VC cooling device for notebook computer

Abstract

The utility model discloses a notebook computer's VC heat abstractor, include: upper cover, lower cover and at least one heat dissipation fin group, the surface on the side of lower cover to upper cover is provided with a recess, the surface on the side of upper cover opposite lower cover forms several recessed parts of uniform distribution, and the recessed part of every stamping forming has several convex parts extending to the direction of lower cover on the other side of upper cover, the surface on the side of upper cover to lower cover and located the recessed area of the intermediate area of upper cover forms, and the recessed area of the opposite direction stamping forming of recessed part forms the convex area higher than upper cover on the other side of upper cover, and the convex area is used for with heat source surface contact. The utility model discloses improve the structural strength while alleviating the overall weight, and also can further improve the structural strength while, can simplify processing technology, and also promote the heat conduction even temperature effect.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation in electronic products, and in particular to a VC heat dissipation device for laptops. Background Technology

[0002] A VC (Vapor Chamber) is a highly efficient heat transfer component with a capillary structure on its inner wall. The liquid at the bottom of the vacuum chamber absorbs heat from the chip, evaporates, and diffuses into the chamber, transferring the heat to the heat dissipation fins. It then condenses back into liquid and returns to the bottom, thus achieving rapid heat diffusion and transfer. With the development of laptops, business laptops are increasingly focused on lightweight design. Traditional heat pipes have limitations in heat transfer, leading to increasingly higher requirements for VC cooling devices. How to meet the heat dissipation needs of the chip while simultaneously achieving lightweight design has become a pressing issue. Utility Model Content

[0003] The purpose of this invention is to provide a VC cooling device for laptops. This VC cooling device for laptops reduces the overall weight while improving structural strength. Furthermore, it can simplify the manufacturing process and improve the heat conduction and temperature uniformity while further enhancing structural strength.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a VC cooling device for a laptop computer, comprising: an upper cover plate, a lower cover plate corresponding to the upper cover plate, and at least one heat dissipation fin assembly. The upper cover plate and the lower cover plate are welded together at their edges. The heat dissipation fin assembly is disposed at the end of the upper cover plate or the lower cover plate. A groove is provided on the surface of the lower cover plate facing the upper cover plate, thereby forming a cavity between the interconnected upper cover plate and the lower cover plate. A plurality of evenly distributed recesses are formed on the surface of the upper cover plate facing away from the lower cover plate. Each of the recesses, formed by stamping, forms a plurality of protrusions extending downward towards the lower cover plate on the other side of the upper cover plate. A recessed area is formed on the surface of the upper cover plate facing the lower cover plate and located in the middle region of the upper cover plate. The recessed area, formed by stamping in the opposite direction to the recesses, forms a protruding area higher than the upper cover plate on the other side of the upper cover plate. The protruding area is used to contact the heat source surface.

[0005] The following are further improvements to the above technical solution: 1. In the above scheme, the cavity is a vacuum cavity.

[0006] 2. In the above scheme, the cavity is filled with metal braided rope between the protrusions.

[0007] 3. In the above scheme, the cavity and the recessed area are filled with metal woven mesh.

[0008] 4. In the above scheme, both the metal braided rope and the metal braided mesh are formed by woven metal wires, and each metal wire is provided with at least two grooves that are distributed circumferentially and extend axially.

[0009] 5. In the above scheme, the metal wire is a copper wire.

[0010] 6. In the above scheme, the edges of the upper cover plate and the lower cover plate are welded together by diffusion welding.

[0011] 7. In the above scheme, the two heat dissipation fin groups are respectively disposed at both ends of the upper cover plate or the lower cover plate.

[0012] 8. In the above scheme, at least one corresponding clearance through hole is provided on both the upper cover plate and the lower cover plate. The groove on the lower cover plate is located outside the clearance through hole. The outer edge of the clearance through hole on the upper cover plate is welded to the outer edge of the clearance through hole on the lower cover plate.

[0013] 9. In the above scheme, the groove on the lower cover plate is formed by etching.

[0014] Due to the application of the above technical solution, this utility model has the following advantages and effects compared with the prior art: This utility model discloses a VC cooling device for a laptop computer. On the surface of the upper cover facing away from the lower cover, several evenly distributed recesses are formed. Each recess, formed by stamping, has several protrusions extending downwards on the other side of the upper cover. A recessed area is formed on the surface of the upper cover facing the lower cover, located in the middle region of the upper cover. A protruding area, formed by stamping in the opposite direction to the recesses, is formed on the other side of the upper cover, higher than the upper cover. The protruding area is used to contact the heat source surface. The stamped protrusions reduce overall weight while increasing structural strength, preventing deformation under external forces during use, and also increasing the heat conduction and dissipation area, thus improving cooling performance. The heat dissipation effect is achieved by using a raised area formed by reverse stamping to contact the heat source. This not only enhances the structural strength but also simplifies the manufacturing process, improves the thermal conductivity with the heat source, and increases the cavity space for stacking capillary structures, further improving the heat conduction and temperature uniformity. Furthermore, the cavity is filled with metal braided rope between the raised parts, and the cavity is filled with metal braided mesh in the recessed area. Both the metal braided rope and the metal braided mesh are woven from metal wires, and each metal wire has at least two grooves that are spaced apart circumferentially and extend axially. This further enhances the shrinkage capacity of the metal braided mesh and the metal braided rope, thereby further improving the temperature uniformity and heat dissipation effect. Attached Figure Description

[0015] Appendix Figure 1This is a schematic diagram of the VC cooling device for a laptop computer according to this utility model; Appendix Figure 2 This is a partial structural cross-sectional view of the VC heat dissipation device of this utility model from one perspective; Appendix Figure 3 This is a partial exploded view of the VC heat dissipation device for a laptop computer according to this utility model; Appendix Figure 4 This is a partial structural cross-sectional view of the VC heat dissipation device of this utility model from another perspective; Appendix Figure 5 This is a cross-sectional schematic diagram of the metal wire in the VC heat dissipation device of the laptop computer of this utility model.

[0016] In the above attached figures: 1. Upper cover plate; 2. Lower cover plate; 3. Heat dissipation fin assembly; 4. Groove; 5. Cavity; 6. Through hole; 71. Recessed part; 72. Protruding part; 81. Recessed area; 82. Protruding area; 9. Metal wire; 91. Wire groove. Detailed Implementation

[0017] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0018] Example 1: A VC cooling device for a laptop computer, comprising: an upper cover plate 1, a lower cover plate 2 corresponding to the upper cover plate 1, and at least one heat dissipation fin assembly 3. The upper cover plate 1 and the lower cover plate 2 are welded together at their edges. The heat dissipation fin assembly 3 is disposed at the end of the upper cover plate 1 or the lower cover plate 2. A groove 4 is provided on the surface of the lower cover plate 2 facing the upper cover plate 1, thereby forming a cavity 5 between the interconnected upper cover plate 1 and the lower cover plate 2. A plurality of evenly distributed recesses 71 are formed on the surface of the upper cover plate 1 opposite to the lower cover plate 2. Each of the recesses 71, formed by stamping, is located on the other side of the upper cover plate 1. The upper cover 1 has several protrusions 72 extending downwards towards the lower cover 2. A recessed area 81 is formed on the surface of the upper cover 1 facing the lower cover 2 and in the middle area of ​​the upper cover 1. The recessed area 81, which is formed by stamping in the opposite direction to the recessed portion 71, forms a protrusion 82 on the other side of the upper cover 1 that is higher than the upper cover 1. The protrusion 82 is used to contact the heat source surface. The process of forming the protrusion and the protrusion area by bidirectional stamping is replaced by etching. This process satisfies the power consumption requirements while achieving the lightweight requirements of thinning and weight reduction. Except for the protrusion area used to contact the chip (heat source), which has an overall thickness of 0.9mm, the overall thickness is 1.7mm.

[0019] The cavity 5 is a vacuum cavity; the cavity 5 and the space between the protrusions 72 are filled with metal braided rope; the cavity 5 and the recessed area 81 are filled with metal braided mesh. Both the aforementioned metal braided rope and metal braided mesh are woven from metal wires 9. Each of the aforementioned metal wires 9 is provided with at least two grooves 91 that are spaced apart circumferentially and extend axially. On each copper wire with a diameter of 0.05 mm that forms the metal braided mesh or metal braided rope, three grooves with a width of 0.01 mm are drawn through a mold before the metal braided rope or metal braided mesh is woven. The specific processing method for the grooves is not within the scope of protection of this application and can be obtained by processing with existing purchased equipment, which will not be described here. The aforementioned metal wires 9 are copper wires.

[0020] Example 2: A VC cooling device for a laptop computer, comprising: an upper cover plate 1, a lower cover plate 2 corresponding to the upper cover plate 1, and at least one heat dissipation fin assembly 3. The upper cover plate 1 and the lower cover plate 2 are welded together at their edges. The heat dissipation fin assembly 3 is disposed at the end of the upper cover plate 1 or the lower cover plate 2. A groove 4 is provided on the surface of the lower cover plate 2 facing the upper cover plate 1, thereby forming a cavity 5 between the interconnected upper cover plate 1 and the lower cover plate 2. A plurality of evenly distributed recesses 71 are formed on the surface of the upper cover plate 1 opposite to the lower cover plate 2. Each recess 71, formed by stamping, has a plurality of protrusions 72 extending downward toward the lower cover plate 2 on the other side of the upper cover plate 1. The surface plays a role in structural strength, preventing deformation under external force. On the other hand, compared with the thick and heavy substrate of the etching process, the stamping process can reduce weight by 30% to 40%. A recessed area 81 is formed on the surface of the upper cover plate 1 facing the lower cover plate 2 and in the middle area of ​​the upper cover plate 1. The recessed area 81, which is stamped in the opposite direction to the recessed part 71, forms a raised area 82 on the other side of the upper cover plate 1 that is higher than the upper cover plate 1. The raised area 82 is used to contact the heat source surface. The reverse stamping increases the cavity space, the inner wall is used to stack capillary structures, and further improves the structural strength. It also forms a raised boss for contact with the chip heat source. Compared with welding a copper block in the prior art, the process is simpler and has better thermal conductivity.

[0021] The edges of the upper cover plate 1 and the lower cover plate 2 are welded together by diffusion welding; the two heat dissipation fin groups 3 are respectively disposed at both ends of the upper cover plate 1 or the lower cover plate 2, and heat dissipation is achieved by the fins cooperating with the fan. Both the upper cover plate 1 and the lower cover plate 2 are provided with at least one corresponding clearance hole 6, which is used to avoid interference with other components inside the laptop when the whole is installed inside the laptop. The groove 4 on the lower cover plate 2 is located outside the clearance hole 6. The outer edge of the clearance hole 6 on the upper cover plate 1 is welded to the outer edge of the clearance hole 6 on the lower cover plate 2. The groove 4 on the lower cover plate 2 is formed by etching.

[0022] When using the aforementioned VC cooling device for laptops, the protrusions formed by stamping reduce the overall weight while increasing structural strength, preventing deformation caused by external forces during use. They also increase the area for heat conduction and dissipation, improving heat dissipation. The protrusions formed by stamping in the opposite direction come into contact with the heat source, further enhancing structural strength. This simplifies the manufacturing process, improves the heat conduction efficiency with the heat source, and increases the cavity space for stacking capillary structures, further improving the heat conduction and temperature uniformity. Furthermore, the cavity is filled with metal braided rope between the protrusions, and the cavity is filled with metal braided mesh in the recessed area. Both the metal braided rope and the metal braided mesh are woven from metal wires. Each metal wire is provided with at least two grooves that are spaced apart circumferentially and extend axially. This can further enhance the shrinkage capacity of the metal braided mesh and the metal braided rope, thereby further improving the effect of uniform heat dissipation.

[0023] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A VC cooling device for a laptop computer, comprising: The upper cover plate (1), the lower cover plate (2) corresponding to the upper cover plate (1), and at least one heat dissipation fin assembly (3) are stacked together and welded together at their edges. The heat dissipation fin assembly (3) is disposed at the end of the upper cover plate (1) or the lower cover plate (2). A groove (4) is provided on the surface of the lower cover plate (2) facing the upper cover plate (1), thereby forming a cavity (5) between the interconnected upper cover plate (1) and the lower cover plate (2). The feature is that a groove (4) is formed on the surface of the upper cover plate (1) facing away from the lower cover plate (2). Several evenly distributed recesses (71) are formed by stamping. Each of the recesses (71) forms several protrusions (72) extending downward toward the cover plate (2) on the other side of the upper cover plate (1). A recessed area (81) is formed on the surface of the upper cover plate (1) facing the lower cover plate (2) and in the middle area of ​​the upper cover plate (1). The recessed area (81) formed by stamping in the opposite direction to the recesses (71) forms a protrusion (82) on the other side of the upper cover plate (1) that is higher than the upper cover plate (1). The protrusion (82) is used to contact the heat source surface.

2. The VC cooling device for a laptop computer according to claim 1, characterized in that: The cavity (5) is a vacuum cavity.

3. The VC cooling device for a laptop computer according to claim 2, characterized in that: The cavity (5) and the space between the protrusions (72) are filled with metal braided rope.

4. The VC cooling device for a laptop computer according to claim 3, characterized in that: The cavity (5) and the recessed area (81) are filled with a metal woven mesh.

5. The VC cooling device for a laptop computer according to claim 4, characterized in that: Both the metal braided rope and the metal braided mesh are woven from metal wires (9), and each metal wire (9) is provided with at least two grooves (91) that are spaced apart circumferentially and extend axially.

6. The VC cooling device for a laptop computer according to claim 5, characterized in that: The metal wire (9) is a copper wire.

7. The VC cooling device for a laptop computer according to claim 1, characterized in that: The upper cover plate (1) and the lower cover plate (2) are welded together at their edges by diffusion welding.

8. The VC cooling device for a laptop computer according to claim 1, characterized in that: The two heat dissipation fin groups (3) are respectively disposed at both ends of the upper cover plate (1) or the lower cover plate (2).

9. The VC cooling device for a laptop computer according to claim 1, characterized in that: The upper cover plate (1) and the lower cover plate (2) are each provided with at least one corresponding clearance through hole (6). The groove (4) on the lower cover plate (2) is located outside the clearance through hole (6). The outer edge of the clearance through hole (6) on the upper cover plate (1) is welded to the outer edge of the clearance through hole (6) on the lower cover plate (2).

10. The VC cooling device for a laptop computer according to claim 1, characterized in that: The groove (4) on the lower cover plate (2) is formed by etching.

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