Acf attaching machine common bottom mold

Abstract

The utility model relates to the field of module display, especially a kind of ACF attaching machine common bottom mould.It is difficult to effectively support and limit FPC for the current ACF attaching machine bottom mould, which leads to the shortcoming that the ACF of FPC type product cannot be normally attached.A kind of ACF attaching machine common bottom mould, including base etc., module placement area is equipped on the base, two positioning columns are fixedly connected on the base, bottom mould is placed on the base, two fixed screw holes are opened on the bottom mould.Workers start vacuum equipment, so that FPC is adsorbed on vacuum adsorption plate and supporting plate, keep FPC flat by the way of limiting FPC, and then effectively attach ACF on the gold finger area of FPC and the terminal area of LCD, which can meet the support and limit of FPC and LCD by the same bottom mould, effectively improve production efficiency and product pass rate, thereby greatly shorten production cycle and save labor cost.

Description

Technical Field

[0001] This utility model relates to the field of module display, and in particular to a common bottom mold for an ACF bonding machine. Background Technology

[0002] The ACF (Anti-Frost Fiber) bonding machine's base mold is used to support and level the terminal area of ​​the LCD or the gold finger area of ​​the FPC on the FOG (Factory Object Packet). Then, using the appropriate temperature, pressure, and time from the ACF indenter, a layer of ACF is bonded onto the ITO of the LCD or the gold finger of the FPC. Currently, ACF bonding machine base molds are typically rectangular plate designs with a relatively simple structure, suitable only for ACF bonding to the terminal area of ​​LCD products. Because FPCs are often too long and exceed the support range of the base mold, the base mold cannot effectively support and limit the FPC, resulting in the inability to properly bond ACF to FPC-type products. Utility Model Content

[0003] In view of the shortcomings or deficiencies in the prior art, this utility model provides a common bottom mold for ACF bonding machine, which can meet the support and positioning requirements of FPC and LCD by the same bottom mold, effectively improving production efficiency and product qualification rate, thereby greatly shortening the production cycle and saving labor costs.

[0004] A common base mold for an ACF bonding machine includes a base with a module placement area. The base surface is coated with Teflon. Two positioning posts are fixedly connected to the base. A base mold, made of stainless steel, is placed on the base. Two fixing screw holes are formed on the base mold, and the two positioning posts are respectively located within the two fixing screw holes. A vacuum adsorption plate is bolted to the base mold. The vacuum adsorption plate has several vacuum adsorption holes. A vacuum connecting pipe is fixedly connected to the base mold, and the vacuum connecting pipe is fixedly connected to and communicates with the vacuum adsorption plate. A support plate is fixedly connected to the base mold, and the support plate has several vacuum limiting holes. The support plate is fixedly connected to and communicates with the vacuum adsorption plate.

[0005] The beneficial effects of this utility model are as follows: the operator places the FOG on the base, so that the LCD is located in the module placement area and the FPC is located on the vacuum adsorption plate and the tray. Then the vacuum equipment will adsorb the FPC onto the vacuum adsorption plate and the tray, thereby keeping the FPC flat by supporting and limiting the vacuum adsorption. This allows for the effective application of ACF to the gold finger area on the FPC and the terminal area of ​​the LCD. In this way, the same bottom mold can support and limit the FPC and LCD, effectively improving production efficiency and product qualification rate, thereby greatly shortening the production cycle and saving labor costs. Attached Figure Description

[0006] Figure 1A three-dimensional structural diagram of this utility model.

[0007] Figure 2 A three-dimensional structural diagram of the base, module placement area, and positioning column of this utility model.

[0008] Figure 3 Partial cross-sectional three-dimensional structural schematic diagram of this utility model.

[0009] Explanation of reference numerals in the attached drawings: 1_base, 2_module placement area, 3_positioning post, 4_bottom mold, 5_fixing screw hole, 6_vacuum adsorption plate, 7_vacuum connecting pipe, 8_support plate. Detailed Implementation

[0010] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0011] Example 1 A common bottom mold for ACF bonding machines, such as Figures 1-3 As shown, the device includes a base 1 with a module placement area 2. The surface of the base 1 is coated with Teflon. Two positioning posts 3 are fixedly connected to the base 1. A bottom mold 4, made of stainless steel, is placed on the base 1. The bottom mold 4 has two fixing screw holes 5, and the two positioning posts 3 are respectively located within the two fixing screw holes 5. A vacuum adsorption plate 6 is bolted to the bottom mold 4, and the vacuum adsorption plate 6 has several vacuum adsorption holes. A vacuum connecting pipe 7 is fixedly connected to the bottom mold 4, and the vacuum connecting pipe 7 is fixedly connected to and communicates with the vacuum adsorption plate 6. A support plate 8 is fixedly connected to the bottom mold 4, and the support plate 8 has several vacuum limiting holes, and the support plate 8 is fixedly connected to and communicates with the vacuum adsorption plate 6.

[0012] First, the operator places the bottom mold 4 on the base 1, so that the two positioning pins 3 respectively engage with the two fixing screw holes 5 on the bottom mold 4, completing the installation of the bottom mold 4. At the same time, the vacuum equipment is connected to the vacuum connector 7. Then, the operator places the FOG on the base 1, so that the LCD is located in the module placement area 2 and the FPC is located on the vacuum adsorption plate 6 and the support plate 8. Then, the operator starts the vacuum equipment, so that the FPC is adsorbed on the vacuum adsorption plate 6 and the support plate 8. By supporting the FPC and limiting it through vacuum adsorption, the FPC is kept flat. This allows for the effective application of ACF to the gold finger area on the FPC and the terminal area of ​​the LCD. In this way, the same bottom mold 4 can support and limit the FPC and LCD, effectively improving production efficiency and product qualification rate, thereby greatly shortening the production cycle and saving labor costs.

[0013] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit the scope of protection of this utility model. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the essence and scope of the technical solutions of this utility model.

Claims

1. A common bottom mold for an ACF bonding machine, characterized in that: The device includes a base (1), on which two positioning posts (3) are fixedly connected. A bottom mold (4) is placed on the base (1). Two fixing screw holes (5) are opened on the bottom mold (4). The two positioning posts (3) are respectively located in the two fixing screw holes (5) on the bottom mold (4). A vacuum adsorption plate (6) is connected to the bottom mold (4) by bolts. A vacuum pipe (7) is fixedly connected to the bottom mold (4). The vacuum pipe (7) is fixedly connected to and communicates with the vacuum adsorption plate (6). A support plate (8) is fixedly connected to the bottom mold (4). The support plate (8) is fixedly connected to and communicates with the vacuum adsorption plate (6).

2. A common bottom mold for an ACF bonding machine according to claim 1, characterized in that: The base (1) is provided with a module placement area (2).

3. A common bottom mold for an ACF bonding machine according to claim 1, characterized in that: The base (1) is covered with Teflon.

4. A common bottom mold for an ACF bonding machine according to claim 1, characterized in that: The bottom mold (4) is made of stainless steel.

5. A common bottom mold for an ACF bonding machine according to claim 1, characterized in that: The vacuum adsorption plate (6) has several vacuum adsorption holes.

6. A common bottom mold for an ACF bonding machine according to claim 1, characterized in that: The tray (8) has several vacuum limiting holes.

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