Liquid crystal display screen convenient for heat dissipation

Abstract

The utility model discloses a liquid crystal display convenient to radiate heat relates to liquid crystal display technical field, this liquid crystal display convenient to radiate heat, including outer frame and liquid crystal panel, the outer side of liquid crystal panel is sleeved and is sealed circle and realizes the sealing, and the four corners of wall side of outer frame are equipped with the buffer pad to form the wall hanging convection gap, and the integral moulded backplate and the heat dissipation fin are equipped in the lower portion of outer frame, and the dustproof net is built -in in the lower bottom surface heat dissipation hole, and the backlight module and drive circuit are connected below liquid crystal panel, and the graphite alkene heat spreading piece is connected graphene heat spreading piece through the circular heat conduction silica gel pad of backlight module, and the drive circuit is connected size -matched ultrathin heat spreading plate, and both sides are equipped with L type heat pipe (through copper column, heat conduction silica gel) and connect backplate, and the drive circuit is connected to the right side heat conduction strip of backlight module. The utility model discloses through the difference heat dissipation (drive circuit is through heat spreading plate + heat pipe, and the backlight is through heat spreading piece + heat conduction strip), IP5X dustproof and temperature self -adaptation control, realizes 40 DEG C environment stable heat dissipation, and gives both sides to the ultrathin, prolongs product life.

Description

Technical Field

[0001] This utility model relates to the field of liquid crystal display technology, and in particular to a liquid crystal display screen that is easy to dissipate heat. Background Technology

[0002] With the increasing popularity of home offices and bedroom entertainment, LCD screens have expanded from being the primary devices in traditional living rooms and studies to compact spaces like bedrooms. According to a 2024 global display industry survey, the market demand for wall-mounted LCD screens for bedrooms increased by 32% year-on-year, with users showing a significant increase in demand for "ultra-thin design, quiet operation, long-lasting dust protection, and stable heat dissipation." However, existing LCD screens, when adapted for bedroom wall-mounting, suffer from four core technical pain points due to structural design and heat dissipation logic, failing to meet actual usage needs. These are as follows:

[0003] 1. Poor dustproof design compatibility leads to long-term malfunctions due to bedroom dust.

[0004] Bedroom environments contain a large amount of micron-sized dust (such as bed sheet fibers, hair fragments, and clothing lint). Existing LCD screens typically have a dustproof rating of IP20, which only blocks larger particles. Firstly, the ventilation holes on the bottom of the screen generally lack dedicated dustproof structures or use only a single layer of sparse mesh, allowing dust to easily penetrate the outer bezel. Secondly, the connection between the LCD panel and the outer bezel lacks a sealing design, allowing dust to seep into the core area of ​​the screen through gaps. After prolonged use (1-2 years), dust will adhere to the heat sink fins, drive circuit pins, and backlight module LEDs. This can lead to a 30% decrease in heat sink convection efficiency, or even increased contact resistance in the drive circuit causing screen flickering, or obstructed heat dissipation in the backlight module LEDs accelerating light decay, shortening the screen's lifespan from the usual 5 years to 2-3 years, significantly increasing user maintenance costs.

[0005] Second, the lack of differentiated management of heat sources means that both highly centralized and decentralized heat sources pose a risk of overheating.

[0006] Existing LCD screens mostly employ a "single heat conduction path" for heat dissipation, without designing differentiated solutions for the characteristics of different heat sources.

[0007] High heat source problem in the drive circuit: The drive circuit (including T-Con chip) is the core high heat generation component, accounting for 40%-50% of the total heat generation. However, existing products only dissipate heat by "directly attaching the thermal conductive film to the back plate", which cannot quickly dissipate the local concentrated heat. The surface temperature of the T-Con chip is often 25-30°C higher than the back plate temperature, forming obvious "hot spots" and accelerating chip aging.

[0008] MiniLED backlight heat source dispersion problem: MiniLED backlight modules are composed of hundreds of LED beads, and the heat is distributed in a dispersed manner. Existing products lack a global heat distribution structure and only set local heat-conducting pads in the LED bead area. This results in the temperature of high-density LED bead areas (such as the center of the screen) being 15-20°C higher than the edge areas, and the light decay rate of local LED beads is accelerated by 50%, affecting the uniformity of the display.

[0009] Third, insufficient temperature adaptability and regulation capabilities, unable to adapt to fluctuations in the bedroom environment.

[0010] The standard operating temperature range of existing LCD screens is mostly 10-35℃, and they lack dynamic temperature control mechanisms, which is significantly inconsistent with the temperature fluctuations in bedroom environments (reaching 40℃ in summer without air conditioning and dropping to 0℃ in winter without heating).

[0011] Under high temperature conditions (>35℃): the heat dissipation system is overloaded, the drive circuit is prone to triggering overheat protection, resulting in black screen, and the backlight module lamp beads experience irreversible light decay due to high temperature.

[0012] In low-temperature environments (<10℃): the display startup time is extended to more than 30 seconds, and image retention is prone to occur.

[0013] Meanwhile, existing products lack precise temperature monitoring components, making it impossible to perceive temperature changes in the core area in real time and to balance heat dissipation requirements by dynamically adjusting power consumption, which further exacerbates the impact of temperature fluctuations on product stability.

[0014] In summary, existing LCD screens have insurmountable technical defects in terms of dust protection, differentiated heat source management, temperature regulation, and the balance between ultra-thinness and heat dissipation. There is an urgent need for a new structural design that can take into account "efficient heat dissipation, long-term dust protection, and quiet and stable operation" to meet the usage needs of compact spaces such as bedrooms. Utility Model Content

[0015] The purpose of this invention is to solve at least one of the technical problems existing in the prior art, and to provide a liquid crystal display screen that facilitates heat dissipation, and can solve the problems of dust protection, differentiated heat source control, temperature regulation and the balance between ultra-thinness and heat dissipation.

[0016] To achieve the above objectives, the present invention provides the following technical solution: a liquid crystal display screen that facilitates heat dissipation, comprising an outer frame and a liquid crystal panel, wherein the liquid crystal panel is disposed inside the upper part of the outer frame, a sealing ring is fitted on the outer side of the liquid crystal panel, and the outer frame is fixedly connected to the liquid crystal panel through the sealing ring; buffer pads are fixedly connected to the four corners of the outer frame on the side closest to the wall.

[0017] A set of heat dissipation fins is fixedly installed inside the lower part of the outer frame. A back plate is fixedly connected above the heat dissipation fins. A set of heat dissipation holes is opened on the bottom surface of the outer frame. A dustproof mesh is fixedly installed in each heat dissipation hole.

[0018] A backlight module is fixedly connected to the center below the LCD panel. A driving circuit is provided on the right side of the backlight module and is fixedly connected to the LCD panel. A set of circular thermally conductive silicone pads is fixedly connected to the center below the backlight module, and a graphene heat sink is fixedly connected below the set of circular thermally conductive silicone pads.

[0019] Preferably, an ultra-thin heat spreader is fixedly connected below the driving circuit, and the size of the ultra-thin heat spreader is the same as that of the driving circuit. Thermally conductive silicone is fixedly connected below the ultra-thin heat spreader, and the driving circuit is fixedly connected to the ultra-thin heat spreader through the thermally conductive silicone.

[0020] Preferably, three sets of L-shaped heat pipes are fixedly connected to both the left and right sides of the driving circuit. Copper pillars are fixedly connected to the outer side of each L-shaped heat pipe. The L-shaped heat pipes are fixedly connected to the thermally conductive silicone through the copper pillars. The lower end of each L-shaped heat pipe is fixedly connected to the back plate. The driving circuit is indirectly fixedly connected to the back plate through the L-shaped heat pipes.

[0021] Preferably, a heat-conducting strip is fixedly connected to the right side of the backlight module. The heat-conducting strip is arranged in a linear array of four groups, and each group of heat-conducting strips is located on one side of the L-shaped heat pipe. The right end of the heat-conducting strip is fixedly connected to the driving circuit, and the backlight module is fixedly connected to the driving circuit through the heat-conducting strip.

[0022] Preferably, the heat dissipation fins are integrally formed with the back plate, and the total area of ​​the heat dissipation fins is 2.5-3 times the surface area of ​​the back plate.

[0023] Preferably, the set of circular thermally conductive silicone pads is set in the high-power area of ​​the backlight module with a lamp bead density of ≥20 beads / cm².

[0024] The area of ​​the graphene heat sink is the same as the area of ​​the backlight module.

[0025] Preferably, the ultrathin heat spreader is filled with deionized water or liquid metal working fluid;

[0026] The number of L-shaped heat pipes is [number], the evaporation section of the L-shaped heat pipe is close to the driving circuit, and the condensation section of the L-shaped heat pipe is fixedly connected to the back plate.

[0027] Preferably, a thermistor is fixedly connected to the connection end between the backlight module and the heat-conducting strip.

[0028] Compared with the prior art, the beneficial effects of this utility model are:

[0029] 1. This heat-dissipating LCD screen features an ultra-thin heat spreader plate fixedly connected below the driving circuit. This heat spreader plate covers the entire driving board area through surface bonding. The localized high-temperature heat generated by the driving circuit is rapidly diffused to the entire surface of the heat spreader plate via a phase change in the working fluid within the microchannels of the ultra-thin heat spreader plate, uniformly reducing the surface temperature of the driving circuit to 65-70℃ and eliminating "localized hot spots on the T-Con chip." Six L-shaped heat pipes on the left and right sides of the driving circuit are fixed to the ultra-thin heat spreader plate and tightly bonded via copper pillars and thermally conductive silicone. The uniform heat from the ultra-thin heat spreader plate is first transferred to the copper pillars via the thermally conductive silicone, and then introduced into the evaporation section (horizontal section, close to the driving circuit side) of the L-shaped heat pipes. After absorbing heat, the working fluid inside the L-shaped heat pipe undergoes a phase change and vaporizes, flowing rapidly along the internal grooves of the heat pipe to the vertical section placed at the lower end. Finally, the heat is transferred to the backplate fixedly connected to the lower end of the L-shaped heat pipe, achieving "cross-regional heat conduction."

[0030] 2. This heat-dissipating LCD screen has a backplate fixed above the heat dissipation fins. The heat introduced by the L-shaped heat pipe is evenly diffused to the heat dissipation fins below, which are an array of fins. The heat dissipation fins transfer heat to the air inside the outer frame through "large surface area convection", and the total fin area is 2.5-3 times that of the backplate. At the same time, the heat dissipation holes on the bottom surface of the outer frame form a natural convection path of "bottom air intake → internal air flow → top air exhaust". After entering through the heat dissipation holes, the cool air flows through the heat dissipation fins, carries away the heat and is discharged from the gap at the top of the outer frame, completing the final dissipation of heat from the drive circuit.

[0031] 3. This heat-dissipating LCD screen features a graphene heat sink fixed beneath a circular thermally conductive silicone pad. Utilizing its high thermal conductivity (≥1500W / m・K), the heat from the backlight module is evenly distributed across the entire surface of the heat sink, stabilizing its surface temperature at 60-65℃. This prevents localized overheating of the LEDs, which could lead to light decay. The graphene heat sink is attached to the backplate and indirectly conducts heat through the backplate above the heat dissipation fins, transferring 60% of the backlight heat to the backplate → heat dissipation fins. This heat is then combined with the heat dissipation path of the drive circuit and dissipated through ventilation holes. Four sets of linear array heat-conducting strips on the right side of the backlight module are fixedly connected, transferring 15%-20% of the backlight heat to the drive circuit on the right. These heat-conducting strips, made of pure copper, are fixed at one end to the backlight module and at the other end to the drive circuit, allowing the backlight heat to share the L-shaped heat pipe heat dissipation path of the drive circuit. This further enhances heat dissipation redundancy and prevents localized heat accumulation on the graphene heat sink. Attached Figure Description

[0032] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0033] Figure 1This is a schematic diagram of the internal structure of a liquid crystal display screen that facilitates heat dissipation, according to the present invention.

[0034] Figure 2 This is a rear view schematic diagram of a liquid crystal display screen that facilitates heat dissipation according to this utility model;

[0035] Figure 3 This is a cross-sectional view of the interior of a liquid crystal display screen that facilitates heat dissipation, according to the present invention.

[0036] Figure 4 This utility model Figure 2 Enlarged view of point A in the middle;

[0037] Figure 5 This utility model Figure 3 Enlarged diagram of point B in the middle.

[0038] Reference numerals: 1. Outer frame; 2. Buffer pad; 3. LCD panel; 4. Heat dissipation hole; 5. Dustproof mesh; 6. Sealing ring; 7. Backlight module; 8. Back plate; 9. Heat dissipation fins; 10. Graphene heat sink; 11. Circular thermal conductive silicone pad; 12. L-shaped heat pipe; 13. Copper pillar; 14. Thermal conductive silicone; 15. Ultra-thin heat sink; 16. Thermal strip; 17. Drive circuit; 18. Thermistor. Detailed Implementation

[0039] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the description of the textual part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0040] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0041] In the description of this utility model, terms such as greater than, less than, and exceeding are understood to exclude the stated number, while terms such as above, below, and within are understood to include the stated number. The use of terms like "first" and "second" is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the quantity or sequence of the indicated technical features.

[0042] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0043] Please see Figure 1-5 This utility model provides a technical solution: a liquid crystal display screen that facilitates heat dissipation, including an outer frame 1 and a liquid crystal panel 3. The liquid crystal panel 3 is disposed inside the upper part of the outer frame 1. A sealing ring 6 is sleeved on the outer side of the liquid crystal panel 3. The outer frame 1 is fixedly connected through the sealing ring 6 on the outer side of the liquid crystal panel 3. Buffer pads 2 are fixedly connected to the four corners of the outer frame 1 on the side closest to the wall. The buffer pads 2 at the four corners of the outer frame 1 on the side closest to the wall are fixedly connected. On the one hand, the 2-3mm height support forms a convection gap between the outer frame 1 and the wall, preventing the back plate 8 and heat dissipation fins 9 from sticking to the wall and blocking airflow. On the other hand, the elastic material absorbs the vibration of the wall, preventing the heat dissipation components such as the L-shaped heat pipe 12 and the graphene heat sink 10 from falling off due to vibration, thus ensuring the stability of the heat dissipation structure.

[0044] A backlight module 7 is fixedly connected to the middle below the LCD panel 3. A driving circuit 17 is provided on the right side of the backlight module 7 and is fixedly connected to the LCD panel 3. A set of circular thermal conductive silicone pads 11 are fixedly connected to the middle below the backlight module 7. A graphene heat sink 10 is fixedly connected below the set of circular thermal conductive silicone pads 11.

[0045] An ultra-thin heat spreader 15, the same size as the driving circuit 17, is fixedly connected below the driving circuit 17. Thermally conductive silicone 14 is fixedly connected below the ultra-thin heat spreader 15. The driving circuit 17 is fixedly connected to the thermally conductive silicone 14 located below the ultra-thin heat spreader 15. Three L-shaped heat pipes 12 are fixedly connected to both sides of the driving circuit 17, and copper pillars 13 are fixedly connected to the outer sides of each L-shaped heat pipe 12. The L-shaped heat pipes 12 are fixedly connected to the thermally conductive silicone 14 located on the copper pillars 13. The lower end of the L-shaped heat pipes 12 is fixedly connected to the back plate 8. The driving circuit 17 is fixedly connected to the back plate 8 located below the L-shaped heat pipes 12. The ultra-thin heat spreader 15, the same size as the driving circuit 17, is fixedly connected below the driving circuit 17, covering the entire area of ​​the driving plate through "surface bonding." This addresses the localized high-temperature heat generated by the driving circuit 17. Through the phase change of the working fluid in the microchannels inside the ultra-thin heat spreader 15, it quickly diffuses to the entire surface of the heat spreader, so that the surface temperature of the drive circuit 17 is uniformly reduced to 65-70℃, eliminating the "local hot spots of the T-Con chip". The three sets of L-shaped heat pipes 12 on the left and right sides of the drive circuit 17, a total of 6 pipes, are fixed to the outside of the L-shaped heat pipes 12 by copper pillars 13 and fixed to the bottom of the ultra-thin heat spreader 15 by thermally conductive silicone 14. The uniform heat of the ultra-thin heat spreader 15 is first transferred to the copper pillars 13 through the thermally conductive silicone 14, and then introduced into the evaporation section (horizontal section, close to the drive circuit 17 side) of the L-shaped heat pipes 12. After the working fluid inside the L-shaped heat pipes 12 absorbs heat, it undergoes phase change and vaporization, and flows quickly along the internal grooves of the heat pipes to the lower end of the vertical section. Finally, the heat is transferred to the back plate 8 fixedly connected to the lower end of the L-shaped heat pipes 12, realizing "cross-regional heat conduction".

[0046] A heat-conducting strip 16 is fixedly connected to the right side of the backlight module 7, and four of them are arranged in a linear array, each set on one side of the L-shaped heat pipe 12. The right end of the heat-conducting strip 16 is fixedly connected to the driving circuit 17. The backlight module 7 is fixedly connected to the driving circuit 17 set at the right end of the heat-conducting strip 16.

[0047] A set of heat dissipation fins 9 are fixedly installed inside the lower part of the outer frame 1. A back plate 8 is fixedly connected above the heat dissipation fins 9. A set of heat dissipation holes 4 are opened on the bottom surface of the outer frame 1, and a dustproof mesh 5 is fixedly installed in each heat dissipation hole 4. The back plate 8 is fixed above the heat dissipation fins 9, and the heat introduced by the L-shaped heat pipe 12 is evenly diffused to the heat dissipation fins 9 below as a set of array fins: the heat dissipation fins 9 transfer heat to the air inside the outer frame 1 through "large surface area convection", and the total fin area is 2.5-3 times that of the back plate 8. At the same time, the heat dissipation holes 4 on the bottom surface of the outer frame 1 form a natural convection path of "bottom air intake → internal air flow → top air exhaust". After the cold air enters from the heat dissipation holes 4, it flows through the heat dissipation fins 9, takes away the heat and is discharged from the top gap of the outer frame 1, completing the final dissipation of heat from the drive circuit 17.

[0048] A thermistor 18 is fixedly connected to one end of the backlight module 7 and the heat-conducting strip 16.

[0049] Working principle: The buffer pads 2 at the four corners of the outer frame 1 near the wall are fixedly connected. On the one hand, the 2-3mm height support forms a convection gap between the outer frame 1 and the wall, preventing the back plate 8 and heat dissipation fins 9 from sticking to the wall and blocking airflow. On the other hand, the elastic material absorbs the vibration of the wall, preventing the L-shaped heat pipe 12, graphene heat sink 10 and other heat dissipation components from falling off due to vibration, thus ensuring the stability of the heat dissipation structure.

[0050] After the sealing ring 6 on the outer side of the LCD panel 3 is fitted, it is fixed to the outer frame 1, thus forming a closed-loop seal between the LCD panel and the outer frame 1. This prevents bedroom dust from entering from the front of the screen. The dustproof mesh 5 inside the heat dissipation holes 4 on the bottom surface of the outer frame 1 is fixedly installed and can block more than 90% of 0.5-3μm dust from entering the interior of the outer frame 1. This prevents dust accumulation on the heat dissipation fins 9 and L-shaped heat pipes 12, which would reduce heat dissipation efficiency and meet IP5X dustproof requirements.

[0051] The ultra-thin heat spreader 15, which is fixedly connected below the driving circuit 17, covers the entire area of ​​the driving board through "surface bonding": the local high temperature heat generated by the driving circuit 17 is rapidly diffused to the entire surface of the heat spreader through the phase change of the working fluid in the microchannel inside the ultra-thin heat spreader 15, so that the surface temperature of the driving circuit 17 is uniformly reduced to 65-70℃, eliminating the "local hot spots of the T-Con chip". The three sets of L-shaped heat pipes 12 on the left and right sides of the driving circuit 17, a total of 6 pipes, are fixed to the outside of the L-shaped heat pipes 12 by copper pillars 13 and fixed to the bottom of the ultra-thin heat spreader 15 with thermally conductive silicone 14 and tightly bonded: the uniform heat of the ultra-thin heat spreader 15 is first transferred to the copper pillars 13 through the thermally conductive silicone 14, and then introduced into the evaporation section of the L-shaped heat pipes 12. After the working fluid inside the L-shaped heat pipes 12 absorbs heat, it undergoes phase change and vaporization, and flows rapidly along the internal grooves of the heat pipes to the lower end of the vertical section, and finally transfers the heat to the back plate 8 fixedly connected to the lower end of the L-shaped heat pipes 12, realizing "cross-regional heat conduction".

[0052] The backplate 8 is fixed above the heat dissipation fins 9, and the heat introduced by the L-shaped heat pipe 12 is evenly diffused to the heat dissipation fins 9 below as a group of array fins: the heat dissipation fins 9 transfer heat to the air inside the outer frame 1 through "large surface area convection" and the total fin area is 2.5-3 times that of the backplate 8. At the same time, the heat dissipation holes 4 on the bottom surface of the outer frame 1 form a natural convection path of "bottom air intake → internal air flow → top air exhaust". After entering through the heat dissipation holes 4, the cold air flows through the heat dissipation fins 9, takes away the heat and is discharged from the top gap of the outer frame 1, completing the final dissipation of heat from the drive circuit 17.

[0053] A set of circular thermally conductive silicone pads 11 are fixedly connected in the middle of the bottom of the backlight module 7, precisely corresponding to the high-power area with an LED density of ≥20 LEDs / cm²: the silicone pads fill the tiny gap between the backlight module 7 and the graphene heat sink 10, efficiently transferring the local heat of the high-density LEDs to the graphene heat sink 10 below, while the non-high-density LED areas are directly contacted and heated through the graphene heat sink 10, ensuring that the heat of all LEDs is transferred without dead corners.

[0054] The graphene heat spreader 10 is fixed below the circular thermally conductive silicone pad 11. Utilizing its high thermal conductivity (≥1500W / m・K), it evenly diffuses the heat from the backlight module 7 to the entire surface of the heat spreader, stabilizing the surface temperature at 60-65℃ and preventing localized overheating of the LEDs that could lead to light decay. The graphene heat spreader 10 is attached to the backplate 8 below and indirectly conducts heat through the backplate 8 above the heat sink 9, transferring 60% of the backlight heat to the backplate 8 → heat sink 9. The heat dissipation path of the backlight module 7 is combined with that of the drive circuit 17 and dissipated through the heat dissipation hole 4. The four sets of linear array heat conduction strips 16 on the right side of the backlight module 7 are fixedly connected to transfer 15%-20% of the backlight heat to the drive circuit 17 on the right side. One end of the heat conduction strip 16 is fixed to the backlight module 7 and the other end is fixed to the drive circuit 17, so that the backlight heat shares the heat dissipation path of the L-shaped heat pipe 12 of the drive circuit 17, further improving the heat dissipation redundancy and avoiding local heat accumulation in the graphene heat spreader 10.

[0055] The heat generated by the LCD panel 3 mainly comes from the edge pixel driving circuit 17. Heat dissipation is achieved through "indirect heat conduction + shared heat dissipation channel". The bonding surface between the LCD panel 3 and the backlight module 7 transfers 5-10W of auxiliary heat to the backlight module 7 through heat conduction. Then the heat is dissipated synchronously along the heat dissipation path of the backlight module 7 (circular thermal conductive silicone pad 11 → graphene heat dissipation sheet 10 → back plate 8 / thermal conductive strip 16). There is no need to design a separate heat dissipation structure, which simplifies the overall layout and avoids the excessive temperature of the panel edge affecting the pixel response speed.

[0056] The thermistor 18 is fixedly installed at the connection end between the backlight module 7 and the heat conduction strip 16. It monitors the temperature of the core area of ​​the backlight module 7 in real time and feeds it back to the temperature control unit (model: STM32L051MCU) of the drive circuit 17 through an electrical signal to achieve a dynamic balance between heat generation and heat dissipation. When the temperature of the backlight module 7 is detected to be >55℃, the temperature control unit reduces the brightness of the LED beads of the backlight module 7 through a PWM signal, thereby reducing the backlight power consumption by 10-15W and reducing the heat dissipation requirement. When the temperature drops below 50℃, the temperature control unit automatically restores the backlight brightness to ensure that the display effect is not affected. This logic can avoid overload of the heat dissipation system in an extreme bedroom environment of 40℃ and ensure long-term stable operation of the screen.

[0057] Structural Description:

[0058] Outer frame 1: Made of ABS engineering plastic in one piece, the outermost layer of the screen, wrapping all internal components, serving as a structural carrier, fixing all internal components, ensuring the overall structure is stable, providing an installation base for heat dissipation holes and buffer pads, suitable for wall-mounted scenarios, please provide me with a copy according to this format;

[0059] Buffer pad 2: Made of aging-resistant silicone rubber with anti-slip texture on the surface, there are 4 pads in total. The four corners of the outer frame 1 are close to the wall side and are embedded in the pre-set installation groove of the outer frame, and are flush with the surface of the outer frame without protruding. It serves as a support for the wall-mounting gap and an anti-vibration component. By ensuring that the outer frame 1 forms a convection gap with the wall, it prevents the back plate 8 and heat dissipation fins 9 from sticking to the wall and blocking airflow. At the same time, it absorbs common wall vibrations of 5-10Hz and prevents heat dissipation components such as L-shaped heat pipe 12 and graphene heat sink 10 from falling off due to vibration, thus ensuring the stability of the heat dissipation structure.

[0060] LCD panel 3: It adopts an IPS / VA / TN type display panel. The front is the visible surface and the back is the non-visible mounting surface. The upper part of the inner side of the outer frame 1 is fixed to the outer frame 1 by the sealing ring 6. The lower part of the back corresponds to the backlight module 7, which is the core display component. It controls the light to form the image through pixel deflection. The back provides the mounting base for the backlight module 7 and the driving circuit 17, and at the same time transfers the heat of its own edge driving circuit to the backlight module, sharing the heat dissipation path.

[0061] Ventilation holes 4 are circular holes, evenly distributed along the bottom surface of the outer frame 1. They penetrate the thickness of the outer frame wall, with the inner side corresponding to the area of ​​the heat dissipation fins 9 and the outer side connecting to the air in the bedroom. As a natural convection channel, they form a path of "bottom air intake → internal convection → top air exhaust", allowing cool air to enter the interior of the outer frame 1 from the ventilation holes 4, flow through the heat dissipation fins 9 to carry away heat, and then be discharged from the top gap of the outer frame 1. This is the key support for the convection heat dissipation of the heat dissipation fins 9.

[0062] Dustproof mesh 5: It is a G4 grade primary keel filter mesh, made of "nylon + metal mesh" composite structure. Its size is adapted to the heat dissipation holes 4. Inside each heat dissipation hole 4, it is fixed to the inner side of the bottom surface of the outer frame 1 by a buckle, completely covering the heat dissipation holes 4. As a dustproof protection component, it prevents dust from entering the inner side of the outer frame 1 and attaching to the heat dissipation fins 9 and L-shaped heat pipes 12. At the same time, it meets the IP5X dustproof rating and does not affect the ventilation of the heat dissipation holes 4.

[0063] Sealing ring 6: Made of silicone rubber, its size is adapted to the outer edge of the LCD panel 3. It fits tightly against the inner wall of the outer frame 1 after being sleeved on the outer side of the LCD panel 3, forming a closed-loop seal. As a sealing and fixing component, it prevents bedroom dust from entering the core area of ​​the screen through the gap between the LCD panel 3 and the outer frame 1. At the same time, it fixes the LCD panel 3 to the outer frame 1 stably through a compression rate of 20%-30%, avoiding damage caused by hard contact between the panel and the frame.

[0064] Backlight module 7: Composed of MiniLED lamp beads, diffusion film, and brightness enhancement film, located in the middle below the LCD panel 3. The back is attached to the circular thermal conductive silicone pad 11 and graphene heat sink 10, and the right side is connected to the driving circuit 17 and heat conduction strip 16. As a light source and heat dissipation component, it provides uniform light source for the LCD panel 3. Through the thermal conductive silicone pad 11 on the back and the heat conduction strip 16 on the side, it efficiently conducts the 25-75W of heat generated by itself to the heat dissipation system, avoiding light decay of the lamp beads.

[0065] Backplate 8: Made of 5052 aluminum alloy with an anodized surface, it is integrally formed above the heat dissipation fins 9. The upper surface is bonded to the graphene heat spreader 10 and L-shaped heat pipe 12 with thermal grease, serving as the heat conduction center and structural support. It receives the heat from the drive circuit conducted by the L-shaped heat pipe 12 and the backlight heat conducted by the graphene heat spreader 10, and evenly diffuses it to the heat dissipation fins 9 below. At the same time, it provides a mounting base for the graphene heat spreader 10 and L-shaped heat pipe 12, ensuring the stability of the heat dissipation components.

[0066] Heat dissipation fins 9: integrally formed with backplate 8, with the same length and width as backplate 8, located below backplate 8, inside the lower part of outer frame 1, corresponding to the heat dissipation hole 4 area on the bottom surface of outer frame 1. As a core heat dissipation component, the total area is 2.5-3 times the surface area of ​​backplate 8, greatly increasing the contact area with air, improving convection heat dissipation efficiency by 60%, and quickly dissipating the heat transferred by backplate 8 to the bedroom environment through natural convection, bearing 70% of the total heat dissipation.

[0067] Graphene heat spreader 10: This is a flexible graphene film with an area exactly the same as that of the backlight module 7. It is located below the circular thermally conductive silicone pad 11, with its upper surface attached to the silicone pad 11 and its lower surface attached to the backplate 8 via thermally conductive silicone grease. Its edge overlaps with the ultra-thin heat spreader 15. As a heat spreader and heat transfer component, it evenly diffuses the dispersed heat of the backlight module 7 to the entire surface of the heat spreader, reducing the surface temperature difference of the backlight module 7 from 15-20℃ to 3-5℃, thus preventing overheating in the high-density LED bead area. At the same time, it transfers 60% of the backlight heat to the backplate 8 and 10%-15% of the heat to the ultra-thin heat spreader 15, achieving dual-path heat dissipation.

[0068] Circular thermally conductive silicone pad 11: Made of high thermal conductivity silicone material, its quantity matches the high-density LED bead area of ​​the backlight module 7, located in the middle below the backlight module 7, corresponding only to the high-power area with an LED bead density ≥20 beads / cm². The upper surface is covered with LED beads, and the lower surface is covered with a graphene heat sink 10. As a local thermal conductivity enhancement component, it fills the tiny gaps between the LED beads of the backlight module 7 and the graphene heat sink 10, eliminating the thermal resistance caused by air gaps. It enhances the thermal conductivity efficiency for the concentrated heat in the high-density LED bead area, preventing the local LED bead temperature from exceeding 75℃.

[0069] L-shaped heat pipe 12: Made of pure copper, L-shaped, 6 in total, 3 on each side of the drive circuit 17. On both sides of the drive circuit 17, the evaporation section is attached to the ultra-thin heat spreader 15 through copper pillars 13 and thermally conductive silicone 14. The condensation section is fixedly connected to the back plate 8. As a cross-regional heat conduction component, it quickly conducts the heat after the ultra-thin heat spreader 15 has been homogenized (from 85℃ to 65-70℃) to the back plate 8, realizing cross-level heat transfer between the drive circuit and the back plate. The heat conduction capacity of a single heat pipe is ≥25W, and the total heat conduction capacity of 6 heat pipes is ≥150W, which meets the heat dissipation requirements of the drive circuit of 25-35W.

[0070] Copper pillar 13: Made of pure copper, one pillar is fixed to the outside of each L-shaped heat pipe 12, for a total of 6 pillars. The side of the L-shaped heat pipe 12 close to the ultra-thin heat spreader 15 has one end welded to the L-shaped heat pipe 12 and the other end attached to the ultra-thin heat spreader 15 through thermally conductive silicone 14. As a thermally conductive contact enhancement component, it avoids the "line contact" defect when the L-shaped heat pipe 12 and the ultra-thin heat spreader 15 are directly attached, and transforms it into "surface contact", reducing the gap thermal resistance between the heat pipe and the heat spreader and ensuring efficient heat transfer.

[0071] Thermally conductive silicone 14: This is a high thermally conductive silicone, consisting of two parts. It is located below the ultra-thin heat spreader 15 and on the surface of the copper pillar 13. The first part covers the contact area between the ultra-thin heat spreader 15 and the copper pillar 13, while the second part fills the gap between the copper pillar 13 and the ultra-thin heat spreader 15. As a gap filler and thermal conductive medium, it eliminates the tiny gaps between the ultra-thin heat spreader 15 and the copper pillar 13, and between the copper pillar 13 and the L-shaped heat pipe 12, preventing air insulation and ensuring that the heat from the ultra-thin heat spreader 15 is efficiently transferred to the L-shaped heat pipe 12 through the copper pillar 13 without heat loss.

[0072] Ultra-thin heat spreader 15: It is a copper microchannel structure with an effective area consistent with the driving circuit 17. It is filled with deionized water / liquid metal and located below the driving circuit 17. Its upper surface is attached to the driving circuit 17 through thermal grease, and its lower surface is connected to the copper pillar 13 and L-shaped heat pipe 12 through thermal silicone 14. As a concentrated heat source heat spreader, it evenly diffuses the concentrated heat of the driving circuit 17 to the entire surface of the heat spreader, so that the surface temperature of the driving circuit 17 drops to 65-70℃, eliminating the aging effect of "hot spots" on the chip. At the same time, it evenly distributes the heat after heat spread to the 6 L-shaped heat pipes 12 to avoid excessive load on a single heat pipe.

[0073] Heat-conducting strip 16: Made of pure copper, arranged in a linear array of 4 groups, located on the right side of the backlight module 7. One end is welded and fixed to the backlight module 7, and the other end is welded and fixed to the drive circuit 17. Each group corresponds to one side of an L-shaped heat pipe 12, serving as a heat-sharing component. It transfers 15%-20% of the heat from the backlight module 7 to the drive circuit 17, sharing the heat dissipation path of the L-shaped heat pipe 12. This increases redundancy for backlight heat dissipation and shortens the heat conduction distance, preventing the backlight heat from relying solely on the single path of graphene heat sink 10 → back plate 8, thus reducing heat transfer loss.

[0074] The driving circuit 17 is a PCB circuit board containing a T-Con chip and a backlight driving chip. It is fixed to the back edge of the LCD panel 3 on the right side of the backlight module 7 and is directly connected to the ultra-thin heat spreader 15, L-shaped heat pipe 12, and heat conduction strip 16. It serves as the control center and centralized heat source carrier, receiving external signals and converting them into pixel control signals for the LCD panel 3 and dimming signals for the backlight module 7. At the same time, the T-Con chip generates 25-35W of concentrated heat, which is efficiently discharged through the ultra-thin heat spreader 15 below and the L-shaped heat pipes 12 on both sides to avoid overheating failure.

[0075] Thermistor 18: A 0402 packaged NTC thermistor with an operating temperature range of -55-125℃. It is the connection point between the backlight module 7 and the heat-conducting strip 16. It is fixed by surface mount soldering and is close to the core LED area of ​​the backlight module 7. As a temperature monitoring and safety protection component, it collects the temperature of the core area of ​​the backlight module 7 in real time to provide data support for temperature control. When the detected temperature is >55℃, it feeds back a signal to the temperature control unit of the drive circuit 17 to trigger the backlight brightness to reduce heat dissipation. When the temperature is <50℃, the brightness is restored to balance heat dissipation and display effect.

[0076] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A liquid crystal display screen with easy heat dissipation, comprising an outer frame (1) and a liquid crystal panel (3), characterized in that: The liquid crystal panel (3) is disposed inside the upper part of the outer frame (1). A sealing ring (6) is fitted on the outer side of the liquid crystal panel (3). The outer frame (1) is fixedly connected to the liquid crystal panel (3) through the sealing ring (6). Buffer pads (2) are fixedly connected to the four corners of the outer frame (1) on the side closest to the wall. A set of heat dissipation fins (9) are fixedly installed inside the lower part of the outer frame (1). A back plate (8) is fixedly connected above the heat dissipation fins (9). A set of heat dissipation holes (4) are opened on the bottom surface of the outer frame (1). A dustproof mesh (5) is fixedly installed in each heat dissipation hole (4). A backlight module (7) is fixedly connected to the middle of the lower part of the liquid crystal panel (3). A driving circuit (17) is provided on the right side of the backlight module (7), and the driving circuit (17) is fixedly connected to the liquid crystal panel (3). A set of circular thermal conductive silicone pads (11) is fixedly connected to the middle of the lower part of the backlight module (7), and a graphene heat sink (10) is fixedly connected below the set of circular thermal conductive silicone pads (11).

2. The liquid crystal display screen with heat dissipation as described in claim 1, characterized in that: An ultra-thin heat spreader plate (15) is fixedly connected below the driving circuit (17), and the size of the ultra-thin heat spreader plate (15) is the same as that of the driving circuit (17). A thermally conductive silicone rubber (14) is fixedly connected below the ultra-thin heat spreader plate (15), and the driving circuit (17) is fixedly connected to the ultra-thin heat spreader plate (15) through the thermally conductive silicone rubber (14).

3. A liquid crystal display screen with heat dissipation as described in claim 2, characterized in that: The driving circuit (17) has three sets of L-shaped heat pipes (12) fixedly connected to both the left and right sides. Copper pillars (13) are fixedly connected to the outer side of each L-shaped heat pipe (12). The L-shaped heat pipe (12) is fixedly connected to the thermally conductive silicone (14) through the copper pillars (13). The lower end of the L-shaped heat pipe (12) is fixedly connected to the back plate (8). The driving circuit (17) is indirectly fixedly connected to the back plate (8) through the L-shaped heat pipe (12).

4. A liquid crystal display screen with heat dissipation as described in claim 3, characterized in that: A heat-conducting strip (16) is fixedly connected to the right side of the backlight module (7). The heat-conducting strip (16) is arranged in a linear array of four groups, and each group of heat-conducting strips (16) is located on one side of the L-shaped heat pipe (12). The right end of the heat-conducting strip (16) is fixedly connected to the driving circuit (17). The backlight module (7) is fixedly connected to the driving circuit (17) through the heat-conducting strip (16).

5. A liquid crystal display screen with heat dissipation as described in claim 4, characterized in that: The heat dissipation fins (9) are integrally formed with the back plate (8), and the total area of ​​the heat dissipation fins (9) is 2.5-3 times the surface area of ​​the back plate (8).

6. A liquid crystal display screen with heat dissipation as described in claim 5, characterized in that: The set of circular thermally conductive silicone pads (11) are set in the high-power area of ​​the backlight module (7) with a lamp bead density of ≥20 beads / cm². The area of ​​the graphene heat spreader (10) is the same as the area of ​​the backlight module (7).

7. A liquid crystal display screen with heat dissipation as described in claim 6, characterized in that: The ultrathin heat spreader (15) is filled with deionized water or liquid metal working fluid. The number of L-shaped heat pipes (12) is 6. The evaporation section of the L-shaped heat pipe (12) is close to the driving circuit (17), and the condensation section of the L-shaped heat pipe (12) is fixedly connected to the back plate (8).

8. A liquid crystal display screen with heat dissipation as described in claim 7, characterized in that: A thermistor (18) is fixedly connected to the connection end of the backlight module (7) and the heat-conducting strip (16).

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