0051] 30 Circuit Boards

[0052] 31 Transmission Components

[0053] 310 ribbon cable

[0054] 32 Heat sink

[0055] 6 barrier components

[0056] 70 fiber optic cables

[0057] A Support Area

[0058] L is the cutting path. Detailed Implementation

[0059] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0060] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0061] Figures 2A to 2H This is a cross-sectional schematic diagram of the manufacturing method of the electronic package 2 of this application.

[0062] like Figure 2A As shown, at least one electronic component 21 is attached to a support structure 24, and a plurality of conductive pillars 23 are formed on the support structure 24, and at least one barrier 6 is disposed on the support structure 24.

[0063] The supporting structure 24 includes at least one insulating layer 240 and a wiring layer 241 bonded to the insulating layer 240, and a support area A is defined on the supporting structure 24 for mounting the barrier 6.

[0064] In this embodiment, the wiring layer 241 is manufactured using a redistribution layer (RDL) specification and is made of copper. The insulating layer 240 is formed of a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP), or a solder resist such as green paint or ink. It should be understood that the number of insulating layers 240 and wiring layers 241 can be configured as needed for the supporting structure 24.

[0065] Furthermore, the barrier 6 can be constructed as a photoresist (PR), a dummy die, or other metal / non-metal solid consumables.

[0066] The electronic component 21 is disposed on the support structure 24 through a bonding layer 22 such as an adhesive material. The electronic component 21 is an active component, a passive component, or a combination of both. The active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, or an inductor.

[0067] In this embodiment, the electronic component 21 is a semiconductor wafer with opposing active surfaces 21a and non-active surfaces 21b. The active surface 21a has multiple electrode pads 210 to bond conductors 211, and these conductors 211 are covered by a protective film 212 such as a passivation material. The electronic component 21 is bonded to the bonding layer 22 with its non-active surface 21b.

[0068] Furthermore, the conductor 211 may be a conductive line, a spherical solder ball, or a columnar metal material such as a copper pillar or solder bump, or a stud conductive part made by a wire bonding machine, but is not limited to these.

[0069] The plurality of conductive pillars 23 are electrically connected to the wiring layer 241, and the material forming the conductive pillars 23 is a metal such as copper or solder.

[0070] like Figure 2B As shown, a covering layer 25 is formed on the support structure 24 so that the covering layer 25 covers the electronic component 21 and the plurality of conductive pillars 23, and the covering layer 25 is not formed on the support area A by the barrier member 6.

[0071] The coating layer 25 has a first surface 25a and a second surface 25b opposite to each other.

[0072] In this embodiment, the coating layer 25 is an insulating material, such as polyimide (PI), dry film, or an encapsulating compound such as epoxy resin. For example, the coating layer 25 can be formed by methods such as liquid compounding, injection, lamination, or compression molding.

[0073] Furthermore, a leveling process can be used to make the first surface 25a of the coating layer 25, the protective film 212, the end face of the conductive pillar 23, and the end face of the conductor 211 flush or coplanar, so that the end face of the conductive pillar 23 and the end face of the conductor 211 are exposed on the first surface 25a of the coating layer 25. For example, this leveling process removes part of the material of the protective film 212, part of the material of the conductive pillar 23, part of the material of the conductor 211, and part of the material of the coating layer 25 by grinding.

[0074] like Figure 2C As shown, the barrier 6 is removed, exposing the support area A of the load-bearing structure 24.

[0075] like Figure 2D As shown, a circuit structure 20 electrically connecting the plurality of conductive pillars 23 and the plurality of conductors 211 (electronic components 21) is formed on the first surface 25a of the covering layer 25. Next, a plurality of conductive elements 27 are formed on the carrier structure 24.

[0076] In this embodiment, the circuit structure 20 includes multiple dielectric layers 200 and circuit layers 201 disposed on the dielectric layers 200, such as a redistribution layer (RDL) specification. The outermost dielectric layer 200 can serve as a solder resist layer, and the outermost circuit layer 201 is exposed above the solder resist layer to serve as an electrical contact pad. Alternatively, the circuit structure 20 may also include only a single dielectric layer 200 and a single circuit layer 201.

[0077] Furthermore, the material forming the circuit layer 201 is copper, and the material forming the dielectric layer 200 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP).

[0078] Furthermore, the conductive element 27 is a solder ball or a metal bump such as a copper bump, which is disposed on the wiring layer 241 and electrically connected to the wiring layer 241.

[0079] like Figure 2E As shown, at least one support member 29 is provided on the support area A of the load-bearing structure 24.

[0080] In this embodiment, the support member 29 is constructed as a dummy die or other rigid structure (such as a metal block or ceramic block).

[0081] like Figure 2FAs shown, at least one optical communication element 26 is disposed on the line structure 20, and the optical communication element 26 protrudes from the side of the covering layer 25 and is located on the support area A, so that the support member 29 supports the optical communication element 26, wherein the portion of the optical communication element 26 protruding from the side of the covering layer 25 serves as a connecting segment 26a.

[0082] In this embodiment, the optical communication element 26 is a photonic IC or an optical module, which is electrically connected to the electrical contact pads of the circuit layer 201 through a plurality of conductive bumps 260 such as solder bumps, copper bumps or others.

[0083] Furthermore, an encapsulating material 28, similar to an adhesive, can be formed between the circuit structure 20 and the optical communication element 26 to cover the conductive bumps 260.

[0084] like Figure 2G As shown, the supporting structure 24 is connected to the circuit board 30 with the multiple conductive elements 27.

[0085] In this embodiment, the circuit board 30 is electrically connected to the conductive elements 27, and the encapsulation material 28 can be formed between the circuit board 30 and the support structure 24 to cover the conductive elements 27.

[0086] like Figure 2H As shown, along as Figure 2G The cutting path L shown is used for the single-piece cutting process. Then, a transmission component 31 with a ribbon cable (such as an optical fiber) 310, such as a fiber optic array unit (FAU), is connected to the connection segment 26a of the optical communication component 26 to obtain the electronic package 2.

[0087] See also Figure 3 In another embodiment, the electronic package 3 may form at least one heat sink 32 on the optical communication element 26 as required.

[0088] In this embodiment, the heat sink 32 may be a high thermal conductivity metal sheet, thermal adhesive, or other heat dissipation material.

[0089] Therefore, this application mainly uses the support area A designed in the bearing structure 24 to support the support member 29, and the support member 29 supports the optical communication element 26 and the ribbon cable 310, so as to avoid the optical communication element 26 and the ribbon cable 310 being suspended. Therefore, compared with the prior art, the electronic package 2,3 of this application can prevent the connection section 26a from breaking when the optical communication element 26 is subjected to external force caused by the ribbon cable 310 shaking or pulling, thus effectively improving the reliability.

[0090] Furthermore, the electronic package 2,3 can be manufactured using existing semiconductor packaging process materials and equipment, thus eliminating the need to develop new processes or purchase new equipment, thereby avoiding significant additional costs. Therefore, this application not only reduces the production cost of the final product but also greatly improves feasibility.

[0091] This application also provides an electronic package 2,3, comprising: a carrier structure 24 having a wiring layer 241, at least one electronic component 21 disposed on the carrier structure 24, a plurality of conductive posts 23 disposed on the carrier structure 24 and electrically connected to the wiring layer 241, a covering layer 25 disposed on the carrier structure 24 to cover the electronic component 21 and the plurality of conductive posts 23, a circuit structure 20 disposed on the covering layer 25 and electrically connecting the conductive posts 23 and the electronic component 21, at least one support member 29 disposed on the carrier structure 24, an optical communication component 26 disposed on the circuit structure 20 and having a connection segment 26a, and at least one transmission member 31 connected to the connection segment 26a.

[0092] The load-bearing structure 24 is defined to have a support area A.

[0093] The covering layer 25 is not formed on the support region A.

[0094] The connecting segment 26a protrudes from the side of the covering layer 25 and is located on the support area A, so that the support member 29 supports the connecting segment 26a.

[0095] In one embodiment, the support structure 24 is disposed on the circuit board 30 via a plurality of conductive elements 27.

[0096] In one embodiment, the support member 29 is constructed as a virtual wafer, a metal block, or a ceramic block.

[0097] In one embodiment, the optical communication element 26 is a photonic chip or an optical module.

[0098] In one embodiment, the transmission element 31 is an optical fiber array element.

[0099] In one embodiment, the transmission element 31 has a ribbon cable 310. For example, the ribbon cable 310 is an optical fiber.

[0100] In one embodiment, the electronic package 3 further includes a heat sink 32 formed on the optical communication element 26.

[0101] In summary, the electronic package of this application has a support area designed to support the support member through the bearing structure, and the support member supports the optical communication element and the ribbon cable, avoiding the optical communication element and the ribbon cable being suspended. Therefore, when the optical communication element is subjected to external force caused by shaking or pulling of the ribbon cable, the electronic package of this application can prevent the connection section from breaking, thus effectively improving reliability.

[0102] Furthermore, this application can manufacture the electronic package using existing semiconductor packaging process materials and equipment, thus eliminating the need to develop new processes or purchase new equipment, thereby avoiding significant additional costs. Therefore, this application not only reduces the production cost of the final product but also greatly improves feasibility.

[0103] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. An electronic package, characterized in that, include: The load-bearing structure has a wiring layer and defines a support area; Electronic components are mounted on this supporting structure; A covering layer is formed on the support structure to cover the electronic component, wherein the covering layer is not formed on the support area; The circuit structure is formed on the cladding layer and electrically connected to the electronic component; Supporting components are provided on the supporting area of ​​the load-bearing structure; An optical communication element having a connecting segment disposed on the line structure, such that the connecting segment protrudes from the side of the cladding layer and is located on the support area, and the support member supports the connecting segment; and The transmission component is the connection segment that connects the optical communication element.

2. The electronic package as described in claim 1, characterized in that, The support structure is mounted on the circuit board via multiple conductive elements.

3. The electronic package as described in claim 1, characterized in that, The support component can be a virtual wafer, a metal block, or a ceramic block.

4. The electronic package as described in claim 1, characterized in that, The optical communication element is a photonic chip or an optical module.

5. The electronic package as described in claim 1, characterized in that, The transmission device is a fiber optic array element.

6. The electronic package as claimed in claim 1, characterized in that, The transmission device has a ribbon cable.

7. The electronic package as described in claim 6, characterized in that, The cable is made of optical fiber.

8. The electronic package as claimed in claim 1, characterized in that, The electronic package also includes a heat sink disposed on the optical communication element.

9. The electronic package as claimed in claim 1, characterized in that, The electronic package also includes a plurality of conductive posts formed on the carrier structure and electrically connecting the circuit structure to the carrier structure.

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