Single-row SMT solder leg and high-speed connector

Abstract

The utility model relates to connector technical field especially relates to a single -row SMT solder leg and high -speed connector, including receiving data terminal, with the interval setting of receiving data terminal transmission data terminal, set up between receiving data terminal and transmission data terminal data transmission terminal, set up between receiving data terminal and data transmission terminal power supply negative pole and set up between transmission data terminal and data transmission terminal power supply positive pole, and receiving data terminal is equipped with the first ground end, and transmission data terminal is equipped with the second ground end, and the ground wire pin is arranged between receiving data terminal and transmission data terminal, and the ground wire pin is located the outside of data transmission terminal, and the quantity of receiving data terminal is at least a pair, and the quantity of transmission data terminal is at least a pair, and the quantity of data transmission terminal is at least a pair. The position order of each pair of terminals is reasonable, avoids the middle of each pair of needle foot to be inserted and separated to have other needle foot, reduces signal interference influence, improves signal transmission integrity and reliability.

Description

Technical Field

[0001] This utility model relates to the field of connector technology, and in particular to a single-row SMT solder pad and high-speed connector. Background Technology

[0002] Driven by the ever-increasing demands for resolution and storage performance in consumer electronics, consumers expect broadband internet connections to enable broader media applications and faster transmission speeds, simplifying downloads, storage, and the sharing of large amounts of multimedia content. USB 3.0 plays a crucial role in providing consumers with the ease of connectivity they need. USB 3.0, considered Super Speed ​​USB, provides a standard interface for various devices connecting to PCs or audio / high-frequency equipment. It boasts higher transmission speeds and more pins to support higher data transfer rates. The USB 3.0 interface typically features a blue tongue, distinguishing it from the black or white of USB 2.0, serving as a primary identifier of its ultra-high speed. Currently, the USB 3.0 connector uses a single-row SMT pin structure with multiple pins. Each pair of pins is interspersed with other pins, resulting in a complex and haphazard pin arrangement. This not only increases the number of pins and manufacturing and soldering complexity but also makes it susceptible to signal interference, causing signal transmission instability and affecting signal integrity and reliability. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by providing a single-row SMT solder pad and high-speed connector.

[0004] To achieve the above objectives, this utility model provides a single-row SMT solder pad, comprising a receiving data terminal, a transmitting data terminal spaced apart from the receiving data terminal, a data transmission terminal disposed between the receiving data terminal and the transmitting data terminal, a negative power supply terminal disposed between the receiving data terminal and the data transmission terminal, and a positive power supply terminal disposed between the transmitting data terminal and the data transmission terminal. A first grounding terminal is disposed on the side of the receiving data terminal away from the negative power supply terminal, and a second grounding terminal is disposed on the side of the transmitting data terminal away from the positive power supply terminal. A ground pin is disposed between the receiving data terminal and the transmitting data terminal, and the ground pin is located outside the data transmission terminal. The number of receiving data terminals is at least one pair, the number of transmitting data terminals is at least one pair, and the number of data transmission terminals is at least one pair.

[0005] Preferably, the ground pin includes a first solder pin, a second solder pin spaced apart from the first solder pin, and a first connection terminal integrally formed with the first solder pin and the second solder pin. The first solder pin and the second solder pin have a Z-shaped vertical structure, and the first solder pin, the second solder pin and the first connection terminal form a Y-shaped fork structure. The data transmission terminal is located between the first solder pin and the second solder pin to isolate the data transmission terminal from the data receiving terminal and the data sending terminal.

[0006] Preferably, one end of the receiving data terminal is provided with a third solder foot, and the other end of the receiving data terminal is provided with a second connecting end. The third solder foot is bent into a Z-shaped vertical structure, and the second connecting end is bent into an inverted L-shape.

[0007] Preferably, one end of the data transmission terminal is provided with a fourth solder foot, and the other end of the data transmission terminal is provided with a third connection end. The fourth solder foot is bent into a Z-shaped vertical structure, and the third connection end is bent into an inverted L-shape.

[0008] Preferably, one end of the data transmission terminal is provided with a fifth solder foot, and the other end of the data transmission terminal is provided with a first elastic arm. The fifth solder foot is bent into a Z-shaped vertical structure, and the first elastic arm is bent into an inverted L-shape.

[0009] Preferably, one end of the negative power supply is provided with a sixth soldering foot, and the other end of the negative power supply is provided with a second elastic arm. The sixth soldering foot is bent into a Z-shaped vertical structure, and the second elastic arm is bent into an inverted L-shape.

[0010] Preferably, one end of the positive terminal of the power supply is provided with a seventh soldering foot, and the other end of the positive terminal of the power supply is provided with a third elastic arm. The seventh soldering foot is bent into a Z-shaped vertical structure, and the third elastic arm is bent into an inverted L-shape.

[0011] A high-speed connector with a single row of SMT solder pads, as described above, includes a housing and a plastic body disposed on the housing. The single row of SMT solder pads is disposed on the plastic body, and the plastic body is provided with bumps that protrude from the outer wall of the plastic body. The outer wall of the housing is provided with grooves for accommodating the bumps.

[0012] Preferably, the housing is provided with multiple springs arranged around the circumference of the housing so that the multiple springs abut against or detach from the outer wall of the plastic body.

[0013] Preferably, the front end of the plastic body is provided with a cavity, and the end of the cavity is provided with a snap-fit ​​hole. The number of snap-fit ​​holes is provided in multiples, and the multiple snap-fit ​​holes are arranged at intervals along the length direction of the cavity. The first connecting end, the second connecting end, and the third connecting end are respectively accommodated in the multiple snap-fit ​​holes. The cavity is provided with a snap-fit ​​groove. The number of snap-fit ​​grooves is provided in multiples, and the multiple snap-fit ​​grooves are arranged at intervals along the length direction of the cavity. The first elastic arm, the second elastic arm, and the third elastic arm are respectively accommodated in the multiple snap-fit ​​grooves.

[0014] The beneficial effects of this utility model are: the position arrangement of each pair of terminals is reasonable, avoiding the presence of other pins interspersed and separated in the middle of each pair of pins, reducing signal interference, and improving the integrity and reliability of signal transmission. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the single-row SMT solder pad structure of this utility model.

[0016] Figure 2 This is a schematic diagram of the high-speed connector structure with a single row of SMT solder pads according to the present invention.

[0017] Figure 3 This is an exploded structural diagram of the high-speed connector with a single row of SMT solder pads according to this utility model.

[0018] Figure 4 This is a front view structural diagram of the high-speed connector with a single row of SMT solder pads according to this utility model.

[0019] The reference numerals in the figures include:

[0020] 1 – Data receiving terminal; 11 – Third solder pin; 12 – Second connection terminal

[0021] 2 – Transmit data terminal; 21 – Fourth solder pin; 22 – Third connection terminal

[0022] 3—Data transmission terminal; 31—Fifth solder pin; 32—First elastic arm

[0023] 4—Power supply negative terminal; 41—Sixth solder pin; 42—Second flexible arm

[0024] 5—Positive power supply terminal; 51—Seventh solder pin; 52—Third flexible arm.

[0025] 6 – First grounding terminal; 7 – Second grounding terminal

[0026] 8 – Ground pin; 81 – First solder pin; 82 – Second solder pin

[0027] 83—First Connection End

[0028] 9—Shell shell; 91—Groove; 92—Spring piece

[0029] 10 – Plastic body; 101 – Protrusion; 102 – Cavity

[0030] 103 - Snap-fit ​​hole; 104 - Snap-fit ​​groove. Detailed Implementation

[0031] The present invention will now be described in detail with reference to the accompanying drawings.

[0032] like Figures 1 to 4 As shown, a single-row SMT solder pad of this utility model includes a receiving data terminal 1, a transmitting data terminal 2 spaced apart from the receiving data terminal 1, a data transmission terminal 3 disposed between the receiving data terminal 1 and the transmitting data terminal 2, a power supply negative terminal 4 disposed between the receiving data terminal 1 and the data transmission terminal 3, and a power supply positive terminal 5 disposed between the transmitting data terminal 2 and the data transmission terminal 3. A first grounding terminal 6 is disposed on the side of the receiving data terminal 1 away from the power supply negative terminal 4, and a second grounding terminal 7 is disposed on the side of the transmitting data terminal 2 away from the power supply positive terminal 5. A ground pin 8 is disposed between the receiving data terminal 1 and the transmitting data terminal 2, and the ground pin 8 is located outside the data transmission terminal 3. The number of receiving data terminals 1 is at least one pair, the number of transmitting data terminals 2 is at least one pair, and the number of data transmission terminals 3 is at least one pair.

[0033] This application applies to USB 3.0 products. Compared to USB 2.0, USB 3.0 increases the number of pins from 4 to 12. This increase is primarily to support higher transmission speeds and more complex signal transmissions. It introduces a receive data terminal 1, a transmit data terminal 2, and a ground pin 8, which helps improve signal integrity and interference immunity, making it suitable for ultra-high-speed data transmission. These additional pins enable USB 3.0 to support higher data transfer rates (such as 5Gbps) and more complex signal processing, and can also meet the high-frequency requirements of 10G. The ground pin 8 is used for ground termination and signal integrity management, helping to reduce the impact of electromagnetic interference (EMI). Furthermore, the pin layout and structural design of USB 3.0, such as the blue casing and improved physical shape, also help reduce signal interference and improve transmission stability. Despite the increased pin count, USB 3.0 maintains backward compatibility with USB 2.0. This means that USB 3.0 devices are compatible with USB 2.0 devices and interfaces, ensuring broad applicability. This compatibility is crucial in practical applications, especially in device manufacturing and user usage. The circuit board has at least one pair of receiving data terminals 1, at least one pair of transmitting data terminals 2, and at least one pair of data transmission terminals 3. Each pair of receiving data terminals 1 and each pair of transmitting data terminals 2 are spaced apart to avoid interleaving or separation between them. A pair of data transmission terminals 3 is positioned between the pair of receiving data terminals 1 and the pair of transmitting data terminals 2, effectively preventing interference caused by interleaving between different terminals and reducing signal interference. Furthermore, the spacing and layout between different terminals are precisely controlled to ensure signal integrity and reliability. In addition, attention must be paid to pin spacing and pad design during soldering to avoid problems such as cold solder joints and bridging. For example, a sanitized TH Padstack can improve the circuit board's performance by increasing the gap between pins and optimizing pad design. This invention features a reasonable arrangement of terminal pairs, avoiding interleaving or separation between other pins in each pair, reducing signal interference, and improving signal transmission integrity and reliability.

[0034] In this embodiment, the ground pin 8 includes a first solder foot 81, a second solder foot 82 spaced apart from the first solder foot 81, and a first connection terminal 83 integrally formed with the first solder foot 81 and the second solder foot 82. The first solder foot 81 and the second solder foot 82 have a Z-shaped vertical structure, and the first solder foot 81, the second solder foot 82, and the first connection terminal 83 form a Y-shaped fork structure. The data transmission terminal 3 is located between the first solder foot 81 and the second solder foot 82 to isolate the data transmission terminal 3 from the receiving data terminal 1 and the transmitting data terminal 2. Specifically, the first solder foot 81, the second solder foot 82, and the first connection terminal 83 form a Y-shaped fork structure so that a pair of data transmission terminals 3 are located between the first solder foot 81 and the second solder foot 82. Thus, the ground pin 8 isolates the pair of data transmission terminals 3 from the pair of receiving data terminals 1 and the pair of transmitting data terminals 2, effectively avoiding mutual interference and ensuring operational stability by ensuring the independent and efficient operation of the data transmission terminal 3, the receiving data terminal 1, and the transmitting data terminal 2.

[0035] In this embodiment, one end of the receiving data terminal 1 is provided with a third solder pin 11, and the other end of the receiving data terminal 1 is provided with a second connection terminal 12. The third solder pin 11 is bent into a Z-shaped vertical structure, and the second connection terminal 12 is bent into an inverted L-shape. Specifically, the receiving data terminal 1 consists of SSRX+ and SSRX-. SSRX+ and SSRX- are the receive channels in the USB 3.0 interface, which are differential signal lines used for ultra-high-speed data transmission and can be used to receive data sent from the device or host. The third solder pin 11 is bent into a Z-shaped vertical structure to facilitate the positioning and welding of the third solder pin 11 to the PCB board. The second connection terminal 12 is bent into an inverted L-shape to improve the overall structural load-bearing capacity and working performance.

[0036] In this embodiment, one end of the data transmission terminal 2 is provided with a fourth solder pin 21, and the other end of the data transmission terminal 2 is provided with a third connection terminal 22. The fourth solder pin 21 is bent into a Z-shaped vertical structure, and the third connection terminal 22 is bent into an inverted L-shape. Specifically, the data transmission terminal 2 consists of SSTX+ and SSTX-. SSTX+ and SSTX- are the transmit channels in the USB 3.0 interface, differential signal lines used for ultra-high-speed data transmission. They can be used to send data from the host to the device or from the device to the host. According to the protocol, SSTX+ is usually connected to SSRX+, and SSTX- is connected to SSRX-, forming full-duplex communication. USB 3.0 uses two sets of differential signal pairs (SSTX+ / - and SSRX+ / -) to achieve full-duplex communication, that is, to send and receive data simultaneously. USB 2.0 only supports half-duplex communication, while SSTX+ / - and SSRX+ / - are differential signals and support full-duplex communication, that is, to send and receive data simultaneously. They have advantages such as strong anti-interference ability and good anti-noise performance.

[0037] In this embodiment, one end of the data transmission terminal 3 is provided with a fifth solder pin 31, and the other end is provided with a first elastic arm 32. The fifth solder pin 31 is bent into a Z-shaped vertical structure, and the first elastic arm 32 is bent into an inverted L-shape. Specifically, the data transmission terminal 3 consists of D+ and D-. In USB 3.0, D+ and D- are data lines in the USB interface used for data transmission. D+ is typically used for the positive phase of data transmission, while D- is used for the negative phase. In the USB 2.0 standard, D+ and D- are designed to support full-speed and high-speed data transmission. In USB 3.0, D+ and D- are still used for data transmission, but support higher transmission rates. The fifth solder pin 31 is bent into a Z-shaped vertical structure to facilitate soldering and fixing the fifth solder pin 31 to the PCB board, and the first elastic arm 32 is bent into an inverted L-shape to improve the overall structural load-bearing capacity and operational performance.

[0038] In this embodiment, one end of the power supply negative terminal 4 is provided with a sixth solder pin 41, and the other end of the power supply negative terminal 4 is provided with a second elastic arm 42. The sixth solder pin 41 is bent into a Z-shaped vertical structure, and the second elastic arm 42 is bent into an inverted L-shape. Specifically, the power supply negative terminal 4 is usually a GND line, used for power return and ground connection. The sixth solder pin 41 is bent into a Z-shaped vertical structure to facilitate soldering and fixing of the sixth solder pin 41 to the PCB board. The second elastic arm 42 is bent into an inverted L-shape to improve the load-bearing capacity and working performance of the overall structure.

[0039] In this embodiment, one end of the positive power supply 5 is provided with a seventh solder pin 51, and the other end of the positive power supply 5 is provided with a third elastic arm 52. The seventh solder pin 51 is bent into a Z-shaped vertical structure, and the third elastic arm 52 is bent into an inverted L-shape. Specifically, the positive power supply 5 is usually a Vbus line, which is marked in white or blue and is connected to the positive terminal of the power supply. The seventh solder pin 51 is bent into a Z-shaped vertical structure to facilitate soldering and fixing to the PCB board, and the third elastic arm 52 is bent into an inverted L-shape to improve the connection strength.

[0040] like Figures 1 to 4 As shown, this utility model discloses a high-speed connector with a single row of SMT solder pads. The connector utilizes the single row of SMT solder pads described above, including a housing 9 and a plastic body 10 disposed within the housing 9. The single row of SMT solder pads is disposed within the plastic body 10. The plastic body 10 is provided with protrusions 101, which protrude from the outer wall of the plastic body 10. The outer wall of the housing 9 is provided with grooves 91 for accommodating the protrusions 101. Specifically, the protrusions 101 and grooves 91 define the positions of the protrusions, reducing positional misalignment and increasing the mating retention force between the plastic body 10 and the housing 9. This helps improve connection stability and enhances the performance and lifespan of the high-speed connector.

[0041] In this embodiment, the housing 9 is provided with multiple spring tabs 92, which are arranged around the circumference of the housing 9 to allow them to contact or disengage from the outer wall of the plastic body 10. Specifically, the spring tabs 92 located around the perimeter of the housing 9 protrude into the housing 9, increasing the contact area and thus enabling the installation and disassembly of the plastic body 10 and the housing 9 without the need for auxiliary tools, making the operation simple and convenient.

[0042] In this embodiment, the front end of the plastic body 10 is provided with a cavity 102, and the end of the cavity 102 is provided with a snap-fit ​​hole 103. The number of snap-fit ​​holes 103 is provided in multiples, and the multiple snap-fit ​​holes 103 are arranged at intervals along the length direction of the cavity 102. The first connecting end 83, the second connecting end 12, and the third connecting end 22 are respectively accommodated in the multiple snap-fit ​​holes 103. The cavity 102 is provided with a locking groove 104. The number of locking grooves 104 is provided in multiples, and the multiple locking grooves 104 are arranged at intervals along the length direction of the cavity 102. The first elastic arm 32, the second elastic arm 42, and the third elastic arm 52 are respectively accommodated in the multiple locking grooves 104. Specifically, the cavity 102 protrudes from the front end of the plastic body 10 to facilitate the insertion and assembly of a single row of SMT solder pads within the cavity 102. When the first connecting end 83, the second connecting end 12, and the third connecting end 22 are respectively accommodated in multiple snap-fit ​​holes 103, and the first elastic arm 32, the second elastic arm 42, and the third elastic arm 52 are respectively accommodated in multiple engagement slots 104, the receiving data terminal 1, the receiving data terminal 2, and the data transmission terminal 3 can be installed on the plastic body 10 with stable and reliable connection, and are not easily loosened or detached. The first grounding terminal 6 and the second grounding terminal 7 are connected to both sides of the plastic body 10, which can provide good grounding and shielding for the plastic body 10.

[0043] The top of the plastic body 10 is provided with a connection hole (not shown). There are multiple connection holes, which are arranged at intervals along the length of the plastic body 10, so that the first welding leg 81, the second welding leg 82, the third welding leg 11, the fourth welding leg 21, the fifth welding leg 31, the sixth welding leg 41, and the seventh welding leg 51 can be connected to the multiple connection holes respectively, thereby fixing the position of each welding leg on the plastic body 10 and ensuring high connection stability.

[0044] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A single-row SMT solder pad, characterized in that: The device includes a receiving data terminal, a transmitting data terminal spaced apart from the receiving data terminal, a data transmission terminal disposed between the receiving data terminal and the transmitting data terminal, a negative power supply terminal disposed between the receiving data terminal and the data transmission terminal, and a positive power supply terminal disposed between the transmitting data terminal and the data transmission terminal. A first grounding terminal is disposed on the side of the receiving data terminal away from the negative power supply terminal, and a second grounding terminal is disposed on the side of the transmitting data terminal away from the positive power supply terminal. A ground pin is disposed between the receiving data terminal and the transmitting data terminal, and the ground pin is located outside the data transmission terminal. The number of receiving data terminals is at least one pair, the number of transmitting data terminals is at least one pair, and the number of data transmission terminals is at least one pair.

2. The single-row SMT solder pads according to claim 1, characterized in that: The ground pin includes a first solder pin, a second solder pin spaced apart from the first solder pin, and a first connection terminal integrally formed with the first solder pin and the second solder pin. The first solder pin and the second solder pin have a Z-shaped vertical structure, and the first solder pin, the second solder pin and the first connection terminal form a Y-shaped fork structure. The data transmission terminal is located between the first solder pin and the second solder pin to isolate the data transmission terminal from the data receiving terminal and the data sending terminal.

3. A single-row SMT solder pad as described in claim 1, characterized in that: One end of the receiving data terminal is provided with a third solder foot, and the other end of the receiving data terminal is provided with a second connection end. The third solder foot is bent into a Z-shaped vertical structure, and the second connection end is bent into an inverted L-shape.

4. A single-row SMT solder pad as described in claim 1, characterized in that: One end of the data transmission terminal is provided with a fourth solder foot, and the other end of the data transmission terminal is provided with a third connection end. The fourth solder foot is bent into a Z-shaped vertical structure, and the third connection end is bent into an inverted L-shape.

5. A single-row SMT solder pad as described in claim 1, characterized in that: One end of the data transmission terminal is provided with a fifth solder foot, and the other end of the data transmission terminal is provided with a first elastic arm. The fifth solder foot is bent into a Z-shaped vertical structure, and the first elastic arm is bent into an inverted L-shape.

6. A single-row SMT solder pad as described in claim 1, characterized in that: One end of the negative terminal of the power supply is provided with a sixth soldering foot, and the other end of the negative terminal of the power supply is provided with a second elastic arm. The sixth soldering foot is bent into a Z-shaped vertical structure, and the second elastic arm is bent into an inverted L-shape.

7. A single-row SMT solder pad as described in claim 1, characterized in that: One end of the positive terminal of the power supply is provided with a seventh soldering foot, and the other end of the positive terminal of the power supply is provided with a third elastic arm. The seventh soldering foot is bent into a Z-shaped vertical structure, and the third elastic arm is bent into an inverted L-shape.

8. A high-speed connector with a single row of SMT solder pads, using a single row of SMT solder pads as described in any one of claims 1 to 7, characterized in that: The device includes a housing and a plastic body disposed on the housing. The single row of SMT solder pads is disposed on the plastic body. The plastic body is provided with protrusions that protrude from the outer wall of the plastic body. The outer wall of the housing is provided with grooves for accommodating the protrusions.

9. A high-speed connector with a single row of SMT solder pads according to claim 8, characterized in that: The housing is provided with multiple springs arranged around the circumference of the housing so that the multiple springs abut against or detach from the outer wall of the plastic body.

10. A high-speed connector with a single row of SMT solder pads according to claim 8, characterized in that: The front end of the plastic body is provided with a cavity, and the end of the cavity is provided with a snap-fit ​​hole. The number of snap-fit ​​holes is provided in multiples, and the multiple snap-fit ​​holes are arranged at intervals along the length of the cavity. The first connecting end, the second connecting end, and the third connecting end are respectively accommodated in the multiple snap-fit ​​holes. The cavity is provided with a snap-fit ​​groove. The number of snap-fit ​​grooves is provided in multiples, and the multiple snap-fit ​​grooves are arranged at intervals along the length of the cavity. The first elastic arm, the second elastic arm, and the third elastic arm are respectively accommodated in the multiple snap-fit ​​grooves.

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