LED package fuse

Abstract

The utility model provides a kind of LED encapsulation fuse, comprising: support assembly;The support assembly includes insulating support structure, the recess of being arranged in the insulating support structure and the connection support structure of being spaced apart in the insulating support structure, the connecting pin is uniformly provided at the top of the connection support structure;Fuse assembly is arranged in the recess;The fuse assembly includes the first fuse structure of being connected with the connecting pin at the top of two adjacent connection support structures and the second fuse structure of being connected with the connecting pin at the top of two connection support structures at head and tail, the first fuse structure includes Sn-Bi alloy and gold wire arranged in Sn-Bi alloy, the first fuse structure is welded on the connecting pin at the top of connection support structure by Sn-Bi alloy at both ends, the second fuse structure includes silver wire and Al2O3 ceramic particle coating coated on the surface of silver wire;Encapsulation glue structure is wrapped the fuse assembly.

Description

Technical Field

[0001] This utility model relates to the field of fuse technology, and in particular to an LED-encapsulated fuse. Background Technology

[0002] As electronic devices become smaller and more integrated, the reliability and accuracy requirements of circuit protection components are increasing. As an overload circuit protection component, fuses are widely used in circuits. With increasing demand and large usage, the cost and performance requirements for fuses are also increasing.

[0003] Traditional fuses consist of a housing, a sealing cap, a fusible alloy, a flux, a sealant, and two leads. They are relatively complex in structure and expensive.

[0004] In existing technologies, traditional LED-encapsulated fuses typically use a single fusing material (metal wire or alloy material) as the fuse structure. Their fusing response speed and current surge resistance are limited, making them unsuitable for the complex operating conditions in drive circuits. Furthermore, their single fusing characteristic makes it difficult to simultaneously meet the requirements of high-precision fusing and high current carrying capacity. In addition, existing fuse encapsulation structures often lack temperature monitoring capabilities, failing to perceive the fuse's operating status in real time, making them prone to overheating and failure, potentially leading to safety hazards. Moreover, existing fuse structures mostly employ a single-path design, lacking multi-path fusing protection capabilities. Additionally, the encapsulating colloids of existing LED-encapsulated fuses are mostly opaque or made of ordinary silicone, failing to visually display changes in the fuse's operating temperature, thus reducing product maintainability and safety. Utility Model Content

[0005] Therefore, the purpose of this utility model is to provide an LED-encapsulated fuse that can effectively solve the shortcomings of the prior art.

[0006] An LED-encapsulated fuse includes:

[0007] Support assembly;

[0008] The bracket assembly includes an insulating bracket structure, a groove disposed within the insulating bracket structure, and a plurality of connecting bracket structures spaced apart within the insulating bracket structure, with connecting pins provided on the top of each connecting bracket structure.

[0009] A fuse assembly disposed within the groove;

[0010] The fuse assembly includes several first fuse structures connecting the top connecting pins of two adjacent connecting bracket structures and second fuse structures connecting the top connecting pins of two end connecting bracket structures. The first fuse structure includes a Sn-Bi alloy and gold wire disposed within the Sn-Bi alloy. The first fuse structure is welded to the connecting pins at the top of the connecting bracket structure by the Sn-Bi alloy at both ends. The second fuse structure includes a silver wire and an Al2O3 ceramic particle coating coated on the surface of the silver wire.

[0011] The encapsulating adhesive structure that encapsulates the fuse assembly.

[0012] Furthermore, the encapsulating adhesive structure is a transparent silicone doped with thermochromic dye.

[0013] Furthermore, a first connection pad is provided on the side of the two connecting bracket structures that are far apart from each other, which is connected to the top connection pin for connecting the positive and negative input / output of the external circuit. On one side of a connecting bracket structure between the two connecting bracket structures, a second connection pad is provided for connecting a thermal resistance sensor to detect the working temperature of the fuse in real time.

[0014] Furthermore, the projected area of ​​the connection pin at the top of the connection bracket structure, where the second connection pad is located, is smaller than that of other connection pins on the connection bracket structure.

[0015] Furthermore, an attachment structure for attaching and fixing the bracket assembly is provided at the bottom of the insulating bracket structure.

[0016] Furthermore, the attachment structure is a double-sided adhesive layer or a thermally conductive adhesive layer.

[0017] Furthermore, the insulating support structure is made of high-temperature resistant engineering plastic, which is selected from polyphenylene sulfide, polyetheretherketone, and liquid crystal polymer.

[0018] Furthermore, the connecting bracket structure includes a conductive layer disposed on top and a heat dissipation layer disposed at the bottom of the conductive layer.

[0019] Furthermore, the conductive layer is made of copper alloy and has a nickel or silver layer plated on its surface, and the heat dissipation layer is a high thermal conductivity aluminum substrate.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows: by setting multiple connecting bracket structures, several first fuse structures connecting the top connecting pins of adjacent connecting bracket structures, and a second fuse structure connecting the top connecting pins of the first and last connecting bracket structures, multi-path fusing protection capability is achieved; by using Sn-Bi alloy to wrap gold wire in the first fuse structure, the low melting point characteristics of Sn-Bi alloy and the high conductivity of gold wire are combined, which not only ensures fast fusing response but also improves current carrying capacity; by using silver wire coated with Al2O3 ceramic particle coating in the second fuse structure, the high temperature resistance and arc resistance are enhanced, making it suitable for high current impact scenarios. This composite design solves the problem that traditional single fusing materials cannot simultaneously achieve high-precision fusing and high current carrying capacity. Attached Figure Description

[0021] Figure 1 This is a schematic cross-sectional view of the overall structure of the LED-encapsulated fuse in this embodiment of the present invention;

[0022] Figure 2 This is a top view of the overall structure of the LED-encapsulated fuse in this embodiment of the present invention;

[0023] Figure 3 This is a bottom view of the overall structure of the LED-encapsulated fuse in this embodiment of the present invention;

[0024] Explanation of key component symbols:

[0025] Insulating support structure 11 Fuse assembly 20 Attachment structure 111 First fuse structure 21 groove 12 Second fuse structure 22 Connecting bracket structure 13 Encapsulation adhesive structure 30 conductive layer 131 First connection pad 40 Heat dissipation layer 132 Second connection pad 50

[0026] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0027] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0028] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0030] Please see Figures 1 to 3 The LED-encapsulated fuse in this embodiment of the present invention includes:

[0031] Support assembly 10;

[0032] The bracket assembly 10 includes an insulating bracket structure 11, a groove 12 disposed in the insulating bracket structure 11, and a plurality of connecting bracket structures 13 disposed at intervals in the insulating bracket structure 11. Each connecting bracket structure 13 is provided with a connecting pin 14 on its top.

[0033] Fuse assembly 20 disposed within the groove 12;

[0034] The fuse assembly 20 includes a plurality of first fuse structures 21 connecting the top connection pins 14 of two adjacent connecting bracket structures 13 and second fuse structures 22 connecting the top connection pins 14 of two end connecting bracket structures 13. The first fuse structure 21 includes Sn-Bi alloy and gold wire disposed in Sn-Bi alloy. The first fuse structure 21 is welded to the connection pins 14 at the top of the connecting bracket structure 13 by Sn-Bi alloy at both ends. The second fuse structure 22 includes silver wire and Al2O3 ceramic particle coating on the surface of the silver wire.

[0035] Encapsulating adhesive structure 30 encapsulating the fuse assembly 20;

[0036] Specifically, in this embodiment, three connecting bracket structures 13 are spaced apart within the insulating bracket structure 11, and the fuse assembly 20 includes two first fuse structures 21 that connect the top connecting pins 14 of two adjacent connecting bracket structures 13.

[0037] Understandably, by setting up three connecting bracket structures 13, two first fuse structures 21 connecting the top connecting pins 14 of adjacent connecting bracket structures 13, and a second fuse structure 22 connecting the top connecting pins 14 of the first and last connecting bracket structures 13, multi-path fusing protection capability is achieved. By using Sn-Bi alloy to wrap gold wire in the first fuse structure 21, the low melting point characteristics of Sn-Bi alloy and the high conductivity of gold wire are combined, ensuring both fast fusing response and improved current carrying capacity. By using silver wire coated with Al2O3 ceramic particle coating in the second fuse structure 22, high temperature resistance and arc resistance are enhanced, making it suitable for high current impact scenarios. This composite design solves the problem that traditional single fusing materials cannot simultaneously achieve high-precision fusing and high current carrying capacity.

[0038] Furthermore, the encapsulating adhesive structure 30 is a transparent silicone doped with thermochromic dye.

[0039] Understandably, the encapsulating adhesive structure 30 uses transparent silicone doped with thermochromic dyes, which can change color according to temperature changes, intuitively displaying the working status of the fuse. This solves the defect in the prior art that the encapsulating adhesive cannot visualize temperature changes, improves the maintainability and safety of the product, and allows users to detect overheating hazards in advance through color changes.

[0040] Furthermore, a first connection pad 40 is provided on the side of the two connecting bracket structures 13 that are far apart from each other, which is connected to the top connection pin 14 for connecting the positive and negative input / output of the external circuit. A second connection pad 50 is provided on one side of a connecting bracket structure 13 between the two connecting bracket structures 13 for connecting a thermal resistance sensor to detect the working temperature of the fuse in real time.

[0041] Understandably, by setting the second connection pad 50 to connect the thermal resistance sensor, the operating temperature of the fuse can be detected in real time, which solves the problem that traditional fuses lack temperature monitoring function and avoids failure or safety hazards caused by overheating.

[0042] Furthermore, the projected area of ​​the connection pin 14 on the top of the connection bracket structure 13, where the second connection pad 50 is provided, is smaller than that of the other connection pins 14.

[0043] Understandably, by setting the projected area of ​​the connection pin 14 on the top of the connection bracket structure 13 with the second connection pad 50 to be smaller than that of other connection pins 14, thermal interference can be reduced and temperature detection accuracy can be improved by reducing the projected area of ​​the connection pin 14 with temperature monitoring function on the connection bracket structure 13.

[0044] Furthermore, an attachment structure 111 for attaching and fixing the bracket assembly 10 is provided at the bottom of the insulating support structure 11.

[0045] Furthermore, the attachment structure 111 is a double-sided adhesive layer or a thermally conductive adhesive layer.

[0046] Specifically, in this embodiment, the attachment structure 111 is a thermally conductive adhesive layer.

[0047] Furthermore, the insulating support structure 11 is made of high-temperature resistant engineering plastic, which is selected from polyphenylene sulfide, polyetheretherketone, and liquid crystal polymer.

[0048] Understandably, the insulating support structure 11 is made of high-temperature resistant engineering plastic. Combined with the attachment structure 111, it not only fixes the support but also ensures mechanical strength under high-temperature conditions and improves heat dissipation performance.

[0049] Furthermore, the connecting bracket structure 13 includes a conductive layer 131 disposed on the top and a heat dissipation layer 132 disposed at the bottom of the conductive layer 131.

[0050] Furthermore, the conductive layer 131 is made of copper alloy and has a nickel or silver layer plated on its surface, and the heat dissipation layer 132 is a high thermal conductivity aluminum substrate.

[0051] Understandably, the copper alloy material and surface plating (nickel or silver) of the conductive layer 131 further optimize conductivity and corrosion resistance, enhancing product reliability and lifespan. Furthermore, the rapid heat dissipation through the bottom heat dissipation layer 132 extends fuse life and reduces accidental melting.

[0052] In summary, the LED-encapsulated fuse in the above embodiments of this utility model achieves multi-path fusing protection by setting multiple connecting bracket structures, several first fuse structures connecting the top connecting pins of adjacent connecting bracket structures, and second fuse structures connecting the top connecting pins of the first and last connecting bracket structures. By using Sn-Bi alloy to wrap gold wire in the first fuse structure, the low melting point of Sn-Bi alloy and the high conductivity of gold wire are combined, ensuring both fast fusing response and improved current carrying capacity. By using silver wire coated with Al2O3 ceramic particles in the second fuse structure, the high temperature resistance and arc resistance are enhanced, making it suitable for high current impact scenarios. This composite design solves the problem that traditional single fusing materials cannot simultaneously achieve high-precision fusing and high current carrying capacity.

[0053] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0054] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An LED-encapsulated fuse, characterized in that, include: Support assembly; The bracket assembly includes an insulating bracket structure, a groove disposed within the insulating bracket structure, and a plurality of connecting bracket structures spaced apart within the insulating bracket structure, with connecting pins provided on the top of each connecting bracket structure. A fuse assembly disposed within the groove; The fuse assembly includes several first fuse structures connecting the top connecting pins of two adjacent connecting bracket structures and second fuse structures connecting the top connecting pins of two end connecting bracket structures. The first fuse structure includes a Sn-Bi alloy and gold wire disposed within the Sn-Bi alloy. The first fuse structure is welded to the connecting pins at the top of the connecting bracket structure by the Sn-Bi alloy at both ends. The second fuse structure includes a silver wire and an Al2O3 ceramic particle coating coated on the surface of the silver wire. The encapsulating adhesive structure that encapsulates the fuse assembly.

2. The LED-encapsulated fuse according to claim 1, characterized in that, The encapsulating adhesive structure is a transparent silicone doped with thermochromic dye.

3. The LED-encapsulated fuse according to claim 1, characterized in that, On one side of the two connecting bracket structures that are far apart from each other, there is a first connecting pad that is connected to the top connecting pin for connecting the positive and negative inputs / outputs of external circuits. On one side of a connecting bracket structure between the two connecting bracket structures, there is a second connecting pad for connecting a thermal resistance sensor to detect the operating temperature of the fuse in real time.

4. The LED-encapsulated fuse according to claim 3, characterized in that, The projection area of ​​the connection pin at the top of the connection bracket structure, where the second connection pad is located, is smaller than that of other connection pins on the connection bracket structure.

5. The LED-encapsulated fuse according to claim 1, characterized in that, An attachment structure for attaching and fixing the bracket assembly is provided at the bottom of the insulating bracket structure.

6. The LED-encapsulated fuse according to claim 5, characterized in that, The attachment structure is a double-sided adhesive layer or a thermally conductive adhesive layer.

7. The LED-encapsulated fuse according to claim 1, characterized in that, The insulating support structure is made of high-temperature resistant engineering plastic, which is selected from polyphenylene sulfide, polyether ether ketone, and liquid crystal polymer.

8. The LED-encapsulated fuse according to claim 1, characterized in that, The connecting bracket structure includes a conductive layer disposed on top and a heat dissipation layer disposed at the bottom of the conductive layer.

9. The LED-encapsulated fuse according to claim 8, characterized in that, The conductive layer is made of copper alloy and is plated with a nickel or silver layer on its surface, and the heat dissipation layer is a high thermal conductivity aluminum substrate.

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