Electronic component and electronic device

Abstract

The utility model discloses an electronic assembly and electronic equipment relates to electronic surface mount field, and electronic assembly includes circuit board and electronic device, and circuit board is equipped with welding through -hole and pad, and electronic device is equipped with pin, and pin inserts and fixes in welding through -hole, and electronic assembly still includes the fixing piece of electronic device both sides, and fixing piece is board -like, and one end passes through the tin cream and pad fixed, and the other end and the side wall of electronic device are pasted, make two fixing pieces to electronic device produce the clamping force, to fix the position of electronic device relative to circuit board. Through pad and fixing piece, improved the connecting force between electronic device and circuit board, in the welding process, through the connection of fixing piece and tin cream, under the action of tension, electronic device is not easy to drop, increases the mounting mode of electronic device, and the design is more flexible.

Description

Technical Field

[0001] This utility model relates to the field of electronic surface mount technology, and in particular to an electronic component and electronic device. Background Technology

[0002] When mounting electronic components onto a PCB (Printed Circuit Board), solder paste is first applied to the first side of the PCB before the components are attached. The components are then passed through a reflow oven to secure them. The PCB is then flipped over, solder paste is applied to the second side, and the components are attached again. However, during the production process of attaching components to the second side, PIP (Pin-in-Paste) components on the first side are positioned downwards. Because these components have some weight, the solder paste on the first side melts during reflow. Without support or pulling force, the weight of the PIP components causes them to sink and fall off, resulting in defects. This leads to a limited mounting method and design difficulties for these components. Utility Model Content

[0003] The purpose of this invention is to provide an electronic component and electronic device that improves the connection between electronic devices and circuit boards by bonding pads to additional component leads using molten solder paste. During the soldering process, the connection between the fixing component and the solder paste makes the electronic device less likely to fall off under tension, increasing the mounting methods for electronic devices and making the design more flexible.

[0004] To solve the above-mentioned technical problems, this utility model provides an electronic component, which includes a circuit board and electronic devices. The circuit board has soldering through holes and pads, and the electronic devices have pins. The pins are inserted into and fixed in the soldering through holes. The electronic component also includes fixing members located on both sides of the electronic devices. The fixing members are plate-shaped, with one end fixed to the pads by solder paste and the other end abutting against the side wall of the electronic devices, so that the two fixing members generate a clamping force on the electronic devices to fix the position of the electronic devices relative to the circuit board.

[0005] On the other hand, the fastener includes a first plate and a second plate that are connected to each other, the first plate and the second plate are set at an angle, the first plate is fixed to the pad, and the second plate is attached to the side wall of the electronic device.

[0006] On the other hand, there is an arc transition between the first plate and the second plate.

[0007] On the other hand, the fastener is integrally molded.

[0008] On the other hand, the first board is the same size as the pad.

[0009] On the other hand, the number of the fasteners is equal to the number of the solder pads.

[0010] On the other hand, the fastener is a fastener with insulating function.

[0011] On the other hand, it also includes surface mount devices, which are fixed to the circuit board by solder paste.

[0012] On the other hand, the length of the pin is less than or equal to the thickness of the circuit board.

[0013] To solve the above-mentioned technical problems, this utility model also provides an electronic device, including the above-mentioned electronic components.

[0014] This utility model discloses an electronic component and electronic device, relating to the field of electronic surface mount technology (SMT). The electronic component includes a circuit board and electronic devices. The circuit board has soldering through holes and pads. The electronic devices have leads that are inserted into and fixed in the soldering through holes. The electronic component also includes fixing members located on both sides of the electronic devices. The fixing members are plate-shaped, with one end fixed by solder paste and pads, and the other end abutting against the side wall of the electronic device. The two fixing members exert a clamping force on the electronic device to fix its position relative to the circuit board. The pads and fixing members improve the connection between the electronic device and the circuit board. During soldering, the connection between the fixing members and the solder paste prevents the electronic device from falling off under the pulling force of the molten solder paste, increasing the bonding methods for the electronic devices and allowing for more flexible designs. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the prior art and embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A cross-sectional view of an electronic component provided by this utility model;

[0017] Figure 2 A schematic diagram of the structure of an electronic device provided by this utility model;

[0018] Figure 3 A schematic diagram of the structure of an electronic device provided by the prior art. Detailed Implementation

[0019] The core of this utility model is to provide an electronic component and electronic device. By using molten solder paste to bond the pads to the added component leads, the connection between the electronic device and the circuit board is improved. During the soldering process, the electronic device is not easy to fall off due to the connection between the fixing component and the solder paste and the pulling force of the molten solder paste. This increases the mounting methods of electronic devices and makes the design more flexible.

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] Figure 1 A cross-sectional view of an electronic component provided by this utility model. Figure 2 This is a schematic diagram of the structure of an electronic device provided by the present invention. The electronic assembly includes a circuit board 1 and an electronic device 2. The circuit board 1 is provided with soldering through holes 11 and solder pads 12. The electronic device 2 is provided with pins 21, which are inserted into and fixed in the soldering through holes 11. The electronic assembly also includes fixing members 22 located on both sides of the electronic device 2. The fixing members 22 are plate-shaped, with one end fixed by solder paste and solder pads 12, and the other end attached to the side wall of the electronic device 2, so that the two fixing members 22 generate a clamping force on the electronic device 2 to fix the position of the electronic device 2 relative to the circuit board 1.

[0022] PIP (PininPaste) is an advanced PCB soldering process that combines surface mount technology with through-hole mounting technology. It is also known as through-hole reflow soldering or immersion reflow soldering. First, solder paste is printed onto the soldering through-holes 11 and pads 12 of the circuit board 1 using methods such as screen printing. Then, the component leads 21 are inserted into the through-holes coated with solder paste. Finally, the circuit board 1 enters a reflow oven for heating. All the solder paste melts and forms liquid solder that adheres to the fixing components 22 and pads 12. After exiting the reflow oven, the solder solidifies, thus fixing the components and achieving electrical connections.

[0023] For PIP-type electronic components, if solder is injected directly into the solder holes, the pulling force provided by the solder in the solder holes is insufficient to hold the electronic component 2 when the circuit board 1 is flipped due to gravity. This causes the component to sink or fall off after passing through the reflow oven, resulting in defects. This leads to a limited mounting method for such components and makes design difficult.

[0024] Please refer to Figure 2 and Figure 3The improvement of this application is that both the circuit board 1 and the electronic device 2 have been improved. Therefore, it is necessary to add pads 12 to the circuit board 1. When the solder paste melts in the reflow oven, it has a pulling force to firmly bond the pads 12 and the electronic device 2 together. After curing, the electronic device 2 can increase the pulling force during the soldering process and will not fall off or tilt.

[0025] This utility model discloses an electronic component and an electronic device, relating to the field of electronic surface mount technology. The electronic component includes a circuit board 1 and an electronic device 2. The circuit board 1 has soldering through holes 11 and solder pads 12. The electronic device 2 has leads 21, which are inserted into and fixed in the soldering through holes 11. The electronic component also includes fixing members 22 located on both sides of the electronic device 2. The fixing members 22 are plate-shaped, with one end fixed by solder paste and the solder pads 12, and the other end attached to the side wall of the electronic device 2, so that the two fixing members 22 generate a clamping force on the electronic device 2 to fix the position of the electronic device 2 relative to the circuit board 1. Through the solder pads 12 and the fixing members 22, the connection between the electronic device 2 and the circuit board 1 is improved. During the soldering process, the electronic device 2 is not easy to fall off due to the connection between the fixing members 22 and the solder paste, which increases the mounting methods of the electronic device 2 and makes the design more flexible.

[0026] Based on the above embodiments:

[0027] In some embodiments, the fastener 22 includes a first plate 221 and a second plate 222 connected to each other. The first plate 221 and the second plate 222 are arranged at an angle. The first plate 221 is fixed to the pad 12, and the second plate 222 is attached to the sidewall of the electronic device 2.

[0028] By using a bending method, and with the bending angle adjustable depending on the space, the contact area between the first board 221 and the pad 12 can be increased. Similarly, the contact area between the second board 222 and the sidewall of the electronic device 2 can also be significantly increased, thereby ensuring a reliable guarantee for the relative position fixation of the electronic device 2.

[0029] In some embodiments, there is an arc transition between the first plate 221 and the second plate 222.

[0030] By using an arc-shaped transition, stress concentration is avoided, and accidental breakage at the connection point of the first plate 221 and the second plate 222 is prevented, thereby improving the reliability of use.

[0031] In some embodiments, the fastener 22 is integrally formed.

[0032] The structure is strong and reliable, extending its service life.

[0033] In some embodiments, the first plate 221 is the same size as the pad 12.

[0034] To save space on circuit board 1, if the dimensions of the first board 221 and the pad 12 are equal, the waste of space on circuit board 1 can be avoided. The number and types of components that can be accommodated within the limited space of circuit board 1 directly determine the functionality of the device. Saving space means that more components can be integrated on the same area of ​​circuit board 1, enabling more complex functions.

[0035] In some embodiments, the number of fasteners 22 is equal to the number of pads 12.

[0036] Since the fastener 22 and the pad 12 are connected in a one-to-one correspondence, they need to be of equal quantity. When the first plate 221 of the fastener 22 is connected to the pad 12, it can provide greater tensile force to prevent the electronic device 2 from falling off.

[0037] In some embodiments, the fastener 22 is a fastener 22 with an insulating function.

[0038] Adding pads 12 on both sides of the component. These pads 12 do not have an electrical function, that is, they can be understood as pads 12 with an insulating function. Therefore, adding pads 12 will not affect the normal function of the circuit board 1, thus avoiding the impact on other circuits of the circuit board 1 and causing functional failure after adding pads 12 with electrical functions.

[0039] In some embodiments, a surface mount device is also included, which is fixed to the circuit board 1 by solder paste.

[0040] Surface mount components (SMTs) on circuit board 1 refer to electronic components mounted on the surface of printed circuit board 1 using surface mount technology. They have advantages such as small size, light weight, and suitability for automated production. The following are some common SMT components: resistors, capacitors, inductors, diodes, transistors, integrated circuits, optoelectronic devices, and ferrite beads—all relatively lightweight and small-sized devices.

[0041] For lightweight surface mount devices, they are directly placed on the solder paste. After the solder paste is reflowed at high temperature, they are fixed on the solder paste. When the circuit board 1 is flipped, because the solder paste is lightweight, the pulling force of the solder paste is greater than the mass of the surface mount device 3. Therefore, the surface mount device can be fixed by the solder paste.

[0042] Soldering of surface mount components relies on solder paste pre-printed on circuit board 1. The solder paste melts during high-temperature reflow soldering and, upon cooling, forms solder joints, achieving electrical conductivity and mechanical fixation between the pins 21 and circuit board 1. For most conventional surface mount components, each pin 21 corresponds to an independent pad 12 on circuit board 1. Solder paste is pre-printed on these pads 12, and the pins 21 are soldered to the pads 12 to form a one-to-one connection. For example, the two pins 21 of a surface mount resistor correspond to two independent pads 12 on circuit board 1, respectively. Solder paste is printed on the pads 12, and after soldering, each pin 21 is connected to its corresponding pad 12 via a solder joint. Regardless of the number or distribution of the component's pins 21, each conductive pin 21 must be soldered to its corresponding pad 12 on circuit board 1 using solder paste to ensure electrical conductivity; simultaneously, the solder joints must provide sufficient mechanical strength to prevent the component from detaching.

[0043] In some embodiments, the length of pin 21 is less than or equal to the thickness of circuit board 1.

[0044] Pin 21 is smaller than the thickness of circuit board 1 and does not protrude from the other side of circuit board 1. This way, when the second side of circuit board 1 is printed, the protruding pin will not push up the stencil and cause the solder paste to be unable to be printed.

[0045] This application also provides an electronic device including the electronic components described above.

[0046] The description of the electronic device provided in this application is based on the above embodiments and will not be repeated here.

[0047] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0048] It should also be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, article, or apparatus that includes said element.

[0049] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic component, characterized in that, The electronic component includes a circuit board and electronic devices. The circuit board has soldering through holes and pads. The electronic devices have pins that are inserted into and fixed in the soldering through holes. The electronic component also includes fixing members located on both sides of the electronic devices. The fixing members are plate-shaped, with one end fixed to the pads by solder paste and the other end abutting against the side wall of the electronic devices, so that the two fixing members generate a clamping force on the electronic devices to fix the position of the electronic devices relative to the circuit board.

2. The electronic component according to claim 1, characterized in that, The fastener includes a first plate and a second plate that are connected to each other. The first plate and the second plate are set at an angle. The first plate is fixed to the pad, and the second plate is attached to the side wall of the electronic device.

3. The electronic component according to claim 2, characterized in that, The first plate and the second plate have an arc-shaped transition.

4. The electronic component according to claim 2, characterized in that, The fastener is integrally molded.

5. The electronic component according to claim 2, characterized in that, The first board has the same dimensions as the solder pad.

6. The electronic component according to claim 1, characterized in that, The number of the fasteners is equal to the number of the solder pads.

7. The electronic component according to claim 1, characterized in that, The fastener is a fastener with insulating function.

8. The electronic component according to claim 1, characterized in that, It also includes surface mount devices, which are fixed to the circuit board by solder paste.

9. The electronic component according to any one of claims 1 to 8, characterized in that, The length of the pin is less than or equal to the thickness of the circuit board.

10. An electronic device, characterized in that, Includes the electronic components as described in any one of claims 1 to 9.

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