An electronic device

Abstract

The application discloses an electronic device, a cooling cavity of a heat dissipation module of the electronic device is in communication with a plurality of evaporation cavities, and the cooling cavity and the evaporation cavities are arranged in an upper and lower mode, so that steam generated by heat exchange can automatically rise into the cooling cavity, and condensed liquid can flow back to the evaporation cavities under the action of gravity, the circulation speed of a phase change liquid cooling medium is accelerated, and the heat dissipation efficiency is improved. Moreover, no additional circulation driving component needs to be added for the cooling medium, cost is reduced, the occupied space is smaller, application is more flexible, and the heat dissipation efficiency is improved. The electronic device comprises a heat dissipation module and a plurality of heat generating devices, wherein the heat dissipation module comprises one cooling cavity and a plurality of evaporation cavities, the plurality of evaporation cavities are respectively connected with the one cooling cavity in pipeline connection, the one cooling cavity is higher than the plurality of evaporation cavities in the direction of gravity, and the evaporation cavities are in heat conduction connection with the heat generating devices.

Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, and in particular to an electronic device. Background Technology

[0002] As server chips become increasingly integrated, their power consumption also increases, leading to greater heat generation. For chip cooling, traditional air cooling typically uses higher-performance fans to achieve better heat dissipation. However, these high-performance fans are noisier and can cause disturbance to users. Utility Model Content

[0003] To address the aforementioned problems, this application provides an electronic device in which the cooling chamber of the heat dissipation module is interconnected with multiple evaporation chambers, and the cooling chambers and evaporation chambers are arranged vertically, allowing the steam generated during heat exchange to automatically rise into the cooling chamber, while the condensed liquid can flow back to the evaporation chamber under gravity. This accelerates the circulation speed of the phase change liquid cooling medium and improves heat dissipation efficiency. Furthermore, it eliminates the need for additional circulation drive components for the cooling medium, reducing costs, occupying less space, and offering flexible application while enhancing heat dissipation efficiency.

[0004] The electronic device provided in the embodiments of this application includes a heat dissipation module and multiple heat-generating devices. The heat dissipation module includes a cooling cavity and multiple evaporation cavities. The multiple evaporation cavities are respectively connected to the cooling cavity through pipes. Along the direction of gravity, the cooling cavity is higher than the multiple evaporation cavities. The evaporation cavities are thermally connected to the heat-generating devices.

[0005] In the above embodiments, the electronic device can specifically be a server, particularly a tower server. A tower server is a server device with a shape similar to a desktop computer, typically placed on a desktop. Multiple heat-generating components can be, for example, a CPU or GPU. The cooling chamber and evaporation chamber are arranged vertically, allowing the steam generated during heat exchange to automatically rise into the cooling chamber, and the condensed liquid to flow back to the evaporation chamber under gravity. This accelerates the circulation speed of the phase change liquid cooling medium and improves heat dissipation efficiency. Furthermore, no additional circulation drive components are needed for the cooling medium, reducing costs.

[0006] Multiple evaporation chambers can dissipate heat for multiple heat-generating devices, and these chambers share a single cooling chamber. The cooling chamber is interconnected with the multiple evaporation chambers, enabling it to cool the steam generated by all chambers and improving heat dissipation efficiency. Compared to a heat dissipation architecture where each evaporation chamber corresponds to a separate cooling chamber, and multiple heat dissipation architectures are required within the device, the heat dissipation module of this application occupies less space and is more flexible in application. When the number of heat-generating devices is small, or when the power of a single heat-generating device is high, fewer evaporation chambers can be used, and unused pipes can be blocked, allowing the cooling chamber to support heat dissipation for higher-power heat-generating devices.

[0007] In one embodiment, the number of the plurality of evaporation chambers is the same as the number of the plurality of heating devices, and each of the evaporation chambers is thermally connected to one of the heating devices to achieve targeted cooling of the heating devices.

[0008] In one embodiment, the cooling cavity has multiple perforated structures spaced apart along a first direction. These perforated structures penetrate the cooling cavity along the direction of gravity, dividing the cooling cavity into multiple interconnected finned cavities. The first direction is perpendicular to the direction of gravity. The multiple perforated structures increase the surface area of ​​the cooling cavity, thereby increasing its heat dissipation surface. Furthermore, the perforated structures form air ducts, allowing air to pass through and accelerating the condensation rate of the cooling medium within the cooling cavity, thus improving the heat dissipation efficiency of the heat dissipation module.

[0009] In one embodiment, the heat dissipation module further includes a fan module mounted at the bottom of the cooling cavity along the direction of gravity, with the exhaust side of the fan module facing the cooling cavity. The fan module can accelerate airflow, thereby achieving rapid cooling. The combination of air cooling and liquid cooling effectively improves the heat dissipation efficiency of the heat dissipation module by radiating heat from the heat-generating components.

[0010] In one embodiment, the fan module at least partially overlaps with the perforated structure along the direction of gravity. The exhaust side of the fan faces the cooling cavity, and the cool air from the exhaust side of the fan module can pass through the air duct formed by the perforated structure, promoting the cooling of the cooling cavity.

[0011] In one embodiment, the hollow structure includes a fin assembly comprising multiple fins spaced apart along a second direction, wherein the first direction, the second direction, and the direction of gravity are perpendicular to each other. The fin assembly effectively increases the outer surface area of ​​the cooling cavity, and the air ducts formed between the fins allow cold air to pass through, further promoting the cooling of the cooling cavity and thus improving heat dissipation efficiency.

[0012] In one embodiment, the electronic device further includes a chassis with a top plate and a first ventilation hole. Along the direction of gravity, the perforated structure at least partially overlaps with the first ventilation hole. Cool air from the fan module's exhaust side undergoes heat exchange through the perforated structure of the cooling cavity and is then discharged from the chassis through the first ventilation hole, preventing heat accumulation inside the chassis and thus avoiding impaired heat dissipation.

[0013] In one embodiment, the cooling cavity includes a top wall and a bottom wall disposed opposite to each other along the direction of gravity. The bottom wall is provided with a plurality of air inlets and a plurality of liquid outlets. The plurality of air inlets and the plurality of liquid outlets are spaced apart and alternately disposed along a first direction, which is perpendicular to the direction of gravity. The plurality of air inlets and the plurality of liquid outlets can connect to a plurality of evaporation cavities.

[0014] In one embodiment, a boss is provided on the side of the air inlet facing the interior of the cooling cavity. This boss acts as a barrier to the returning cooling medium, reducing the amount of cooling medium flowing out of the air inlet.

[0015] In one embodiment, the plurality of evaporation chambers includes a first evaporation chamber, which includes a first shell and a plurality of first heat dissipation fins. The first shell includes a first bottom wall and a first top wall. The plurality of first heat dissipation fins are spaced apart from each other on the first bottom wall, with a gap between each first heat dissipation fin and the first top wall. The gap between each first heat dissipation fin and the first top wall forms a flow space to allow steam to accumulate and flow. The plurality of first heat dissipation fins are used to increase the heat dissipation area between the first evaporation chamber and the cooling medium, thereby improving heat transfer efficiency.

[0016] In one embodiment, the plurality of evaporation chambers includes a second evaporation chamber, which comprises a second shell and a plurality of second heat dissipation fins. The second shell includes a second bottom wall and a second top wall. The plurality of second heat dissipation fins are spaced apart from each other on the second bottom wall, with a gap between each second heat dissipation fin and the second top wall to form a flow space, allowing steam to accumulate and flow. The plurality of second heat dissipation fins increase the heat dissipation area between the second evaporation chamber and the cooling medium, thereby improving heat transfer efficiency.

[0017] In one embodiment, the electronic device further includes a chassis and a power module. The power module is mounted on the bottom of the chassis, which includes a base plate with a second ventilation hole. The power module has a cooling fan with its intake side facing the base plate. Along the direction of gravity, the power module at least partially overlaps with the second ventilation hole to isolate the heat from the chassis interior. External cool air can enter the chassis through the second ventilation hole to dissipate heat from the power module. Simultaneously, the heat generated by the power module can also diffuse to the outside of the chassis through the second ventilation hole, ensuring that the temperature on the intake side of the power module meets the usage requirements.

[0018] In one embodiment, the plurality of heat-generating devices includes a first heat-generating device and a second heat-generating device, which are disposed between the cooling cavity and the power module. Since both the top and bottom plates of the chassis have ventilation holes, and a fan module is installed within the chassis, a heat dissipation channel is formed between the top and bottom plates. Driven by the fan module, cool air enters the chassis from the bottom plate, gradually rises, and then flows out from the top plate. The first and second heat-generating devices are positioned precisely within this heat dissipation channel between the cooling cavity and the power module, which helps improve heat dissipation efficiency.

[0019] In one embodiment, the piping includes gas piping and liquid piping, and the piping is flexible. Flexible piping is more adaptable than rigid piping, and can be bent according to the space inside the chassis to reduce the impact on other components in the electronic equipment. Attached Figure Description

[0020] Figure 1 A schematic diagram of the structure of an electronic device provided in one embodiment of this application;

[0021] Figure 2 This is a schematic diagram of the assembly of the heating device and the evaporation cavity provided in one embodiment of the present application;

[0022] Figure 3 A schematic diagram of the assembly of the heating element and the evaporation cavity provided for another embodiment of this application;

[0023] Figure 4 A structural diagram of a cooling cavity and fan module provided in one embodiment of this application;

[0024] Figure 5 A structural diagram of a cooling cavity provided in one embodiment of this application;

[0025] Figure 6 A schematic diagram of the structure of an electronic device provided in another embodiment of this application;

[0026] Figure 7 A schematic diagram of the structure of the bottom plate of the cooling cavity provided in one embodiment of this application;

[0027] Figure 8 A structural diagram of a first evaporation chamber provided in one embodiment of this application;

[0028] Figure 9 A cross-sectional view of a first evaporation chamber provided in one embodiment of this application;

[0029] Figure 10 A structural diagram of a second evaporation chamber provided in one embodiment of this application;

[0030] Figure 11 A perspective view of a second evaporation chamber provided for one embodiment of this application.

[0031] Figure label:

[0032] 1-Cooling chamber; 11-Perforated structure; 12-Top wall; 13-Bottom wall; 131-Air inlet; 132-Liquid outlet; 111-Fin assembly;

[0033] 3-Gas piping; 4-Liquid piping; 5-Heating element; 0-Circuit board;

[0034] 2-Evaporation chamber; 21-First evaporation chamber; 211-First top wall; 212-First bottom wall; 213-First side wall; 214-Second side wall; 215-First heat dissipation fin;

[0035] 22-Second evaporation chamber; 221-Second top wall; 222-Second bottom wall; 223-Third side wall; 224-Second heat dissipation fins;

[0036] X - First direction; Y - Gravity direction; Z - Second direction.

[0037] 6-Fan module; 61-Fan unit;

[0038] 7-Chassis; 71-Baseplate; 711-Second ventilation hole;

[0039] 8-Power supply module; 9-Hard disk; 10-Memory. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description of the application is provided in conjunction with the accompanying drawings and embodiments.

[0041] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0042] References to “an embodiment” or “a specific embodiment” as used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. The terms “comprising,” “including,” “having,” and variations thereof mean “including, but not limited to,” unless otherwise specifically emphasized.

[0043] Air cooling is commonly used to dissipate heat from high-power components in servers (such as CPUs and GPUs). The core cooling components include a heatsink, heat pipes, heat sink fins, and a fan, utilizing heat conduction and convection to reduce temperature. However, when the power consumption of high-power components exceeds 400W, high-power fans can cause excessive noise, which is detrimental to the desktop layout of tower servers.

[0044] In related technologies, servers typically employ a hybrid air-liquid cooling system for each high-power device. This system includes a liquid cooling unit and a single fan, combining air and liquid cooling to improve heat dissipation efficiency. Because the liquid cooling channels of multiple hybrid cooling systems are independent, multiple systems are required if a server contains multiple high-power devices, resulting in significant space consumption. Furthermore, each hybrid cooling system has a heat dissipation limit of approximately 500W, which is insufficient for cooling higher-power devices, hindering product expansion and requiring replacement of the cooling system for even higher-power devices during future maintenance.

[0045] In view of this, embodiments of this application provide an electronic device that can solve the heat dissipation problem of multiple high-power devices in a server, and has low noise, as well as good adaptability and scalability.

[0046] Figure 1 A schematic diagram of the structure of an electronic device provided in one embodiment of this application, such as... Figure 1 As shown in the figure, an embodiment of this application provides an electronic device including a heat dissipation module and multiple heat-generating devices 5 (not shown). The heat dissipation module includes a cooling cavity 1 and multiple evaporation cavities 2, each of which is connected to the cooling cavity 1 via piping. Along the gravitational direction Y, the cooling cavity 1 is higher than the multiple evaporation cavities 2, and the evaporation cavities 2 are thermally connected to the heat-generating devices 5.

[0047] In the above embodiments, the electronic device can specifically be a server, particularly a tower server. A tower server is a server device with a shape similar to a desktop computer host, typically placed on a desktop for use. Multiple heat-generating devices 5 can be, for example, a CPU, GPU, etc. Multiple evaporation chambers 2 are all liquid-cooled gas-liquid phase-change chambers, and the cooling chamber 1 and evaporation chamber 2 are filled with a cooling medium. The evaporation chamber 2 is thermally connected to the heat-generating devices 5, enabling heat transfer through contact. When the heat-generating devices 5 are operating, the heat generated can be absorbed by the cooling medium within the evaporation chamber 2. The cooling medium is a phase-change liquid cooling medium; when the cooling medium absorbs heat and its temperature rises, part of the liquid turns into vapor. Because the cooling chamber 1 is higher than the evaporation chamber 2, the vapor automatically rises and enters the higher-positioned cooling chamber 1 through pipes. After the vapor reaches the cooling chamber 1, where the temperature is lower, the vapor condenses and returns to liquid. Another portion of the cooling medium absorbs heat in the evaporation chamber 2 and then enters the cooling chamber 1 for cooling. Under the influence of gravity, the cooled liquid flows back to the evaporation chamber 2 through the pipeline, and absorbs the heat generated by the heating device 5 again. This cycle carries away the heat from the heating device 5, realizing the self-driving heat dissipation of the heat dissipation module.

[0048] The cooling chamber 1 and the evaporation chamber 2 are arranged vertically, allowing the steam generated during heat exchange to automatically rise into the cooling chamber 1, while the condensed liquid can flow back to the evaporation chamber 2 under gravity. This accelerates the circulation speed of the phase change liquid cooling medium and improves heat dissipation efficiency. Furthermore, no additional circulation drive components are needed for the cooling medium, reducing costs.

[0049] Multiple evaporation chambers 2 can dissipate heat for multiple heat-generating devices 5, and the multiple evaporation chambers 2 share a single cooling chamber 1. The cooling chamber 1 is interconnected with the multiple evaporation chambers 2, enabling the cooling chamber 1 to cool the steam generated by the multiple evaporation chambers 2, thereby improving heat dissipation efficiency. Compared to a heat dissipation architecture where one cooling chamber 1 is set for each evaporation chamber 2, and multiple sets of heat dissipation architectures are required within the device, the heat dissipation module of this application occupies less space and is more flexible in application. When the number of heat-generating devices 5 is small, or when the power of a single heat-generating device 5 is high, fewer evaporation chambers 2 can be set, and unused pipes can be blocked, allowing the cooling chamber 1 to support heat dissipation for higher-power heat-generating devices 5.

[0050] In one embodiment, the piping includes a gas pipe 3 and a liquid pipe 4, and the piping is flexible. Vapor in the evaporation chamber 2 enters the cooling chamber 1 through the gas pipe 3, condenses, and then flows back to the evaporation chamber 2 through the liquid pipe 4. Flexible piping is more adaptable than rigid piping, allowing it to bend according to the space within the chassis, thus reducing impact on other components in the electronic equipment.

[0051] In one embodiment, the volume of the cooling cavity 1 is larger than the volume of each evaporation cavity 2 to increase the condensation rate of the cooling medium, thereby improving heat dissipation efficiency. Specifically, along the first direction X, the length of the cooling cavity 1 is approximately three times the length of a single evaporation cavity 2. Of course, in other embodiments, the length of the cooling cavity 1 may also be other multiples of the length of a single evaporation cavity 2, and this application does not impose specific limitations.

[0052] In one embodiment, the number of evaporation chambers 2 is the same as the number of heat-generating devices 5, and each evaporation chamber 2 is connected to one heat-generating device 5. Specifically, the electronic device has three heat-generating devices 5, such as one CPU and two GPUs. Furthermore, the heat dissipation module includes three evaporation chambers 2, each of which is thermally connected to one heat-generating device 5 to dissipate heat.

[0053] Figure 2 This is a schematic diagram of the assembly of the heating element and the evaporation cavity according to one embodiment of this application. Figure 3 This is a schematic diagram illustrating the assembly of the heating element and the evaporation chamber according to another embodiment of this application. Figure 2 As shown, in other embodiments, the number of evaporation chambers 2 can be greater than the number of heating elements 5. Each of the multiple evaporation chambers 2 is thermally connected to one heating element 5, improving heat dissipation efficiency. Specifically, when two evaporation chambers 2 are thermally connected to one heating element 5, the two evaporation chambers 2 can be respectively disposed on opposite sides of the heating element 5, for example, one evaporation chamber 2 is disposed on the top surface of the heating element 5, and the other evaporation chamber 2 is disposed on the bottom surface of the heating element 5. Or as... Figure 3 As shown, the two evaporation chambers 2 are located on the same side of the heating device 5.

[0054] Figure 4 This is a structural diagram of a cooling cavity and fan module provided in one embodiment of this application. Figure 5 This is a structural diagram of a cooling cavity provided in one embodiment of the present application, combined with... Figure 4 and Figure 5 In one embodiment, the cooling cavity 1 has multiple perforated structures 11 spaced apart along a first direction X. The perforated structures 11 extend along the gravitational direction Y, dividing the cooling cavity 1 into multiple interconnected finned cavities. The first direction X is perpendicular to the gravitational direction Y. Specifically, the multiple perforated structures 11 increase the surface area of ​​the cooling cavity 1, thereby increasing its heat dissipation surface. Furthermore, the perforated structures 11 form air ducts, allowing air to pass through and accelerating the condensation rate of the cooling medium in the cooling cavity 1, thus improving the heat dissipation efficiency of the heat dissipation module.

[0055] In one embodiment, the heat dissipation module further includes a fan module 6. Along the gravitational direction Y, the fan module 6 is mounted at the bottom of the cooling cavity 1, with its exhaust side facing the cooling cavity 1. The fan module 6 can accelerate airflow, thereby achieving rapid cooling. The combination of air cooling and liquid cooling effectively improves the heat dissipation efficiency of the heat dissipation module by cooling the heat-generating device 5.

[0056] In a further embodiment, along the gravitational direction Y, the fan module 6 at least partially overlaps with the hollow structure 11. The air outlet side of the fan faces the cooling cavity 1, and the cold air blown out by the fan module can pass through the air duct formed by the hollow structure 11, promoting the cooling of the cooling cavity 1.

[0057] In a further embodiment, the hollow structure 11 includes a fin assembly 111, which comprises multiple fins spaced apart along the second direction Z. The first direction X, the second direction Z, and the gravitational direction Y are perpendicular to each other. The fin assembly 111 effectively increases the outer surface area of ​​the cooling cavity 1, and the air ducts formed between the fins allow cold air to pass through, further promoting the cooling of the cooling cavity 1 and thus improving heat dissipation efficiency.

[0058] In one embodiment, the fan module 6 may include a plurality of fan units 61 arranged along a first direction X. When the fan module 6 rotates the plurality of fan units 61 in accordance with the heat dissipation standard of the highest temperature, the plurality of fan units 61 can achieve the same temperature control effect at a lower speed, which makes the fan module 6 quieter and makes the electronic device more suitable for desktop placement.

[0059] In one specific embodiment, the fan module may include three, four, five or more individual fan units. This application does not impose a specific limit on the number of individual fan units.

[0060] Figure 6 A schematic diagram of the structure of an electronic device provided for another embodiment of this application, as shown below. Figure 6 As shown, in one embodiment, the electronic device further includes a chassis 7, in which the heat dissipation module and the heat-generating device 5 are both installed. The chassis includes a top plate (not shown), and a cooling cavity 1 is installed on the top of the chassis near the top plate. The top plate has a first ventilation hole (not shown), and along the direction of gravity Y, the perforated structure 11 at least partially overlaps with the first ventilation hole. The cold air from the exhaust side of the fan module 6 is cooled by the perforated structure 11 of the cooling cavity 1 and then discharged from the chassis through the first ventilation hole, preventing heat from accumulating inside the chassis and affecting heat dissipation.

[0061] Figure 7 This is a schematic diagram of the structure of the bottom plate of the cooling cavity provided in one embodiment of this application. (Continue referring to...) Figure 4 , Figure 5 and Figure 7In one embodiment, the cooling cavity 1 includes a top wall 12 and a bottom wall 13 arranged opposite each other along the gravitational direction Y. The bottom wall 13 is provided with a plurality of air inlets 131 and a plurality of liquid outlets 132, which are spaced apart and alternately arranged along the first direction X. Specifically, the cooling cavity 1 can be divided into multiple regions, which are arranged along the first direction X, such as... Figure 1 As shown, in this embodiment, the cooling chamber 1 is divided into three interconnected regions along the first direction X. Each region is provided with an air inlet 131 and a liquid outlet 132, and correspondingly, one air inlet 131 and one liquid outlet 132 of that region are connected to one evaporation chamber 2. Thus, the three regions can be connected to three evaporation chambers 2. The three evaporation chambers 2 share one cooling chamber 1. Steam can enter the cooling chamber 1 from the air inlet pipe of any region of the cooling chamber 1 and quickly flow to the entire cooling chamber 1 for uniform cooling, improving the cooling speed. Similarly, the liquefied liquid can flow back to the evaporation chamber 2 from the liquid outlet pipe of any region, improving heat dissipation efficiency.

[0062] Just for reference Figure 7 In a further embodiment, a boss is provided on the side of the air inlet 131 facing the interior of the cooling cavity 1. This boss acts as a barrier to the returning cooling medium, reducing the possibility of the cooling medium flowing back from the air inlet 131. The liquid inlet is flush with the cavity surface, leaving no obstruction to the returning cooling medium, which is beneficial for the return of the cooling medium.

[0063] Figure 8 This is a structural diagram of a first evaporation chamber provided in one embodiment of this application. Figure 9 A cross-sectional view of a first evaporation chamber provided for one embodiment of this application, as shown below. Figure 8 and Figure 9As shown, in one embodiment, the plurality of evaporation chambers 2 include a first evaporation chamber 21, which includes a first shell and a plurality of first heat dissipation fins 215. Specifically, the first evaporation chamber 21 can be used to dissipate heat for a CPU mounted on a circuit board 0 and parallel to the circuit board 0. The first evaporation chamber 21 is mounted on the side of the CPU facing away from the circuit board 0. The first shell of the first evaporation chamber includes a first bottom wall 212 and a first top wall 211 disposed opposite each other along the gravitational direction Y, and also includes a first side wall 213 connected to the first bottom wall 212 and the first top wall 211, which is thermally connected to the CPU. Compared with the first bottom wall 212 and the first top wall 211, the first side wall 213 has a larger area and a larger contact area with the CPU, thereby improving heat transfer efficiency. The plurality of first heat dissipation fins 215 are spaced apart along the first direction X on the first bottom wall 212, and each first heat dissipation fin 215 has a gap with the first top wall 211 to form a flow space so that vapor can accumulate and flow. Multiple first heat dissipation fins 215 are used to increase the heat dissipation area between the first evaporation cavity 21 and the cooling medium, thereby improving heat transfer efficiency.

[0064] In a further embodiment, the first evaporation chamber 21 further includes a second sidewall 214, which is disposed opposite to the first sidewall 213. The second sidewall 214 is provided with a first gas transmission pipe connector and a first liquid return pipe connector. Along the gravitational direction Y, the first gas transmission pipe connector is located above the first liquid return pipe connector.

[0065] Figure 10 This is a structural diagram of the second evaporation chamber provided in one embodiment of this application. Figure 11 A perspective view of a second evaporation chamber provided in one embodiment of this application, as shown below. Figure 10 and Figure 11 As shown, in another embodiment, the plurality of evaporation chambers 2 further include a second evaporation chamber 22, which includes a second housing and a plurality of second heat dissipation fins 224. Specifically, the second evaporation chamber 22 can be used to dissipate heat for a GPU mounted on a circuit board 0 and perpendicular to the circuit board 0. The second evaporation chamber 22 can be mounted on the bottom of the GPU and is thermally connected to the GPU. The second housing of the second evaporation chamber 22 includes a second bottom wall 222 and a second top wall 221. A plurality of second heat dissipation fins 224 are spaced apart along a first direction X on the second bottom wall 222, and each second heat dissipation fin 224 has a gap with the second top wall 221 to form a flow space so that steam can accumulate and flow.

[0066] In a further embodiment, the second evaporation chamber 22 includes a third sidewall 223, which connects to the second top wall 221 and the second bottom wall 222. The third sidewall 223 is provided with a second gas transmission pipe connector and a second liquid return pipe connector spaced apart along the second direction Z. Along the first direction X shown in the figure, the left side is the front end and the right side is the rear end. The third sidewall 223 is located at the rear end of the second heat dissipation chamber.

[0067] In one embodiment, the plurality of heat-generating devices 5 include a first heat-generating device and a second heat-generating device, which are disposed between the cooling cavity 1 and the power module 8. Specifically, the first heat-generating device may be a CPU, and the second heat-generating device may be a GPU. The electronic device may include two GPUs, which are spaced apart along the gravitational direction Y. Each GPU is thermally connected to a second evaporation cavity 22. Since the top and bottom plates of the chassis 7 are provided with ventilation holes, and a fan module is installed in the chassis, a heat dissipation channel is formed between the top and bottom plates. Driven by the fan module, cold air enters the chassis from the bottom plate, gradually rises, and then flows out from the top plate. The first and second heat-generating devices are disposed between the cooling cavity 1 and the power module 8, precisely within this heat dissipation channel, which helps to improve heat dissipation efficiency.

[0068] In one embodiment, the electronic device further includes a power module 8, which is mounted on the bottom of the chassis. The power module 8 also serves as a heat source. The chassis 7 includes a base plate 71 with a second ventilation hole 711. The power module 8 has a cooling fan with its intake side facing the base plate 71. Along the direction of gravity Y, the power module 8 and the second ventilation hole 711 at least partially overlap to isolate the heat from the chassis interior. The base plate 71 has a support leg on its outward-facing side, allowing a gap between the base plate and the placement surface (desktop). This allows cool air from outside to enter the chassis through the second ventilation hole 711 and dissipate heat from the power module 8. Simultaneously, the heat generated by the power module 8 can also be diffused to the outside of the chassis through the second ventilation hole 711, ensuring that the temperature on the intake side of the power module meets the usage requirements.

[0069] In one specific embodiment, the electronic device further includes a hard disk 9 and multiple memory modules 10. The hard disk can specifically be an M.2 solid-state drive. Along the gravitational direction Y, the hard disk is positioned above the GPU, and the multiple memory modules are positioned above the hard disk. The multiple memory modules are spaced apart along a first direction X, and their extension direction is consistent with the gravitational direction Y. This creates airflow channels between adjacent memory modules, and the direction of these airflow channels is consistent with the airflow channel formed by the aforementioned perforated structure 11, which facilitates the flow of cooling air and thus improves heat dissipation efficiency.

[0070] The electronic equipment layout of this application is reasonable, resulting in good ventilation inside the chassis. The heat dissipation module combines air cooling and liquid cooling, using a combined air-liquid cooling method to dissipate heat from the heat-generating components 5, thus improving heat dissipation efficiency. One cooling chamber 1 is connected to multiple evaporation chambers 2 via piping, resulting in high heat dissipation efficiency. Furthermore, the number of evaporation chambers 2 can be set as needed, offering good flexibility and adaptability, which is beneficial for future equipment expansion.

[0071] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An electronic device, characterized in that, Includes a heat dissipation module and multiple heat-generating components, among which, The heat dissipation module includes a cooling cavity and multiple evaporation cavities. The multiple evaporation cavities are respectively connected to the cooling cavity through pipes. Along the direction of gravity, the cooling cavity is higher than the multiple evaporation cavities. The evaporation cavities are thermally connected to the heat-generating device.

2. The electronic device according to claim 1, characterized in that, The number of the plurality of evaporation chambers is the same as the number of the plurality of heating devices, and each of the evaporation chambers is thermally connected to one of the heating devices.

3. The electronic device according to claim 1, characterized in that, The cooling cavity has multiple hollow structures spaced apart along a first direction. The hollow structures penetrate the cooling cavity along the direction of gravity and divide the cooling cavity into multiple interconnected fin cavities. The first direction is perpendicular to the direction of gravity.

4. The electronic device according to claim 3, characterized in that, The heat dissipation module also includes a fan module, which is installed at the bottom of the cooling cavity along the direction of gravity, with the air outlet side of the fan module facing the cooling cavity.

5. The electronic device according to claim 4, characterized in that, Along the direction of gravity, the fan module at least partially overlaps with the hollow structure.

6. The electronic device according to claim 3, characterized in that, The hollow structure is provided with a fin group, which includes a plurality of fins spaced apart along a second direction, wherein the first direction, the second direction and the gravity direction are perpendicular to each other.

7. The electronic device according to claim 3, characterized in that, It also includes a chassis, which includes a top plate with a first ventilation hole. Along the direction of gravity, the hollow structure at least partially overlaps with the first ventilation hole.

8. The electronic device according to claim 1, characterized in that, The cooling cavity includes a top wall and a bottom wall arranged opposite each other along the direction of gravity. The bottom wall is provided with a plurality of air inlets and a plurality of liquid outlets. The plurality of air inlets and the plurality of liquid outlets are spaced apart and alternately arranged along a first direction, which is perpendicular to the direction of gravity.

9. The electronic device according to claim 8, characterized in that, The air inlet is provided with a boss on the side facing the interior of the cooling cavity.

10. The electronic device according to claim 1, characterized in that, The plurality of evaporation chambers include a first evaporation chamber, the first evaporation chamber including a first shell and a plurality of first heat dissipation fins, the first shell including a first bottom wall and a first top wall, the plurality of first heat dissipation fins being spaced apart from the first bottom wall, and each first heat dissipation fin having a gap with the first top wall.

11. The electronic device according to claim 1, characterized in that, The plurality of evaporation chambers include a second evaporation chamber, the second evaporation chamber includes a second shell and a plurality of second heat dissipation fins, the second shell includes a second bottom wall and a second top wall, the plurality of second heat dissipation fins are spaced apart on the second bottom wall, and each second heat dissipation fin has a gap with the second top wall.

12. The electronic device according to claim 1, characterized in that, It also includes a chassis and a power module. The power module is installed at the bottom of the chassis. The chassis includes a base plate with a second ventilation hole. The power module has a cooling fan with the air intake side of the cooling fan facing the base plate. Along the direction of gravity, the power module and the second ventilation hole at least partially overlap.

13. The electronic device according to claim 12, characterized in that, The plurality of heating devices includes a first heating device and a second heating device, which are disposed between the cooling cavity and the power module.

14. The electronic device according to claim 1, characterized in that, The pipeline includes gas pipelines and liquid pipelines, and the pipeline is a flexible pipeline.

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