cooling system

Abstract

Embodiments of the present application provide a cooling system including a housing having a first volume and a second volume, a heat source located in the first volume, and a liquid coolant located in the first volume such that the liquid coolant is in contact with the heat source. As heat generated by the heat source is absorbed by the liquid coolant, the liquid coolant generates vapor that partially fills the second volume. A condenser located in the second volume removes heat from the vapor, thereby condensing the vapor into condensed liquid coolant that returns to the first volume. A space-filling device located in the second volume partially fills the second volume, thereby displacing vapor from a portion of the second volume. The space-filling device increases the height of the vapor, causing an increase in overlap between the vapor and the condenser, thereby increasing condenser efficiency.

Description

Technical Field

[0001] Embodiments of this utility model relate to a cooling system, and more particularly to a two-phase cooling system. Background Technology

[0002] Cooling systems are used to maintain optimal temperatures for computer systems, especially components that generate significant heat during operation, such as the central processing unit (CPU) and graphics processing unit (GPU). There are various types of cooling solutions, including air cooling, liquid cooling, and phase-change cooling. Each solution has its own advantages and is suitable for different scenarios based on factors such as performance requirements, space constraints, and budget. Liquid cooling systems are increasingly used in high-performance computing environments where traditional air cooling may not be able to dissipate the heat generated by components such as the CPU and GPU.

[0003] A key advantage of liquid cooling lies in its efficiency in transferring heat away from the heat source. Liquids have a higher heat capacity than air, allowing them to absorb more heat before reaching critical temperatures. Furthermore, liquid cooling solutions tend to operate more quietly than air-cooled solutions because they rely on pumps rather than fans for heat dissipation. This reduced noise level is particularly attractive in noise-sensitive environments. While liquid cooling systems have made progress, challenges remain, and there is an ongoing need to improve cooling systems for computer components and data systems. Utility Model Content

[0004] An embodiment of this utility model provides a cooling system comprising: a housing including a first volume and a second volume, a heat source located in the first volume, a condenser, and a space-filling device. The first volume is configured to contain a liquid coolant such that the liquid coolant is in contact with the heat source, and the second volume is configured to contain vapor partially filling the second volume. The vapor is generated by the liquid coolant when heat generated by the heat source is absorbed by the liquid coolant. The condenser is located in the second volume and configured to remove heat from the vapor, causing the vapor to condense into liquid and return to the first volume. The space-filling device, located in the second volume, partially fills the second volume and is configured to displace the vapor from a portion of the second volume.

[0005] Based on the above, the space-filling device of the cooling system in the embodiment of this utility model changes the density distribution of steam to increase the spatial overlap between steam and condenser, thereby increasing the efficiency of heat transfer coupling between steam and condenser, resulting in a corresponding improvement in the overall cooling system performance.

[0006] To make the above features and advantages of the embodiments of this utility model more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description

[0007] Figure 1A This is a vertical sectional view of a two-phase cooling system according to a comparative embodiment.

[0008] Figure 1B yes Figure 1A A top view of a two-phase cooling system, showing one configuration of the condenser.

[0009] Figure 1C Based on the comparative embodiments Figure 1A A top view of a two-phase cooling system, showing another configuration of the condenser.

[0010] Figure 2A This is a three-dimensional perspective view of a two-phase cooling system 200 in a first configuration according to various embodiments.

[0011] Figure 2B This is a three-dimensional perspective view of a two-phase cooling system 200 in a second configuration according to various embodiments.

[0012] Figure 3A This is a vertical sectional view of a two-phase cooling system in a first configuration according to various embodiments.

[0013] Figure 3B In another configuration according to various embodiments Figure 3A A vertical sectional view of a two-phase cooling system.

[0014] Figure 3C In another configuration according to various embodiments Figure 3A A vertical sectional view of a two-phase cooling system.

[0015] Figure 4A This is a vertical sectional view of a two-phase cooling system in a first configuration according to various embodiments.

[0016] Figure 4B In another configuration according to various embodiments Figure 4A A vertical sectional view of a two-phase cooling system.

[0017] Figure 5A This is a vertical sectional view of a two-phase cooling system in a first configuration according to various embodiments.

[0018] Figure 5B In another configuration according to various embodiments Figure 5A A vertical sectional view of a two-phase cooling system.

[0019] Figure 5CIn another configuration according to various embodiments Figure 5A A vertical sectional view of a two-phase cooling system.

[0020] Figure 6A This is a vertical sectional view of a two-phase cooling system in a first configuration according to various embodiments.

[0021] Figure 6B In another configuration according to various embodiments Figure 6A A vertical sectional view of a two-phase cooling system.

[0022] Figure 6C In another configuration according to various embodiments Figure 6A A vertical sectional view of a two-phase cooling system.

[0023] Figure 7A This is a vertical sectional view of a two-phase cooling system in a first configuration according to various embodiments.

[0024] Figure 7B In another configuration according to various embodiments Figure 7A A vertical sectional view of a two-phase cooling system.

[0025] Figure 7C In another configuration according to various embodiments Figure 7A A vertical sectional view of a two-phase cooling system.

[0026] Figure 8A This is a vertical cross-sectional view of a two-phase cooling system according to various embodiments.

[0027] Figure 8B According to various embodiments Figure 8A A three-dimensional perspective view of a two-phase cooling system.

[0028] Figure 9 A flowchart illustrating the operation of a method for cooling a computing device according to various embodiments.

[0029] Figure 10 A flowchart illustrating the operation of a method for cooling a computing device according to various embodiments. Detailed Implementation

[0030] The following disclosure provides numerous different embodiments or examples for implementing various features of this disclosure. Specific examples of components and arrangements are described below to simplify this disclosure. Of course, these are merely examples and are not intended to limit the scope of this disclosure. For example, in the following description, the first feature being formed "on" or "on" a second feature may include embodiments where the first and second features are formed in direct contact, or embodiments where an additional feature is formed between the first and second features such that the first and second features are not in direct contact. Furthermore, component numbers and / or letters may be repeated in various examples of this disclosure. Such repetition is for simplification and clarity of description of this disclosure, and is not intended to limit the relationship between various embodiments and / or configurations.

[0031] Furthermore, for ease of explanation, spatially relative terms such as "below," "under," "lower," "above," and "upper" may be used herein to describe the relationship between one component or feature shown in the figures and another component or feature. In addition to the orientations illustrated in the figures, these spatially relative terms also cover different orientations of the device during use or operation. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptions used therein may be interpreted in the same manner. Unless otherwise explicitly stated, each component with the same reference numerals is assumed to have the same material composition and thickness within the same thickness range.

[0032] The disclosed embodiments provide a cooling system for computer system components that offers advantages over similar cooling systems. In this regard, a two-phase cooling system is provided, comprising a liquid coolant (i.e., a first phase) that absorbs heat from the computer system components to generate steam (i.e., a second phase), which is cooled by a condenser to remove heat. A steam control device is provided that alters the density distribution of the steam to increase the spatial overlap between the steam and the condenser, thereby improving the efficiency of heat transfer coupling between the steam and the condenser. In various embodiments, the steam control device takes the form of a space-filling device, a deformable object, an inflatable bag, a fan, or an expandable container. The steam control device in each embodiment directs steam toward the condenser, thereby improving heat transfer between the steam and the condenser, resulting in a corresponding improvement in the overall cooling system performance.

[0033] Liquid cooling is increasingly being adopted for computer servers, particularly in data centers and high-performance computing (HPC) environments. While air cooling has long been the primary method for cooling servers due to its simplicity and lower initial cost, liquid cooling offers several advantages that make it attractive for certain server deployments. In data centers, energy efficiency and cooling capacity are critical considerations, and liquid cooling provides significant benefits. Liquid cooling systems can more effectively dissipate heat from server components, enabling higher-density deployments without the risk of overheating. This allows data center operators to maximize server density within the same footprint, reducing overall space requirements and lowering operating costs.

[0034] Liquid cooling can also more effectively cool high-power components such as CPUs, GPUs, and memory modules, which are increasingly common in modern server architectures. By keeping these components at their optimal operating temperatures, liquid cooling improves performance and reliability, thereby increasing overall server efficiency. Furthermore, liquid cooling reduces the need for mechanical cooling systems, such as air conditioning units, contributing to energy savings in data centers. Through liquid cooling solutions that utilize ambient or circulating water, data centers can significantly reduce power consumption and cooling costs.

[0035] The adoption of liquid cooling in server environments is growing, but it is not yet widespread. Challenges such as upfront costs, system complexity, maintenance requirements, and concerns about potential leaks or system failures may still limit the widespread adoption of liquid cooling systems. However, with the continued rise in demand for higher computing density, energy efficiency, and performance, liquid cooling is likely to become increasingly common in server deployments, especially in dedicated HPC and hyperscale data center environments.

[0036] Liquid cooling technologies include phase change cooling and two-phase cooling systems. Both phase change and two-phase cooling operate on the principle of phase change, but their implementation methods and operations differ. Phase change cooling systems use a refrigerant that undergoes a phase change from liquid to gas and then back again to effectively transfer heat away from the heat-generating components. This process involves a closed-loop system comprising a compressor, condenser, expansion valve, and evaporator. The compressor compresses the refrigerant into a high-pressure liquid, which then flows through the condenser, releasing heat and condensing the refrigerant back into a liquid. After passing through the expansion valve, the refrigerant evaporates into a low-pressure gas, absorbing heat from the cooled components. This gas then circulates back to the compressor to repeat the process.

[0037] In contrast, two-phase cooling encompasses a broader category of cooling technologies in which the liquid and vapor phases of the coolant coexist. In these systems, the coolant partially vaporizes as it absorbs heat from the component, and the resulting liquid-vapor mixture interacts with a heat exchanger (i.e., a condenser), where the vapor condenses back into liquid, releasing the absorbed heat. The condensate is then returned to the component to continue the cooling cycle. Therefore, while phase change cooling is a specific type of cooling system involving a phase change between liquid and gaseous states, two-phase cooling encompasses a wider range of technologies that utilize both the liquid and gaseous phases of the coolant simultaneously.

[0038] Figure 1A This is a vertical cross-sectional view of a two-phase cooling system 100 according to a comparative embodiment. Figure 1B yes Figure 1A A top view of a two-phase cooling system 100, showing one configuration of the condenser 101, and... Figure 1C Based on the comparative embodiments Figure 1A A top view of a two-phase cooling system, showing another configuration of the condenser 101. (See attached image.) Figure 1A As shown, the two-phase cooling system 100 includes a housing 102 having a first volume 104a and a second volume 104b. The two-phase cooling system 100 includes a heat source 106 located in the first volume 104a and a liquid coolant 108 located in the first volume 104a, such that the liquid coolant 108 is in contact with the heat source 106. As described above, the two-phase cooling system 100 can be part of a computing system, computer server, data center, etc.

[0039] When the system is operating, the heat generated by heat source 106 is absorbed by liquid coolant 108, thereby generating steam 110. For example... Figure 1A As shown, steam 110 partially fills the second volume 104b. If the system were in thermodynamic equilibrium, one might expect steam 110 to fill the second volume 104b uniformly. However, during operation, the two-phase cooling system 100 is not in thermodynamic equilibrium, but rather in a non-equilibrium steady state, in which heat absorbed from the heat source 106 through the liquid coolant 108 continuously generates steam 110. The steam 110 generated by the liquid coolant 108 is then continuously condensed into condensed liquid coolant by the condenser 101, eventually returning to the first volume 104a. In this way, heat is transferred from the heat source 106, through the liquid coolant 108, to the steam 110, to the condenser 101, and finally leaves the system.

[0040] Due to the non-equilibrium operation of the two-phase cooling system 100, the vapor 110 fills the second volume 104b non-uniformly. Instead, the vapor 110 has a density distribution characterized by a first height 112a. For example, the vapor 110 has a density distribution that decreases with distance above the surface of the liquid coolant 108, where the characteristic length scale corresponds to the first height 112a. In this regard, in some embodiments, the vapor density distribution has an exponentially decreasing density as a function of distance above the surface of the liquid coolant 108, where the first height 112a is identified as the characteristic length scale of exponential density dependence. Generally, the second volume 104b comprises a mixture of vapor 110 and air. The vapor 110 tends to reside at the bottom of the second volume 104b because it has a density greater than that of air (e.g., 0.012 g / ml) (e.g., 0.013 g / ml).

[0041] like Figure 1A and 1B As shown, condenser 101 is located near the central region 114 of the second volume 104b, such that steam 110 comes into contact with condenser 101. The condenser includes a conduit 116 through which condenser coolant (not shown) flows, such that the condenser coolant absorbs heat from a portion of the steam 110 in contact with the conduit 116. Figure 1A As shown, conduit 116 includes an inlet conduit 116a and an outlet conduit 116b that allow condenser coolant to flow into and out of condenser 101. Various materials can be used as condenser coolant, such as water, refrigerant, etc.

[0042] The degree of interaction between steam 110 and condenser 101 depends on the first height 112a of the steam. As mentioned above, the first height 112a depends on the non-equilibrium state of steam 110. Therefore, the first height 112a is a function of the rate at which heat source 106 generates heat and the rate at which condenser 101 removes heat from steam 110. The rates of heat generation and removal also depend on the temperature difference between heat source 106 and condenser 101 and the coupling efficiency between condenser 101 and steam 110. Figure 1A As shown, because the steam 110 does not completely fill the second volume 104b, the steam 110 does not completely overlap with the condenser 101.

[0043] According to various embodiments described below, a steam control device is used to increase the height of steam 110 to a second height 112b greater than the first height 112a, thereby increasing the coupling efficiency between steam 110 and condenser 101. In this regard, in some embodiments, condenser conduit 116 is formed to extend vertically above the surface of liquid coolant 108 to a third height 112c (see, for example, see...). Figure 1A , Figure 2A and Figure 2B ) coils (see, for example) Figure 1B and Figure 1C ).

[0044] like Figure 1B and Figure 1C As shown, the condenser 101 is configured such that the central section 114 of the second volume 104b is free of any components of the condenser 101. It can be advantageous to keep such a central section 114 vacant by providing space accessible during the installation and maintenance of computer system components housed in the first volume 104a. For example, as... Figure 1B As shown, the condenser 101 is located in the space adjacent to the central area 114. Alternatively, as... Figure 1C As shown, the condenser 101 is formed as a coil surrounding the central zone 114. While the central zone 114 provides convenient access for maintenance operations, its presence represents a disadvantage in terms of coupling efficiency between the condenser 101 and the steam 110. In this sense, the central zone 114 represents a volume in which there is no spatial overlap between the steam 110 and the condenser 101, and therefore no coupling between the condenser 101 and the steam 110 in the central zone 114. However, the central zone 114 provides space to accommodate a steam control device in the form of a space-filling device 202 for directing the steam 110 toward the condenser 101, as described in more detail below.

[0045] Figure 2A This is a schematic diagram of a two-phase cooling system 200 according to a first configuration of various embodiments, wherein the second volume 104b is shown in a three-dimensional perspective view, and Figure 2B This is a second configuration according to various embodiments. Figure 2A A schematic diagram of a two-phase cooling system 200. (See diagram for reference.) Figure 2A and 2B As shown, the two-phase cooling system 200 includes a housing 102 having a first volume 104a and a second volume 104b, a heat source 106 located in the first volume 104a, and a liquid coolant 108 located in the first volume 104a, bringing the liquid coolant 108 into contact with the heat source 106. When the heat generated by the heat source 106 is absorbed by the liquid coolant 108, the liquid coolant 108 generates vapor 110 that partially fills the second volume 104b. Figure 2A and 2B As shown, condenser 101 is located in the second volume 104b and is configured to remove heat from steam 110. By removing heat from steam 110, condenser 101 condenses steam 110 into condensed liquid coolant, which is then returned to the first volume 104a.

[0046] and Figures 1A to 1C Compared to the two-phase cooling system 100, the two-phase cooling system 200 also includes a space-filling device 202 located in the second volume 104b, such as... Figure 2B As shown, the space-filling device 202 partially fills the second volume 104b, thereby displacing steam 110 from a portion of the second volume 104b. The displaced steam 110 fills the area surrounding the space-filling device 202, thus increasing the height of the steam 110 from a first height 112a to a second height 112b, where the first height 112a represents the steam 110 when the space-filling device 202 is removed from the second volume 104b, and the second height 112b represents the steam 110 when the space-filling device 202 is placed within the second volume 104b.

[0047] like Figure 2A and 2B As shown, the space-filling device 202 is configured as a removable object located in the central region 114 of the second volume 104b during operation of the two-phase cooling system 200, such as Figure 2B As shown. Alternatively, the space-filling device 202 can be removed from the two-phase cooling system 200, leaving the central area 114 empty during installation and maintenance operations. Reference is made below in the corresponding embodiments. Figures 3A to 6C The various space-filling devices 202 are described in more detail.

[0048] The first height 112a of the vapor 110 above the surface of the liquid coolant is a function of the temperature of the liquid coolant 108, the temperature of the condenser 101, and specific properties of the liquid coolant 108. In a particular embodiment, the liquid coolant 108 is a fluorine-based chemical with a boiling point between 46°C and 55°C, a latent heat between 90 kJ / kg and 125 kJ / kg, and a vapor pressure between 30 kPa and 40 kPa at a temperature of approximately 20°C. Examples of chemicals that can be used as liquid coolant 108 include: HT-55 (perfluoropolyether (1-propylene, 1,1,2,3,3,3-hexafluoro-oxidative polymer)) available from Galden; Novec 7200 (ethylnonafluoroisobutyl ether) available from 3M; FC16P (1,1,1,2,2,4,5,5,5-nonafluoro-4-(trifluoromethyl))-3-pentanone) available from Taimax; and Novec 7200 (3-nonafluoroisobutyl ether) available from 3M. 649 (1,1,1,2,2,4,5,5,5-nonafluoro-4-(trifluoromethyl)-3-pentanone); FC-3284 (perfluorinated compound, C5-18) available from 3M; FC18P (2-pentene, 1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)) available from Taimax; IM6 (perfluoro(4-methylpent-2-ene)) available from Inventec; 2100A (perfluoro(4-methylpent-2-ene)) available from Noah; DAISAVE SS-54 (1,1,2,3,3,3-hexafluoropropyl methyl ether)) available from Daikin; Opteon 2P50 (hydrofluoroolefin) available from Chemours.

[0049] As above Figure 1B and Figure 1C The condenser 101 includes a conduit 116 through which a condenser coolant (not shown) flows, such that the condenser coolant absorbs heat from a portion of the vapor 110 in contact with the conduit 116. Various condenser coolants (e.g., water, refrigerant, etc.) can be used, as long as the condenser coolant is maintained at a temperature below the boiling point of the liquid coolant 108.

[0050] According to various embodiments, the condenser 101 is located in a region of the second volume 104b adjacent to the space-filling device 202 along at least one edge of the space-filling device 202, such that the space-filling device 202 directs the vapor 110 toward the condenser 101. For example, such as Figure 1C , Figure 2A and Figure 2B As shown, the condenser 101 is configured to include a conduit 116 forming a coil around the periphery of a central region 114 of the second volume 104b. In this configuration, when the space-filling device 202 is placed within the second volume 104b, the conduit 116 is adjacent to the outer edge of the space-filling device 202, such as... Figure 2B As shown. As another option, such as Figure 1A and Figure 1B As shown, the condenser 101 includes a conduit 116 with a coil configured to be located on one side of the adjacent space-filling device 202. In other embodiments, the condenser 101 has various other configurations (e.g., two sides, three sides, etc. adjacent to the adjacent space-filling device 202).

[0051] like Figure 1A , Figure 2A and Figure 2B As shown, the condenser 101 extends spatially along a vertical direction characterized by a third height 112c. In this regard, the conduit 116 is formed as a coil extending vertically above the surface of the liquid coolant 108 at a third height 112c. Figure 1A , Figure 2A and Figure 2B As further shown, the third height 112c is greater than the first height 112a, such that when the space-filling device 202 is placed within the second volume 104b, the steam 110 is displaced, thereby increasing the degree of contact between the steam 110 and the condenser 101. For example, as Figure 2B As shown, steam 110 is displaced, causing the height of steam 110 to change from as shown in the figure. Figure 2A The first height 112a shown rises to, as Figure 2B The second height 112b is shown. In this exemplary embodiment, the third height 112c, characterizing the vertical spatial range of the condenser 101, is greater than the first height 112a. Therefore, with the space-filling device 202 present, the height of the steam 110 from the first height 112a to the second height 112b increases, allowing the steam 110 to contact the condenser 101 to a greater extent, thereby increasing the volume of steam 110 cooled by the condenser 101. Therefore, the presence of the space-filling device 202 improves the cooling efficiency between the steam 110 and the condenser 101.

[0052] Figure 3A This is a vertical sectional view of a two-phase cooling system 300 in a first configuration according to various embodiments, and Figure 3Band Figure 3C According to various embodiments Figure 3A A vertical cross-sectional view of the two-phase cooling system 300 in another configuration. Figures 3A to 3C Two-phase cooling system 300 and Figure 2A and Figure 2B The two-phase cooling system is similar to the 200. Figures 3A to 3C Condenser 101 and Figure 2A and Figure 2B The condenser 101 is similar in that it includes conduits (116a, 116b) formed as a coil around the central area 114. Figures 3A to 3C The cross-sectional view shows the first section 116a and the second section 116b of the conduits (116a, 116b), illustrating the corresponding circulation direction of the condenser coolant. For example, in the first section 116a, the condenser coolant flows along the exit... Figures 3A to 3C The plane moves in the direction of the flow, and in the second section 116b, the condenser coolant moves along the path leading to the inlet. Figures 3A to 3C The plane moves in the direction shown in the figure.

[0053] exist Figure 3B and Figure 3C In each configuration, the two-phase cooling system 300 includes a space-filling device 202 that displaces the steam 110, thereby raising the height of the steam 110 from... Figure 3A The first height 112a shown increases to, as Figure 3B and Figure 3C The second height 112b is shown. In Figure 3B In this embodiment, the space-filling device 202 takes the form of an object floating on the surface of the liquid coolant 108. As shown in the figure, Figure 3B The space-filling device 202 is an open container. In this respect, the space-filling device 202 floats on the surface of the liquid coolant 108 and displaces the surface of the liquid coolant 108 to a specific depth 302. In certain embodiments, it is advantageous to further provide one or more counterweights 304 within the space-filling device 202, thereby increasing the depth 302 to which the space-filling device 202 displaces the surface of the liquid coolant 108. In other embodiments, the space-filling device 202 is a closed container or a solid object, provided that the density of the solid object is lower than that of the liquid coolant 108, allowing it to float on the liquid coolant 108. For example, in some embodiments, the density of the liquid coolant 108 is approximately 1.6 g / ml, so any solid with a density less than 1.6 g / ml will float on the surface of the liquid coolant 108.

[0054] exist Figure 3CIn some embodiments, the space-filling device 202 takes the form of an object floating in the vapor 110 above the surface of the liquid coolant 108. For example, the space-filling device 202 is made of a material with a density equal to or lower than that of the vapor 110, such that the space-filling device 202 floats within the vapor. For example, in a particular embodiment, the space-filling device 202 has a density of 0.4 g / cm³. 2 up to 0.7 g / cm 2 Synthetic foam materials between.

[0055] As shown in the figure, in some embodiments, the space-filling device 202 is configured as an open container. Alternatively, in other embodiments, the space-filling device 202 is configured as a closed container or a solid object. Figure 3B and Figure 3C In each embodiment, the space-filling device 202 displaces the steam 110 to a second height 112b, which is greater than a third height 112c characterizing the vertical spatial extent of the condenser 101. Therefore, the presence of the space-filling device 202 changes the spatial distribution of the steam 110 from partially overlapping with the condenser 101 to completely overlapping it, resulting in a corresponding increase in the coupling efficiency between the condenser 101 and the steam 110.

[0056] Figure 4A This is a vertical sectional view of a two-phase cooling system 400 in a first configuration according to various embodiments, and Figure 4B In another configuration according to various embodiments Figure 4A Vertical sectional view of a two-phase cooling system 400. Figure 4A and Figure 4B Two-phase cooling system 400 similar Figures 3A to 3C Two-phase cooling system 300 and Figure 2A and Figure 2B The two-phase cooling system 200. Compared to these previously described two-phase cooling systems (200, 300), Figure 4A and 4B The two-phase cooling system 400 includes a space-filling device 202 that is a deformable object.

[0057] exist Figure 4A and Figure 4B In an exemplary embodiment, the space filling device 202 has a reconfigurable volume ( Figure 4BOnly one volume is shown, such that in a first configuration, the space-filling device 202 has a first size, while in a second configuration, the space-filling device has a second size different from the first size. For example, the space-filling device 202 is a cylindrical bellows with a string 402, which in some embodiments is used to control the size of the bellows. For example, in a fully extended configuration, such as... Figure 4B As shown, the bellows has a maximum volume that substantially fills the central region 114. Alternatively, the size of the bellows can be reduced (i.e., contracted) by pulling the string 402. In other embodiments, various other types of deformable objects can be used as the space-filling device 202, as referenced below. Figures 5A to 6C A more detailed description.

[0058] Figure 5A This is a vertical sectional view of a two-phase cooling system 500 in a first configuration according to various embodiments, and Figure 5B and Figure 5C According to various embodiments Figure 5A A vertical cross-sectional view of the 500 two-phase cooling system in another configuration. Figures 5A to 5C Two-phase cooling system 500 and Figure 4A and Figure 4B Two-phase cooling system 400 Figures 3A to 3C Two-phase cooling system 300 and Figure 2A and 2B The two-phase cooling system is similar to the 200. (And...) Figure 4A and Figure 4B The two-phase cooling system 400 is the same as that of the two-phase cooling system 500, which includes a space-filling device 202 as a deformable object.

[0059] In this regard, the space-filling device 202 of the two-phase cooling system 500 includes a porous mesh 502 that holds a plurality of deformable objects 504 within it. In an exemplary embodiment, the deformable objects 504 are rubber balls or similar elastic deformable objects that are compressed such that each deformable object has a first volume in a first configuration, such as... Figure 5B As shown, and each deformable object has a second volume (e.g., a smaller compressed volume) in the second configuration, such as Figure 5C As shown. The volume of the space-filling device 202 is changed by altering the size of the porous mesh 502. For example, according to some embodiments, the porous mesh 502 has an adjustable size (e.g., controlled by a string (not shown)) such that the plurality of deformable objects are compressed by the porous mesh in a second configuration (see, for example, see...). Figure 5C And the plurality of deformable objects are expanded in the first configuration (see, for example, see...). Figure 5B ).

[0060] Figure 6A This is a vertical sectional view of a two-phase cooling system 600 in a first configuration according to various embodiments, and Figure 6B and Figure 6C In another configuration according to various embodiments Figure 6A Vertical sectional view of a 600-phase two-phase cooling system. Figures 6A to 6C Two-phase cooling system 600 and Figure 5A , Figure 5B and Figure 5C Two-phase cooling system 500 Figure 4A and 4B Two-phase cooling system 400 Figures 3A to 3C Two-phase cooling system 300 and Figure 2A and Figure 2B The two-phase cooling system is similar to the 200. (And...) Figure 5A , Figure 5B and Figure 5C The two-phase cooling system 500 is the same as that of the two-phase cooling system 600, which includes a space-filling device 202 as a deformable object.

[0061] In this regard, the space-filling device 202 of the two-phase cooling system 600 includes an inflatable bag 602 with adjustable dimensions, the size of which is increased or decreased by increasing or decreasing the gas volume within the inflatable bag. Figure 6B and Figure 6C As shown, the two-phase cooling system 600 also includes a fan 604, which is used to add or remove air or other gases to the air bag 602, thereby increasing or decreasing the size of the air bag 602.

[0062] like Figure 6B As shown, the air bag 602 has a first size in the first configuration, such that the air bag does not come into contact with the steam 110. Therefore, in Figure 6B In the first configuration, steam 110 is assumed to be at a first height 112a. Conversely, in the second configuration, as... Figure 6C As shown, fan 604 is used to add air or other gas to inflation bag 602, thereby increasing the size of inflation bag 602. Therefore, inflation bag 602 is expanded to contact steam 110 and thereby displace steam 110. The steam 110 is then displaced by inflation bag 602, causing the height of steam 110 to increase to a second height 112b, as... Figure 6C As shown. Similar to the other embodiments described above, the presence of the space-filling device 202 changes the spatial distribution of the steam 110 from partially overlapping with the condenser 101 to completely overlapping with the condenser 101, resulting in a corresponding increase in the cooling efficiency between the condenser 101 and the steam 110.

[0063] Figure 7AThis is a vertical sectional view of a two-phase cooling system 700 in a first configuration according to various embodiments, and Figure 7B and Figure 7C According to various embodiments Figure 7A A vertical cross-sectional view of the two-phase cooling system 700 in another configuration. Figures 7A to 7C Two-phase cooling system 700 and Figure 6A , Figure 6B and Figure 6C Two-phase cooling system 600 Figure 5A , Figure 5B and Figure 5C Two-phase cooling system 500 Figure 4A and Figure 4B Two-phase cooling system 400 Figures 3A to 3C Two-phase cooling system 300 and Figure 2A and Figure 2B The two-phase cooling system 700 is similar to the two-phase cooling system 200. However, compared to these previously described systems, the two-phase cooling system 700 employs a different type of steam control device to control the density distribution of the steam 110.

[0064] Figure 7B and Figure 7C The steam control device is, for example, an expandable container 702, such as a balloon or a bellows. The expandable container 702 is attached to an opening in the second volume 104b portion of the outer casing 102, allowing air and steam 110 to escape from the second volume 104b into the expandable container 702. The density distribution of the steam 110 is controlled by allowing the gas and steam 110 to escape from the second volume 104b. For example, in an alternative system (not shown) where the gas volume is fixed within the second volume 104b, the vapor pressure increases with increasing temperature of the liquid coolant 108. This pressure increase limits the steam 110 to have a first height 112a, such as... Figure 7A As shown. Conversely, by allowing gas and vapor 110 to escape from the second volume 104b, as Figure 7B and Figure 7C In this embodiment, the steam pressure is maintained. By controlling the pressure in this way, the steam 110 is not restricted by the presence of air above it. Therefore, the steam 110 is allowed to expand within the second volume 104b, and thus exhibits, for example... Figure 7C The second height 112b is shown. Then, the increased volume of steam 110 overlaps more completely with the condenser 101, thereby increasing the cooling efficiency between the steam 110 and the condenser 101.

[0065] Figure 8A This is a vertical sectional view of a two-phase cooling system 800 according to different embodiments, and Figure 8B According to different embodiments Figure 8A A three-dimensional perspective view of the 800 two-phase cooling system. Figure 8A and Figure 8B Two-phase cooling system 800 and Figures 7A to 7C Two-phase cooling system 700 Figure 6A , Figure 6B and Figure 6C Two-phase cooling system 600 Figure 5A , Figure 5B and Figure 5C Two-phase cooling system 500 Figure 4A and Figure 4B Two-phase cooling system 400 Figures 3A to 3C Two-phase cooling system 300 and Figure 2A and 2B The two-phase cooling system 700 is similar to the two-phase cooling system 200. However, compared to these previously described systems, the two-phase cooling system 700 employs a different type of steam control device to control the density distribution of the steam 110.

[0066] In this regard, the fan 604 is positioned within or outside the second volume 104b of the housing and can be connected to the second volume 104b via a gas conduit (not shown). The fan 604 causes a circulation 802 of steam 110 and other gases (e.g., air) within the second volume 104b. The circulation 802 of steam 110 within the second volume 104b allows a greater amount of steam 110 to contact the condenser 101 than would be without circulation 802. Therefore, the fan 604 functions as a steam control device, which improves the cooling efficiency between the steam 110 and the condenser 101.

[0067] Figure 9 This is a flowchart illustrating the operation of a method 900 for cooling a heat source 106 according to various embodiments. In operation 902, method 900 includes enclosing the heat source 106 within a first volume 104a of a housing 102, the housing 102 including a first volume 104a and a second volume 104b. In operation 904, method 900 includes placing a liquid coolant 108 within the first volume 104a such that the liquid coolant 108 contacts the heat source 106 and receives heat from the heat source 106, thereby generating steam 110. In operation 906, method 900 includes cooling the steam 110 with a condenser 101 located within the second volume 104b, thereby generating condensed liquid coolant 108 returning to the first volume 104a. In operation 908, method 900 includes using a space-filling device 202 to control the density distribution of the steam 110.

[0068] According to a particular embodiment, the space-filling device 202 is a removable object, and method 900 further includes placing the space-filling device 202 within a second volume 104b, the space-filling device 202 causing the steam 110 to shift, resulting in the steam 110 having a second height 112b, the second height 112b being greater than a first height 112a of the steam 110 when the space-filling device 202 is removed from the second volume 104b. According to a particular embodiment, the removable object is configured to float on the liquid coolant 108, and method 900 further includes placing the removable object on the surface of the liquid coolant 108 such that the removable object floats on the liquid coolant 108.

[0069] According to other embodiments, the space-filling device 202 is a deformable object with a reconfigurable volume, and the method further includes increasing the volume of the space-filling device 202 from a first configuration having a first size to a second configuration having a second size larger than the first size, such that the deformable object causes the steam 110 to have a second height 112b, the second height 112b being greater than the first height 112a included by the steam 110 when the deformable object has the first size. According to a further embodiment, the deformable object is an inflatable bag 602, and the method 900 further includes increasing the gas volume within the inflatable bag 602, thereby increasing the volume from the first size to the second size.

[0070] Figure 10 This is a flowchart illustrating the operation of another method 1000 for cooling a computing device 106 according to various embodiments. In operation 1002, method 1000 includes enclosing the heat-generating computing device 106 within a first volume 104a of a housing 102 comprising a first volume 104a and a second volume 104b. In operation 1004, method 1000 includes placing a liquid coolant 108 within the first volume 104a such that the liquid coolant 108 contacts the computing device 106 and receives heat from the computing device 106, thereby generating steam 110. In operation 1006, method 1000 includes cooling the steam 110 with a condenser 101 located within the second volume 104b, thereby generating condensed liquid coolant 108 that returns to the first volume 104a. In operation 1008, method 1000 includes using a steam controller device (e.g., 202, 602, 604, 702) to control the density distribution of steam 110.

[0071] In a particular embodiment, an expandable container 702 attached to the second volume 104b serves as a steam control device (e.g., 202, 602, 604, 702). In this embodiment, method 1000 further includes allowing steam 110 and air to escape from the second volume 104b into the expandable container 702. In other embodiments, a fan 604 serves as a steam control device (e.g., 202, 602, 604, 702). In this embodiment, method 1000 further includes operating the fan 604 to circulate air and steam 110 within the second volume 104b. In yet another embodiment, a space-filling device 202, which is a removable object, is used as a steam control device (e.g., 202, 602, 604, 702). In this embodiment, method 1000 further includes placing the space-filling device 202 within the second volume 104b to displace the steam 110. Then, the displacement of the generated steam 110 increases the height of the steam 110 to a second height 112b relative to the first height 112a of the steam 110 when the space filling device 202 is removed from the second volume 104b.

[0072] Referring to all the accompanying drawings and various embodiments disclosed herein, a two-phase cooling system (e.g., 200, 300, 400, 500, 600, 700, 800) is provided. According to some embodiments, the two-phase cooling system (e.g., 200, 300, 400, 500, 600, 700, 800) includes a housing 102 having a first volume 104a and a second volume 104b, a heat source 106 located in the first volume 104a, and a liquid coolant 108 located in the first volume 104a such that a liquid coolant 108 contacts the heat source 106. When heat generated by the heat source 106 is absorbed by the liquid coolant 108, the liquid coolant generates vapor 110 that partially fills the second volume 104b produced by the liquid coolant 108. Two-phase cooling systems (e.g., 200, 300, 400, 500, 600, 700, 800) also include a condenser 101 located in a second volume 104b, which removes heat from the vapor 110, thereby condensing the vapor 110 into a liquid coolant 108 that returns to the first volume 104a. Two-phase cooling systems (e.g., 200, 300, 400, 500, 600, 700, 800) also include a space-filling device 202 located in the second volume 104b, which partially fills the second volume 104b, thereby displacing the vapor 110 from a portion of the second volume 104b.

[0073] In a particular embodiment, the space-filling device 202 is a removable object. In this embodiment, when the space-filling device 202 is removed from the second volume 104b, the vapor 110 has a first height 112a, and when the space-filling device 202 is placed within the second volume 104b, the vapor 110 has a second height 112b greater than the first height 112a. For example, in a particular embodiment, the space-filling device 202 is an object that floats on the liquid coolant 108. In other embodiments, the space-filling device 202 is an object with a density less than that of the vapor 110, and therefore floats in the vapor 110 above the surface of the liquid coolant 108.

[0074] In a particular embodiment, the condenser 101 includes a conduit 116 through which condenser coolant flows, such that the condenser coolant absorbs heat from a portion of the vapor 110 in contact with the conduit 116. Furthermore, in this embodiment, the condenser 101 is located in a region of the second volume 104b adjacent to at least one edge of the space-filling device 202, such that the space-filling device 202 directs the vapor 110 toward the condenser 101. In a further embodiment, the conduit 116 is formed as a coil extending vertically above the surface of the liquid coolant 108 at a third height 112c. In this embodiment, the third height 112c is greater than the first height 112a, such that when the space-filling device 202 is placed within the second volume 104b, the vapor 110 is displaced, thereby increasing the degree of contact between the vapor 110 and the condenser 101. In another embodiment, the conduit 116 is formed as a coil surrounding the periphery of the central region 114 of the second volume 104b, such that when the space filling device 202 is placed in the second volume 104b, the conduit 116 is adjacent to the outer edge of the space filling device 202.

[0075] In a particular embodiment, the space filling device 202 is a deformable object with a reconfigurable volume, such that in a first configuration, the space filling device 202 has a first size, and in a second configuration, the space filling device 202 has a second size different from the first size. For example, in a particular embodiment, the space filling device 202 is a bellows. In other embodiments, the space filling device 202 is an inflatable bag 602 with an adjustable size, the size being increased or decreased by increasing or decreasing the gas volume within the inflatable bag 602. In a further embodiment, the space filling device 202 includes a porous mesh 502 that holds a plurality of deformable objects 504 within it. In this embodiment, the porous mesh 502 includes an adjustable size such that the plurality of deformable objects 504 are compressed by the porous mesh 502 in a first configuration and expanded in a second configuration.

[0076] The disclosed embodiments provide cooling systems for computer system components that offer advantages over existing cooling systems. In this regard, a two-phase cooling system (e.g., 200, 300, 400, 500, 600, 700, 800) is provided, comprising a liquid coolant 108 (i.e., a first phase) that absorbs heat from computer system component 106, thereby generating vapor 110 (i.e., a second phase), which is cooled by condenser 101 to remove heat. A vapor control device (e.g., 202, 602, 604, 702) is provided that alters the density distribution of vapor 110 to increase the spatial overlap between vapor 110 and condenser 101, thereby increasing the efficiency of heat transfer coupling between vapor 110 and condenser 101. In various embodiments, the steam control device (e.g., 202, 504, 602, 604, 702) takes the form of a space-filling device 202, a deformable object 504, an inflatable bag 602, a fan 604, and an expandable container 702. The steam control device (e.g., 202, 602, 604, 702) in each embodiment directs steam 110 toward condenser 101, thereby improving heat transfer between steam 110 and condenser 101, resulting in a corresponding improvement in the overall cooling system performance.

[0077] An embodiment of a system (e.g., a two-phase cooling system) includes a housing having a first volume and a second volume, a heat source located in the first volume, and a liquid coolant located in the first volume such that a liquid coolant is in contact with the heat source. When heat generated by the heat source is absorbed by the liquid coolant, the liquid coolant generates vapor that partially fills the second volume. A condenser located in the second volume removes heat from the vapor, thereby condensing the vapor into condensed liquid coolant that returns to the first volume. A space-filling device located in the second volume partially fills the second volume, thereby displacing the vapor from a portion of the second volume.

[0078] In various embodiments, the system is configured such that the space-filling device is a removable object, configured to lower the vapor height in the second volume to a first height when the space-filling device is removed from the second volume, and configured to increase the vapor height in the second volume to a second height when the space-filling device is placed in the second volume. In a particular embodiment, the space-filling device is configured as an object floating on the liquid coolant, and in other embodiments, the space-filling device is configured as an object floating in vapor above the surface of the liquid coolant.

[0079] In some embodiments, the condenser includes a conduit configured to allow condenser coolant to flow through, such that the condenser coolant absorbs heat from a portion of the vapor in contact with the conduit. The condenser is located in a region of the second volume adjacent to at least one edge of the space-filling device, such that the space-filling device directs vapor toward the condenser. In a particular embodiment, the conduit is formed as a coil configured to extend vertically to a third height above the surface of the liquid coolant, such that the third height is greater than a first height. Therefore, when the space-filling device is placed within the second volume, the vapor is displaced, thereby increasing the degree of contact between the vapor and the condenser. In other embodiments, the conduit is formed as a coil surrounding the periphery of a central region of the second volume, such that when the space-filling device is placed within the second volume, the conduit is adjacent to the outer edge of the space-filling device.

[0080] In various embodiments, the space-filling device is a deformable object with a reconfigurable volume, such that in a first configuration, the space-filling device has a first size, and in a second configuration, the space-filling device has a second size different from the first size. In a particular embodiment, the space-filling device includes a bellows, and in other embodiments, the space-filling device includes an adjustable-size inflatable bag, the size of which can be increased or decreased by increasing or decreasing the gas volume within the inflatable bag. In other embodiments, the space-filling device includes a porous mesh comprising a plurality of deformable objects held within the porous mesh. In this embodiment, the porous mesh has an adjustable size such that the plurality of deformable objects are compressed by the porous mesh in a first configuration and expanded in a second configuration.

[0081] An embodiment of a method (e.g., a method for cooling a heat source) includes: enclosing the heat source within a first volume of a housing comprising a first volume and a second volume; placing a liquid coolant within the first volume such that the liquid coolant is in contact with the heat source and receives heat from the heat source to generate steam; cooling the steam with a condenser located in the second volume to generate condensed liquid coolant returning to the first volume; and using a space-filling device to control the density distribution of the steam. In a particular embodiment, the space-filling device is a removable object and the method further includes placing the space-filling device within the second volume, the space-filling device causing the steam to displace such that a second height of the steam is greater than a first height of the steam when the space-filling device is removed from the second volume. In some embodiments, the removable object is configured to float on the liquid coolant, and the method further includes placing the removable object on the surface of the liquid coolant such that the removable object floats on the liquid coolant.

[0082] In other embodiments, the space-filling device is a deformable object with a reconfigurable volume, and the method further includes increasing the volume of the space-filling device from a first configuration having a first size to a second configuration having a second size greater than the first size, such that when the deformable object has the first size, the deformable object causes the vapor to have a second height, the second height being greater than the first height included by the vapor. In some embodiments, the deformable object is an inflatable bag, and the method further includes increasing the gas volume within the inflatable bag, thereby increasing the volume from the first size to the second size.

[0083] Another method (e.g., a method for cooling a computing device) includes enclosing the heat-generating computing device within a first volume of a housing having a first volume and a second volume. The method also includes placing a liquid coolant within the first volume such that the liquid coolant contacts the computing device and causes the liquid coolant to receive heat from the computing device, thereby generating steam. The method further includes cooling the steam with a condenser located within the second volume, thereby generating condensed liquid coolant that returns to the first volume. The method also includes using a steam control device to control the density distribution of the steam. In some embodiments, the steam control device is an expandable container attached to the second volume, and the method further includes allowing steam and air to escape from the second volume into the expandable container. In other embodiments, the steam control device is a fan, and the method further includes operating the fan to circulate air and steam within the second volume. In yet another embodiment, the steam control device is a space-filling device that is a removable object, and the method further includes placing the space-filling device within the second volume to displace the steam, thereby increasing the height of the steam to a second height relative to a first height when the space-filling device is removed from the second volume.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this utility model, and are not intended to limit it. Although the embodiments of this utility model have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A cooling system, characterized in that, include: The outer casing includes a first volume and a second volume; The heat source is located in the first volume. The first volume is configured to contain a liquid coolant, such that the liquid coolant is in contact with the heat source, and The second volume is configured to contain steam that partially fills the second volume, and the steam is generated by the liquid coolant when the heat generated by the heat source is absorbed by the liquid coolant; A condenser, located in the second volume and configured to remove heat from the vapor, causing the vapor to condense into a liquid that returns to the first volume; as well as A space-filling device, located in the second volume, partially fills the second volume and is configured to displace the vapor from a portion of the second volume.

2. The cooling system according to claim 1, characterized in that, in: The space-filling device is a removable object. The space-filling device is configured to lower the height of the steam in the second volume to a first height when the space-filling device is removed from the second volume, and is configured to increase the height of the steam in the second volume to a second height when the space-filling device is placed in the second volume.

3. The cooling system according to claim 2, characterized in that, The space-filling device includes an object configured to float on the liquid coolant.

4. The cooling system according to claim 2, characterized in that, The space-filling device includes an object configured to float in the vapor above the surface of the liquid coolant.

5. The cooling system according to claim 2, characterized in that, The condenser includes a conduit configured to allow condenser coolant to flow through, such that the condenser coolant absorbs heat from the vapor in contact with a portion of the conduit. The condenser is located in a region of the second volume adjacent to the space-filling device along at least one edge of the space-filling device, such that the space-filling device moves the vapor toward the condenser.

6. The cooling system according to claim 5, characterized in that, The conduit is formed as a coil, which is configured to extend vertically to a third height above the surface of the liquid coolant, and The third height is greater than the first height, such that when the space-filling device is placed in the second volume, the steam is displaced, thereby increasing the degree of contact between the steam and the condenser.

7. The cooling system according to claim 6, characterized in that, The conduit is formed as a coil around the periphery of the central area of ​​the second volume, such that when the space-filling device is placed within the second volume, the conduit is adjacent to the outer edge of the space-filling device.

8. The cooling system according to claim 1, characterized in that, The space-filling device is a deformable object with a reconfigurable volume, such that in a first configuration, the space-filling device has a first size, and in a second configuration, the space-filling device has a second size different from the first size.

9. The cooling system according to claim 8, characterized in that, The space-filling device includes an inflatable bag or a corrugated tube, the inflatable bag or corrugated tube having an adjustable size, the adjustable size being increased or decreased by increasing or decreasing the gas volume inside the inflatable bag or corrugated tube.

10. The cooling system according to claim 8, characterized in that, The space-filling device includes a porous mesh, which comprises a plurality of deformable objects fixed within the porous mesh. The porous mesh includes adjustable dimensions such that the plurality of deformable objects are compressed by the porous mesh in a first configuration and expanded in a second configuration.

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