Power supply backplane assembly, power supply integrated system and server
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HUNTKEY ELECTRIC
- Filing Date
- 2025-07-22
- Publication Date
- 2026-08-07
AI Technical Summary
[0004]本申请实施例的目的在于提供一种电源背板组件、电源集成系统及服务器，以解决现有技术中存在的电源背板组件整体厚度较厚的技术问题
[0015] The beneficial effects of the power backplane assembly, power integration system, and server provided in this application are as follows: Compared with the prior art, the power backplane assembly of this application is stacked and combined by output circuit boards, input circuit boards, and control circuit boards. The first row of pins, the second row of pins, the third row of pins, the fourth row of pins, the adapter pins, and the busbars can play both electrical and mechanical connection roles, so that the first row of pins, the second row of pins, the third row of pins, the fourth row of pins, the adapter pins, and the busbars are fully utilized. The power backplane assembly has a reasonable layout and is easy to assemble, effectively reducing the number of parts in the power backplane assembly. This helps to reduce the overall thickness of the power backplane assembly in the stacking direction, reduce the space occupied by the power backplane assembly in the power socket, and thus achieve the purpose of reducing the overall thickness of the power socket and realizing the miniaturization of the power socket.
Smart Images
Figure CN224610993U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of electronic technology, and more specifically, relates to a power backplane assembly, a power integration system, and a server. Background Technology
[0002] With the rapid development of information technology, the demand for high-density servers is becoming increasingly urgent. To achieve higher integration and stronger performance while keeping the overall server size constant, it is necessary to minimize the size of internal components. Among these, the power supply chassis, as a key component for powering the server system, is crucial for miniaturization. However, the size of the power supply units within the power supply chassis is relatively fixed and difficult to modify significantly. Therefore, optimizing the power backplane assembly within the power supply chassis has become an important way to reduce the size of the power supply chassis.
[0003] Currently, the traditional power backplane assembly has an unreasonable structural layout. When assembling the assembly, the functional circuit boards are electrically connected through conductive parts. Additional components are required to fix each functional circuit board, resulting in a large number of components in the power backplane assembly, which takes up a lot of space and thus makes the overall thickness of the power backplane assembly relatively thick. Utility Model Content
[0004] The purpose of this application is to provide a power backplane assembly, a power integration system, and a server to solve the technical problem of the excessive thickness of the power backplane assembly in the prior art.
[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: A first aspect provides a power supply backplane assembly, comprising: an input circuit board, a control circuit board, an output circuit board, an adapter pin header, and a busbar; the output circuit board, the input circuit board, and the control circuit board are stacked sequentially and spaced apart; the input circuit board has a first pin header and a second pin header on its side facing the control circuit board, and the control circuit board has a third pin header on its side facing the input circuit board, which is inserted into the first pin header; the output circuit board has a fourth pin header on its side away from the input circuit board, corresponding to the position of the second pin header; the adapter pin header is inserted between the input circuit board and the output circuit board, and is electrically connected to the second pin header and the fourth pin header; both ends of the busbar are fixed to and electrically connected to the input circuit board and the output circuit board, respectively.
[0006] Optionally, the third row of pins is mounted on the control circuit board using surface mount technology.
[0007] Optionally, the first pin header is mounted on the input circuit board using through-hole mounting technology.
[0008] Optionally, the busbar is located on the same side of the input circuit board and the output circuit board, and one end of the busbar is soldered to a pad on the edge of the input circuit board, and the other end of the busbar is soldered to a pad on the edge of the output circuit board.
[0009] Optionally, the second pin header is mounted on the input circuit board using surface mount technology, the fourth pin header is mounted on the output circuit board using surface mount technology, and the two ends of the adapter pin header are respectively inserted into the input circuit board and the output circuit board.
[0010] Optionally, the power backplane assembly further includes a spacer post, the two ends of which are connected to the input circuit board and the output circuit board, respectively, and the spacer post is disposed opposite to the busbar.
[0011] Optionally, the spacer column is made of plastic.
[0012] Optionally, the input circuit board is provided with a first socket, the output circuit board is provided with a second socket, the two ends of the spacer post are respectively inserted into the first socket and the second socket, and both ends of the spacer post are provided with a buckle, one of the buckles is engaged on the side of the input circuit board away from the output circuit board, and the other buckle is engaged on the side of the output circuit board away from the input circuit board.
[0013] A second aspect of this application provides a power supply integrated system, including a power supply unit, a power supply frame, and a power supply backplane assembly as described in any one of the above claims, wherein the power supply backplane assembly and the power supply unit are both installed within the power supply frame.
[0014] A third aspect of this application provides a server, including the aforementioned power supply integrated system.
[0015] The beneficial effects of the power backplane assembly, power integration system, and server provided in this application are as follows: Compared with the prior art, the power backplane assembly of this application is stacked and combined by output circuit boards, input circuit boards, and control circuit boards. The first row of pins, the second row of pins, the third row of pins, the fourth row of pins, the adapter pins, and the busbars can play both electrical and mechanical connection roles, so that the first row of pins, the second row of pins, the third row of pins, the fourth row of pins, the adapter pins, and the busbars are fully utilized. The power backplane assembly has a reasonable layout and is easy to assemble, effectively reducing the number of parts in the power backplane assembly. This helps to reduce the overall thickness of the power backplane assembly in the stacking direction, reduce the space occupied by the power backplane assembly in the power socket, and thus achieve the purpose of reducing the overall thickness of the power socket and realizing the miniaturization of the power socket. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 A three-dimensional structural diagram of the power backplane assembly provided in the embodiments of this application. Figure 1 ;
[0018] Figure 2 A three-dimensional structural diagram of the power backplane assembly provided in the embodiments of this application. Figure 2 ;
[0019] Figure 3 A three-dimensional structural diagram of the power backplane assembly provided in the embodiments of this application. Figure 3 ;
[0020] Figure 4 This is an exploded view of the power backplane assembly provided in an embodiment of this application.
[0021] Figure 5 A three-dimensional structural schematic diagram of the input circuit board provided in an embodiment of this application;
[0022] Figure 6 A three-dimensional structural schematic diagram of the control circuit board provided in an embodiment of this application;
[0023] Figure 7 This is a three-dimensional structural diagram of the output circuit board provided in an embodiment of this application.
[0024] Explanation of key figure labels:
[0025] 10. Input circuit board; 11. First row of pins; 12. Second row of pins;
[0026] 20. Control circuit board; 21. Third row of pins;
[0027] 30. Output circuit board; 31. Fourth row of pins;
[0028] 40. Adapter pin header;
[0029] 50. Busbar;
[0030] 60. Spacer column. Detailed Implementation
[0031] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.
[0032] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0033] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0035] Please refer to the following: Figures 1 to 7 The power backplane assembly provided in the embodiments of this application will now be described.
[0036] Please refer to Figure 1 and Figure 4 The power supply backplane assembly includes an input circuit board 10, a control circuit board 20, an output circuit board 30, an adapter pin header 40, and a busbar 50. The output circuit board 30, the input circuit board 10, and the control circuit board 20 are stacked sequentially and spaced apart. The side of the input circuit board 10 facing the control circuit board 20 has a first pin header 11 and a second pin header 12. The side of the control circuit board 20 facing the input circuit board 10 has a third pin header 21 that is inserted into the first pin header 11. The side of the output circuit board 30 away from the input circuit board 10 has a fourth pin header 31 that corresponds to the position of the second pin header 12. The adapter pin header 40 is inserted between the input circuit board 10 and the output circuit board 30 and is electrically connected to the second pin header 12 and the fourth pin header 31. The two ends of the busbar 50 are fixed to and electrically connected to the input circuit board 10 and the output circuit board 30, respectively.
[0037] Specifically, the first row of pins 11 on the input circuit board 10 is connected to the third row of pins 21 on the control circuit board 20, thereby achieving electrical connection between the input circuit board 10 and the control circuit board 20, enabling signal and power transmission between them. An adapter pin header 40 is inserted between the input circuit board 10 and the output circuit board 30, and is electrically connected to the second row of pins 12 and the fourth row of pins 31. The two ends of the busbar 50 are fixed and electrically connected to the input circuit board 10 and the output circuit board 30 respectively, achieving electrical connection between them, enabling signal and power transmission between them.
[0038] Compared with the prior art, the power backplane assembly provided in this application achieves a compact and reasonable overall structure by stacking and spacing the output circuit board 30, input circuit board 10, and control circuit board 20 sequentially, which helps to reduce the thickness of the power backplane assembly in the stacking direction. Electrical and mechanical connections between the input circuit board 10 and control circuit board 20 are achieved by inserting the first row of pins 11 on the input circuit board 10 into the third row of pins 21 on the control circuit board 20, while maintaining a spacing, eliminating the need for additional components to fix the input circuit board 10 and control circuit board 20. An adapter pin 40 is inserted between the input circuit board 10 and the output circuit board 30 and electrically connected to the second row of pins 12 and the fourth row of pins 31. The busbar 50 is fixed and electrically connected to both the input circuit board 10 and the output circuit board 30 at both ends, achieving electrical and mechanical connections between the input circuit board 10 and the control circuit board 20 while maintaining a spacing, thus eliminating or reducing the need for components to fix the input circuit board 10 and control circuit board 20. Thus, the power backplane assembly of this application is stacked and combined using the output circuit board 30, the input circuit board 10, and the control circuit board 20. The first pin header 11, the second pin header 12, the third pin header 21, the fourth pin header 31, the adapter pin header 40, and the busbar 50 serve both electrical and mechanical connection functions, making full use of these components. This power backplane assembly has a reasonable layout, is easy to assemble, and effectively reduces the number of components, thereby reducing the overall thickness of the power backplane assembly in the stacking direction and minimizing the space occupied by the power backplane assembly within the power socket, ultimately achieving the goal of reducing the overall thickness of the power socket and miniaturizing the power socket. For example, compared to existing power sockets, the overall thickness of the power socket using the power backplane assembly of this application can be reduced by approximately 40mm.
[0039] In one embodiment of this application, please refer to Figure 3 and Figure 6 The third row of pins 21 is mounted on the control circuit board 20 using surface mount technology (SMT). Since the other pins on the control circuit board 20 also use surface mount technology, the third row of pins 21 also uses surface mount technology. Thus, the pins on the control circuit board 20 can be soldered in a single reflow soldering process, which helps reduce the number of processing steps on the control circuit board 20, thereby improving the processing efficiency of the control circuit board 20 and reducing manufacturing costs.
[0040] In one embodiment of this application, please refer to Figure 4 and Figure 5 The first row of pins 11 is mounted on the input circuit board 10 using through-hole technology (THT). This through-hole mounting allows the first row of pins 11 to mate with the second row of pins 12. Furthermore, since other pins on the input circuit board 10 also use through-hole mounting, the use of this technology for the first row of pins 11 reduces the number of processing steps required for the input circuit board 10.
[0041] It should be noted that the number of the first row of pins 11 and the third row of pins 21 is not limited, and is determined according to the needs of electrical connection, mechanical connection or testing. Specifically, the number of the first row of pins 11 and the third row of pins 21 depends on the number of signal lines, such as how many interfaces need to be connected, or the number of power pins. In addition, mechanical strength must also be considered. For example, if the input circuit board 10 and the control circuit board 20 are large, more first row of pins 11 and third row of pins 21 are needed for fixation.
[0042] Please see Figure 5 and Figure 6 Optionally, the number of first row pins 11 is two, and the two first row pins 11 are arranged relatively alternately. The number of third row pins 21 is equal to the number of first row pins 11, that is, there are also two third row pins 21, and the two first row pins 11 are respectively inserted into the two third row pins 21 in a one-to-one correspondence. By using at least two first row pins 11 to be respectively inserted into at least two third row pins 21 in a one-to-one correspondence, it is beneficial to improve the stability of the electrical and mechanical connection between the input circuit board 10 and the control circuit board 20.
[0043] In one embodiment of this application, please refer to Figure 1 , Figure 5 and Figure 7The second row of pins 12 is surface-mount mounted on the input circuit board 10, and the fourth row of pins 31 is surface-mount mounted on the output circuit board 30. The two ends of the adapter pin 40 are inserted into the input circuit board 10 and the output circuit board 30, respectively. Specifically, one end of the adapter pin 40 is inserted into the input circuit board 10 at the position corresponding to the second row of pins 12, achieving electrical contact between the adapter pin 40 and the second row of pins 12. The other end of the adapter pin 40 is inserted into the output circuit board 30 at the position corresponding to the fourth row of pins 31, achieving electrical contact between the adapter pin 40 and the fourth row of pins 31, thereby achieving an electrical connection between the second row of pins 12 and the fourth row of pins 31.
[0044] Since the other pin headers on the output circuit board 30 also use surface mount technology, the fourth pin header 31 also uses surface mount technology. Therefore, the pin headers on the output circuit board 30 can be soldered in a single reflow soldering process, which helps reduce the processing steps of the output circuit board 30, thereby improving processing efficiency and reducing manufacturing costs. The second pin header 12 is surface mounted on the output circuit board 30, and the two ends of the adapter pin header 40 are inserted into the input circuit board 10 and the output circuit board 30 respectively, to achieve electrical connection between the second pin header 12 and the fourth pin header 31, which improves the ease of assembly between the input circuit board 10 and the output circuit board 30.
[0045] Optionally, please refer to Figures 2 to 4 Busbar 50 is located on the same side of the input circuit board 10 and the output circuit board 30. One end of busbar 50 is connected to one side edge of the input circuit board 10, and the other end of busbar 50 is connected to one side edge of the output circuit board 30. For example, one end of busbar 50 is soldered to a pad on the edge of the input circuit board 10, and the other end of busbar 50 is soldered to a pad on the edge of the output circuit board 30.
[0046] It should be noted that there is no limit to the number of busbars 50. The number of busbars 50 is determined based on actual usage requirements, such as the number of power supply lines and the number of electrical modules requiring independent power supply. Optionally, the number of busbars 50 can be three.
[0047] In one embodiment of this application, please refer to Figure 1 , Figure 3 and Figure 4 The power supply backplane assembly also includes a spacer post 60, with its two ends connected to the input circuit board 10 and the output circuit board 30, respectively, and the spacer post 60 is positioned opposite to the busbar 50. Specifically, the spacer post 60 is positioned opposite to the busbar 50 such that the busbar 50 is connected to one edge of the input circuit board 10 and the output circuit board 30, while the spacer post 60 is connected to the other edge of the input circuit board 10 and the output circuit board 30 relative to the busbar 50.
[0048] The input circuit board 10 and the output circuit board 30 are connected by the spacer 60 and the busbar 50, which helps to strengthen the stability of the connection between the input circuit board 10 and the output circuit board 30 and keep the distance between the input circuit board 10 and the output circuit board 30 stable.
[0049] It should be noted that the number of spacers 60 is not limited; the number of spacers 60 is determined based on actual usage requirements. Specifically, the number of spacers 60 depends on the size or stress points of the input circuit board 10 and the output circuit board 30. For example, the larger the size of the input circuit board 10 and the output circuit board 30, the more spacers 60 are required. Optionally, the number of spacers 60 is two.
[0050] In one embodiment of this application, please refer to Figure 3 and Figure 4 The input circuit board 10 has a first socket, and the output circuit board 30 has a second socket. The two ends of a spacer post 60 are respectively inserted into the first and second sockets. Each end of the spacer post 60 has a latch; one latch is engaged with the side of the input circuit board 10 opposite to the output circuit board 30, and the other latch is engaged with the side of the output circuit board 30 opposite to the input circuit board 10. After the two ends of the spacer post 60 are inserted into the first and second sockets, the latches at both ends of the spacer post 60 are engaged with the input circuit board 10 and the output circuit board 30 respectively, effectively preventing the spacer post 60 from detaching from both circuit boards, thus effectively avoiding any loosening between the input circuit board 10 and the output circuit board 30.
[0051] Optionally, the spacer 60 is made of plastic, and the snap fasteners of the spacer can undergo slight elastic deformation, so that one snap fastener can pass through the first socket from the side of the input circuit board 10 toward the output circuit board 30 to the side of the input circuit board 10 away from the output circuit board 30, and the other snap fastener can pass through the second socket from the side of the output circuit board 30 toward the input circuit board 10 to the side of the output circuit board 30 away from the input circuit board 10.
[0052] This application also provides a power supply integration system, which includes a power supply unit, a power supply frame, and a power supply backplane assembly of any of the above embodiments, wherein the power supply backplane assembly and the power supply unit are both installed within the power supply frame.
[0053] The power supply integrated system provided in this application adopts the aforementioned power supply backplane assembly. The power supply backplane assembly is stacked and combined through an output circuit board 30, an input circuit board 10, and a control circuit board 20. The first row of pins 11, the second row of pins 12, the third row of pins 21, the fourth row of pins 31, the adapter pins 40, and the busbar 50 serve both electrical and mechanical connection functions, making full use of the first row of pins 11, the second row of pins 12, the third row of pins 21, the fourth row of pins 31, the adapter pins 40, and the busbar 50. The power supply backplane assembly has a reasonable layout and is easy to assemble, effectively reducing the number of components in the power supply backplane assembly. This helps to reduce the overall thickness of the power supply backplane assembly in the stacking direction, reduce the space occupied by the power supply backplane assembly in the power supply frame, and thus achieve the purpose of reducing the overall thickness of the power supply frame and realizing the miniaturization of the power supply frame.
[0054] This application also provides a server that employs the aforementioned power integration system. The power integration system includes a power unit, a power frame, and a power backplane assembly according to any of the above embodiments. Both the power backplane assembly and the power unit are installed within the power frame. The power backplane assembly is stacked and combined via an output circuit board 30, an input circuit board 10, and a control circuit board 20. The first pin header 11, the second pin header 12, the third pin header 21, the fourth pin header 31, the adapter pin header 40, and the busbar 50 serve both electrical and mechanical connection functions, ensuring full utilization of the first pin header 11, the second pin header 12, the third pin header 21, the fourth pin header 31, the adapter pin header 40, and the busbar 50. This power backplane assembly has a reasonable layout and is easy to assemble, effectively reducing the number of components in the power backplane assembly. This helps to reduce the overall thickness of the power backplane assembly in the stacking direction, reducing the space occupied by the power backplane assembly within the power socket, thereby achieving the goal of reducing the overall thickness of the power socket and realizing the miniaturization of the power socket.
[0055] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A power supply backplane assembly, characterized in that, include: The circuit includes an input circuit board, a control circuit board, an output circuit board, an adapter pin header, and a busbar. The output circuit board, the input circuit board, and the control circuit board are stacked sequentially and spaced apart. The side of the input circuit board facing the control circuit board has a first pin header and a second pin header, and the side of the control circuit board facing the input circuit board has a third pin header that connects to the first pin header. The side of the output circuit board away from the input circuit board has a fourth pin header corresponding to the position of the second pin header. The adapter pin header is inserted between the input circuit board and the output circuit board and is electrically connected to the second pin header and the fourth pin header. The two ends of the busbar are fixed and electrically connected to the input circuit board and the output circuit board, respectively.
2. The power supply backplane assembly as described in claim 1, characterized in that: The third row of pins is mounted on the control circuit board using surface mount technology.
3. The power supply backplane assembly as described in claim 2, characterized in that: The first row of pins is mounted on the input circuit board using through-hole mounting technology.
4. The power supply backplane assembly as claimed in claim 1, characterized in that: The busbar is located on the same side of the input circuit board and the output circuit board, with one end of the busbar soldered to a pad on the edge of the input circuit board and the other end of the busbar soldered to a pad on the edge of the output circuit board.
5. The power supply backplane assembly as claimed in claim 1, characterized in that: The second row of pins is mounted on the input circuit board using surface mount technology, and the fourth row of pins is mounted on the output circuit board using surface mount technology. The two ends of the adapter pins are respectively inserted into the input circuit board and the output circuit board.
6. The power backplane assembly as claimed in claim 1, characterized in that: The power backplane assembly also includes a spacer post, the two ends of which are connected to the input circuit board and the output circuit board, respectively, and the spacer post is disposed opposite to the busbar.
7. The power supply backplane assembly as claimed in claim 6, characterized in that: The spacer column is made of plastic.
8. The power supply backplane assembly as claimed in claim 6, characterized in that: The input circuit board has a first socket, and the output circuit board has a second socket. The two ends of the spacer post are respectively inserted into the first socket and the second socket. Both ends of the spacer post are provided with a buckle. One of the buckles is engaged on the side of the input circuit board away from the output circuit board, and the other buckle is engaged on the side of the output circuit board away from the input circuit board.
9. A power supply integrated system, characterized in that, It includes a power supply unit, a power supply frame, and a power supply backplane assembly as described in any one of claims 1-8, wherein the power supply backplane assembly and the power supply unit are both mounted within the power supply frame.
10. A server, characterized in that, include: The power supply integrated system as described in claim 9.