An integrally formed inductor and power module
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUNAN INSTITUTE OF ENGINEERING
- Filing Date
- 2025-08-20
- Publication Date
- 2026-08-07
AI Technical Summary
然而电源提升功率密度的同时其所使用的功率电感的工作电流也需要提升,随着功率电感的工作电流的增大,其铜线就必须更粗,相应的磁体体积也越大,这样电感成为电源提升功率密度的一个瓶颈
[0014]与现有技术相比,本实用新型中,将一体成型电感设计成呈凹槽状的壳体,将其作为电源模块的外壳,扩大了电感尺寸,提高了工作电流。其次,取消了原有的电源外壳,从而使整个电源模块的体积变得更小;第三,凹槽方便为其它元器件提供安装空间,壳体设计增加了散热面积,有利于增强电感散热。
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Figure CN224609678U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power inductor technology, and in particular to an integrally molded inductor and power module. Background Technology
[0002] Currently, most electronic device power supplies are switching power supplies, in which power inductors are used in DC-DC conversion modules to stabilize the current. Users are increasingly demanding higher power density from electronic devices, requiring continuous reduction in power supply size while increasing power output. The higher the power output, the greater the operating current of the power inductor. Inductors made from a single piece of metal powder and flat copper wire are widely used in switching power supplies due to their high anti-saturation characteristics and large operating current. However, as power density increases, the operating current of the power inductor also needs to increase. With the increase in the operating current of the power inductor, the copper wire must be thicker, and the corresponding magnet size must be larger, making the inductor a bottleneck for increasing power density. Secondly, the inductor is the largest and most heat-generating component in the power supply module. How to increase the inductor's operating current while simultaneously miniaturizing the power supply module and enhancing inductor heat dissipation is a pressing technical problem that needs to be solved. Utility Model Content
[0003] This utility model provides an integrated inductor and power supply module to solve the above-mentioned technical problems.
[0004] This utility model provides an integrally molded inductor, including a groove-shaped housing. The housing contains a copper sheet with multiple bends. The bends are in three sections: the first and last sections are located in the groove wall of the housing, and the middle section is located in the groove bottom of the housing. The two ends of the copper sheet are exposed at the groove opening of the housing to form leads. The housing also has a fixing part at the groove opening, which is fixed to the bends.
[0005] Preferably, the pins are formed by bending the two ends of a copper sheet at 90°.
[0006] Preferably, the fixing part is formed by bending the bending part at 90°.
[0007] Preferably, two adjacent bends are arranged in parallel.
[0008] Preferably, the distance between two adjacent bends gradually increases from one end to the other.
[0009] Preferably, the pin is bent outward from the copper sheet, and the fixing part is bent outward from the bent part.
[0010] Preferably, the thickness of the copper sheet is 0.08-1mm, and the thickness of the shell is 6mm.
[0011] Preferably, the housing includes an outer shell and an inner shell, and the copper sheet is fixed between the outer shell and the inner shell by molding.
[0012] Preferably, the groove wall of the housing is perpendicular to the groove bottom of the housing.
[0013] This utility model also provides a power module including the above-described integral molded inductor, wherein the pins and fixing part of the integral molded inductor are fixed to the circuit board by welding, and the components of the circuit board are located in the groove of the housing.
[0014] Compared with existing technologies, this invention designs the integrally molded inductor as a grooved shell, which serves as the outer casing of the power module, thereby increasing the inductor size and improving the operating current. Secondly, it eliminates the original power supply shell, making the overall power module smaller. Thirdly, the groove provides installation space for other components, and the shell design increases the heat dissipation area, which is beneficial for enhancing inductor heat dissipation. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present utility model;
[0017] Figure 2 This is a cross-sectional schematic diagram of Embodiment 1 of the present utility model;
[0018] Figure 3 This is an exploded view of Embodiment 1 of the present invention;
[0019] Figure 4 This is a schematic diagram of the structure of Embodiment 2 of the present invention;
[0020] Figure 5 This is an exploded view of Embodiment 2 of the present invention;
[0021] Figure 6 This is a schematic diagram of the power module of this utility model.
[0022] Figure label:
[0023] 1. Housing, 11. Outer shell, 12. Inner shell, 2. Copper sheet, 21. Bending part, 22. Pin, 23. Fixing part, 3. Circuit board, 31. Component, 100. Molded inductor. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0025] Example 1
[0026] See attached document Figure 1 and attached Figure 2 A molded inductor 100 includes a recessed housing 1. Inside the housing 1 is a copper sheet 2 with multiple bends 21. Each bend 21 is divided into three sections: the first and last sections are located within the recessed wall of the housing 1, and the middle section is located within the recessed bottom. The two ends of the copper sheet 2 protrude at the recess opening of the housing 1 to form leads 22, which are plated with tin. The housing 1 also has a fixing part 23 at the recess opening, which is fixed to the bends 21. The fixing part 23 is used to fix the inductor 100 to a circuit board 3, thereby improving the fixation effect of the molded inductor 100. In this invention, designing the molded inductor 100 with a recessed housing 1 increases the inductor size and improves the operating current. Secondly, it also facilitates heat dissipation. Thirdly, the recess provides convenient space for the installation of other components 31.
[0027] As another embodiment of this utility model: refer to the appendix Figure 3 The two pins 22 are formed by bending the two ends of the copper sheet 2 at 90°.
[0028] In another embodiment of this utility model, the fixing part 23 is formed by bending the bending part 21 at 90°. Specifically, the copper sheet 2 is punched out of the bending part 21, the lead 22 and the fixing part 23 using a stamping process.
[0029] As another embodiment of this utility model: refer to the appendix Figure 3 The two adjacent bends 21 are arranged in parallel.
[0030] In another embodiment of this utility model: the pin 22 is bent outward from the copper sheet 2, and the fixing part 23 is bent outward from the bent part 21. The end of the pin 22 is flush with the outer side of the housing 1, and the end of the fixing part 23 is flush with the outer side of the housing 1. Both the pin 22 and the fixing part 23 serve as fixing points. Through this structural design, the distance between the fixing points between the two groove walls of the housing 1 can be increased.
[0031] In another embodiment of this utility model, the thickness of the copper sheet 2 is 0.08-1mm, and the thickness of the shell 1 is 6mm.
[0032] As another embodiment of this utility model: refer to the appendix Figure 3 The housing 1 includes an outer shell 11 and an inner shell 12. A copper sheet 2 is fixed between the outer shell 11 and the inner shell 12 by molding. Iron-silicon-aluminum and iron-nickel atomized powders coated with silicon dioxide or aluminum oxide are used as raw materials, and are pressed into the outer shell 11 and inner shell 12 respectively. Then, the inner shell 12, copper sheet 2, and outer shell 11 are placed sequentially from bottom to top and molded into a single-piece inductor 100 blank. The blank is placed in an atmosphere furnace and sintered at 660-720℃ for 1-2 hours under nitrogen protection. After sintering, a layer of tin is plated onto the leads 22 of the single-piece inductor 100. For example, taking the integrally molded inductor 100 with external dimensions of 40×40×20mm as an example, the total thickness of the magnet is 6mm, the internal space is 40×28×14mm, and the flat copper wire with a cross-section of 5.0×1.0mm is used. Under 200V voltage, it can withstand a maximum current of 25A, that is, the power can reach 5000W. With the inductor designed by this utility model, the power limit of the power module can reach 5000W within the above-mentioned size, which is far higher than existing products.
[0033] As another embodiment of this utility model: the groove wall of the housing 1 is perpendicular to the bottom of the groove of the housing 1.
[0034] Example 2
[0035] This embodiment is basically the same as Embodiment 1, except that:
[0036] As another embodiment of this utility model: refer to the appendix Figure 4 and attached Figure 5 The distance between two adjacent bends 21 gradually increases from one end to the other.
[0037] See attached document Figure 6 The present invention also provides a power module including the above-mentioned integrally molded inductor 100. The pins 22 and fixing parts 23 of the integrally molded inductor 100 are fixed to the circuit board 3 by soldering, and the components 31 of the circuit board 3 are located in the groove of the housing 1.
[0038] In this invention, the integrally molded inductor 100 is used as the housing 11 of the power module, thereby increasing the size of the inductor to the size of the entire power supply and raising its upper limit of operating current; secondly, the original power supply housing 11 is eliminated, thereby making the overall power module smaller; thirdly, the housing design increases the heat dissipation area, which is beneficial to enhancing the heat dissipation of the inductor.
[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A molded inductor, characterized in that, The device includes a recessed housing with a copper sheet having multiple bends inside. The bends are in three sections: the first and last sections are located inside the groove wall of the housing, and the middle section is located inside the groove bottom of the housing. The two ends of the copper sheet protrude at the groove opening of the housing to form leads. The housing also has a fixing part at the groove opening, which is fixed to the bends.
2. The integrally molded inductor according to claim 1, characterized in that, The pins are formed by bending the two ends of a copper sheet at 90°.
3. The integrally molded inductor according to claim 2, characterized in that, The fixing part is formed by bending the bending part at 90°.
4. The integrally molded inductor according to claim 1, characterized in that, The two adjacent bends are set in parallel.
5. The integrally molded inductor according to claim 1, characterized in that, The distance between two adjacent bends gradually increases from one end to the other.
6. The integrally molded inductor according to claim 3, characterized in that, The pin is bent outward from the copper sheet, and the fixing part is bent outward from the bent part.
7. The integrally molded inductor according to claim 1, characterized in that, The thickness of the copper sheet is 0.08-1mm, and the thickness of the shell is 6mm.
8. The integrally molded inductor according to claim 6, characterized in that, The housing includes an outer shell and an inner shell, and the copper sheet is fixed between the outer shell and the inner shell by molding.
9. The integrally molded inductor according to claim 1, characterized in that, The groove wall of the shell is perpendicular to the bottom of the groove.
10. A power module comprising the integrally molded inductor according to any one of claims 1-9, characterized in that, The pins and fixing parts of the integrally molded inductor are fixed to the circuit board by soldering, and the components of the circuit board are located in the groove of the housing.