A high-temperature constant-temperature anti-vibration crystal resonator of SM1 type

Abstract

The utility model relates to piezoelectric quartz crystal technical field discloses a kind of SM1 type high-temperature constant temperature anti-vibration crystal resonator, including vibrator, conductive glue, wafer, pedestal group and cover plate, the conductive glue is set in the four corners of pedestal group upper surface, the wafer is fixed in the center of pedestal group upper surface, two corresponding surfaces of wafer upper surface are provided with gold film, the vibrator is composed of wafer and gold film, and vibrator is installed in the upper end of pedestal group, the rim of pedestal group upper surface is provided with cover plate. In the utility model, by adopting four-point dispensing structure, the firmness of element is ensured, processing technology is serialized, product consistency is good, it is ensured that crystal resonator can work stably under the condition of severe test requirement, realize the new technology of new design of crystal resonator plating layer, small volume, temperature stability is good, low aging rate, strong anti-vibration and other advantages are realized.

Description

Technical Field

[0001] This utility model relates to the field of piezoelectric quartz crystal technology, and in particular to an SM1 type high-temperature constant temperature anti-vibration crystal resonator. Background Technology

[0002] Existing crystal resonators all use a single metal film process, which has drawbacks for crystal oscillators with special requirements for phase noise. The phase noise is poor under vibration and cannot meet the requirements of temperature stability and low aging rate under vibration. Based on these special usage requirements, those skilled in the art have provided an SM1 type high-temperature isothermal vibration-resistant crystal resonator. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing an SM1 type high-temperature isothermal anti-vibration crystal resonator. This crystal resonator adopts a vacuum resistance welding packaging structure. It mainly achieves high resistance and low g-sensitivity by calculating the wafer size design, selecting the optimal design size, calculating the best matching coating area, and determining the optimal glue dot position of the coating area. Then, it uses an isothermal fine-tuning method to adjust the frequency difference at the inflection point, and finally eliminates stress through a high-temperature annealing process to achieve stress balance. This results in the product having the advantages of good frequency stability, small size, good temperature stability, low aging rate, and strong vibration resistance.

[0004] To achieve the above objectives, the present invention provides the following technical solution: An SM1 type high-temperature constant temperature anti-vibration crystal resonator includes an oscillator, conductive adhesive, a wafer, a base assembly, and a cover plate. The conductive adhesive is disposed at the four corners of the upper surface of the base assembly. The wafer is fixed at the center of the upper surface of the base assembly. Two corresponding surfaces of the upper surface of the wafer are provided with gold films. The oscillator is composed of a wafer and gold films and is mounted on the upper end of the base assembly. A cover plate is provided at the edge of the upper surface of the base assembly. The above technical solution, by adopting a four-point dispensing structure, ensures the robustness of the components, standardizes the processing technology, and ensures good product consistency, thereby ensuring that the crystal resonator can work stably under harsh testing conditions.

[0005] Furthermore, the wafer is a thin slice cut from a quartz crystal using a double-angle cut, and the diameter of the wafer after resizing is 6.2 mm.

[0006] Furthermore, the crystal resonator employs a vacuum resistance soldering type package.

[0007] Furthermore, the wafer is a thin slice cut from a quartz crystal with a double-angle cut. After the wafer size is modified to Φ6.2, a metal film is deposited on its two corresponding surfaces through vacuum deposition to serve as electrodes, forming an oscillator. It is then installed on a base assembly, and conductive adhesive is applied to four platforms on the base assembly and cured at high temperature to form a resonator. Finally, a cover plate is attached for encapsulation.

[0008] This utility model has the following beneficial effects: 1. The SM1 type high-temperature constant temperature anti-vibration crystal resonator proposed in this utility model adopts a four-point dispensing structure to ensure the component's firmness, serialize the processing technology, and ensure good product consistency. It ensures that the crystal resonator can work stably under harsh test conditions, making it a key core component for key projects and also widely applicable to communications, navigation, and broadcasting. It realizes a new process for the coating design of crystal resonators, achieving advantages such as small size, good temperature stability, low aging rate, and strong vibration resistance. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the structure of an SM1 type high-temperature isothermal anti-vibration crystal resonator proposed in this utility model; Figure 2 This is a top view of an SM1 type high-temperature isothermal anti-vibration crystal resonator proposed in this utility model; Figure 3 This is a schematic diagram of the resonator structure in the SM1 type high-temperature constant temperature anti-vibration crystal resonator proposed in this utility model.

[0010] Legend: 1. Oscillator; 2. Conductive adhesive; 3. Chip; 4. Base assembly; 5. Cover plate; 6. Gold film. Detailed Implementation

[0011] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of specific embodiments. Obviously, the described specific embodiments are only a part of the specific embodiments of the present invention, and not all of them. Based on the specific embodiments of the present invention, all other specific embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0012] One specific embodiment of this utility model is provided: An SM1 type high-temperature constant temperature anti-vibration crystal resonator includes an oscillator 1, conductive adhesive 2, a wafer 3, a base assembly 4, and a cover plate 5. The conductive adhesive 2 is disposed at the four corners of the upper surface of the base assembly 4. The wafer 3 is fixed at the center of the upper surface of the base assembly 4. Two corresponding surfaces of the upper surface of the wafer 3 are provided with gold films 6. The oscillator 1 is composed of the wafer 3 and the gold films 6, and the oscillator 1 is installed at the upper end of the base assembly 4. The cover plate 5 is provided at the edge of the upper surface of the base assembly 4. By adopting a four-point dispensing structure, the robustness of the components is ensured, the processing technology is standardized, and the product consistency is good, ensuring that the crystal resonator can work stably under harsh testing conditions.

[0013] The wafer 3 is a thin slice cut from a quartz crystal with a double-corner cut. After being resized, the diameter of the wafer 3 is 6.2mm. The crystal resonator is packaged using vacuum resistance welding. The wafer 3 is a thin slice cut from a quartz crystal with a double-corner cut. After being resized, the wafer 3 is Φ6.2. Metal films are deposited on its two corresponding surfaces through vacuum deposition to form electrodes, forming the oscillator 1. It is installed on the base assembly 4. Conductive adhesive 2 is applied to the four platforms on the base assembly 4 and cured at high temperature to form the resonator. The cover plate 5 is then attached for encapsulation.

[0014] The oscillator 1 is formed by depositing metal electrodes onto a double-corner cut crystal 3 through vacuum deposition. The oscillator 1 is fixed to the base assembly 4 using a four-point application of conductive adhesive 2, which helps the crystal resonator withstand more stringent tests. After fixing, the cover plate 5 is attached for encapsulation. The crystal 3 has a size of Φ6.2, and the gold film 6 is the metal film. The crystal 3 is a thin slice cut from a quartz crystal with a double-corner cut. After resizing the crystal 3 to Φ6.2, metal films are deposited on its two corresponding surfaces as electrodes to form the oscillator 1, which is then mounted onto the base assembly 4. Conductive adhesive 2 is applied to all four corners and cured at high temperature to form a resonator. The resonator is then fine-tuned by a fine-tuning machine to deposit another layer of gold film 6 to achieve the nominal frequency. Finally, the cover plate 5 is attached for encapsulation, thus constituting the crystal resonator of this embodiment. The following points should be noted in this article: 1. The accompanying drawings of the embodiments disclosed herein only relate to the structures involved in the embodiments disclosed herein; other structures can be referred to in general design.

[0015] 2. Where there is no conflict, the embodiments of this disclosure and the features thereof can be combined with each other to obtain new embodiments. In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. The specific meaning of the above terms in this utility model shall be understood by those skilled in the art based on the specific circumstances. In addition, unless otherwise stated, "multiple" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and should not be construed as a limitation on this utility model; the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0016] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing specific embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A type SM1 high-temperature isothermal anti-vibration crystal resonator, comprising an oscillator (1), conductive adhesive (2), a crystal wafer (3), a base assembly (4), and a cover plate (5), characterized in that: The conductive adhesive (2) is disposed at the four corners of the upper surface of the base assembly (4), the wafer (3) is fixed at the center of the upper surface of the base assembly (4), and gold film (6) is disposed on two corresponding surfaces of the upper surface of the wafer (3). The oscillator (1) is composed of the wafer (3) and the gold film (6), and the oscillator (1) is installed at the upper end of the base assembly (4). A cover plate (5) is disposed at the edge of the upper surface of the base assembly (4).

2. The SM1 type high-temperature isothermal anti-vibration crystal resonator according to claim 1, characterized in that: The wafer (3) is a thin slice cut from a quartz crystal using a double-angle cut, and the diameter of the wafer (3) after resizing is 6.2 mm.

3. The SM1 type high-temperature isothermal anti-vibration crystal resonator according to claim 1, characterized in that: The crystal resonator is packaged using a vacuum resistance soldering method.

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