A leveling mechanism for a wafer warping exposure machine

Abstract

The utility model belongs to the field of exposure machine, specifically speak a kind of for the levelling mechanism of exposure machine warping wafer, including bottom plate, the edge at the top of bottom plate is fixedly connected with side plate, one side of side plate is fixedly connected with slide rail, the surface of slide rail is fixedly connected with clamping assembly, the top of bottom plate is rotatably connected with detection assembly, the surface of side plate is fixedly connected with the one side of apron close to slide rail, the structure design of detection assembly, before using the levelling mechanism, wafer is placed on apron and is fixed after through clamping assembly, B servo motor is connected to power supply and is energized, makes B driving rod drive screw rod rotation, and according to the direction of screw rod rotation through thread barrel driving connecting ring whole ascension or decline, and then adjust the height of laser emitter and laser sensor to the top of wafer and carry out warping detection, to make levelling mechanism can carry out warping detection to different thickness wafer, improve the applicability of the levelling device.

Description

Technical Field

[0001] This utility model relates to the field of exposure machines, specifically a leveling mechanism for warped wafers in exposure machines. Background Technology

[0002] The exposure machine is one of the most critical pieces of equipment in semiconductor manufacturing. It is used to precisely transfer the designed circuit pattern onto the photoresist layer on the surface of the wafer. It is a key link in chip manufacturing that determines the process accuracy. The wafer leveling mechanism is a key piece of equipment in the semiconductor manufacturing and packaging process. It is used to correct the warping of the wafer caused by stress, temperature or process steps.

[0003] In the prior art, such as in publication number CN218004786U, a wafer warpage leveling device is disclosed. It includes an upper pressure member and a lower pressure member arranged opposite to each other, which can move closer together and further apart. The opposing surfaces of the upper and lower pressure members are planar. An array of first pressure sensors is arranged on the opposing surfaces of the upper and lower pressure members. The first pressure sensors transmit pressure information when in contact with a warped area of ​​the wafer. A heating module is arranged next to the first pressure sensors. When the first pressure sensor contacts the warped area of ​​the wafer, the heating module is activated and begins heating. Limiting posts are provided on the opposing surfaces of the upper or lower pressure members. The aforementioned patent describes a first pressure sensor positioned on the opposing surfaces of the upper and lower pressure components. When the first pressure sensor contacts the warped end of the wafer, a heating module located next to the sensor is activated to preheat the wafer, rapidly raising the ambient temperature to the operating temperature required for wafer leveling. This heating gradually improves the warping. However, this leveling device is not convenient for aligning and fixing the wafer before leveling, reducing the leveling accuracy. Furthermore, the degree of wafer warping needs to be detected before leveling, and this device is not suitable for detecting warping on wafers of different thicknesses, reducing its applicability. Therefore, to address these issues, a leveling mechanism for warped wafers in an exposure machine is proposed. Utility Model Content

[0004] To overcome the shortcomings of existing technologies and solve the problems of inconvenience in centering and fixing wafers before leveling and inconvenience in detecting warpage of wafers of different thicknesses, this utility model proposes a leveling mechanism for warped wafers in an exposure machine.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: The flattening mechanism for warped wafers in an exposure machine, as described in this utility model, includes a base plate; a side plate is fixedly connected to the top edge of the base plate, a slide rail is fixedly connected to one side of the side plate, a clamping assembly is fixedly connected to the surface of the slide rail, a detection assembly is rotatably connected to the top of the base plate, a top plate is rotatably connected to the top of the detection assembly, a flattening structure is connected through the surface of the top plate, and a step plate is fixedly connected to the side of the side plate near the slide rail. The clamping assembly includes a slider slidably connected to the surface of the slide rail, a support plate fixedly connected to the top of the slider, a soft clamping block rotatably connected to the edge of the top of the support plate, a threaded rod threadedly connected to one side of the slider, a transmission rod A fixedly connected to one end of the threaded rod, and a splined connection of one end of the transmission rod A to the output end of the servo motor A. The detection assembly includes a lead screw rotatably connected to the top of the base plate, a B transmission rod fixedly connected to the top of the lead screw, a splined connection at the top of the B transmission rod to the output end of the B servo motor, a threaded cylinder threadedly connected to the surface of the lead screw, a connecting ring fixedly connected to one side of the threaded cylinder, a cylinder fixedly connected to the surface of the connecting ring, a laser emitter fixedly connected to the other side of the threaded cylinder, and a laser sensor fixedly connected to the side of the cylinder facing the laser emitter.

[0006] Preferably, the surface of the A servo motor is fixedly connected to the A motor box, one side of the A motor box is fixedly connected to a side plate, and the surface of the A transmission rod is connected through the side plate.

[0007] Preferably, a B motor housing is fixedly connected to the surface of the B servo motor, a top plate is fixedly connected to the bottom of the B motor housing, and the top plate is connected through the surface of the B transmission rod.

[0008] Preferably, the connecting ring has grooves on both sides, and protrusions are slidably connected to the surface of the grooves. A side plate is fixedly connected to one side of each protrusion.

[0009] Preferably, a limiting block is fixedly connected to the bottom of the protrusion, and a side plate is fixedly connected to one side of the limiting block.

[0010] Preferably, a vertical rod is slidably connected to the inner surface of the cylinder, a top plate is fixedly connected to the top of the vertical rod, and a bottom plate is fixedly connected to the bottom of the vertical rod.

[0011] The advantages of this utility model are: 1. Through the structural design of the clamping component, this utility model allows the wafer to be placed on the mounting plate before using the leveling mechanism. Then, the A servo motor is connected to the power supply and powered on, causing the A transmission rod to drive the threaded rod to rotate. Through the setting of two opposite threads, the two sliders can be pushed to slide synchronously along the slide rail towards the wafer, and the soft clamping block is rotated and deformed. The wafer is centered and fixed by four-point pressing, so that the leveling mechanism can center and fix the wafer before leveling, thus improving the accuracy of the leveling work. 2. Through the structural design of the detection component, this utility model allows the wafer to be placed on the mounting plate and fixed by the clamping component before using the leveling mechanism. Then, the B servo motor is connected to the power supply, causing the B transmission rod to drive the lead screw to rotate. Depending on the direction of the lead screw rotation, the connecting ring is raised or lowered as a whole through the threaded cylinder. This adjusts the height of the laser emitter and the laser sensor to detect warpage on the top of the wafer. As a result, the leveling mechanism can detect warpage on wafers of different thicknesses, improving the applicability of the leveling device. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the disassembled structure of this utility model; Figure 3 This is a schematic diagram of the clamping component structure of this utility model; Figure 4 This is a schematic diagram of the detection component structure of this utility model.

[0014] In the diagram: 1. Base plate; 2. Side plate; 3. Slide rail; 4. Clamping assembly; 401. Slider; 402. Support plate; 403. Soft clamping block; 404. Threaded rod; 405. A transmission rod; 406. A servo motor; 5. Detection assembly; 501. Lead screw; 502. B transmission rod; 503. B servo motor; 504. Threaded cylinder; 505. Connecting ring; 506. Cylinder; 507. Laser emitter; 508. Laser sensor; 6. Top plate; 7. Flattening structure; 8. Step plate; 9. A motor box; 10. B motor box; 11. Protrusion; 12. Limiting block; 13. Vertical rod. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0016] Please see Figures 1-4 As shown, a leveling mechanism for warped wafers in an exposure machine includes a base plate 1; a side plate 2 is fixedly connected to the top edge of the base plate 1, a slide rail 3 is fixedly connected to one side of the side plate 2, a clamping assembly 4 is fixedly connected to the surface of the slide rail 3, a detection assembly 5 is rotatably connected to the top of the base plate 1, a top plate 6 is rotatably connected to the top of the detection assembly 5, a flattening structure 7 is connected through the surface of the top plate 6, and a step plate 8 is fixedly connected to the side of the side plate 2 near the slide rail 3. The clamping assembly 4 includes a slider 401 slidably connected to the surface of the slide rail 3, a support plate 402 fixedly connected to the top of the slider 401, a soft clamping block 403 rotatably connected to the edge of the top of the support plate 402, a threaded rod 404 threadedly connected to one side of the slider 401, an A transmission rod 405 fixedly connected to one end of the threaded rod 404, and a splined connection of one end of the A transmission rod 405 to the output end of the A servo motor 406. The detection assembly 5 includes a lead screw 501 rotatably connected to the top of the base plate 1. A B transmission rod 502 is fixedly connected to the top of the lead screw 501. The top of the B transmission rod 502 is splinedly connected to the output end of the B servo motor 503. A threaded cylinder 504 is threadedly connected to the surface of the lead screw 501. A connecting ring 505 is fixedly connected to one side of the threaded cylinder 504. A cylinder 506 is fixedly connected to the surface of the connecting ring 505. A laser emitter 507 is fixedly connected to the other side of the threaded cylinder 504. A laser sensor 508 is fixedly connected to the side of the cylinder 506 facing the laser emitter 507. During operation, thanks to the structural design of the clamping assembly 4, the wafer is placed on the mounting plate 8 before using the leveling mechanism. Then, the A servo motor 406 is connected to the power supply, causing the A transmission rod 405 to drive the threaded rod 404 to rotate. Through the two opposing threaded configurations, two sliders 401 can be simultaneously pushed to slide synchronously along the slide rail 3 towards the wafer, causing the soft clamping block 403 to rotate and deform. The wafer is centered and fixed through four-point compression, enabling the leveling mechanism to center and fix the wafer before leveling, thus improving the accuracy of the leveling work. This is verified by the inspection group. The structural design of component 5 allows the wafer to be placed on the mounting plate 8 and fixed by the clamping assembly 4 before using the leveling mechanism. Then, the B servo motor 503 is connected to the power supply and powered on, causing the B transmission rod 502 to drive the lead screw 501 to rotate. Depending on the direction of rotation of the lead screw 501, the connecting ring 505 is raised or lowered via the threaded cylinder 504. This adjusts the height of the laser emitter 507 and the laser sensor 508 to detect warpage on the top of the wafer. This enables the leveling mechanism to detect warpage on wafers of different thicknesses, improving the applicability of the leveling device.

[0017] Furthermore, a motor box 9 is fixedly connected to the surface of servo motor A 406, a side plate 2 is fixedly connected to one side of motor box 9, and a side plate 2 is connected through the surface of transmission rod A 405. During operation, the A servo motor 406 is protected and supported by the A motor box 9.

[0018] Furthermore, the surface of the B servo motor 503 is fixedly connected to the B motor box 10, the bottom of the B motor box 10 is fixedly connected to the top plate 6, and the surface of the B transmission rod 502 is connected through the top plate 6. During operation, the B servo motor 503 is protected and supported by the B motor box 10.

[0019] Furthermore, the connecting ring 505 has grooves on both sides, and protrusions 11 are slidably connected to the surface of the grooves. A side plate 2 is fixedly connected to one side of the protrusions 11. During operation, the protrusion 11 improves the stability of the connecting ring 505 during lifting and lowering.

[0020] Furthermore, a limiting block 12 is fixedly connected to the bottom of the protrusion 11, and a side plate 2 is fixedly connected to one side of the limiting block 12. During operation, the lifting height of the connecting ring 505 can be limited by the setting of the limit block 12.

[0021] Furthermore, a vertical rod 13 is slidably connected to the inner surface of the cylinder 506, a top plate 6 is fixedly connected to the top of the vertical rod 13, and a bottom plate 1 is fixedly connected to the bottom of the vertical rod 13. During operation, the vertical rod 13 improves the stability of the lifting and lowering of the connecting ring 505, while ensuring that the laser emitter 507 and the laser sensor 508 remain at the same height during the lifting and lowering process of the connecting ring 505.

[0022] Working principle: Before using the leveling mechanism, the wafer is placed on the mounting plate 8. Then, the inspection personnel connect the A servo motor 406 to the power supply, causing the A transmission rod 405 to drive the threaded rod 404 to rotate. Through the two opposite thread settings, the two sliders 401 can be pushed to slide synchronously along the slide rail 3 towards the wafer, and the soft clamp 403 is rotated and deformed. The wafer is centered and fixed by four-point pressing. Then, the inspection personnel connect the B servo motor 503 to the power supply, causing the B transmission rod 502 to drive the lead screw 501 to rotate. According to the rotation direction of the lead screw 501, the threaded cylinder 504 drives the connecting ring 505 to rise or fall as a whole, thereby adjusting the height of the laser emitter 507 and the laser sensor 508 to detect the warping of the top of the wafer. After the detection is completed, the inspection personnel start the flattening structure 7 to level the wafer.

[0023] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, or similar improvements made within the theoretical and principle content of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A leveling mechanism for warped wafers in an exposure machine, characterized in that: Includes a base plate (1); a side plate (2) is fixedly connected to the top edge of the base plate (1), a slide rail (3) is fixedly connected to one side of the side plate (2), a clamping assembly (4) is fixedly connected to the surface of the slide rail (3), a detection assembly (5) is rotatably connected to the top of the base plate (1), a top plate (6) is rotatably connected to the top of the detection assembly (5), a flattening structure (7) is connected through the surface of the top plate (6), and a step plate (8) is fixedly connected to the side of the side plate (2) near the slide rail (3); The clamping assembly (4) includes a slider (401) slidably connected to the surface of the slide rail (3), a support plate (402) fixedly connected to the top of the slider (401), a soft clamping block (403) rotatably connected to the edge of the top of the support plate (402), a threaded rod (404) threadedly connected to one side of the slider (401), an A transmission rod (405) fixedly connected to one end of the threaded rod (404), and a splined connection of one end of the A transmission rod (405) to the output end of the A servo motor (406). The detection component (5) includes a lead screw (501) rotatably connected to the top of the base plate (1). A B transmission rod (502) is fixedly connected to the top of the lead screw (501). The top of the B transmission rod (502) is splinedly connected to the output end of the B servo motor (503). A threaded cylinder (504) is threadedly connected to the surface of the lead screw (501). A connecting ring (505) is fixedly connected to one side of the threaded cylinder (504). A cylinder (506) is fixedly connected to the surface of the connecting ring (505). A laser emitter (507) is fixedly connected to the other side of the threaded cylinder (504). A laser sensor (508) is fixedly connected to the side of the cylinder (506) facing the laser emitter (507).

2. The leveling mechanism for warped wafers in an exposure machine according to claim 1, characterized in that: The surface of the A servo motor (406) is fixedly connected to the A motor box (9), and a side plate (2) is fixedly connected to one side of the A motor box (9). The surface of the A transmission rod (405) is connected through the side plate (2).

3. A leveling mechanism for warped wafers in an exposure machine according to claim 1, characterized in that: The surface of the B servo motor (503) is fixedly connected to the B motor box (10), the bottom of the B motor box (10) is fixedly connected to the top plate (6), and the surface of the B transmission rod (502) is connected through the top plate (6).

4. A leveling mechanism for warped wafers in an exposure machine according to claim 1, characterized in that: The connecting ring (505) has grooves on both sides, and protrusions (11) are slidably connected to the surface of the grooves. A side plate (2) is fixedly connected to one side of the protrusions (11).

5. A leveling mechanism for warped wafers in an exposure machine according to claim 4, characterized in that: The bottom of the protrusion (11) is fixedly connected to a limiting block (12), and a side plate (2) is fixedly connected to one side of the limiting block (12).

6. A leveling mechanism for warped wafers in an exposure machine according to claim 1, characterized in that: A vertical rod (13) is slidably connected to the inner surface of the cylinder (506), a top plate (6) is fixedly connected to the top of the vertical rod (13), and a bottom plate (1) is fixedly connected to the bottom of the vertical rod (13).

Images