Touch module, touch display screen and electronic device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN GOODIX TECH CO LTD
- Filing Date
- 2025-05-08
- Publication Date
- 2026-08-07
Smart Images
Figure CN224609478U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of touch technology, specifically to a touch module, a touch display screen, and an electronic device. Background Technology
[0002] Touch sensors are widely used in various electronic products. A touch sensor typically includes a touch area and a non-touch area. The touch area comprises an array of touch nodes that sense touch operations and generate touch signals. The wiring area contains the connecting lines used to transmit touch signals and drive signals. In specific electronic devices with touch displays (such as smartphones and smartwatches), the touch area is roughly the same size as or slightly larger than the display area, while the non-touch area is located within the bezel of the touch display. With technological advancements, the bezels of touch displays are becoming increasingly narrow, continuously compressing the space available for the wiring area. Therefore, reducing the non-touch area of touch sensors has become a crucial issue. Utility Model Content
[0003] In view of the above problems, this application provides a touch module, a touch display screen, and an electronic device to solve the above technical problems.
[0004] In a first aspect, embodiments of this application provide a touch module, comprising: a touch area having N rows of first conductive grids arranged along a first direction and M columns of second conductive grids arranged along a second direction, the N rows of first conductive grids and the M columns of second conductive grids forming M multiplied N touch nodes, where M and N are positive integers; and a plurality of connecting grids located on different layers from the first conductive grids, each connecting grid being used to electrically connect a row of first conductive grids to a non-touch area, each connecting grid extending along the first direction and being blocked by the first conductive grids it passes through.
[0005] In some possible implementations, each connecting grid extends along a first direction and its orthogonal projection overlaps with the first conductive grid it passes through.
[0006] In some possible implementations, each row of the first conductive grid includes: P columns of first sub-conductive grids arranged along a second direction, where P is a positive integer; and multiple rows of second sub-conductive grids arranged along a first direction for electrically connecting the P columns of first sub-conductive grids; wherein each connected grid is shielded by a first sub-conductive grid of the first conductive grid it passes through.
[0007] In some possible implementations, each column of the second conductive grid includes: Q columns of third sub-conductive grids arranged along a second direction, the Q columns of third sub-conductive grids being electrically connected to each other, where Q is a positive integer.
[0008] In some possible implementations, the third sub-conductive grid in column Q is disconnected at the intersection with multiple rows of second sub-conductive grids, and the disconnected third sub-conductive grids are connected by a first conductive bridge; the connecting grid is located on the lower surface of the insulating layer, and the first conductive grid and the second conductive grid are located on the upper surface of the insulating layer; the first conductive bridge includes a first connecting line located on the lower surface of the insulating layer and a first connecting portion penetrating the insulating layer, the first connecting portion being used to connect the third sub-conductive grid to the first connecting line.
[0009] In some possible implementations, the multi-row second sub-conductive grid is disconnected at the intersection with the Q-column third sub-conductive grid, and the disconnected second sub-conductive grid is connected by a second conductive bridge; the connecting grid is located on the lower surface of the insulating layer, and the first conductive grid and the second conductive grid are located on the upper surface of the insulating layer; the second conductive bridge includes a second connecting line located on the lower surface of the insulating layer and a second connecting portion penetrating the insulating layer, the second connecting portion being used to connect the second sub-conductive grid to the second connecting line.
[0010] In some possible implementations, each column of the second conductive grid further includes at least one row of fourth sub-conductive grids extending along the second direction and located at the end of the third sub-conductive grid, the at least one row of fourth sub-conductive grids being used to electrically connect the Q column of the third sub-conductive grids.
[0011] In some possible implementations, each column of the second conductive grid further includes: multiple rows of fifth sub-conductive grids arranged along a first direction, the multiple rows of fifth sub-conductive grids being used to electrically connect the Q column of the third sub-conductive grids; the P column of the first sub-conductive grids being disconnected at the point where they intersect with the multiple rows of fifth sub-conductive grids; the multiple rows of second sub-conductive grids being disconnected at the point where they intersect with the Q column of the third sub-conductive grids, the disconnected second sub-conductive grids being connected by a third conductive bridge; the connecting grids being located on the lower surface of the insulating layer, the first conductive grids and the second conductive grids being located on the upper surface of the insulating layer; the third conductive bridge including a third connecting line located on the lower surface of the insulating layer and a third connecting portion penetrating the insulating layer, the third connecting portion being used to connect the second sub-conductive grids to the third connecting line.
[0012] In some possible implementations, the outer contour of the first sub-conductive grid is elongated.
[0013] In some possible implementations, each touch node includes a first sub-conductive grid in column P / M and a third sub-conductive grid in column Q, wherein P / M and Q are greater than or equal to 3 and less than or equal to 7.
[0014] In some possible implementations, the first conductive grid, the second conductive grid, and the connecting grid are metal grids.
[0015] In some possible implementations, the touch area is rectangular, with a first direction being the direction of the long side of the rectangle and a second direction being the direction of the short side of the rectangle; the non-touch area is located in the direction of the short side.
[0016] In some possible implementations, the connecting grid is located on the lower surface of the insulating layer, and the first conductive grid and the second conductive grid are located on the upper surface of the insulating layer; each connecting grid extends along a first direction to the non-touch area and is electrically connected to the upper surface of the insulating layer through a fourth connecting portion penetrating the insulating layer.
[0017] In some possible implementations, the non-touch area on the upper surface of the insulating layer is also provided with a bonding point, and the fourth connection portion is connected to the bonding point, which is used to connect to the flexible circuit board (FPC).
[0018] Secondly, embodiments of this application also provide a touch display screen, including a display layer stacked on top of each other and a touch module as described in the first aspect.
[0019] In some possible implementations, the display layer has a plurality of pixel regions arranged in an array and light-shielding regions between adjacent pixel regions, and the first conductive grid, the second conductive grid and the connecting grid are projected onto the light-shielding regions in the display layer.
[0020] Thirdly, embodiments of this application also provide an electronic device, including a device body and a touch display screen as described in the second aspect above, disposed on the device body.
[0021] In the touch module, touch display screen, and electronic device provided in this application embodiment, the touch nodes and traces are located on different layers. This allows for the placement of a large number, or even all, of traces from a conductive mesh in one direction within the touch area, significantly reducing the non-touch area. Furthermore, this trace arrangement does not affect the area of the touch nodes, and the consistency of each touch node is largely unaffected by the traces. Further, the traces connect to the mesh and are shielded by the conductive mesh they pass through, reducing coupling with conductive meshes in another direction and minimizing interference with touch sensing, thus ensuring the accuracy of touch position calculation.
[0022] These or other aspects of this application will become more apparent in the following description of the embodiments. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1ASchematic diagrams of applicable electronic devices according to various exemplary embodiments of this application are shown.
[0025] Figure 1B A schematic diagram of a touch module that may be applied according to various exemplary embodiments of this application is shown.
[0026] Figure 2 An exemplary top view of a touch module according to an embodiment of this application is shown.
[0027] Figure 3 A schematic diagram of the stacked layers of a touch module according to an embodiment of this application is shown.
[0028] Figure 4A An exemplary shape of the first conductive grid of a touch node provided in an embodiment of this application is shown.
[0029] Figure 4B The adapter provided in the embodiments of this application is shown. Figure 4A An exemplary shape of the connecting mesh of the first conductive mesh.
[0030] Figure 5 A partial cross-sectional view of the touch module provided in an embodiment of this application is shown.
[0031] Figure 6 The diagram shows the connection relationship of the conduction bridge according to one embodiment of this application.
[0032] Figure 7 A diagram showing the connection relationship of the conduction bridge according to another embodiment provided in this application is illustrated.
[0033] Figure 8 This illustration shows a schematic diagram of the composition structure of a touch display screen provided in an embodiment of this application.
[0034] Figure 9 This illustration shows a schematic diagram of the positional relationship between a grid and a display layer pixel region according to an embodiment of this application.
[0035] Figure 10 This illustration shows a schematic diagram of the composition structure of an electronic device provided in an embodiment of this application. Detailed Implementation
[0036] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
[0037] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. To enable those skilled in the art to better understand the solutions of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0038] In the embodiments of this application, it should be noted that, in this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.
[0039] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0040] In the description of the embodiments of this application, the words "example" or "for example" are used to indicate exemplification, illustration, or description. Any embodiment or design described as "example" or "for example" in the embodiments of this application is not to be construed as being more preferred or having more advantages than another embodiment or design. The use of the words "example" or "for example" is intended to present relative concepts in a clear manner.
[0041] Furthermore, in this application embodiment, "multiple" refers to two or more. Therefore, in this application embodiment, "multiple" can also be understood as "at least two." "At least one" can be understood as one or more, such as one, two, or more. For example, including at least one means including one, two, or more, and it does not limit which ones are included. For example, including at least one of A, B, and C, then it could include A, B, C, A and B, A and C, B and C, or A and B and C. It should be noted that in this application embodiment, "and / or" describes the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / ", unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.
[0042] It should be noted that in the embodiments of this application, "connection" can be understood as electrical connection. The connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components.
[0043] Figure 1A Schematic diagrams of applicable electronic devices according to various exemplary embodiments of this application are shown. In some embodiments, electronic device 100 may be a portable mobile electronic device with a touch display screen, such as a smartphone, tablet, laptop, personal digital assistant, etc. In other embodiments, electronic device 100 may also be a smart wearable device. This disclosure does not limit the type of electronic device 100. Figure 1A As shown, the electronic device 100 may include a device body 101 and a touch display screen 102.
[0044] Please see Figure 1A As shown, the main body 101 of the device may include a mid-frame 20. The mid-frame 20 is generally located between the touch display screen 102 and the rear shell of the electronic device, supporting the touch display screen 102 and housing various functional components inside the main body 101, such as the motherboard, battery, camera, speaker, microphone, and various sensing units. In a specific embodiment, the mid-frame 20 may include a border surrounding the main body 101. The border may be integrally formed with the main body portion of the mid-frame 20 located between the touch display screen 102 and the rear shell, and may include multiple sides and house power buttons, volume buttons, or other function buttons, such as a side-mounted fingerprint sensor.
[0045] Please see Figure 1A As shown, the touch display screen 102 is located on the front of the device body 101. The touch display screen 102 is used to display images and provide a human-computer interaction interface for the user. It can detect the user's touch operation and generate touch signals for touch position calculation. Further, the touch display screen 102 includes a display area 1021 and a display bezel 1022, with the display bezel 1022 being a non-display area. The touch display screen 102 may include a display screen 103, which may include an active-matrix organic light-emitting diode (AMOLED) display screen. AMOLED displays are widely used in smartphones and other portable electronic devices due to their advantages such as thinness, flexibility, and foldability.
[0046] Please see Figure 1BAs shown, the touch display screen 102 includes a touch module 104, which includes a touch area 1041 and a non-touch area 1042. The touch area 1041 is substantially the same size as the display area 1021 of the touch display screen 102, or slightly larger. The touch area 1041 has multiple touch nodes 105 arranged in an array, which are used to detect user touch operations within the display area 1021. The non-touch area 1042 has connection lines 1043 for signal transmission between the touch nodes 105 and the touch chip 106. Please refer to... Figure 1B As shown, in some implementations, the touch chip 106 is disposed on a flexible printed circuit (FPC) 107, which is electrically connected to the connection line 1043 of the touch module 104. The touch chip 106 can send control signals to the touch node 105 through the connection line, and receive and process the touch signals generated by the touch node 105, such as calculating touch coordinates based on the touch signals.
[0047] Please see Figure 1A and Figure 1B As shown, the non-touch area 1042 is generally located on the display bezel 1022. As smartphones and other portable electronic devices move towards full-screen designs, the display bezel 1022 is becoming narrower. Correspondingly, the non-touch area 1042 is becoming narrower, and the connection lines 1043 also need to be changed accordingly.
[0048] In one implementation, horizontal and vertical touch channels are arranged in the touch area 1041, forming a matrix of multi-point mutual capacitance sensors. These mutual capacitance sensors serve as touch nodes 105. In a specific implementation, the touch channels can be conductive grids. In this case, the horizontal and vertical conductive grids interweave to form a matrix of multi-point mutual capacitance sensors. The display area 1021 of the touch screen 102 is typically rectangular, with common aspect ratios including 16:9, 18:9, and 19:9. Usually, there are more touch channels arranged along the longer side than along the shorter side. The touch channels arranged along the longer side extend along the shorter side, and vice versa. In a specific implementation, the channels arranged along the longer side are receiving channels (RX channels, also called sensing channels), and the channels arranged along the shorter side are transmitting channels (TX channels, also called driving channels), or vice versa. Please refer to [link to relevant documentation]. Figure 1A and Figure 1BAs shown, the display area 1021 has RX channels arranged along its long side and TX channels arranged along its short side. The non-touch area 1042 below the touch area 1041 (i.e., the side closest to the touch chip 106) contains the traces for the TX channels, while the non-touch areas 1042 on the left and right sides of the touch area 1041 contain the traces for the RX channels. Since the longer side corresponds to more touch channels, a larger trace area is required. To achieve a narrower display bezel 1022, the trace area for the touch channels along the longer side needs to be compressed.
[0049] In related technologies, wiring within the touch area is routed by occupying the area of touch nodes at the edge of the touch area, thereby reducing the area of the non-touch area. This implementation method reduces the area of touch nodes at the edge of the touch area, thus affecting the performance of the edge area of the touch display. Balancing edge performance requires limiting the space occupied by wiring, as the number of connection lines that can run within the touch area is limited, thus limiting the reduction in bezel width. Furthermore, there is coupling between the connection lines arranged within the touch area and adjacent touch nodes, forming a mutual capacitance value. This mutual capacitance value is superimposed on the mutual capacitance value of the touch nodes, resulting in poor consistency of the mutual capacitance values of the touch nodes on the touch display. This mutual capacitance value also affects the accuracy of touch coordinate calculation.
[0050] To address the aforementioned problems, embodiments of this application provide a touch module that can be applied to, for example... Figure 1A The electronic device 100 shown is designed to reduce the non-touch area and the display bezel.
[0051] Figure 2 An exemplary top view of a touch module according to an embodiment of this application is shown. Please refer to [link / reference]. Figure 2 As shown, the touch module 200 includes a touch area, which is provided with N rows of first conductive grids 221 arranged along a first direction and M columns of second conductive grids 222 arranged along a second direction. The N rows of first conductive grids 221 and the M columns of second conductive grids 222 are interleaved to form M by N touch nodes. Here, M and N are positive integers. In a specific implementation, the first conductive grids 221 are sensing channels, and the second conductive grids 222 are driving channels; or the first conductive grids 221 are driving channels, and the second conductive grids 222 are sensing channels. Please continue reading. Figure 2 As shown, the touch module 200 also includes multiple connecting grids 231, which are located on different layers from the first conductive grid 221. For an example, please refer to... Figure 2 and Figure 3As shown, a first conductive mesh 221 and a second conductive mesh 222 are disposed on the upper surface of the insulating layer 210, and the first conductive mesh 221 and the second conductive mesh 222 form a touch layer 220. A connecting mesh 231 is disposed on the lower surface of the insulating layer 210, and multiple connecting meshes 231 form a connecting layer 230. In this embodiment, the area where the first conductive mesh 221 and the second conductive mesh 222 are located on the insulating layer 210 is called the touch area.
[0052] Each connecting grid 231 is used to connect the first conductive grid 221 to the non-touch area 240, and the connecting grid 231 extends along a first direction. In this embodiment, the connecting grid 231 extends along the first direction and is shielded by the first conductive grid 221, so that the first conductive grid 221 shields at least part of the signal of the connecting grid 231, reducing the coupling formed between the connecting grid 231 and the second conductive grid 222. Preferably, the orthogonal projections of the connecting grid 231 and the first conductive grid 221 on the insulating layer 210 overlap, so that the signal of the connecting grid 231 is shielded by the first conductive grid 221 and basically does not couple with the second conductive grid 222, greatly reducing interference to touch sensing and ensuring the accuracy of touch position calculation.
[0053] In touchscreen applications such as smartphones, the touch area is typically rectangular, with one direction (first direction) being the long side of the rectangle and the other being the short side. In this embodiment, the first direction is the long side of the rectangle, and the second direction is the short side. The non-touch area 240 is located along the short side and outside the touch area. In some specific implementations, the N rows of first conductive grids 221 arranged along the long side constitute N sensing channels, and the M columns of second conductive grids 222 arranged along the short side constitute M driving channels. The touch chip can send driving signals to the M columns of second conductive grids 222 and detect the N rows of first conductive grids 221 to obtain touch signals.
[0054] In some implementations, the touch module 200 may include N connecting grids 231 to connect N rows of first conductive grids 221 to the non-touch area 240. In some implementations, the connecting grids 231 are fewer than N, so that only a portion of the N rows of first conductive grids 221 are connected to the non-touch area 240, and the remaining first conductive grids 221 can be used... Figure 1B The connection method shown is as follows: the connection lines are located in the non-touch areas on both sides of the upper surface of the insulating layer 210.
[0055] In some specific embodiments, the non-touch area 240 is also provided with a bonding point 241, which is used to connect to a flexible circuit board or a touch chip, for example... Figure 1BThe FPC 107 and touch chip 106 are shown. The bonding points 241 can be made of conductive materials such as anisotropic conductive adhesive (ACF), metal bump material, solder, or transparent conductive material. N rows of first conductive mesh 221 correspond to N bonding points 241, and each of the N bonding points 241 connects one row of the first conductive mesh 221 to the touch chip. M columns of second conductive mesh 222 correspond to M bonding points 241, and each of the M bonding points 241 connects one column of the second conductive mesh 222 to the touch chip.
[0056] In some implementations, the bonding point 241 is located in the non-touchable area 240 on the upper surface of the insulating layer 210. The connecting mesh 231 can be connected to the upper surface of the insulating layer 210 through a connecting portion penetrating the insulating layer 210, thereby connecting with the bonding point 241. Specifically, a window penetrating the insulating layer 210 can be provided on the insulating layer 210, and the connecting portion can be a conductive material disposed within the window. The conductive material forming the connecting portion can be metal. Further, in some examples, the connecting portion is directly connected to the bonding point 241, that is, the bonding point 241 is provided at one end of the connecting portion on the upper surface of the insulating layer 210 or serves as the bonding point 241. In other examples, such as Figure 2 As shown, the connecting mesh 231 is connected to the upper surface of the insulating layer 210 through a connecting portion penetrating the insulating layer 210, and connected to the first connecting line 251 in the non-touch area 240 on the upper surface of the insulating layer 210. The first connecting line 251 can be a non-mesh type. Further, the touch module 200 may also include a second connecting line 252, which connects the second conductive mesh 222 to the binding point 241 provided in the non-touch area 240 and is connected to the binding point 241. The second connecting line 252 can also be a non-mesh type. In some implementations, the binding point 241 can be provided on the lower surface of the insulating layer 210, and the second connecting line 252 can be connected to the lower surface of the insulating layer 210 through a connecting portion penetrating the insulating layer 210 to connect to the binding point 241. This embodiment will not elaborate further.
[0057] exist Figure 2 The outer contours of the first conductive mesh 221 and the second conductive mesh 222 are shown. Preferably, the outer contour of the first conductive mesh 221 is elongated to facilitate orthogonal projection overlap. For further illustration of the orthogonal projection overlap of the connecting mesh 231 and the first conductive mesh 221 it passes through on the insulating layer 210, please refer to [reference needed]. Figure 4A As shown, the first conductive grid 221 is composed of interconnected diamond-shaped grid cells. (See also...) Figure 4BAs shown, the connecting mesh 231 and the first conductive mesh 221 are connected using the same rhombic mesh units. In mode 1, the connecting mesh 231 is formed by connecting half a rhombic mesh unit; in mode 2, the connecting mesh 231 is formed by connecting one rhombic mesh unit to form one column; and in mode 3, the connecting mesh 231 is formed by connecting one rhombic mesh unit to form three columns. Since the connecting mesh 231 and the first conductive mesh 221 in modes 1, 2, and 3 are connected using the same rhombic mesh units, the orthogonal projections of the connecting mesh 231 and the first conductive mesh 221 onto the insulating layer 210 can overlap. It should be understood that the shape of the mesh units is not limited in this embodiment, and other polygons are also feasible. The width of the connecting mesh 231 can be specifically determined according to space and resistance.
[0058] For example, please refer to Figure 2 As shown, the touch area includes three rows of first conductive grids 221 arranged along a first direction and three columns of second conductive grids 222 arranged along a second direction. The three rows of first conductive grids 221 arranged along the first direction are designated as first conductive grid 221-1, first conductive grid 221-2, and first conductive grid 221-3, respectively. The three rows of second conductive grids 222 arranged along the second direction are designated as second conductive grid 222-1, second conductive grid 222-2, and second conductive grid 222-3, respectively. The three rows of first conductive grids 221 and the three columns of second conductive grids 222 interweave to form 3×3 touch nodes, designated as touch nodes S1, S2, S3, S4, S5, S6, S7, S8, and S9, for a total of nine touch nodes.
[0059] Continuing with this example, please refer to Figure 2 As shown, the connection layer 230 includes connection meshes 231-1, 231-2, and 231-3. Connection mesh 231-1 connects a first conductive mesh 221-1 to a non-touch area 240; connection mesh 231-2 connects a first conductive mesh 221-2 to a non-touch area 240; and connection mesh 231-3 connects a first conductive mesh 221-3 to a non-touch area 240. Further, connection mesh 231-1 is connected to a bonding point 241 via a first connection line 251-1; connection mesh 231-2 is connected to a bonding point 241 via a first connection line 251-2; and connection mesh 231-3 is connected to a bonding point 241 via a first connection line 251-3. It should be understood that... Figure 2 The example shown is where the bonding point is located on the upper surface of the insulating layer 210, for ease of illustration. Figure 2 The connecting grid 231 shown is its orthogonal projection onto the insulating layer 210.
[0060] Continuing with this example, please refer to Figure 2As shown, the second connection line 252 includes a second connection line 252-1, a second connection line 252-2, and a second connection line 252-3. Specifically, the second connection line 252-1 connects the second conductive mesh 222-1 to the binding point 241 in the non-touch area 240; the second connection line 252-2 connects the second conductive mesh 222-2 to the binding point 241 in the non-touch area 240; and the second connection line 252-3 connects the second conductive mesh 222-3 to the binding point 241 in the non-touch area 240.
[0061] Continuing with this example, please refer to Figure 2 As shown, the connecting mesh 231 extends along a first direction and overlaps with the orthogonal projection of the first conductive mesh 221 onto the insulating layer 210. "Through" refers to the orthogonal projection of the connecting mesh 231 onto the first conductive mesh 221 on the insulating layer 210. Specifically, connecting mesh 231-1 connects the first conductive mesh 221-1 to the non-touch area 240, and may pass through at least a portion of the first conductive mesh 221-1, as well as the first conductive meshes 221-2 and 221-3; connecting mesh 231-2 connects the first conductive mesh 221-2 to the non-touch area 240, and may pass through at least a portion of the first conductive mesh 221-2 and the first conductive mesh 221-3; connecting mesh 231-3 connects the first conductive mesh 221-3 to the non-touch area 240, and may pass through at least a portion of the first conductive mesh 221-3. In some implementations, to ensure that all connecting meshes 221 have equal lengths, please refer to [reference needed]. Figure 2 As shown, each connecting grid 221 can pass through all the first conductive grids 221.
[0062] For some specific implementations, please refer to Figure 2 As shown, the non-touch area 240 is located on the side of the insulating layer 210 in the second direction. Combined with... Figure 1B As shown, the binding point 241 set in the non-touch area 240 can be connected to... Figure 1BThe FPC 107 shown is connected, and a touch chip 106 is disposed on the FPC 107. In some implementations, the first conductive grid 221 is a sensing channel, and the second conductive grid 222 is a driving channel. In this case, the touch chip 106 can send a driving signal to the second conductive grid 222 through the second connection line 252, and receive the touch signal generated by the first conductive grid 221 through the connection grid 231, and perform processing such as touch coordinate calculation based on the touch signal. In other implementations, the first conductive grid 221 is a driving channel, and the second conductive grid 222 is a sensing channel. In this case, the touch chip 106 can send a driving signal to the first conductive grid 221 through the second connection line 252, and receive the touch signal generated by the second conductive grid 222 through the connection grid 231, and perform processing such as touch coordinate calculation based on the touch signal.
[0063] In some implementations, in Figure 1A and Figure 1B In the illustrated electronic device 100, the first direction is the long side direction of the touch display screen 102, and the second direction is the short side direction of the touch display screen 102. In this case, the number of rows of the first conductive mesh 221 in the long side direction is greater than the number of columns of the second conductive mesh 222 in the short side direction. By placing at least a portion of the connecting lines of the first conductive mesh in the long side direction in the connection layer 230, the wiring space of the first conductive mesh 221 can be reduced, which is beneficial for narrowing the bezel of the touch display screen 102. It should be understood that in some other embodiments, the first direction is the short side direction of the touch display screen 102, and the second direction is the long side direction of the touch display screen 102; this application embodiment does not limit this.
[0064] As one implementation method, please refer to Figure 2 As shown, the connecting grid 231 can be electrically connected to the first conductive grid 221 through the connecting portion 232 penetrating the insulating layer 210. In a specific implementation, a window can be opened in the insulating layer 210 to form a window penetrating the insulating layer 210, and conductive material can be deposited in the window to form the connecting portion 232. For details, please refer to [link to relevant documentation]. Figure 5 As shown, it illustrates Figure 2 A partial cross-sectional view of the touch module shows that the connecting part 232 penetrates the insulating layer 210, with one end connected to the first conductive mesh 221 and the other end connected to the connecting mesh 231.
[0065] In one implementation, each row of the first conductive grid 221 may include P columns of first sub-conductive grids 2211 arranged along a second direction and multiple rows of second sub-conductive grids 2212 arranged along a first direction. The overlapping portions of the first sub-conductive grids 2211 and the second sub-conductive grids 2212 can be considered as components of either the first sub-conductive grid 2211 or the second sub-conductive grid 2212. It should be understood that... Figure 2 Only one column of the first sub-conductive grid 2211 and one row of the second sub-conductive grid 2212 are marked; the remaining first sub-conductive grids 2211 and one row of the second sub-conductive grids 2212 are not marked.
[0066] Furthermore, each connecting grid 231 is obscured by the first sub-conductive grid 2211 of the first conductive grid 221 it passes through. Preferably, each connecting grid 231 orthogonally overlaps with the first sub-conductive grid 2211 of the first conductive grid 221 it passes through. Preferably, the outer contour of the first sub-conductive grid 2211 is elongated to facilitate orthogonal projection overlap. Wherein, P is a positive integer, and the multiple rows of second sub-conductive grids 2212 are used to electrically connect the P columns of first sub-conductive grids 2211. If the first conductive grid 221 includes P columns of first sub-conductive grids 2211 arranged along the second direction, and the touch area includes M columns of second conductive grids 222, then each touch node may include P / M columns of first sub-conductive grids 2211. For example, each row of first conductive grids 221 may contain 90 columns of first sub-conductive grids 2211, and the touch area may include 30 columns of second conductive grids 222, then each touch node may include 3 (i.e., 90 / 30) columns of first sub-conductive grids 2211. It should be understood that the embodiments of this application do not limit the number of first sub-conductive grids 2211 included in each touch node. Preferably, when the number of first sub-conductive grids 2211 in each touch node is between 3 and 7, a balance between touch performance and structural complexity can be achieved.
[0067] As an example, please refer to Figure 4A As shown, each touch node includes 3 columns of first sub-conductive grids 2211. A row of first conductive grids 221 and 3 columns of second conductive grids 222 form 3 touch nodes. Therefore, a row of first conductive grids 221 includes 9 columns of first sub-conductive grids 2211. For details, please refer to [link to documentation]. Figure 4A As shown, the three columns of the first sub-conductive grid 2211 of a touch node are designated as first sub-conductive grid 2211-1, first sub-conductive grid 2211-2, and first sub-conductive grid 2211-3. Furthermore, the first conductive grid 221 includes three rows of second sub-conductive grids 2212, designated as second sub-conductive grid 2212-1, second sub-conductive grid 2212-2, and second sub-conductive grid 2212-3. It should be understood that... Figure 4A Only a portion of one touch node in the second sub-conductive grid 2212 is shown.
[0068] Furthermore, each column of second conductive grid 222 may include Q columns of third sub-conductive grids 2221 arranged along the second direction, wherein the Q columns of third sub-conductive grids are electrically connected, and Q is a positive integer. See also... Figure 2As shown, each column of the second conductive grid 222 includes three columns of the third sub-conductive grid 2221, which should be understood. Figure 2 Only one column of the third sub-conductive grid 2221 is marked; the remaining columns of the third conductive grid 2221 are not marked. For further details, please refer to [link / reference needed]. Figure 2 As shown, the three columns of third sub-conductive meshes 2221 can be electrically connected by at least one row of fourth sub-conductive meshes 2222 extending along the second direction and located at the end of the third sub-conductive meshes 2221. The electrically connected third sub-conductive meshes 2221 as a whole serve as a column of second conductive meshes 222, and are connected to the binding point 241 set in the non-touch area 240 via the second connection line 252.
[0069] In this embodiment, the first conductive mesh 221 and the second conductive mesh 222 are disposed on the upper surface of the insulating layer 210 and are in the same plane. If they are connected at the intersection, it will cause interference. In some embodiments, one of them is disconnected at the intersection and connected by a conductive bridge 260. Figure 2 The diagram shows a bridge 260 connecting a second conductive grid 222. Figure 2 The image shown is an orthogonal projection of the conduction bridge 260 onto the upper surface of the insulating layer 210. (See reference...) Figure 5 As shown, it illustrates Figure 2 A partial cross-sectional view of the touch module shows that the conductive bridge 260 includes a connecting line 261 disposed on the lower surface of the insulating layer 210 and a connecting portion 262 penetrating the insulating layer 210. The connecting portion 262 specifically includes a connecting portion 262-1 and a connecting portion 262-2, which respectively connect the disconnection point of the second conductive mesh 222 to the connecting line 261.
[0070] In some implementation methods, please refer to Figure 2 As shown, all third sub-conductive meshes 2221 are disconnected at their intersections with the second sub-conductive meshes 2212. The disconnected third sub-conductive meshes 2221 are connected by a conductive bridge 260. For a detailed implementation of the conductive bridge 260, please refer to [link to implementation details]. Figure 5 In this case, the signal of the connecting grid 231 can be completely shielded by the first sub-conductive grid 2211, which greatly reduces the coupling between the connecting grid 231 and the second conductive grid 222, thus achieving higher touch performance.
[0071] In other implementations, please refer to Figure 6 As shown, all the second sub-conductive meshes 2212 are disconnected at their intersections with the third sub-conductive meshes 2221. The disconnected third sub-conductive meshes 2221 are connected by a conductive bridge 270. For a detailed implementation of the conductive bridge 270, please refer to [link to implementation details]. Figure 5The conductive bridge 260 is shown. In this case, the connecting mesh 231 can be completely shielded by the first sub-conductive mesh 2211, greatly reducing the coupling between the connecting mesh 231 and the second conductive mesh 222, thus achieving higher touch performance. This embodiment is similar to... Figure 2 The difference in the implementation methods shown is that, Figure 2 The third sub-conductive grid 2221 is connected via a conductive bridge. Figure 6 The second sub-conductive grid 2212 is connected via a conductive bridge. In the specific implementation, Figure 6 The shape of the conductive mesh shown can be found in [reference]. Figure 4A As shown.
[0072] Furthermore, Figure 2 Each column of the second conductive grid 222 contains a third sub-conductive grid 2221 that can be electrically connected by at least one row of fourth sub-conductive grids 2222 extending along the second direction and located at the end of the third sub-conductive grid 2221. Figure 6 Similarly, each column of second conductive mesh 222 includes a third sub-conductive mesh 2221, which can be electrically connected via sub-conductive meshes extending along the second direction and located at the ends of the third sub-conductive mesh 2221. The electrically connected third sub-conductive mesh 2221 as a whole serves as a column of second conductive mesh 222, and is connected to the binding point 241 set in the non-touch area 240 via the second connection line 252.
[0073] In some other implementations, please refer to Figure 7 As shown, each row of the first conductive grid 221 may include P columns of first sub-conductive grids 2211 arranged along the second direction and multiple rows of second sub-conductive grids 2212 arranged along the first direction. The overlapping portions of the first sub-conductive grids 2211 and the second sub-conductive grids 2212 can be considered as components of either the first sub-conductive grid 2211 or the second sub-conductive grid 2212. Each connecting grid 231 overlaps with the orthogonal projection of the first sub-conductive grid 2211 of the first conductive grid 221 it passes through onto the insulating layer 210. Each column of the second conductive grid 222 may include Q columns of third sub-conductive grids 2221 arranged along the second direction and multiple rows of fifth sub-conductive grids 2223 arranged along the first direction, the multiple rows of fifth sub-conductive grids 2223 being used to electrically connect the Q columns of third sub-conductive grids 2221.
[0074] Please continue to refer to this. Figure 7As shown, the first sub-conductive grid 2211 in column P is partially broken at its intersection with the fifth sub-conductive grid 2223 in multiple rows, so that the fifth sub-conductive grid 2223 electrically connects a portion of the third sub-conductive grid 2221, specifically connecting a portion of the third sub-conductive grids 2221 in two adjacent columns. The second sub-conductive grid 2212 in multiple rows is partially broken at its intersection with the third sub-conductive grid 2221 in column Q, and the broken second sub-conductive grids are connected through a conductive bridge 280. For a detailed implementation of the conductive bridge 280, please refer to [link to implementation details]. Figure 5 The conductive bridge 260 is shown. In this case, the number of conductive bridges can be reduced. If the connecting grid 231 passes through the disconnected first sub-conductive grid 2211, the coupling between the fifth sub-conductive grid 2223 and the connecting grid 231 can be reduced by decreasing the width of the fifth sub-conductive grid 2223. In some implementations, the width of the fifth sub-conductive grid 2223 is smaller than the width of the first sub-conductive grid 2211.
[0075] This application also provides a touch display screen, see embodiments thereof. Figure 8 The diagram shown is a schematic representation of the structural composition of a touch display screen according to an embodiment of this application. The touch display screen 800 may include a display layer 810 and a touch module 820 stacked together. The touch module 820 may be the touch module 200 described above in this application. Optionally, the display layer 810 has a plurality of pixel regions arranged in an array and light-shielding regions between adjacent pixel regions. The orthographic projection of the first conductive grid, the second conductive grid, and the connecting grid onto the display layer 810 lies within the light-shielding regions. See [link to documentation] for details. Figure 9 As shown, the area outside the pixel area is the light-blocking area, and the above-mentioned grid is projected onto the display layer 810 within the light-blocking area.
[0076] Figure 8 The touch display screen 800 shown may include a display layer 810 and a touch module 820 stacked together. In a specific implementation, the touch display layer 800 may also include one or more layers. For example, a polarizer and a glass cover may be disposed on the touch module 820, and the glass cover and the polarizer may be connected by transparent adhesive. A display encapsulation layer may also be disposed between the touch module 820 and the display layer 810. Furthermore, a protective layer may be disposed on the touch layer of the touch module 820. In addition, the above-mentioned layers may be disposed on a substrate layer.
[0077] This application also provides an electronic device, see embodiments thereof. Figure 10The diagram shows the structural composition of an electronic device according to an embodiment of this application. The electronic device 1000 includes a touchscreen display 1010 and a controller 1020. For example, the electronic device 1000 can be a smart consumer electronic device such as a mobile phone, tablet computer, or laptop computer; a wearable electronic device such as augmented reality (AR), virtual reality (VR), smartwatch, or smart bracelet; or an in-vehicle device such as a vehicle infotainment system. The controller 1020 can interact with the touchscreen display 1020 via signals. For example, the controller 1020 can send control commands to the touchscreen display 1010 and receive sensing signals returned by the touchscreen display 1010. The controller 1020 determines the location of the touch operation based on the sensing signals. Upon determining the location of the touch operation, the controller 1020 can send a response signal to the touchscreen display 1010. Optionally, in this embodiment, the device body A1 may include an FPC integrating a touch IC.
[0078] For example, the controller 1020 can be specifically implemented as a system on chip (SOC), micro control unit (MCU), central processing unit (CPU), other general-purpose processor, digital signal processor (DSP), application specific integrated circuit (ASIC), field-programmable gate array (FPGA), or other programmable logic device, discrete gate or transistor logic device, discrete hardware component, etc., and the embodiments of this application do not specifically limit it in this way.
[0079] The touch display screen 1010 can adopt the touch module provided in this application embodiment. The touch nodes are disposed on the upper surface of the insulating layer, and the traces are disposed on the lower surface of the insulating layer. This allows a large number, or even all, of the traces of the conductive grid in one direction to be disposed in the touch area, greatly reducing the non-touch area and achieving an extremely narrow bezel. Furthermore, this trace arrangement does not affect the area of the touch nodes, and the consistency of each touch node is basically unaffected by the traces. Further, the traces connect the grid and overlap with the orthogonal projection of the conductive grids they pass through on the insulating layer, so that the traces are shielded by the conductive grids and basically do not couple with the conductive grids in another direction, greatly reducing interference with touch sensing and ensuring the accuracy of touch position calculation.
[0080] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Although this application has disclosed preferred embodiments as above, it is not intended to limit this application. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this application. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.
Claims
1. A touch module, characterized in that, include: The touch area is provided with N rows of first conductive grids arranged along a first direction and M columns of second conductive grids arranged along a second direction. The N rows of first conductive grids and the M columns of second conductive grids form M by N touch nodes, where M and N are positive integers. Multiple connecting grids are located on different layers from the first conductive grid. Each connecting grid is used to electrically connect a row of the first conductive grid to a non-touch area. Each connecting grid extends along the first direction and is blocked by the first conductive grid it passes through.
2. The touch module as described in claim 1, characterized in that, Each connecting grid extends along the first direction and its orthogonal projection overlaps with the first conductive grid it passes through.
3. The touch module as described in claim 1, characterized in that, The first conductive grid in each row includes: The first sub-conductive grid of P columns arranged along the second direction, where P is a positive integer; Multiple rows of second sub-conductive grids arranged along the first direction, the multiple rows of second sub-conductive grids being used to electrically connect the P columns of first sub-conductive grids; In this process, each connecting grid is occluded by the first sub-conductive grid of the first conductive grid it passes through.
4. The touch module as described in claim 3, characterized in that, Each column of the second conductive grid includes: Q columns of third sub-conductive grids arranged along the second direction, wherein the Q columns of third sub-conductive grids are electrically connected to each other, and Q is a positive integer.
5. The touch module as described in claim 4, characterized in that, The third sub-conductive grid in column Q is disconnected at the intersection with the second sub-conductive grid in multiple rows, and the disconnected third sub-conductive grid is connected through the first conductive bridge; The connecting grid is located on the lower surface of the insulating layer, and the first conductive grid and the second conductive grid are located on the upper surface of the insulating layer; The first conductive bridge includes a first connecting line located on the lower surface of the insulating layer and a first connecting portion penetrating the insulating layer, the first connecting portion being used to connect the third sub-conductive grid to the first connecting line.
6. The touch module as described in claim 4, characterized in that, The multi-row second sub-conductive grid is disconnected at the intersection with the Q column third sub-conductive grid, and the disconnected second sub-conductive grid is connected through a second conductive bridge; The connecting grid is located on the lower surface of the insulating layer, and the first conductive grid and the second conductive grid are located on the upper surface of the insulating layer; The second conductive bridge includes a second connecting line located on the lower surface of the insulating layer and a second connecting portion penetrating the insulating layer, the second connecting portion being used to connect the second sub-conductive grid to the second connecting line.
7. The touch module as described in claim 5 or 6, characterized in that, Each column of the second conductive grid further includes at least one row of fourth sub-conductive grids extending along the second direction and located at the end of the third sub-conductive grid, the at least one row of fourth sub-conductive grids being used to electrically connect the Q column of the third sub-conductive grids.
8. The touch module as described in claim 4, characterized in that, Each column of the second conductive grid further includes: multiple rows of fifth sub-conductive grids arranged along the first direction, the multiple rows of fifth sub-conductive grids being used to electrically connect the Q column of the third sub-conductive grid; The first sub-conductive grid in column P is broken at the point where it intersects with the fifth sub-conductive grid in multiple rows; The multi-row second sub-conductive grid is broken at the point where it intersects with the Q column third sub-conductive grid, and the broken second sub-conductive grid is connected through a third conductive bridge; The connecting grid is located on the lower surface of the insulating layer, and the first conductive grid and the second conductive grid are located on the upper surface of the insulating layer; The third conductive bridge includes a third connecting line located on the lower surface of the insulating layer and a third connecting portion penetrating the insulating layer, the third connecting portion being used to connect the second sub-conductive grid to the third connecting line.
9. The touch module as described in claim 3, characterized in that, The outer contour of the first sub-conductive mesh is elongated.
10. The touch module as described in claim 4, characterized in that, Each touch node includes a first sub-conductive grid in column P / M and a third sub-conductive grid in column Q, wherein P / M and Q are greater than or equal to 3 and less than or equal to 7.
11. The touch module as described in claim 1, characterized in that, The first conductive mesh, the second conductive mesh, and the connecting mesh are metal meshes.
12. The touch module as described in claim 1, characterized in that, The touch area is rectangular, the first direction is the direction of the long side of the rectangle, and the second direction is the direction of the short side of the rectangle; the non-touch area is located in the direction of the short side.
13. The touch module as described in claim 12, characterized in that, The connecting grid is located on the lower surface of the insulating layer, and the first conductive grid and the second conductive grid are located on the upper surface of the insulating layer; Each connecting grid extends along the first direction to the non-touch area and is electrically connected to the upper surface of the insulating layer through a fourth connecting portion that penetrates the insulating layer.
14. The touch module as described in claim 13, characterized in that, The non-touch area is also provided with a bonding point, and the fourth connecting part is connected to the bonding point. The bonding point is used to connect to the flexible circuit board (FPC).
15. A touch display screen, characterized in that, It includes a display layer stacked on top of each other and a touch module as described in any one of claims 1-14.
16. An electronic device, characterized in that, It includes a device body and a touch display screen as described in claim 15 disposed on the device body.