Leveling mechanism for die bonding of PCB board and PCB board processing production line

Abstract

The utility model discloses a kind of for the flattening mechanism and PCB board processing production line of PCB board fixed crystal, it is related to PCB board processing technical field.For the flattening mechanism of PCB board fixed crystal includes base, flattening carrier and flow fixture, base is equipped with operating position;Flattening carrier is movably arranged in base and below operating position, flattening carrier can be lifted relative to base to be close to or away from operating position, the side of flattening carrier towards operating position is equipped with a plurality of first protrusions, a plurality of first protrusions are spaced arrangement and consistent in height;Flow fixture is equipped with placing groove and the first avoidance hole being communicated with placing groove, each first protrusion is correspondingly provided with a first avoidance hole, the depth of avoidance hole is less than the height of first protrusion;In operating position, first protrusion penetrates corresponding first avoidance hole, to lift PCB board.The technical scheme provided by the utility model improves the flatness of PCB board, and then guarantees the fixed crystal precision of PCB board.

Description

Technical Field

[0001] This utility model relates to the field of PCB board processing technology, and in particular to a leveling mechanism for die bonding of PCB boards and a PCB board processing production line. Background Technology

[0002] In the PCB manufacturing process, die bonding is a critical step, which involves soldering the chip onto the PCB. During die bonding, the bottom surface of the chip must maintain a very high degree of coplanarity with the PCB to ensure the overall performance stability of the PCB. To achieve precise die bonding, the PCB needs to be leveled before the bonding process.

[0003] Currently, existing leveling mechanisms typically place the PCB board on a flow fixture to directly flatten it. However, if the flow fixture is unstable, it will affect the flatness of the PCB board, thus affecting the die bonding effect. Utility Model Content

[0004] The main purpose of this invention is to propose a leveling mechanism and a PCB board processing production line for die bonding of PCB boards, which aims to improve the flatness of PCB boards and thus ensure the die bonding accuracy of PCB boards.

[0005] To achieve the above objectives, the present invention proposes a leveling mechanism for die bonding of PCB boards, comprising:

[0006] The base has an operating position;

[0007] A leveling carrier, movably mounted on the base and located below the operating position, is capable of rising and falling relative to the base to move closer to or further away from the operating position. The leveling carrier has a plurality of first protrusions on the side facing the operating position, the plurality of first protrusions being spaced apart and of uniform height; and

[0008] A mobile fixture is provided with a placement groove and a first clearance hole communicating with the placement groove. Each first protrusion is provided with a first clearance hole, and the depth of the clearance hole is less than the height of the first protrusion.

[0009] At the operating position, the first protrusion passes through the corresponding first clearance hole to lift the PCB board.

[0010] In one embodiment, the leveling mechanism further includes:

[0011] An adsorption element is disposed on the leveling carrier, and the adsorption element is used to adsorb the PCB board.

[0012] In one embodiment, the adsorption element includes:

[0013] The suction cups are evenly distributed on the leveling carrier, and at least a portion of the first protrusion has mounting holes, with the suction cups disposed in the mounting holes; and

[0014] A vacuum chamber plate is attached to the side of the leveling carrier opposite to the operating position, and the vacuum chamber plate is connected to a plurality of the mounting holes.

[0015] In one embodiment, the leveling mechanism includes:

[0016] A pressure plate is provided on the base. The pressure plate has an opening for avoiding the PCB board. The pressure plate cooperates with the leveling carrier to squeeze the edge of the flow fixture.

[0017] In one embodiment, the flow fixture includes:

[0018] The supporting body is provided with the placement groove and the first clearance hole; and

[0019] An extension is provided around the outer periphery of the support body, and the pressure plate and the leveling carrier abut against opposite sides of the extension.

[0020] In one embodiment, the leveling carrier is further provided with a limiting part on the side facing the operating position, the limiting part being used to abut against the PCB board to restrict the movement of the PCB board.

[0021] In one embodiment, the limiting portion includes:

[0022] The leveling carrier has multiple second protrusions spaced apart on the side facing the operating position, and the flow fixture has multiple second clearance holes corresponding to these protrusions. The height of each of the second protrusions is less than the height of the first protrusion.

[0023] Friction pads are attached to the side of each of the second protrusions facing the operating position.

[0024] In one embodiment, the leveling mechanism further includes:

[0025] A magnetic suction plate is disposed on the side of the PCB board away from the flow fixture. The magnetic suction plate has multiple operating windows, which are used to avoid the die bonding points of the PCB board. The flow fixture has magnetic components, which are attracted to the magnetic suction plate to clamp the PCB board.

[0026] In one embodiment, the leveling mechanism further includes:

[0027] The conveyor belts are movably mounted on two opposite side walls of the base, and two conveyor belts are located on both sides of the operating position. The two ends of the flow fixture are respectively mounted on one of the conveyor belts, and the conveyor belts are used to transport the flow fixture to the operating position.

[0028] This utility model also proposes a PCB board processing production line, including a leveling mechanism as described in any of the above embodiments.

[0029] In the technical solution of this utility model, a base, a leveling carrier, and a flow fixture are provided in the leveling mechanism for die bonding of PCB board. The base has an operating position; the leveling carrier is movably disposed on the base and located below the operating position. The leveling carrier can be raised and lowered relative to the base to approach or move away from the operating position. The side of the leveling carrier facing the operating position has multiple first protrusions, which are spaced apart and have the same height. The flow fixture has a placement groove and a first clearance hole connected to the placement groove. Each first protrusion is provided with a first clearance hole, and the depth of the clearance hole is less than the height of the first protrusion. At the operating position, the first protrusion passes through the corresponding first clearance hole to lift the PCB board. Compared to existing leveling mechanisms that directly flatten PCBs on a flow fixture, this invention provides a leveling carrier with a first clearance hole. A first protrusion on the leveling carrier penetrates the clearance hole to lift the PCB, allowing it to leave the flow fixture. Multiple first protrusions of consistent height lift the PCB, achieving leveling and avoiding the influence of the flow fixture, thus improving the flatness of the PCB. Furthermore, during die bonding, the first protrusions maintain the lifted state, ensuring the die bonding accuracy of the PCB. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0031] Figure 1 A schematic diagram of an embodiment of the leveling mechanism for die bonding of PCB boards provided by this utility model;

[0032] Figure 2 for Figure 1 A partial exploded view of one embodiment;

[0033] Figure 3 for Figure 2 A schematic diagram of the structure of one embodiment of the flow fixture;

[0034] Figure 4 for Figure 2 A schematic diagram of one embodiment of a leveling vehicle;

[0035] Figure 5 for Figure 1 A partial cross-sectional view of one embodiment.

[0036] Explanation of icon numbers:

[0037] 100. Base; 110. Side panel; 120. Bottom plate;

[0038] 200. Leveling carrier; 210. First protrusion; 211. Mounting hole; 220. Second protrusion; 230. Moving block; 240. First power component; 250. Guide shaft;

[0039] 300. Movable fixture; 310. Support body; 311. First clearance hole; 312. Second clearance hole; 320. Extension;

[0040] 410. Vacuum chamber plate; 411. Chamber; 412. Groove;

[0041] 500, pressure plate; 510, opening;

[0042] 600. Magnetic chuck; 620. Operation window;

[0043] 710. Conveyor belt; 720. Second drive assembly;

[0044] 800, PCB board.

[0045] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0046] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0047] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0048] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0049] In the PCB manufacturing process, die bonding is a critical step, which involves soldering the chip onto the PCB. During die bonding, the bottom surface of the chip must maintain a very high degree of coplanarity with the PCB to ensure the overall performance stability of the PCB. To achieve precise die bonding, the PCB needs to be leveled before the bonding process.

[0050] Currently, existing leveling mechanisms typically place the PCB board on a flow fixture to directly flatten it. However, if the flow fixture is unstable, it will affect the flatness of the PCB board, thus affecting the die bonding effect.

[0051] This invention proposes a leveling mechanism and a PCB manufacturing line for die bonding of PCB boards, so as to improve the flatness of PCB boards and thus ensure the die bonding accuracy of PCB boards.

[0052] Please see Figure 1 and Figure 2 In one embodiment, the leveling mechanism for die bonding of a PCB board includes a base 100, a leveling carrier 200, and a moving fixture 300. The base 100 has an operating position. The leveling carrier 200 is movably disposed on the base 100 and located below the operating position. The leveling carrier 200 can be raised and lowered relative to the base 100 to approach or move away from the operating position. The side of the leveling carrier 200 facing the operating position has a plurality of first protrusions 210, which are spaced apart and have the same height. The moving fixture 300 has a placement groove and a first clearance hole 311 communicating with the placement groove. Each first protrusion 210 is provided with a corresponding first clearance hole 311, and the depth of the clearance hole is less than the height of the first protrusion 210. At the operating position, the first protrusion 210 passes through the corresponding first clearance hole 311 to lift the PCB board 800.

[0053] The leveling mechanism is used to level the PCB board 800 before die bonding to ensure the die bonding accuracy of the PCB board 800. The leveling mechanism is located at the die bonding station to level the PCB board 800 before die bonding and to ensure that the PCB board 800 is flat during die bonding. There are no restrictions on this.

[0054] The base 100 is used to provide support and mounting foundation for the leveling mechanism. In one embodiment, the base 100 includes two side plates 110 and a bottom plate 120, with the two side plates 110 arranged parallel to each other at opposite ends of the bottom plate 120, and the operating position located between the two side plates 110.

[0055] The leveling carrier 200 is used to level the PCB board 800. The leveling carrier 200 is vertically mounted between the two side plates 110 and located below the operating position. All the first protrusions 210 are evenly distributed on the side of the leveling carrier 200 facing the operating position. The number of the first protrusions 210 can be flexibly set according to the size of the PCB board 800 and actual needs. The shapes of all the first protrusions 210 can be different or the same, as long as the height of all the first protrusions 210 is the same; no limitation is imposed here. In one embodiment, the thickness of the leveling carrier 200 is greater than or equal to 7mm, excluding the height of the first protrusions 210, to ensure that the leveling carrier 200 is not easily deformed and has good flatness, so that the side of all the first protrusions 210 facing the operating position is always at the same horizontal plane, thereby ensuring the flatness of the PCB board 800 raised by the first protrusions 210.

[0056] In one embodiment, the leveling mechanism further includes four first drive components, which are located at the four corners of the leveling carrier 200. The four first drive components operate synchronously to simultaneously drive the leveling carrier 200 to rise and fall relative to the base 100. For details, please refer to... Figure 2 and Figure 5In one embodiment, a movable block 230 is fixed at each end of the leveling carrier 200 near the two side plates 110. The movable block 230 is located on the side of the leveling carrier 200 away from the operating position and extends parallel to the length direction of the leveling carrier 200. Guide holes are provided at both ends of the movable block 230 on the side away from the leveling carrier 200. Each first drive assembly includes a first power member 240 and a guide shaft 250. One end of the guide shaft 250 is located on the base plate 120, and the other end of the guide shaft 250 extends movably into the guide hole. The first power member 240 is located on the base plate 120, and the output shaft of the first power member 240 extends toward the movable block 230 and is connected to the movable block 230 through a floating joint. The extension and retraction of the power shaft drives the movable block 230 to rise and fall along the guide shaft 250 to move the leveling carrier 200 closer to or away from the operating position. The first power member 240 can be configured as a motor or cylinder, etc., without limitation. Of course, in other embodiments, the first driving component may be configured to be two or more, and no limitation is made here.

[0057] A flow fixture 300 is used to support a PCB board 800. In one embodiment, the flow fixture 300 has a recessed placement groove for placing the PCB board 800, and all first clearance holes 311 are provided through the bottom of the placement groove to communicate with it. The size and shape of the placement groove are flexibly designed to fit the size and shape of the PCB board 800 to prevent the PCB board 800 from moving within the placement groove. In one embodiment, the depth of the first clearance hole 311 is greater than or equal to 2 mm and less than 4 mm, and the height of the first protrusion 210 is greater than or equal to 3 mm and less than 6 mm. Specifically, in one embodiment, the depth of the first clearance hole 311 is 3 mm, and the height of the first protrusion 210 is 5 mm, to ensure that the placement groove has sufficient support while reducing the movement path of the first protrusion 210 to ensure work efficiency. Of course, in other embodiments, the depth of the first clearance hole 311 and the height of the first protrusion 210 can be flexibly set according to actual needs, as long as the height of the first protrusion 210 is greater than the depth of the first clearance hole 311; no limitation is imposed here. The shape of each first clearance hole 311 is set according to the shape of the corresponding first protrusion 210. As long as the inner diameter of the first clearance hole 311 is slightly larger than the outer diameter of the first protrusion 210, so that the first protrusion 210 can move in the first clearance hole 311, there are no restrictions.

[0058] Before die bonding, when the flow fixture 300 carrying the PCB board 800 reaches the operating position, the first power unit 240 drives the leveling carrier 200 to move towards the operating position, so that the first protrusion 210 passes through the corresponding first clearance hole 311. Since the height of the first protrusion 210 is greater than the depth of the first clearance hole 311, when the leveling carrier 200 abuts against the flow fixture 300, the first protrusion 210 can lift the PCB board 800 and move it away from the flow fixture 300. After the first protrusion 210 lifts the PCB board 800, the first power unit 240 stops running to keep the PCB board 800 stable, which facilitates the die bonding operation. During the die bonding process, the first protrusion 210 always lifts the PCB board 800 so that the PCB remains flat during die bonding. After the die bonding is completed, the first power unit 240 drives the leveling carrier 200 away from the operating position, so that the die-bonded PCB board 800 returns to the flow fixture 300.

[0059] In the technical solution of this utility model, a base 100, a leveling carrier 200, and a moving fixture 300 are provided in the leveling mechanism for die bonding of PCB board. The base 100 is provided with an operating position. The leveling carrier 200 is movably disposed on the base 100 and located below the operating position. The leveling carrier 200 can be raised and lowered relative to the base 100 to approach or move away from the operating position. The side of the leveling carrier 200 facing the operating position is provided with a plurality of first protrusions 210. The plurality of first protrusions 210 are arranged at intervals and have the same height. The moving fixture 300 is provided with a placement groove and a first clearance hole 311 communicating with the placement groove. Each first protrusion 210 is provided with a first clearance hole 311. The depth of the clearance hole is less than the height of the first protrusion 210. At the operating position, the first protrusion 210 passes through the corresponding first clearance hole 311 to lift the PCB board 800. Compared to existing leveling mechanisms that directly flatten the PCB board 800 on the flow fixture 300, the present invention provides a leveling carrier 200 with a first clearance hole 311 on the flow fixture 300. A first protrusion 210 on the leveling carrier 200 can penetrate the first clearance hole 311 to lift the PCB board 800, allowing the PCB board 800 to leave the flow fixture 300. By having multiple first protrusions 210 of consistent height lift the PCB board 800 together, the leveling of the PCB board 800 is achieved, avoiding the influence of the flow fixture 300 on the PCB board 800 and improving the flatness of the PCB board 800. Furthermore, during the die bonding process, the first protrusions 210 can maintain the state of lifting the PCB board 800, thereby ensuring the die bonding accuracy of the PCB board 800.

[0060] Please see Figure 2 and Figure 4 In one embodiment, the leveling mechanism further includes an adsorption element disposed on the leveling carrier 200, which is used to adsorb the PCB board 800.

[0061] Specifically, in one embodiment, the adsorption component includes a suction cup (not shown) and a vacuum chamber plate 410. The leveling carrier 200 has a plurality of suction cups evenly distributed thereon. At least a portion of the first protrusion 210 is provided with mounting holes 211, and the suction cups are disposed in the mounting holes 211. The vacuum chamber plate 410 is attached to the side of the leveling carrier 200 away from the operating position, and the vacuum chamber plate 410 is connected to the plurality of mounting holes 211.

[0062] The suction cup is positioned on a first protrusion 210 that is offset from the opening on the PCB board 800. Specifically, the first protrusion 210 with mounting holes 211 is offset from the opening on the PCB board 800 to prevent the suction cup from directly facing the opening. A vacuum chamber is provided within the vacuum chamber plate 410, and the vacuum chamber is connected to an external vacuum pump. The mounting holes 211 penetrate the first protrusion 210, and the suction cup is positioned within the mounting holes 211 and communicates with the vacuum chamber. The number and position of the mounting holes 211 and the suction cup can be flexibly configured according to actual needs and are not limited here. In one embodiment, the suction nozzle of the suction cup is positioned facing the operating position and flush with the surface of the first protrusion 210 to avoid affecting the flattening of the PCB board 800 by the first protrusion 210. In another embodiment, the suction nozzle of the suction cup is positioned facing the operating position and slightly protrudes from the surface of the first protrusion 210. Since the main body of the suction cup is located inside the mounting hole 211, when the vacuum chamber plate 410 is evacuated, the suction cup can retract into the mounting hole 211 under the action of negative pressure, so that when the suction cup adsorbs the PCB board 800, the suction cup falls completely into the mounting hole 211. That is, during adsorption, the suction cup does not protrude from the surface of the first protrusion 210.

[0063] In one embodiment, the vacuum chamber plate 410 includes two cavities 411, which are independently arranged and jointly attached to the side of the leveling carrier 200 opposite to the operating position. Each cavity 411 is connected to an external vacuum pump. One cavity 411 communicates with a portion of the mounting holes 211, and the other cavity 411 communicates with another portion of the mounting holes 211. Further, in one embodiment, each cavity 411 has multiple grooves 412, all of which are interconnected. Each mounting hole 211 corresponds to one groove 412 to ensure the uniformity of the vacuum negative pressure. Of course, in other embodiments, the vacuum chamber plate 410 can also be a single unit or multiple independent cavities 411; this is not a limitation. Of course, in other embodiments, the adsorption component can also include the vacuum chamber plate 410 and a sponge suction cup or adsorption holes, etc., but the adsorption effect is best when the adsorption component is a suction cup and the vacuum chamber plate 410; this is not a limitation.

[0064] In the technical solution of this utility model embodiment, by setting an adsorption component, when the first protrusion 210 lifts the PCB board 800, the PCB board 800 can be adsorbed onto the first protrusion 210, avoiding the PCB board 800 from shaking or shifting relative to the first protrusion 210, thus ensuring the flatness of the PCB board 800; by setting a suction cup on the adsorption component, the openings on the PCB board 800 can be avoided and the suction cup can perform point adsorption on the PCB board 800, thus avoiding the influence of adsorption on the flatness of the PCB board 800; in addition, during adsorption, the suction cup can not protrude from the surface of the first protrusion 210, thus avoiding affecting the flattening of the PCB board 800 by the first protrusion 210, thus ensuring the flatness of the PCB board 800.

[0065] Please see Figure 1 , Figure 2 and Figure 5 In one embodiment, the leveling mechanism includes a pressure plate 500 disposed on the base 100. The pressure plate 500 has an opening 510 for avoiding the PCB board 800. The pressure plate 500 cooperates with the leveling carrier 200 to squeeze the edge of the flow fixture 300.

[0066] As the leveling carrier 200 moves upward and the first protrusion 210 lifts the PCB board 800, the remaining part of the leveling carrier 200 will come into contact with the flow fixture 300, causing the flow fixture 300 to move upward simultaneously. During the die bonding process, the flow fixture 300 may wobble under the influence of external forces, thus affecting the flatness of the PCB board 800. Therefore, a pressure plate 500 needs to be set above the leveling carrier 200. The pressure plate 500 cooperates with the leveling carrier 200 to squeeze the edge of the flow fixture 300, thereby restricting the movement of the flow fixture 300.

[0067] Specifically, in one embodiment, the pressure plate 500 is configured as a frame structure, with both ends of the pressure plate 500 fixed to a side plate 110. An opening 510 is provided at the center of the pressure plate 500 to avoid obstructing the entire PCB board 800, ensuring that all die-bonding points of the PCB board 800 are exposed. Of course, in other embodiments, the pressure plate 500 can also be movably mounted on the base 100, and a driving structure can be provided to drive the pressure plate 500 to cooperate with the leveling carrier 200 to compress the flow fixture 300. The pressure plate 500 can also be configured as two pressure strips, spaced apart and each fixed to a side plate 110; this is not a limitation.

[0068] Please see Figure 2 , Figure 3 and Figure 5In one embodiment, the flow fixture 300 includes a support body 310 and an extension 320. The support body 310 is provided with a placement groove and a first clearance hole 311. The extension 320 is arranged around the outer periphery of the support body 310, and the pressure plate 500 and the leveling carrier 200 abut against the opposite sides of the extension 320.

[0069] The support body 310 is the main part of the flow jig 300 used to support the PCB board 800, and the extension 320 is the main part of the flow jig 300 used to contact the pressure plate 500. In one embodiment, the leveling carrier 200 includes a carrier body and an abutment portion. The carrier body has a first protrusion 210, and the abutment portion is arranged around the outer periphery of the carrier body. The carrier body is opposite to the support body 310, and the abutment portion is opposite to the extension 320.

[0070] Before die bonding, when the flow fixture 300 carrying the PCB board 800 reaches the operating position, the first power member 240 drives the leveling carrier 200 to move towards the operating position, so that the first protrusion 210 passes through the corresponding first clearance hole 311 and lifts the PCB board 800. At this time, the abutting part abuts against one side of the extension 320, so that the leveling carrier 200 synchronously drives the flow fixture 300 to move upward until the pressure plate 500 abuts against the other side of the extension 320. The pressure plate 500 cooperates with the leveling carrier 200 to squeeze the edge of the flow fixture 300. Since the pressure plate 500 is fixed to the side plate 110, the pressure plate 500 restricts the movement of the flow fixture 300 and also restricts the upward movement of the leveling carrier 200. Therefore, when the pressure plate 500 abuts against the extension 320, the first power member 240 stops running.

[0071] The technical solution of this utility model embodiment, by setting a pressure plate 500, can limit the movement of the flow fixture 300 while cooperating with the leveling carrier 200, and can also limit the lifting stroke of the first protrusion 210. That is, the pressure plate 500 provides a reference plane for the leveling of the PCB board 800, thereby improving the reliability of the leveling mechanism.

[0072] In one embodiment, the leveling carrier 200 is further provided with a limiting part on the side facing the operating position. The limiting part is used to abut against the PCB board 800 to limit the movement of the PCB board 800.

[0073] Please see Figure 4 In one embodiment, the limiting part includes a second protrusion 220 and a friction pad (not shown). The leveling carrier 200 is provided with a plurality of second protrusions 220 at intervals on the side facing the operating position. The flow fixture 300 is provided with a plurality of second clearance holes 312. The height of the plurality of second protrusions 220 is less than the height of the first protrusion 210. A friction pad is attached to the side of each second protrusion 220 facing the operating position.

[0074] In one embodiment, a plurality of second protrusions 220 and a plurality of first protrusions 210 are evenly spaced apart. The total height of each group of second protrusions 220 and friction pads is the same as the height of the first protrusions 210. This ensures that the friction pads contact the PCB board 800 while avoiding affecting the flattening of the PCB board 800 by the first protrusions 210. The shapes of all the first protrusions 210 can be the same or different. The shape of each second clearance hole 312 is set according to the shape of the corresponding first protrusion 210, as long as the inner diameter of the second clearance hole 312 is slightly larger than the outer diameter of the second protrusion 220, allowing the first protrusion 210 to move within the first clearance hole 311. No limitation is imposed. Furthermore, the number of second protrusions 220 and friction pads can be flexibly set according to actual needs. The friction pads can be configured as silicone, rubber, etc., and no limitation is imposed. Of course, in other embodiments, the limiting part can also be configured as a limiting baffle, and the flow fixture 300 is provided with a third clearance hole. The limiting baffle is arranged around the outer periphery of all the first protrusions 210 to be opposite to the outer periphery of the PCB board 800. The height of the limiting baffle is greater than the first protrusions 210 so as to pass through the third clearance hole and abut against the outer periphery of the PCB board 800. Here, no limitation is made.

[0075] The technical solution of this utility model embodiment, by setting a limiting part, can further prevent the PCB board 800 from moving relative to the first protrusion 210; by setting the limiting part as the second protrusion 220 and the friction pad, the frictional resistance can be increased to limit the PCB board 800, avoid damage to the PCB board 800, and ensure the normal function of the first protrusion 210, thus ensuring the reliability of the leveling mechanism.

[0076] Please see Figure 1 and Figure 2 In one embodiment, the leveling mechanism further includes a magnetic plate 600, which is disposed on the side of the PCB board 800 away from the flow fixture 300. The magnetic plate 600 is provided with a plurality of operating windows 620, which are used to avoid the die bonding points of the PCB board 800. The flow fixture 300 is provided with a magnetic element, which is attracted to the magnetic plate 600 to clamp the PCB board 800.

[0077] In one embodiment, the magnetic suction plate 600 is opposite to the support body 310 of the flow fixture 300, and the size of the magnetic suction plate 600 is smaller than the size of the opening 510 of the pressure plate 500, to ensure that when the first protrusion 210 lifts the PCB board 800, the magnetic suction plate 600 can pass through the opening 510, avoiding affecting the flattening of the PCB board 800. A magnetic element is provided on the side of the support body 310 away from the PCB board 800, which can attract the magnetic suction component. The magnetic element can be embedded in the support body 310 to prevent the first protrusion 210 from lifting the PCB board 800. The magnetic suction plate 600 can be an iron plate or steel plate, etc., and the magnetic element can be ferrite or rubber magnet, etc., without limitation. In one embodiment, the magnetic suction plate 600 is configured as a grid structure, with each cutout serving as an operation window 620 to avoid the die bonding point. Of course, in other embodiments, the magnetic suction plate 600 may only have operation windows 620 at positions opposite to the die bonding point, without limitation.

[0078] The technical solution of this utility model embodiment, by setting a magnetic suction plate 600, can restrict the PCB board 800 to the flow fixture 300. Especially for the flexible PCB board 800, the magnetic suction plate 600 ensures that the flexible PCB board 800 is always in an unfolded state on the flow fixture 300, thereby ensuring the flattening effect of the PCB board 800.

[0079] Please see Figure 2 and Figure 5 In one embodiment, the leveling mechanism further includes conveyor belts 710, which are movably disposed on two opposite side walls of the base 100. Two conveyor belts 710 are disposed on both sides of the operating position. The two ends of the flow fixture 300 are respectively mounted on one conveyor belt 710. The conveyor belts 710 are used to transport the flow fixture 300 to the operating position.

[0080] In one embodiment, the leveling carrier 200 and the first drive assembly are both located between two conveyor belts 710. The extension 320 has recessed portions at both ends facing the leveling carrier 200, which are used to rest on the conveyor belts 710 to prevent the flow fixture 300 from shifting relative to the conveyor belts 710 during transport. A gap exists between the conveyor belts 710 and the pressure plate 500 to allow the flow fixture 300 carrying the PCB board 800 to pass through. In one embodiment, the leveling mechanism also includes two second drive assemblies 720, each driven by one conveyor belt 710. Specifically, in one embodiment, each second drive assembly 720 includes a driving wheel, a driven wheel, and a second power component. A driven wheel is provided at each end of the side plates 110 that are close to each other. The second power component is located on the base plate 120, and its output shaft is driven by the driving wheel. The conveyor belt 710 is engaged with the two driven wheels and the driving wheel. The second power component can be a rotary motor or a swing cylinder, etc., and there are no restrictions on this.

[0081] Before die bonding, the flow fixture 300 carrying the PCB board 800 is placed on the conveyor belt 710. The second drive assembly 720 drives the conveyor belt 710 to move the flow fixture 300 toward the operating position. When the flow fixture 300 carrying the PCB board 800 reaches the operating position, the first power component 240 drives the leveling carrier 200 to move toward the operating position so that the first protrusion 210 lifts the PCB board 800. At the same time, the leveling carrier 200 lifts the flow fixture 300 until the flow fixture 300 is squeezed between the leveling carrier 200 and the pressure plate 500.

[0082] The technical solution of this utility model embodiment realizes the automated transmission of PCB board 800 by setting up conveyor belt 710, and facilitates the movement of the flow fixture 300 carrying PCB board 800 between pressure plate 500 and leveling carrier 200, thereby improving the ease of operation of the leveling mechanism.

[0083] This utility model also proposes a PCB board processing production line, including a leveling mechanism for die bonding of the PCB board as described in the above embodiments. The specific structure of the leveling mechanism is as described in the above embodiments. Since this PCB board processing production line adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here.

[0084] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A leveling mechanism for die bonding on a PCB board, characterized in that, include: The base has an operating position; A leveling carrier, movably mounted on the base and located below the operating position, is capable of rising and falling relative to the base to move closer to or further away from the operating position. The leveling carrier has a plurality of first protrusions on the side facing the operating position, the plurality of first protrusions being spaced apart and of uniform height; and A mobile fixture is provided with a placement groove and a first clearance hole communicating with the placement groove. Each first protrusion is provided with a first clearance hole, and the depth of the clearance hole is less than the height of the first protrusion. At the operating position, the first protrusion passes through the corresponding first clearance hole to lift the PCB board.

2. The leveling mechanism for die bonding of a PCB board as described in claim 1, characterized in that, The leveling mechanism also includes: An adsorption element is disposed on the leveling carrier, and the adsorption element is used to adsorb the PCB board.

3. The leveling mechanism for die bonding of a PCB board as described in claim 2, characterized in that, The adsorption element includes: The suction cups are evenly distributed on the leveling carrier, and at least a portion of the first protrusion has mounting holes, with the suction cups disposed in the mounting holes; and A vacuum chamber plate is attached to the side of the leveling carrier opposite to the operating position, and the vacuum chamber plate is connected to a plurality of the mounting holes.

4. The leveling mechanism for die bonding of a PCB board as described in claim 1, characterized in that, The leveling mechanism includes: A pressure plate is provided on the base. The pressure plate has an opening for avoiding the PCB board. The pressure plate cooperates with the leveling carrier to squeeze the edge of the flow fixture.

5. The leveling mechanism for die bonding of a PCB board as described in claim 4, characterized in that, The flow fixture includes: The supporting body is provided with the placement groove and the first clearance hole; and An extension is provided around the outer periphery of the support body, and the pressure plate and the leveling carrier abut against opposite sides of the extension.

6. The leveling mechanism for die bonding of a PCB board as described in claim 1, characterized in that, The leveling carrier is also provided with a limiting part on the side facing the operating position. The limiting part is used to abut against the PCB board to restrict the movement of the PCB board.

7. The leveling mechanism for die bonding of a PCB board as described in claim 6, characterized in that, The limiting part includes: The leveling carrier has multiple second protrusions spaced apart on the side facing the operating position, and the flow fixture has multiple second clearance holes corresponding to these protrusions. The height of each of the second protrusions is less than the height of the first protrusion. Friction pads are attached to the side of each of the second protrusions facing the operating position.

8. The leveling mechanism for die bonding of a PCB board as described in claim 1, characterized in that, The leveling mechanism also includes: A magnetic suction plate is disposed on the side of the PCB board away from the flow fixture. The magnetic suction plate has multiple operating windows, which are used to avoid the die bonding points of the PCB board. The flow fixture has magnetic components, which are attracted to the magnetic suction plate to clamp the PCB board.

9. The leveling mechanism for die bonding of a PCB board as described in claim 1, characterized in that, The leveling mechanism also includes: The conveyor belts are movably mounted on two opposite side walls of the base, and two conveyor belts are located on both sides of the operating position. The two ends of the flow fixture are respectively mounted on one of the conveyor belts, and the conveyor belts are used to transport the flow fixture to the operating position.

10. A PCB board processing production line, characterized in that, Includes the leveling mechanism as described in any one of claims 1 to 9.

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