A 400G DR4 silicon photonics engine

Abstract

The utility model relates to a kind of 400G DR4 silicon light optical engine, comprising: PCB board and the pedestal being laid below PCB board, first through slot is opened on PCB board in the area corresponding pedestal, the upper surface of pedestal has the first boss into it at corresponding first through slot, the upper surface of first boss is equipped with light emission end, at least one side of pedestal is equipped with the step of its lower surface higher than the lower surface of pedestal, pedestal is adhered with PCB board using black glue in multiple places, and each step is wrapped by black glue.There is beneficial effect for: because at least one side of pedestal is equipped with step, and the lower surface of step is higher than the lower surface of pedestal, i.e. Step is thinner than pedestal, and each step is wrapped by black glue, so even if the adhesion of pedestal and black glue is very weak, black glue can also hold step, so that pedestal cannot fall off from PCB board.

Description

Technical Field

[0001] This utility model relates to the field of optical engine technology, specifically to a 400G DR4 silicon photonics engine. Background Technology

[0002] The structure of a traditional 400G DR4 silicon photonics engine is as follows: Figure 1 As shown, it includes: a PCB board, a base, a light emitting end and a light receiving end. The base is arranged below the PCB board. A through slot is opened on the PCB board in the area corresponding to the base. A boss is provided on the upper surface of the base at the corresponding through slot. The light emitting end is provided on the upper surface of the boss. The light receiving end is fixed on the PCB board. The base is bonded to the PCB board with black glue in many places. The base material is tungsten copper. The optical transmitter includes: a silicon photonic chip fixed on the surface of the boss, a TX fiber array, a converging lens, an optical isolator, a collimating lens, and a heat sink. The TX fiber array is coupled to the output waveguide of the silicon photonic chip. A DFB chip is fixed on the heat sink. The emitted light from the DFB chip passes through the collimating lens, the optical isolator, and the converging lens in sequence before being coupled into the input waveguide of the silicon photonic chip. The TX fiber array has four channels, and the heat sink is made of ceramic. The optical receiver includes: an RX fiber array, a PD chip, and a TIA chip fixed on the top surface of the PCB board. The RX fiber array is coupled to the PD chip, the PD chip is electrically connected to the TIA chip, and the TIA chip is electrically connected to the PCB board. The RX fiber array has four channels. This solution has the following problems: 1) The tungsten copper base has weak adhesion to black adhesive, and the base is easy to fall off the PCB board; 2) The optical receiver is fixed on the PCB board. When the PCB board is assembled onto the module housing, the screw tightening force is very large, which can easily cause the PCB board to deform, thus causing the RX optical path to shift. 3) Since the optical receiver is fixed on the PCB board, heat dissipation is achieved through copper plating and resin plugging on the sidewalls of the PCB board's through-holes. This process results in poor heat dissipation and higher PCB board costs. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a 400G DR4 silicon photonics engine to overcome the shortcomings of the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A 400G DR4 silicon photonics engine includes: a PCB board and a base disposed below the PCB board. A first through slot is formed on the PCB board in the area corresponding to the base. A first protrusion is formed on the upper surface of the base at the location corresponding to the first through slot. A light emitting end is provided on the upper surface of the first protrusion. At least one side of the base is provided with a step whose lower surface is higher than the lower surface of the base. The base is bonded to the PCB board with black glue in multiple places, and each step is wrapped with black glue.

[0005] The beneficial effects of this utility model are: because a step is provided on at least one side of the base, and the lower surface of the step is higher than the lower surface of the base, that is, the step is thinner than the base, and each step is wrapped with black glue, even if the adhesion between the base and the black glue is very weak, the black glue can hold the step in place, so that the base cannot fall off the PCB board.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, the base has a step on each of the two sides in the width direction of the PCB board.

[0008] The further beneficial effect of adopting the above method is that applying black glue to only two points can effectively prevent the base from detaching from the PCB board.

[0009] Furthermore, the thickness of the step is 0.5mm ± 0.1mm, and the length is 1mm to 6mm.

[0010] The further beneficial effects of adopting the above are that this size can prevent the step from being too thin, which would cause it to deform, and at the same time, it can also prevent it from being too thick, which would cause the black glue to be too high.

[0011] Furthermore, a U-shaped groove is opened on the side of the base, penetrating its lower surface, and a step is formed at each U-shaped groove on the base.

[0012] The further beneficial effect of adopting the above is that a step can be designed without increasing the width of the base, so that not only does not increase the weight of the base, but also reduces the weight of the base to a certain extent, further preventing the base from falling off the PCB board.

[0013] Furthermore, a second through slot is formed on the PCB board in the area corresponding to the base, and a second boss is formed on the upper surface of the base at the location corresponding to the second through slot. A light receiving end is provided on the upper surface of the second boss.

[0014] The further beneficial effects of adopting the above are: placing the optical receiver on the second protrusion of the base, rather than on the PCB board, can prevent deformation due to excessive screw tightening force after the PCB board is assembled onto the module housing, thus preventing displacement of the RX optical path and ensuring the stability of the RX optical path. It also facilitates heat dissipation of the optical receiver and eliminates the need for the PCB board to perform complex hole-plating copper plating processes for heat dissipation of the TIA chip in the optical receiver, effectively reducing costs.

[0015] Furthermore, the optical receiver includes: an RX fiber array, a PD chip, and a TIA chip fixed on the upper surface of the second protrusion. The RX fiber array is coupled to the PD chip, and the PD chip is electrically connected to the TIA chip. The RX fiber array has four channels.

[0016] Furthermore, the optical transmitter includes: a silicon photonic chip fixed on the surface of the first protrusion, a TX fiber array, a converging lens, an optical isolator, a collimating lens, and a heat sink. The TX fiber array is coupled to the output waveguide of the silicon photonic chip. A DFB chip is fixed on the heat sink. The emitted light from the DFB chip passes through the collimating lens, the optical isolator, and the converging lens in sequence before being coupled into the input waveguide of the silicon photonic chip. The TX fiber array has four channels.

[0017] Furthermore, the heat sink is made of ceramic.

[0018] Furthermore, the base is made of tungsten copper. Attached Figure Description

[0019] Figure 1 This is a structural diagram of a 400G DR4 silicon photonics engine in the prior art; Figure 2 This is a top view of the 400G DR4 silicon photonics engine in this utility model; Figure 3 This is a bottom view of the 400G DR4 silicon photonics engine after the black adhesive has been removed in this utility model; Figure 4 for Figure 3 Cross-sectional view along the AA direction.

[0020] The attached diagram lists the components represented by each number as follows: 1. PCB board, 110. First through slot, 120. Second through slot, 2. Base, 210. First boss, 220. Step, 230. U-shaped groove, 240. Second boss, 3. Optical transmitter, 310. Silicon photonic chip, 320. TX fiber array, 330. Converging lens, 340. Optical isolator, 350. Collimating lens, 360. Heat sink, 370. DFB chip, 4. Black glue, 5. Optical receiver, 510. RX fiber array, 520. PD chip, 530. TIA chip. Detailed Implementation

[0021] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0022] Example 1 like Figure 2 , Figure 3 , Figure 4 As shown, a 400G DR4 silicon photonics engine includes: a PCB board 1 and a base 2, wherein the base 2 is disposed below the PCB board 1. A first through slot 110 is formed on the PCB board 1 in the area corresponding to the base 2. A first boss 210 is formed on the upper surface of the base 2 at the location corresponding to the first through slot 110. The first boss 210 enters the first through slot 110. A light emitting end 3 is provided on the upper surface of the first boss 210, i.e., this part is still consistent with the prior art; at least one side of the base 2 is provided with a step 220, and the step... The lower surface of step 220 is higher than the lower surface of base 2. Base 2 is bonded to PCB board 1 with black glue 4 in multiple places, and each step 220 is wrapped with black glue 4. Since there is a step 220 on at least one side of base 2, and the lower surface of step 220 is higher than the lower surface of base 2, that is, step 220 is thinner than base 2, and each step 220 is wrapped with black glue 4, even if the adhesion between base 2 and black glue 4 is very weak, the black glue 4 can hold the step 220 in place, so that base 2 cannot fall off PCB board 1.

[0023] Example 2 like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The base 2 has a step 220 on each of the two sides of the PCB board 1 in the width direction. That is, in this embodiment, the base 2 has two steps 220. Only two places need to be covered with black glue 4 to effectively prevent the base 2 from falling off the PCB board 1.

[0024] Furthermore, the thickness of step 220 is 0.5mm ± 0.1mm. This dimension can prevent step 220 from being too thin and causing deformation, while also preventing it from being too thick and causing the black glue 4 to be too high. The length of step 220 is 1mm to 6mm.

[0025] Example 3 like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on embodiment 2, as detailed below: A U-shaped groove 230 is formed on the side of the base 2, penetrating its lower surface. Then, a step 220 is formed on the base 2 at each U-shaped groove 230. The step 220 can be designed without increasing the width of the base 2. This not only does not increase the weight of the base 2, but can also reduce the weight of the base 2 to a certain extent, further preventing the base 2 from falling off the PCB board 1.

[0026] Example 4 like Figure 2 , Figure 4 As shown, this embodiment is a further improvement on any one of embodiments 1 to 3, as detailed below: A second through slot 120 is formed on the PCB board 1 in the area corresponding to the base 2. A second boss 240 is formed on the upper surface of the base 2 at the location corresponding to the second through slot 120. The second boss 240 enters the second through slot 120. A light receiver 5 is provided on the upper surface of the second boss 240, so that the light receiver 5 is located on the second boss 240 of the base 2, rather than on the PCB board 1. When the PCB board 1 is assembled onto the module housing, it can avoid deformation due to excessive screw tightening force, prevent RX optical path displacement, and thus ensure the stability of the RX optical path. It also facilitates heat dissipation of the light receiver 5, and the PCB board 1 does not need to perform a complex hole-plating copper process for heat dissipation of the TIA chip 530 in the light receiver 5, effectively reducing costs.

[0027] Furthermore, the optical receiver 5 includes an RX fiber array 510, a PD chip 520, and a TIA chip 530. The RX fiber array 510, PD chip 520, and TIA chip 530 are respectively fixed on the upper surface of the second protrusion 240. The RX fiber array 510 is coupled to the PD chip 520, the PD chip 520 is electrically connected to the TIA chip 530, and the TIA chip 530 is electrically connected to the PCB board 1. The RX fiber array 510 has four channels.

[0028] Example 5 like Figure 2 , Figure 4 As shown, this embodiment is a further improvement on any one of embodiments 1 to 4, as detailed below: The optical transmitter 3 includes a silicon photonics chip 310, a TX fiber array 320, a converging lens 330, an optical isolator 340, a collimating lens 350, and a heat sink 360. The silicon photonics chip 310, the TX fiber array 320, the converging lens 330, the optical isolator 340, the collimating lens 350, and the heat sink 360 are respectively fixed on the upper surface of the first protrusion 210. The TX fiber array 320 is coupled to the output waveguide of the silicon photonics chip 310. A DFB chip 370 is fixed on the heat sink 360. The collimating lens 350, the optical isolator 340, and the converging lens 330 are sequentially coupled between the DFB chip 370 and the input waveguide of the silicon photonics chip 310. The emitted light from the DFB chip 370 is coupled into the input waveguide of the silicon photonics chip 310 after passing through the collimating lens 350, the optical isolator 340, and the converging lens 330 in sequence. The TX fiber array 320 has four channels. The heat sink 360 is preferably made of ceramic.

[0029] Example 6 like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on any one of embodiments 1 to 5, as detailed below: The base 2 is preferably made of tungsten copper, meaning that the material of the base 2 remains consistent with the existing technology. Since the first boss 210 and the second boss 240 are integrally formed on the base 2, it can be understood that the material of the first boss 210 and the second boss 240 is also tungsten copper.

[0030] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A 400G DR4 silicon photonics engine, comprising: The PCB board (1) and the base (2) arranged below the PCB board (1) are provided with a first through groove (110) in the area corresponding to the base (2). The upper surface of the base (2) has a first boss (210) that enters the first through groove (110). The upper surface of the first boss (210) is provided with a light emitting end (3). The base (2) has at least one side with a step (220) whose lower surface is higher than the lower surface of the base (2). The base (2) is bonded to the PCB board (1) with black glue (4) in multiple places, and each step (220) is wrapped with black glue (4).

2. A 400G DR4 silicon photonics engine according to claim 1, characterized in that, The base (2) has a step (220) on each of the two sides of the PCB board (1) in the width direction.

3. A 400G DR4 silicon photonics engine according to claim 1, characterized in that, The thickness of the step (220) is 0.5mm ± 0.1mm, and the length is 1mm to 6mm.

4. A 400G DR4 silicon photonics engine according to claim 1, characterized in that, The base (2) has a U-shaped groove (230) extending through its lower surface on its side, and a step (220) is formed at each U-shaped groove (230) on the base (2).

5. A 400G DR4 silicon photonics engine according to claim 1, characterized in that, The PCB board (1) has a second through slot (120) in the area corresponding to the base (2). The upper surface of the base (2) has a second boss (240) that enters the second through slot (120). The upper surface of the second boss (240) is provided with a light receiving end (5).

6. A 400G DR4 silicon photonics engine according to claim 5, characterized in that, The optical receiver (5) includes: an RX fiber array (510), a PD chip (520) and a TIA chip (530) fixed on the upper surface of the second protrusion (240). The RX fiber array (510) is coupled to the PD chip (520), and the PD chip (520) is electrically connected to the TIA chip (530). The RX fiber array (510) has four channels.

7. A 400G DR4 silicon photonics engine according to claim 1, characterized in that, The light emitting end (3) includes: a silicon photonic chip (310), a TX fiber array (320), a converging lens (330), an optical isolator (340), a collimating lens (350), and a heat sink (360) fixed on the upper surface of the first protrusion (210). The TX fiber array (320) is coupled to the output waveguide of the silicon photonic chip (310). A DFB chip (370) is fixed on the heat sink (360). The emitted light of the DFB chip (370) is coupled into the input waveguide of the silicon photonic chip (310) after passing through the collimating lens (350), the optical isolator (340), and the converging lens (330) in sequence. The TX fiber array (320) has four channels.

8. A 400G DR4 silicon photonics engine according to claim 7, characterized in that, The heat sink (360) is made of ceramic.

9. A 400G DR4 silicon photonics engine according to any one of claims 1 to 8, characterized in that, The base (2) is made of tungsten copper.

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