Tiled display apparatus

Abstract

The application relates to a spliced display device, which comprises at least two display panels arranged in splicing mode to realize the effect of large-screen display. The display panel comprises a substrate, a protective layer and a plurality of LED chips. The side surface of the substrate is provided with a signal line. The signal line is electrically connected with the LED chip located on the first surface and the flexible circuit board or the driving chip located on the second surface. The protective layer covers the area on the side surface of the substrate where the signal line is arranged. The protective layer comprises organic ceramic. The organic ceramic has good heat conduction performance and certain anti-collision capacity, can meet the heat dissipation requirement, prevent the failure of the signal line caused by the collision between the two display panels during splicing, improve the stability of the signal line, and ensure the display effect of the spliced display device after splicing.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a splicing display device. Background Technology

[0002] The display panel can have multiple mini-LEDs (Mini-LED or Micro-LED). In large-size display devices, at least two display panels need to be spliced ​​together to achieve the effect of displaying images on a super-large screen.

[0003] When splicing and assembling multiple display panels, the sides of the display panels are prone to bumps and scratches, which can cause the side wiring of the display panels to fail, thereby affecting the display performance of the splicing display device. Utility Model Content

[0004] Therefore, it is necessary to provide a splicing display device that can effectively protect the side wiring of the display panel, thereby preventing side wiring defects from affecting display performance.

[0005] In a first aspect, this application provides a splicing display device, comprising:

[0006] At least two spliced ​​display panels, the display panels including:

[0007] Multiple LED chips;

[0008] The substrate includes a first surface, a second surface opposite to each other in the thickness direction of the substrate, and a side surface located between the first surface and the second surface. The side surface of the substrate is provided with signal lines, which are electrically connected to an LED chip located on the first surface and a flexible circuit board or driver chip located on the second surface.

[0009] A protective layer covers the area on the side of the substrate where signal lines are disposed, and the protective layer includes organic ceramic.

[0010] In one embodiment, organic ceramic is applied to the signal lines on the side of the substrate, and the protective layer further includes:

[0011] The first light-shielding layer is disposed on organic ceramic.

[0012] In one embodiment, the organic ceramic is a patterned encapsulation layer, and the patterned encapsulation layer is covered with a metallic material.

[0013] In one embodiment, the organic ceramic is filled with a light-blocking agent.

[0014] In one embodiment, the opacifier includes one or more of titanium dioxide, carbon black, and pigment.

[0015] In one embodiment, the organic ceramic includes:

[0016] The polymer matrix includes one or more of polyimide, epoxy resin and acrylic resin;

[0017] Ceramic nanoparticles include one or more of alumina, aluminum nitride, silicon nitride, silicon carbide, zirconium oxide, and calcium carbonate.

[0018] In one embodiment, the organic ceramic is a structure formed by cross-linking polymerization of inorganic ionic oligomers.

[0019] In one embodiment, the display panel further includes:

[0020] The second light-shielding layer covers the area on the side of the substrate where no signal lines are located.

[0021] In one embodiment, the display panel further includes:

[0022] An elastic protective layer is disposed between the second light-shielding layer and the side of the substrate, and the second light-shielding layer encapsulates the elastic protective layer.

[0023] In one embodiment, where the protective layer further includes a first light-shielding layer, the thickness of the elastic protective layer is greater than the thickness of the organic ceramic.

[0024] The aforementioned splicing display device includes at least two display panels spliced ​​together to achieve a large-screen display effect. Each display panel includes a substrate, a protective layer, and multiple LED chips. Signal lines are provided on the side of the substrate, and the signal lines are electrically connected to the LED chips on the first surface and the flexible circuit board or driver chip on the second surface. The protective layer covers the area on the side of the substrate where the signal lines are located. The protective layer includes organic ceramic, which has good thermal conductivity and a certain degree of impact resistance. This meets the heat dissipation requirements and prevents the signal lines from failing due to collisions between the two display panels during splicing, thereby improving the stability of the signal lines and ensuring the display effect of the splicing display device after splicing. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a plan view of the splicing display device in one embodiment;

[0027] Figure 2 This is a side sectional view of the display panel in one embodiment;

[0028] Figure 3 This is a schematic diagram illustrating a collision between two display panels during the splicing and assembly process in one embodiment.

[0029] Figure 4 A side sectional view of a display panel with a protective layer provided in one embodiment;

[0030] Figure 5 A top view of a display panel with a protective layer provided in one embodiment;

[0031] Figure 6 A side sectional view of a display panel in one embodiment, wherein the protective layer includes organic ceramic and a first light-shielding layer;

[0032] Figure 7 A side sectional view of a display panel in another embodiment, wherein the protective layer includes organic ceramic and a first light-shielding layer;

[0033] Figure 8 A side sectional view of a display panel in one embodiment, wherein the protective layer comprises an organic ceramic filled with a light-blocking agent;

[0034] Figure 9 A side sectional view of a display panel in another embodiment, the protective layer comprising an organic ceramic filled with a light-blocking agent;

[0035] Figure 10 This is a top view of a display panel with a trace area and a non-trace area on the side of the substrate in one embodiment;

[0036] Figure 11 The above is a flowchart illustrating the structure of an embodiment where the organic ceramic is a patterned encapsulation layer, and the wiring area is provided with stacked organic ceramic and a first light-shielding layer, while the non-wiring area is provided with a second light-shielding layer.

[0037] Figure 12 A side sectional view of a display panel in one embodiment, wherein the protective layer includes an elastic impact layer and a second light-shielding layer;

[0038] Figure 13 This is a schematic diagram of the structure of the wiring area of ​​the substrate in one embodiment;

[0039] Figure 14 This is a schematic diagram of the structure of the non-trace area of ​​the substrate in one embodiment;

[0040] Figure 15 The diagram below shows a structure in one embodiment where the organic ceramic is a patterned encapsulation layer, and the wiring area is provided with stacked organic ceramic and a first light-shielding layer, while the non-wiring area is provided with stacked elastic protective layer and a second light-shielding layer. Detailed Implementation

[0041] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0043] It should be noted that the terms "first," "second," etc., used in this application may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from the second element.

[0044] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0045] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0046] In related technologies, splicing display devices refer to multiple display panels that are spliced ​​together to achieve ultra-large screen image display, such as... Figure 1 As shown, the splicing display device is formed by splicing 12 display panels together. It should be noted that the shape and size of the display panels can be set according to the actual situation. In this embodiment, the display panel is a rectangular body as an example for illustration.

[0047] Currently, a single display panel in a splicing display device can include multiple self-emissive elements, such as light-emitting diodes (LEDs) or mini-LEDs (or micro-LEDs). It should be noted that micro-LEDs have advantages such as high brightness, wide color gamut, and high reliability, and are easy to achieve in terms of flexibility, transparency, free splicing, and sensor integration. At the same time, because they can be widely used in various fields from micro-displays to consumer electronics to large-screen displays, they are recognized by the industry as the next generation of display technology. In the development of micro-LED display technology, "wireless splicing" is regarded as an important industrialization goal. This is also a unique advantage of micro-LED display technology, which cannot be achieved by traditional LCD and OLED display technologies.

[0048] Taking Micro-LED as an example of a self-emissive component, such as... Figure 2 As shown, the display panel includes a substrate 210, a plurality of Micro-LEDs 220 disposed on a first surface of the substrate 210, and a bonding area 230 disposed on a second surface of the substrate 210. The bonding area 230 is used to bond a flexible circuit board or a driver chip. Signal lines (not shown) are provided on the side of the substrate 210. Figure 2 As shown in the figure, the signal line is electrically connected to the Micro-LED 220 located on the first surface and the bonding area 230 located on the second surface to drive the Micro-LED 220 so that the display panel displays the corresponding image.

[0049] However, when assembling multiple display panels, such as Figure 3 As shown, the sides of the display panel are prone to bumps and scratches, which can cause the side wiring (signal lines) of the display panel to fail, thereby affecting the display performance of the splicing display device.

[0050] Based on this, in an exemplary embodiment, such as Figure 4 As shown in the figure, an embodiment of this application provides a splicing display device, comprising:

[0051] At least two spliced ​​display panels, the display panels including:

[0052] Multiple LED chips 10;

[0053] The substrate 20 includes a first surface, a second surface opposite to each other in the thickness direction of the substrate, and a side surface located between the first surface and the second surface. The side surface of the substrate 20 is provided with signal lines, which are electrically connected to the LED chip 10 located on the first surface and the flexible circuit board or driver chip located on the second surface.

[0054] The protective layer 30 covers the area on the side of the substrate 20 where signal lines are disposed, and the protective layer 30 includes organic ceramic.

[0055] The number of LED chips 10 can be set according to actual conditions, and is not limited in this embodiment. The LED chips 10 can be Mini-LED or Micro-LED.

[0056] Specifically, such as Figure 4 As shown, a plurality of LED chips 10 are disposed on the first surface of the substrate 20. Each LED chip 10 is connected to a flexible circuit board or driver chip located on the second surface of the substrate 20 via a signal line. The side of the substrate 20 is provided with a wiring area, through which the signal line is connected to the flexible circuit board or driver chip, thus meeting the different wiring requirements of the substrate 20 in different scenarios.

[0057] A protective layer 30 is provided on the side of the substrate 20. The protective layer 30 covers the area on the side of the substrate 20 where signal lines are arranged. That is, the protective layer 30 covers the wiring area and plays a role in protecting multiple signal lines. It prevents the signal lines located on the side of the substrate 20 from being damaged by bumps or scratches, which could lead to poor circuits or even circuit failures. The protective layer 30 is made of organic ceramic. Organic ceramic has good thermal conductivity and a certain degree of impact resistance. It meets the heat dissipation requirements and can also prevent the signal lines from failing due to bumps between the two display panels during the splicing process. This improves the stability of the signal lines and ensures the display effect of the spliced ​​display device after the splicing is completed.

[0058] For example, such as Figure 4 As shown, the second surface of the substrate 20 may be provided with a bonding area 40, which is used to connect a flexible circuit board, a driver chip or other driving device to drive the LED chip 10, indicate the working state of the LED chip, and thus control the display panel to display the corresponding image.

[0059] Furthermore, the packaging of the side traces of the substrate 20 can be achieved by adhesive pad printing or inkjet printing, and the curing method of the packaging material can be thermal curing or UV curing. It is understood that the above packaging and curing methods can also take other forms, and are not limited to the forms mentioned in the above embodiments, as long as they can achieve the function of packaging.

[0060] It should be noted that, as Figure 5 As shown, Figure 5An exemplary top view of a display panel is shown. The protective layer 30 can cover the side of the substrate 20 and extend to a portion of the first and second surfaces, thereby protecting the side of the substrate 20 (including protecting multiple signal lines), preventing signal line failure caused by collisions between the two display panels during splicing, and preventing the substrate 20 itself from being affected by collisions between the two display panels during splicing. At the same time, it improves the stability of the signal lines and the substrate 20, thereby improving the stability of the display panel and the splicing display device formed by splicing the display panels.

[0061] Compared to traditional technologies where signal lines on the side of the substrate are exposed, the aforementioned splicing display device is less susceptible to damage or even failure of the signal lines due to collisions and scratches on the substrate side during the splicing and assembly of multiple display panels. This affects the display performance of the splicing display device. This application addresses this issue by providing a protective layer that covers the area on the side of the substrate where the signal lines are located. This protective layer protects the signal lines. Even if collisions and scratches occur on the side of the substrate during the splicing and assembly of multiple display panels, the collisions are between the protective layers, and the scratches are only on the protective layer itself. The protective layer significantly reduces the impact of collisions and scratches on the signal lines, improving their stability. Furthermore, the protective layer includes organic ceramic, which has excellent thermal conductivity, meeting the heat dissipation requirements of the circuitry while further enhancing the stability of the signal lines, ensuring the display effect of the splicing display device after assembly.

[0062] In one embodiment, such as Figure 6 As shown, organic ceramic 301 covers the signal lines on the side of the substrate 20, and the protective layer 30 also includes:

[0063] The first light-shielding layer 302 is disposed on the organic ceramic 301.

[0064] The first light-shielding layer has a light-shielding function to improve the display uniformity of the side of the substrate. In this embodiment, the first light-shielding layer is made of a light-shielding material.

[0065] Specifically, such as Figure 6 As shown, the protective layer 30 adopts a stacked structure. The bottom layer is made of organic ceramic 301, which has excellent thermal conductivity, meets the heat dissipation requirements of the circuit, and prevents signal line failure caused by bumps during the splicing and assembly of multiple display panels, thereby improving the stability of the signal line. The top layer is made of a first light-shielding layer 302, which is made of light-shielding material to improve the display uniformity of the side of the substrate 20.

[0066] like Figure 6As shown, the protective layer 30 of the stacked structure can cover the side of the substrate 20 and extend to part of the first surface and the second surface, thereby protecting the side of the substrate 20 (including protecting multiple signal lines), preventing the signal lines from failing due to collisions between the two display panels during splicing, and preventing the substrate 20 itself from being affected by collisions between the two display panels during splicing. At the same time, it improves the stability of the signal lines and the substrate 20, thereby improving the stability of the display panel and the splicing display device formed by splicing the display panels. Meanwhile, the provision of the first light-shielding layer 302 enables the protective layer 30 to have a light-shielding function, thereby improving the display uniformity of the side of the substrate 20.

[0067] For example, the light-shielding material comprises a resin matrix and a light-shielding agent. The light-shielding agent may be titanium dioxide, carbon black, pigment, etc., and the resin matrix may be polyimide, epoxy resin, acrylic resin, etc. It is understood that the above-mentioned light-shielding material may also include other components, not limited to the components mentioned in the above embodiments, as long as it can achieve the light-shielding function.

[0068] It should be noted that, Figure 7 An exemplary schematic diagram of a display panel (with a laminated protective layer) is shown, such as... Figure 7 As shown, the substrate material can be set according to the actual situation. In this embodiment, the substrate is a liquid crystal glass substrate (TFT Glass) as an example for explanation. Figure 7 In this context, Pad represents one of the driving components used to drive the LED chip; Figure 7 The green area below the organic ceramic refers to the signal line; Figure 7 The first surface of the substrate is provided with multiple micro-LED chips (μLED chips), and the multiple micro-LED chips may include a red chip (corresponding to...). Figure 7 (Red square), green chip (corresponding) Figure 7 (Green square) and blue chip (corresponding) Figure 7 (Middle blue square) Figure 7 The first surface of the substrate is covered with a light-shielding material (corresponding to) Figure 7 (In the black area), the light-shielding material covering the first surface of the substrate is different from the light-shielding material used in the first light-shielding layer. The light-shielding material covering the first surface of the substrate is photosensitive, with good photosensitivity and strong spectral selectivity, which can improve the display performance of the first surface, which is the display area. The light-shielding material used in the first light-shielding layer is non-photosensitive, with the characteristics of strong stability and high hardness. While improving the display uniformity of the substrate side, it effectively reduces the impact of bumps and scratches on the signal lines, thus improving the stability of the signal lines.

[0069] In this embodiment, the protective layer adopts a stacked structure. The bottom layer is organic ceramic, which meets the heat dissipation requirements of the circuit and prevents signal line failure caused by bumps during the splicing and assembly of multiple display panels, thereby improving the stability of the signal line. The top layer is a first light-shielding layer, which improves the display uniformity of the substrate side, thereby improving the display effect of the splicing display device.

[0070] In one embodiment, the organic ceramic is a patterned encapsulation layer, and the patterned encapsulation layer is covered with a metallic material.

[0071] It should be noted that patterned packaging is a modern electronic packaging technology, which refers to a packaging method that uses specific patterns or structural designs in the packaging process of integrated circuits or chips. Patterned packaging achieves higher density and more complex integration through fine patterning technology, and has the advantage of small package size.

[0072] Specifically, by patterning organic ceramics, the organic ceramics serve as a patterned encapsulation layer, covering the area where signal lines are located on the side of the substrate and encapsulating the side metal traces. This reduces the impact of collisions on the signal lines during the splicing and assembly of the display panel. At the same time, the patterned encapsulation layer is designed with corresponding patterns to fit the signal lines, which can effectively control the impact range of collisions on the signal lines during the splicing and assembly of the display panel, avoiding large-area impact on the signal lines and improving the stability of the signal lines.

[0073] It should be noted that the protective layer adopts a multilayer structure. The bottom layer is made of organic ceramic, which has excellent thermal conductivity, meeting the heat dissipation requirements of the circuit while preventing signal line failure caused by collisions during the splicing and assembly of multiple display panels, thus improving the stability of the signal lines. At the same time, the organic ceramic is patterned and encapsulated with metal materials to further reduce the impact of collisions on the signal lines during the splicing and assembly of display panels. This effectively controls the impact range of collisions on the signal lines during the splicing and assembly of display panels, avoiding large-area impact on the signal lines. The top layer is a first light-shielding layer made of light-shielding material to improve the display uniformity on the side of the substrate.

[0074] In this embodiment, by patterning the organic ceramic, the organic ceramic serves as a patterned encapsulation layer, covering the area on the side of the substrate where signal lines are disposed, and is also covered with a metal material. This enhances the anti-collision capability of the patterned encapsulation layer, reduces the impact of collisions on the signal lines during the splicing and assembly of the display panel, and ensures good adhesion between the patterned encapsulation layer and the signal lines. This effectively controls the impact range of collisions on the signal lines during the splicing and assembly of the display panel, preventing large-area impact on the signal lines and improving the stability of the signal lines.

[0075] In one embodiment, such as Figure 8 As shown, the organic ceramic is filled with a light-blocking agent.

[0076] Among them, the light-blocking agent has a light-blocking function to improve the display uniformity of the substrate side.

[0077] Specifically, such as Figure 8 As shown, the protective layer 30 includes an organic ceramic filled with a light-blocking agent (corresponding to...). Figure 8 The circular area within the middle protective layer 30 achieves a light-shielding effect directly by filling the organic ceramic with a light-shielding agent, eliminating the need for an additional light-shielding layer design. This reduces costs while improving the display uniformity of the substrate side.

[0078] like Figure 8 As shown, the protective layer 30, which includes an organic ceramic filled with a light-shielding agent, can cover the sides of the substrate 20 and extend to a portion of the first and second surfaces. This provides protection for the sides of the substrate 20 (including protection for multiple signal lines), preventing signal line failure caused by collisions between the two display panels during splicing, and preventing the substrate 20 itself from being affected by collisions between the two display panels during splicing. It also improves the stability of the signal lines and the substrate 20, thereby enhancing the stability of the display panels and the splicing display device formed by splicing the display panels. Furthermore, the inclusion of a light-shielding agent in the organic ceramic provides the protective layer 30 with a light-shielding function, thereby improving the display uniformity of the sides of the substrate 20.

[0079] It should be noted that, Figure 9 An exemplary schematic diagram of the actual structure of another display panel (organic ceramic filled with a light-blocking agent) is shown, such as... Figure 9 As shown, the substrate material can be set according to the actual situation. In this embodiment, the substrate is a liquid crystal glass substrate (TFT Glass) as an example for explanation. Figure 9 In this context, Pad represents one of the driving components used to drive the LED chip; Figure 9 The green area below the organic ceramic refers to the signal line; Figure 9 The first surface of the substrate is provided with multiple micro-LED chips (μLED chips), and the multiple micro-LED chips may include a red chip (corresponding to...). Figure 9 (Red square), green chip (corresponding) Figure 9 (Green square) and blue chip (corresponding) Figure 9 (Middle blue square) Figure 9 The first surface of the substrate is covered with a light-shielding material (corresponding to) Figure 9 The black, blocky area in the middle, where the protective layer includes organic ceramic (corresponding to...). Figure 9 The purple area is filled with a light-blocking agent (corresponding to...) Figure 9The black circle within the purple area can achieve a light-shielding effect directly using organic ceramics, improving the stability of the signal line and the display uniformity on the side of the substrate, without the need for an additional light-shielding layer, thus reducing costs.

[0080] In this embodiment, by filling the organic ceramic with a light-shielding agent, the light-shielding effect can be achieved directly using the organic ceramic. The signal lines on the side of the substrate are protected by a protective layer containing organic ceramic, which improves the stability of the signal lines. At the same time, the light-shielding agent filled in the organic ceramic enables the protective layer to have a light-shielding function, thereby improving the display uniformity on the side of the substrate. Moreover, there is no need to design an additional light-shielding layer, which reduces costs.

[0081] In one embodiment, the opacifier includes one or more of titanium dioxide, carbon black, and pigment.

[0082] It is understood that the above-mentioned light-blocking agent may also include other components, not limited to those mentioned in the above embodiments, as long as they can achieve the function of light blocking.

[0083] In one embodiment, the organic ceramic includes:

[0084] The polymer matrix includes one or more of polyimide, epoxy resin and acrylic resin;

[0085] Ceramic nanoparticles include one or more of alumina, aluminum nitride, silicon nitride, silicon carbide, zirconium oxide, and calcium carbonate.

[0086] Specifically, organic ceramics are nanocomposite materials, including polymer aggregates and ceramic nanoparticles. They possess the strength and hardness of ceramics and can be sintered and cured at relatively low temperatures using printing methods.

[0087] In one embodiment, the organic ceramic is a structure formed by cross-linking polymerization of inorganic ionic oligomers.

[0088] Specifically, organic ceramics are inorganic ionic oligomers that combine the strength and hardness of ceramics with good elasticity. By adjusting the organic functional molecules of the oligomers, UV curing can be achieved.

[0089] In one embodiment, the display panel further includes:

[0090] The second light-shielding layer covers the area on the side of the substrate where no signal lines are located.

[0091] Among them, such as Figure 10As shown, the area on the side of the substrate where no signal lines are provided can be called the non-trace area B. That is, the side of the substrate can be divided into trace area A and non-trace area B based on whether or not signal lines pass through it. The second light-shielding layer has a light-shielding function to improve the display uniformity of the side of the substrate. In the embodiment of this application, the second light-shielding layer is made of a light-shielding material.

[0092] Specifically, such as Figure 10 As shown, since the main protection target of the protective layer is the signal line, a stacked organic ceramic and a first light-shielding layer can be provided on the side of the substrate where the signal line is located, i.e., the trace area A. A second light-shielding layer can be provided on the side of the substrate where no signal line is located, i.e., the non-trace area B. Both the first and second light-shielding layers can be made of light-shielding materials to improve the display uniformity of the side of the substrate. This achieves regional protection of the side of the substrate by the protective layer. For the trace area A, which requires special protection, a stacked organic ceramic and a first light-shielding layer are provided, while for the non-trace area B, a second light-shielding layer is provided. This improves the stability of the signal line while reducing the cost of the protective layer.

[0093] For example, the light-shielding material comprises a resin matrix and a light-shielding agent. The light-shielding agent may be titanium dioxide, carbon black, pigment, etc., and the resin matrix may be polyimide, epoxy resin, acrylic resin, etc. It is understood that the above-mentioned light-shielding material may also include other components, not limited to the components mentioned in the above embodiments, as long as it can achieve the light-shielding function.

[0094] It should be noted that, as Figure 10 As shown, since the main protection target of the protective layer is the signal line, an organic ceramic filled with a light-shielding agent can be set on the side of the substrate where the signal line is located, i.e., the routing area A. A second light-shielding layer can be set on the side of the substrate where no signal line is located, i.e., the non-routing area B. This achieves regional protection of the side of the substrate by the protective layer. For the routing area A, which needs to be protected, an organic ceramic filled with a light-shielding agent is set, while for the non-routing area B, a second light-shielding layer is set. This improves the stability of the signal line while reducing the cost required for the protective layer.

[0095] For example, the first light-shielding layer and the second light-shielding layer can be the same light-shielding layer. After the organic ceramic covers the wiring area A, the side of the substrate is encapsulated with a light-shielding material. At this time, the wiring area A is a stacked configuration, with the bottom layer being organic ceramic and the top layer being the first light-shielding layer. The non-wiring area B is provided with a second light-shielding layer. Figure 11 An exemplary flowchart is provided, showing a structure in which organic ceramic is used as a patterned encapsulation layer, and a trace area A is provided with stacked organic ceramic and a first light-shielding layer, while a non-trace area B is provided with a second light-shielding layer. Figure 11As shown, organic ceramic is used to pattern and encapsulate the trace area A, and then light-shielding material 1 is used to encapsulate the side of the substrate. At this time, trace area A is provided with stacked organic ceramic and a first light-shielding layer, and non-trace area B is provided with a second light-shielding layer. Light-shielding material 2 is used to encapsulate the first surface (front) of the substrate, realizing the protective layer for the side of the substrate in a regional manner. For the trace area A that needs to be protected, stacked organic ceramic and a first light-shielding layer are provided, while non-trace area B is provided with a second light-shielding layer. This improves the stability of the signal lines while reducing the cost required for the protective layer. Among them, light-shielding material 1 and light-shielding material 2 are different. Light-shielding material 1 can be non-photosensitive and has the characteristics of high stability and high hardness. While improving the display uniformity of the side of the substrate, it effectively reduces the impact of bumps and scratches on the signal lines, thus improving the stability of the signal lines. Light-shielding material 2 can be photosensitive, with good photosensitivity and strong spectral selectivity, which can improve the display performance of the first surface, which is the display area.

[0096] In this embodiment, by dividing the side of the substrate into regions for protection, a protective layer with a stacked structure is provided to cover the area on the side of the substrate where signal lines are located, or a protective layer including an organic ceramic filled with a light-shielding agent is provided to cover the area on the side of the substrate where signal lines are located, and a second light-shielding layer is provided to cover the area on the side of the substrate where no signal lines are located, the stability of the signal lines is improved while the cost of the protective layer is reduced.

[0097] In one embodiment, the display panel further includes:

[0098] An elastic protective layer is disposed between the second light-shielding layer and the side of the substrate, and the second light-shielding layer encapsulates the elastic protective layer.

[0099] The elastic protective layer can be composed of organic elastomers such as PDMS (polydimethylsiloxane). It is understood that the organic elastomers may also include other components, not limited to those mentioned in the above embodiments, as long as they can achieve the function of anti-collision.

[0100] Specifically, by providing an elastic protective layer between the second light-shielding layer and the side of the substrate (non-wiring area), if a collision occurs during the splicing and assembly of the display panels, the buffering effect of the elastic protective layer reduces the impact of the collision between the two display panels on the side of the substrate during the splicing process, thereby protecting the signal lines.

[0101] Figure 12 An exemplary schematic diagram of a non-trace area on the side of a substrate 20 is shown, such as... Figure 12 As shown, an elastic protective layer 303 is provided on the non-wire area of ​​the side of the substrate 20, and a second light-shielding layer 304 is encapsulated on the outside of the elastic protective layer 303.

[0102] It is understandable that the protective layer 30 has different structures for different areas on the side of the substrate 20. For the routing area through which the signal lines pass, the protective layer 30 can be a stacked structure. The bottom layer is organic ceramic, which meets the heat dissipation requirements of the circuit and prevents the signal lines from failing due to bumps during the splicing and assembly of multiple display panels, thus improving the stability of the signal lines. The top layer is the first light-shielding layer, which improves the display uniformity on the side of the substrate, thereby improving the display effect of the splicing display device. The protective layer 30 can also be organic ceramic filled with a light-shielding agent. The light-shielding effect can be achieved directly using organic ceramic, which improves the stability of the signal lines and the display uniformity on the side of the substrate, and does not require the design of an additional light-shielding layer, thus reducing costs.

[0103] For non-trace areas where signal lines do not pass, the protective layer can be an elastic protective layer 303. The elastic protective layer 303 is encapsulated with a second light-shielding layer 304. When the display panels are spliced ​​and assembled, if a collision occurs, the elastic protective layer 303 can be used to buffer the impact of the collision between the two display panels on the side of the substrate during the splicing process, thereby protecting the signal lines. At the same time, the setting of the second light-shielding layer 304 improves the display uniformity of the side of the substrate.

[0104] It should be noted that the thickness of the protective layer (the dimension in the thickness direction of the substrate) must be consistent. That is, the thickness of the protective layer covering the area on the side of the substrate where signal lines are set is the same as the thickness of the protective layer covering the area on the side of the substrate where no signal lines are set, to ensure the flatness of the side of the substrate and improve the uniformity of the display.

[0105] In this embodiment, by providing an elastic protective layer between the second light-shielding layer and the side of the substrate, if a collision occurs during the splicing and assembly of the display panels, the impact of the collision between the two display panels on the side of the substrate can be reduced by the buffering effect of the elastic protective layer, thereby protecting the signal lines, improving the stability of the signal lines, and thus improving the display performance of the splicing display device; and the second light-shielding layer encapsulates the elastic protective layer, improving the display uniformity of the side of the substrate.

[0106] In one embodiment, where the protective layer further includes a first light-shielding layer, the thickness of the elastic protective layer is greater than the thickness of the organic ceramic.

[0107] Specifically, when the protective layer also includes a first light-shielding layer, that is, when the protective layer set in the wiring area is a stacked structure (the bottom layer is organic ceramic and the top layer is the first light-shielding layer), the thickness of the elastic protective layer is greater than the thickness of the organic ceramic. When the display panel is spliced ​​and assembled, if a collision occurs, because the thickness of the elastic protective layer is greater than the thickness of the organic ceramic, the force generated by the collision will be preferentially applied to the elastic protective layer. With the buffering effect of the elastic protective layer, the impact of the collision on the side of the substrate is reduced, greatly reducing the probability of the organic ceramic being bumped, thereby improving the stability of the signal line.

[0108] Figure 13 An exemplary schematic diagram of the wiring region of a substrate is shown, such as... Figure 13 As shown, the substrate material can be set according to the actual situation. In this embodiment, the substrate is a liquid crystal glass substrate (TFT Glass) as an example for explanation. Figure 13 In this context, Pad represents one of the driving components used to drive the LED chip; Figure 13 The green area below the organic ceramic refers to the signal line; Figure 13 The first surface of the substrate is provided with multiple micro LED chips, which may include a red chip (corresponding to...). Figure 13 (Red square), green chip (corresponding) Figure 13 (Green square) and blue chip (corresponding) Figure 13 (Middle blue square); the side of the substrate has a wiring area (corresponding to) Figure 13 The purple square in the image shows an organic ceramic area with a thickness of H1.

[0109] Figure 14 An exemplary schematic diagram of the structure of a non-wired region of a substrate is shown, such as... Figure 14 As shown, the constituent material of the substrate can be set according to the actual situation. In this embodiment, the substrate is a liquid crystal glass substrate (TFTGlass) as an example for illustration. Figure 14 In this context, Pad represents one of the driving components used to drive the LED chip; Figure 14 The green area below the organic ceramic refers to the signal line; Figure 14 The first surface of the substrate is provided with multiple micro LED chips, which may include a red chip (corresponding to...). Figure 14 (Red square), green chip (corresponding) Figure 14 (Green square) and blue chip (corresponding) Figure 14 (Middle blue square); the side of the substrate has a non-trace area (corresponding to) Figure 14The area between the purple squares in the image has an elastic protective layer in the non-wire area. The thickness of the elastic protective layer is H2. When the display panel is spliced ​​and assembled, if a collision occurs, since H2 is greater than H1, the force generated by the collision will be preferentially applied to the elastic protective layer. With the buffering effect of the elastic protective layer, the impact of the collision on the side of the substrate is reduced, which greatly reduces the probability of organic ceramic being bumped, thereby improving the stability of the signal lines.

[0110] Figure 15 An exemplary flowchart is provided, showing a structure in which organic ceramic is used as a patterned encapsulation layer, and the wiring area has a stacked organic ceramic and a first light-shielding layer, while the non-wiring area has a stacked elastic protective layer and a second light-shielding layer. Figure 15 As shown, organic ceramic is used to pattern and encapsulate the wiring area, and an elastic protective layer is used to pattern and encapsulate the non-wiring area. The thickness of the elastic protective layer is greater than the thickness of the organic ceramic. Light-shielding material 1 is used to encapsulate the side of the substrate. At this time, the wiring area is provided with a stacked organic ceramic and a first light-shielding layer, and the non-wiring area is provided with a stacked elastic protective layer and a second light-shielding layer. Light-shielding material 2 is used to encapsulate the first surface (front) of the substrate. This achieves regional protection of the side of the substrate by the protective layer. For the wiring area that needs special protection, a stacked organic ceramic and a first light-shielding layer are used, while the non-wiring area is provided with a stacked elastic protective layer and a second light-shielding layer. This improves the stability of the signal lines while reducing the cost of the protective layer. The thickness of the elastic protective layer is greater than the thickness of the organic ceramic. When the display panel is spliced ​​and assembled, if a collision occurs, the force generated by the collision will be preferentially applied to the elastic protective layer because the thickness of the elastic protective layer is greater than that of the organic ceramic. With the buffering effect of the elastic protective layer, the impact of the collision on the side of the substrate is reduced, which greatly reduces the probability of the organic ceramic being hit, thereby improving the stability of the signal lines.

[0111] It should be noted that light-shielding material 1 and light-shielding material 2 are different. Light-shielding material 1 can be non-photosensitive and has the characteristics of high stability and high hardness. While improving the display uniformity of the substrate side, it effectively reduces the impact of bumps and scratches on the signal lines and improves the stability of the signal lines. Light-shielding material 2 can be photosensitive and has good photosensitivity and strong spectral selectivity, which can improve the display performance of the first surface of the display area.

[0112] In this embodiment, by setting the thickness of the elastic protective layer to be greater than that of the organic ceramic, if a collision occurs during the splicing and assembly of the display panel, the force generated by the collision will preferentially act on the elastic protective layer. With the buffering effect of the elastic protective layer, the impact of the collision on the side of the substrate is reduced, greatly reducing the probability of the organic ceramic being bumped, thereby improving the stability of the signal line.

[0113] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0114] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0115] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A splicing display device, characterized in that, include: At least two spliced ​​display panels, the display panels comprising: Multiple LED chips; The substrate includes a first surface, a second surface opposite to each other in the thickness direction of the substrate, and a side surface located between the first surface and the second surface. The side surface of the substrate is provided with signal lines, which are electrically connected to the LED chip located on the first surface and the flexible circuit board or driver chip located on the second surface. A protective layer covers the area on the side of the substrate where signal lines are disposed, and the protective layer comprises organic ceramic.

2. The splicing display device according to claim 1, characterized in that, The organic ceramic covers the signal lines on the side of the substrate, and the protective layer further includes: A first light-shielding layer is disposed on the organic ceramic.

3. The splicing display device according to claim 2, characterized in that, The organic ceramic is a patterned encapsulation layer, and the patterned encapsulation layer is covered with a metal material.

4. The splicing display device according to claim 1, characterized in that, The organic ceramic is filled with a light-blocking agent.

5. The splicing display device according to claim 4, characterized in that, The opacifier includes one or more of titanium dioxide, carbon black, and pigments.

6. The splicing display device according to any one of claims 2-5, characterized in that, The organic ceramics include: The polymer matrix includes one or more selected from polyimide, epoxy resin, and acrylic resin; Ceramic nanoparticles, wherein the ceramic nanoparticles include one or more of alumina, aluminum nitride, silicon nitride, silicon carbide, zirconium oxide, and calcium carbonate.

7. The splicing display device according to any one of claims 2-5, characterized in that, The organic ceramic is a structure formed by cross-linking polymerization of inorganic ionic oligomers.

8. The splicing display device according to any one of claims 1-5, characterized in that, The display panel also includes: The second light-shielding layer covers the area on the side of the substrate where the signal line is not located.

9. The splicing display device according to claim 8, characterized in that, The display panel also includes: An elastic protective layer is disposed between the second light-shielding layer and the side of the substrate, and the second light-shielding layer encapsulates the elastic protective layer.

10. The splicing display device according to claim 9, characterized in that, When the protective layer further includes a first light-shielding layer, the thickness of the elastic protective layer is greater than the thickness of the organic ceramic.

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