A server liquid cooling plate and cold plate assembly

Abstract

The utility model provides a kind of server liquid cooling plate and cold plate assembly, belong to liquid cooling plate technical field, including mounting plate, mounting groove is opened in mounting plate, heat conduction plate is clamped in mounting groove, mounting plate top is equipped with shell, two groups of baffle are equipped in shell, and two groups of baffle divide shell into two groups of liquid preparation cavity and heat dissipation cavity;Multiple mounting holes are opened in baffle, multiple cooling fins are equipped in heat dissipation cavity, and cooling fin two ends respectively extend to the liquid preparation cavity by the mounting hole of two groups of baffle, and multiple cooling fins are evenly arrayed along mounting plate height direction;Multiple heat conduction columns are arranged on multiple cooling fins, and one end of heat conduction column is in contact with heat conduction plate.The separation of the device through heat dissipation cavity and liquid preparation cavity makes that the internal structure of device is more reasonable, and the maintainability of the device is improved.

Description

Technical Field

[0001] This utility model belongs to the field of liquid cooling plate technology, and more specifically, it relates to a server liquid cooling plate and a cooling plate assembly. Background Technology

[0002] Current server liquid cooling plate technology has several drawbacks. Common liquid cooling plates often employ planar or S-shaped flow channel designs, such as Inspur's modular cold plates, and single-plate coverage methods. Furthermore, traditional liquid cooling plates are mostly integrated, with the heat dissipation chamber and liquid distribution chamber not separated, resulting in a complex internal structure, cross-flow channel interference, and high maintenance difficulty; a single fault can easily affect overall operation. Additionally, traditional liquid cooling plates consist of a flow channel and a metal plate. Because the metal plate and flow channel rely solely on simple physical contact, there is significant contact thermal resistance, preventing heat from being transferred and dissipated from the heat source in a timely manner. Utility Model Content

[0003] To address the aforementioned technical problems, this utility model provides a server liquid cooling plate and a cooling plate assembly, thereby solving the technical problems of uneven heat dissipation, difficult maintenance, and low heat transfer efficiency of traditional liquid cooling plates in the prior art.

[0004] The purpose and effect of this utility model of a server liquid cooling plate and cooling plate assembly are achieved by the following specific technical means:

[0005] A server liquid cooling plate includes a mounting plate with a mounting groove. A heat-conducting plate is fitted into the mounting groove. A shell is located on the top of the mounting plate, and two sets of partitions are provided inside the shell. The two sets of partitions divide the shell into two sets of liquid dispensing chambers and heat dissipation chambers. Multiple sets of mounting holes are provided on the partitions. Multiple sets of cooling fins are provided in the heat dissipation chambers. The two ends of the cooling fins extend into the liquid dispensing chambers through the mounting holes of the two sets of partitions, and the multiple sets of cooling fins are evenly arrayed along the height direction of the mounting plate. Multiple sets of heat-conducting pillars are passed through the multiple sets of cooling fins, and one end of the heat-conducting pillar contacts the heat-conducting plate.

[0006] According to a preferred embodiment, the cooling plate has a hollow, flat structure, and the cooling plate has a flow channel inside. The flow channel is serpentine, and both ends of the flow channel are respectively connected to two sets of liquid distribution chambers.

[0007] According to a preferred embodiment, the heat-conducting pillar is made of oxygen-free copper, and multiple sets of heat-conducting pads are sleeved on the heat-conducting pillar. The heat-conducting pads are provided on both sides of the cooling plate.

[0008] According to a preferred embodiment, the two sets of liquid preparation chambers are a liquid inlet chamber and a liquid outlet chamber, respectively. The liquid inlet chamber is provided with a liquid inlet interface on one side, and the liquid outlet chamber is provided with a liquid outlet interface on one side.

[0009] According to a preferred embodiment, the connection between the mounting plate and the outer shell is provided with an annular sealing groove, and a fluororubber sealing ring is embedded in the sealing groove. The mounting plate and the outer shell are connected by multiple sets of bolts.

[0010] According to a preferred embodiment, the heat dissipation cavity is filled with a thermally conductive medium, which is a thermally conductive gel.

[0011] The cold plate assembly includes a cooling box and a heat dissipation fan. The inlet and outlet ports of the cooling box are respectively connected to the outer shell pipes of the server liquid cooling plate to form a cooling circuit. The heat dissipation fan is installed on one side of the cooling box.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. This utility model, by separating the heat dissipation chamber and the liquid distribution chamber, makes the internal structure of the device more rational and improves its maintainability. When the liquid cooling plate fails, the liquid distribution chamber or the heat dissipation chamber can be easily checked and repaired separately, avoiding the complex maintenance process caused by cross-flow interference in traditional integrated cold plates. The device can be divided into independent liquid distribution chamber and heat dissipation chamber by a partition, realizing an independent space operation mode of "refrigerant distribution - heat exchange - recovery", making the device more stable during operation. A failure in one part is less likely to affect other parts, thus improving the overall reliability of the device.

[0014] 2. When using this device, thermally conductive gel is filled into the heat dissipation cavity to fill the gap between the cooling fins and the outer shell, thus eliminating air thermal resistance. Since the thermal conductivity of the thermally conductive gel is much higher than that of air, it improves heat exchange efficiency, thereby enhancing the device's heat dissipation performance. Furthermore, the hollow, flat structure of the cooling fins, with its internal serpentine flow channels, increases the flow path and time of the coolant within the fins, further enhancing the heat exchange effect and improving the device's ability to dissipate the high heat generated by the server, ensuring stable server operation. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the assembled structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the disassembled structure of this utility model;

[0017] Figure 3 This is a top view of the present invention;

[0018] Figure 4 This is a schematic diagram of the internal structure of this utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the cooling plate of this utility model;

[0020] Figure 6 This is a structural schematic diagram of the cold plate assembly.

[0021] In the diagram, the correspondence between component names and drawing numbers is as follows:

[0022] 11. Mounting plate; 12. Heat-conducting plate; 13. Outer shell; 14. Partition plate; 15. Cooling fins; 16. Heat-conducting pillars; 17. Heat-conducting pads; 18. Liquid inlet port; 19. Liquid outlet port; 21. Fluororubber sealing ring; 22. Cooling box; 23. Cooling fan. Detailed Implementation

[0023] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the technical solution of this utility model, but should not be used to limit the scope of protection of this utility model.

[0024] Example:

[0025] like Figures 1 to 5 As shown, this utility model provides a server liquid cooling plate, including a mounting plate 11 with a mounting groove on the mounting plate 11, and a heat-conducting plate 12 is fitted into the mounting groove. This configuration allows for rapid heat transfer from the server to the heat-conducting plate 12, enabling the device to collect heat and improving its heat capture efficiency.

[0026] The mounting plate 11 has a housing 13 on top, and two sets of partitions 14 are provided inside the housing 13, which divide the housing 13 into two sets of liquid distribution chambers and heat dissipation chambers. This arrangement enables the regional independent operation of refrigerant distribution, heat exchange and recovery, so that the device can avoid cross-flow interference and improve the stability and reliability of the device operation.

[0027] Multiple sets of mounting holes are provided on the partition plate 14, and multiple sets of cooling fins 15 are provided in the heat dissipation cavity. The two ends of the cooling fins 15 extend into the corresponding liquid cavity through the mounting holes of the two sets of partition plates 14, and the multiple sets of cooling fins 15 are evenly arrayed along the height direction of the mounting plate 11. This arrangement can increase the heat dissipation area and optimize the coolant circulation path, thereby improving the overall heat dissipation efficiency of the device.

[0028] Multiple sets of cooling fins 15 are fitted with multiple sets of heat-conducting pillars 16, one end of which contacts the heat-conducting plate 12. This arrangement enhances heat transfer from the heat-conducting plate 12 to the cooling fins 15, enabling the device to dissipate heat more quickly and improving its heat dissipation efficiency.

[0029] like Figure 2 , 5As shown, the cooling fin 15 has a hollow, flat structure with internal flow channels in a serpentine shape. Both ends of the flow channels are connected to two sets of liquid distribution chambers. This design extends the residence time of the coolant within the cooling fin 15, allowing the device to fully utilize the coolant's cooling capacity and improving its heat exchange efficiency. The heat-conducting pillar 16 is made of oxygen-free copper and is fitted with multiple sets of heat-conducting pads 17. Heat-conducting pads 17 are also located on both sides of the cooling fin 15. This design enhances the heat conduction between the heat-conducting pillar 16 and the cooling fin 15, reducing heat loss during the transfer process and improving the device's heat transfer efficiency.

[0030] The two sets of liquid distribution chambers are an inlet chamber and an outlet chamber, respectively. The inlet chamber has an inlet port 18 on one side, and the outlet chamber has an outlet port 19 on one side. This arrangement allows for the planning of the inlet and outlet paths of the coolant, ensuring smooth coolant circulation and improving the stability of the coolant circulation system.

[0031] An annular sealing groove is provided at the connection between the mounting plate 11 and the outer casing 13, and a fluororubber sealing ring 21 is embedded in the sealing groove. The mounting plate 11 and the outer casing 13 are connected by multiple sets of bolts. This arrangement ensures the sealing performance of the liquid cooling plate, preventing coolant leakage and improving the safety and durability of the device.

[0032] The heat dissipation cavity is filled with a thermally conductive medium, which is a thermally conductive gel. This arrangement fills the gap between the cooling fin 15 and the outer shell 13, eliminates air thermal resistance, and improves the heat exchange efficiency of the device, thereby enhancing its heat dissipation performance.

[0033] like Figure 6 As shown, a cooling box 22 and a cooling fan 23 are provided. The inlet and outlet ports of the cooling box 23 are respectively connected to the liquid inlet port 18 and the liquid outlet port 19 on the outer shell 13 of the liquid cooling plate to form a refrigeration circuit. The cooling fan 23 is installed on one side of the cooling box 22.

[0034] This configuration, through the cooling box 22 and the cooling fan 23, achieves circulating cooling and rapid heat dissipation of the coolant. Specifically, the cooling box 22 is responsible for cooling the high-temperature coolant flowing out of the liquid cooling plate outlet 19, restoring it to a lower temperature. The cooled coolant is then piped back to the liquid cooling plate inlet 18, forming a continuous and stable cooling loop. This ensures a constant flow of low-temperature coolant to the liquid cooling plate to maintain its heat dissipation effect. The cooling fan 23, installed on one side of the cooling box 22, accelerates the airflow around the cooling box 22, quickly removing the heat generated during the cooling process and further improving its cooling efficiency. This ensures the operation of the entire cooling loop, dissipates heat from the server, and guarantees stable server operation. The liquid cooling box 22 can utilize NENX's AL-6 air-liquid CDU.

[0035] The specific usage and function of this embodiment are as follows:

[0036] In practical applications, installation and connection are performed first. The heat-conducting plate 12 is inserted into the mounting groove of the mounting plate 11, and the mounting plate 11 with the heat-conducting plate 12 is securely connected to the outer casing 13 using multiple sets of bolts. Simultaneously, the fluororubber sealing ring 21 within the annular sealing groove at the connection ensures good sealing of the liquid cooling plate. The liquid inlet port 18 and liquid outlet port 19 are respectively connected to the external coolant circulation system. The entire cold plate assembly is installed close to heat sources such as the CPU. This installation ensures the stability of the liquid cooling plate structure, prevents coolant leakage, and achieves close contact with the server's heat-generating components and connection to the external circulation system, laying the foundation for heat dissipation.

[0037] When the server is running, the heat generated is transferred to the heat-conducting plate 12 in contact with it. After the heat-conducting plate 12 collects the heat, it conducts the heat to the cooling plate 15 through the heat-conducting pillar 16 in contact with it. Here, the heat-conducting plate 12 captures the heat, and the heat-conducting pillar 16 made of oxygen-free copper, together with the heat-conducting pad 17, transfers the heat to the cooling plate 15, preventing heat from accumulating at the heat source.

[0038] Next comes the coolant circulation and heat dissipation process. Coolant flows into the inlet chamber from the inlet port 18, and through the mounting holes on the baffle 14, enters the serpentine flow channel of the cooling fins 15. While flowing within the channel, the coolant absorbs heat transferred from the heat-conducting pillars 16 by the cooling fins 15. After heating up, it flows into the outlet chamber through the mounting holes on the other side of the baffle 14, and finally flows out from the outlet port 19, entering external cooling equipment for cooling and reuse. Multiple sets of cooling fins 15 are evenly arrayed along the height of the mounting plate 11, performing heat exchange synchronously. This serpentine flow channel extends the contact time between the coolant and the cooling fins 15. The separation of the distribution chamber and the heat dissipation chamber, along with the array of the cooling fins 15, optimizes coolant distribution and heat dissipation paths, solving the problem of uneven server heat dissipation.

[0039] Furthermore, the thermally conductive gel filling the heat dissipation cavity plays a role in enhancing heat dissipation. It fills the gap between the cooling fin 15 and the outer shell 13, eliminating air thermal resistance. With its high thermal conductivity, the thermally conductive gel can improve the heat transfer efficiency within the heat dissipation cavity, allowing the heat emitted by the cooling fin 15 to be transferred to the outer shell 13 more quickly and dissipated, further enhancing the overall heat dissipation performance of the liquid cooling plate.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments.

Claims

1. A server liquid cooling plate, comprising a mounting plate (11), characterized in that: The mounting plate (11) has a mounting groove, and a heat-conducting plate (12) is installed in the mounting groove. The top of the mounting plate (11) has a shell (13), and the shell (13) has two sets of partitions (14). The two sets of partitions (14) divide the shell (13) into two sets of liquid dispensing chambers and heat dissipation chambers. The partitions (14) have multiple sets of mounting holes. The heat dissipation chambers have multiple sets of cooling fins (15). The two ends of the cooling fins (15) extend into the liquid dispensing chambers through the mounting holes of the two sets of partitions (14), and the multiple sets of cooling fins (15) are evenly arrayed along the height direction of the mounting plate (11). Multiple sets of heat-conducting columns (16) are inserted through the multiple sets of cooling fins (15), and one end of the heat-conducting column (16) contacts the heat-conducting plate (12).

2. The server liquid cooling plate according to claim 1, characterized in that: The cooling plate (15) has a hollow and flat structure. The cooling plate (15) has a flow channel inside. The flow channel is serpentine and its two ends are respectively connected to the two sets of liquid distribution chambers.

3. A server liquid cooling plate according to claim 2, characterized in that: The heat-conducting column (16) is made of oxygen-free copper. Multiple sets of heat-conducting pads (17) are sleeved on the heat-conducting column (16). The heat-conducting pads (17) are provided on both sides of the cooling plate (15).

4. A server liquid cooling plate according to claim 3, characterized in that: The two sets of liquid preparation chambers are a liquid inlet chamber and a liquid outlet chamber, respectively. The liquid inlet chamber is provided with a liquid inlet port (18) on one side, and the liquid outlet chamber is provided with a liquid outlet port (19) on one side.

5. A server liquid cooling plate according to claim 1, characterized in that: The mounting plate (11) and the outer shell (13) are provided with an annular sealing groove, and a fluororubber sealing ring (21) is embedded in the sealing groove. The mounting plate (11) and the outer shell (13) are connected by multiple sets of bolts.

6. A server liquid cooling plate according to claim 1, characterized in that: The heat dissipation cavity is filled with a thermally conductive medium, which is a thermally conductive gel.

7. A cold plate assembly, comprising a cooling box (22) and a heat dissipation fan (23), characterized in that: The inlet and outlet ports of the cooling box (22) are respectively connected to the outer shell (13) pipe of the server liquid cooling plate according to any one of claims 1 to 6 to form a cooling circuit; the heat dissipation fan (23) is installed on one side of the cooling box (22).

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