Heat dissipation structure and power supply

Abstract

The utility model provides a kind of heat dissipation structure, is suitable for the heat dissipation of heating element.Heat dissipation structure includes heat dissipation piece and copper pipe.Heat dissipation piece includes plate body and heat dissipation fin.Heating element is set to plate body.Copper pipe is connected to plate body and heat dissipation fin, and the end of copper pipe is closed.In the above design, copper pipe provides efficient heat conduction path, so that the heat emitted by heating element can be transmitted to heat dissipation fin more quickly by copper pipe, and good heat dissipation effect is realized.The utility model further provides a kind of power supply.

Description

Technical Field

[0001] This utility model relates to a heat dissipation structure and a power supply, and more particularly to a heat dissipation structure for a power supply. Background Technology

[0002] Power supplies typically provide stable power to electronic products such as computers. They are usually equipped with fans or heatsinks to dissipate heat from the internal electronic components. However, these traditional cooling methods are no longer sufficient to meet the cooling requirements of modern power supplies. Therefore, a design with better heat dissipation efficiency is needed to ensure stable operation under high loads and extend the lifespan of the power supply. Utility Model Content

[0003] This invention provides a heat dissipation structure that has a good heat dissipation effect.

[0004] This utility model discloses a heat dissipation structure suitable for dissipating heat from a heat-generating element, comprising a heat sink and copper pipes. The heat sink includes a plate and heat dissipation fins. The heat-generating element is disposed on the plate. The copper pipes connect the plate and the heat dissipation fins, and the ends of the copper pipes are closed.

[0005] In one embodiment of this invention, the plate has a first surface and a second surface facing each other. A heating element is disposed on the first surface. At least a portion of a copper tube is disposed on the second surface.

[0006] In one embodiment of this invention, the heating element is disposed on the first surface of the plate. At least a portion of the copper tube is disposed on the first surface and contacts the heating element.

[0007] In one embodiment of this utility model, the plate is parallel or perpendicular to the heat dissipation fins.

[0008] In one embodiment of the present invention, the fins of the heat dissipation fins are perpendicular or inclined relative to the plate.

[0009] In one embodiment of the present invention, the plate has a recess, and at least a portion of the copper tube is accommodated in the recess.

[0010] In one embodiment of the present invention, the heat dissipation fins have a recess, and at least a portion of the copper tube is accommodated in the recess.

[0011] In one embodiment of the present invention, the copper tube has a first section and a second section that are bent and connected together. The first section is disposed on the plate and the second section is disposed on the heat dissipation fins.

[0012] The present invention provides a power supply, which includes a heating element and the aforementioned heat dissipation structure.

[0013] In one embodiment of this utility model, the power supply further includes a housing, a fan, and heat dissipation holes. The housing is provided with heat dissipation holes. The fan is disposed inside the housing and adjacent to the heat dissipation fins.

[0014] Based on the above, in the heat dissipation structure of this utility model, the heat sink is thermally coupled to the heat-generating element and includes a plate and heat dissipation fins connected to each other, with copper pipes connected to the plate and heat dissipation fins. Since the copper pipes provide an efficient heat conduction path, the heat emitted by the heat-generating element can be transferred not only to the heat dissipation fins through the plate but also quickly to the heat dissipation fins through the copper pipes, where it then exchanges heat with the air, thereby achieving a good heat dissipation effect.

[0015] To make the above-mentioned features and advantages of this utility model more apparent and understandable, specific embodiments are described below, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a power supply according to an embodiment of the present invention;

[0017] Figure 2 yes Figure 1 Exploded view of some components of a power supply unit;

[0018] Figure 3A yes Figure 2 A schematic diagram of the heat dissipation structure;

[0019] Figure 3B yes Figure 3A Another perspective of the heat dissipation structure;

[0020] Figure 4 This is a schematic diagram of a heat dissipation structure according to another embodiment of the present invention;

[0021] Figure 5A This is a schematic diagram of a heat dissipation structure according to another embodiment of the present invention;

[0022] Figure 5B yes Figure 5A Another perspective of the heat dissipation structure.

[0023] Explanation of reference numerals in the attached figures

[0024] 10: Power supply;

[0025] 100, 100b, 100c: Heat dissipation structure;

[0026] 110, 110a, 110c: Heat sinks;

[0027] 112, 112a, 112c: Plate body;

[0028] 114, 114a: Heat dissipation fins;

[0029] 120, 120b: Copper pipe;

[0030] 122, 122b: First paragraph;

[0031] 124, 124b: Second paragraph;

[0032] 140: Casing;

[0033] 150: Fan;

[0034] 160: Ventilation holes;

[0035] 170: Circuit board;

[0036] 190: Heating element;

[0037] F1: First page;

[0038] F2: Second page;

[0039] P1, P2: concave parts. Detailed Implementation

[0040] Figure 1 This is a schematic diagram of a power supply according to an embodiment of the present invention. X, Y, and Z are mutually perpendicular directions.

[0041] Please see Figure 1 In this embodiment, the power supply 10 is suitable for electrical connection to an external power source. The current from the external power source can be input to the power supply 10, converted into a suitable current by the power supply 10, and then output to an electronic device, such as a computer host, to provide stable power to the electronic device. However, the application of the power supply 10 is not limited to this.

[0042] The power supply 10 includes a housing 140, which is provided with a plurality of heat dissipation holes 160. Hot air inside the housing 140 can be discharged to the outside of the power supply 10 through the heat dissipation holes 160 to achieve a good heat dissipation effect.

[0043] Figure 2 yes Figure 1 An exploded view of some components of the power supply 10. To clearly illustrate the internal structure of the power supply 10, Figure 2 Conceal the housing 140.

[0044] Please see Figure 2 In this embodiment, the power supply 10 may include a fan 150, a circuit board 170, a heat dissipation structure 100, and a heat-generating element 190. The fan 150 is disposed in the housing 140. Figure 1The heat dissipation structure 100 is located inside and near the heat dissipation structure 100, which can enhance the heat convection inside the housing 140, especially near the heat dissipation structure 100, and help to accelerate the heat dissipation to the outside of the power supply 10, thereby improving the heat dissipation efficiency.

[0045] In this embodiment, the heat dissipation structure 100 is disposed on the circuit board 170, and is suitable for dissipating heat from multiple heat-generating elements 190. Figure 2 Six types of heat dissipation devices are shown, such as metal-oxide-semiconductor (MOS) and bridge rectifiers, but the types of heat-generating elements 190 are not limited thereto. In another embodiment, the heat dissipation structure 100 may not be in contact with the circuit board 170.

[0046] The structure and effect of the heat dissipation structure 100 will be explained further below. Figure 3A yes Figure 2 A schematic diagram of the heat dissipation structure. Figure 3B yes Figure 3A Another perspective of the heat dissipation structure. Figure 4 This is a schematic diagram of a heat dissipation structure according to another embodiment of this utility model. For ease of identification, Figure 3A and Figure 3B The copper tube 120 is schematically shown as dots.

[0047] Please see Figure 3A and Figure 3B The heat dissipation structure 100 in this embodiment includes a heat sink 110 and a copper pipe 120. The heat sink 110 is thermally coupled to the heat-generating element 190 and includes a plate 112 and heat dissipation fins 114 connected to each other. The material of the heat sink 110 is, for example, aluminum with good thermal conductivity, but the material is not limited thereto.

[0048] The heat dissipation fins 114 have multiple fins, and ventilation channels are formed between the multiple fins. In this embodiment, the plate body 112 is arranged along the YZ plane, and the heat dissipation fins 114 are arranged along the XY plane, so that the plate body 112 is arranged approximately perpendicular to the heat dissipation fins 114. More specifically, the plate body 112 of the heat sink 110 is arranged approximately perpendicular to the heat dissipation fins 114, and the heat dissipation fins 114 are arranged on one side of the plate body 112; the heat dissipation fins 110a ( Figure 2 The plate 112a is positioned approximately perpendicular to the heat dissipation fins 114a, which are located on the top side of the plate 112a. Figure 4 In this embodiment, the plate 112 of the heat dissipation structure 100b can be arranged approximately parallel to the heat dissipation fins 114, that is, the lengths of both the plate 112 and the heat dissipation fins 114 are arranged along the XY plane. The plate 112 has opposing first surfaces F1 and second surfaces F2.

[0049] These heat dissipation fins can be perpendicular to the first surface F1 (e.g., heat dissipation fin 114) or inclined relative to the first surface F1 (e.g., Figure 2 The heat dissipation fins 114a are provided, but the fin arrangement direction is not limited thereto. The heat-generating element 190 is disposed on the first surface F1 of the plate 112.

[0050] Preferably, the first surface F1 and / or the second surface F2 of the plate 112 may have a recess P1. Preferably, the heat dissipation fins 114 may have a recess P2. In this embodiment, the recess P1 is located on the second surface F2 of the plate 112 and is generally L-shaped, while the recess P2 is straight. However, the shapes of the recesses P1 and P2 may be determined depending on the shape and arrangement of the copper tube 120.

[0051] On the other hand, in this embodiment, the copper tube 120 has a hollow structure and its two ends are closed. The thermal conductivity of the copper tube 120 is greater than that of the plate 112. The copper tube 120 is connected to the plate 112 and the heat dissipation fins 114.

[0052] Specifically, the copper pipe 120 has a first segment 122 and a second segment 124 that are bent and connected. The first segment 122 is parallel to the plate 112 and disposed in the recess P1, and the second segment 124 is parallel to the heat dissipation fins 114 and disposed in the recess P2. By placing the copper pipe 120 in the recesses P1 and P2 or by making the copper pipe 120 flat, the heat dissipation structure 100 can have a flat shape and save space. In another embodiment, the plate 112 does not have a recess P1, and / or the heat dissipation fins 114 does not have a recess P2, and the copper pipe 120 is provided to protrude from the plate 112 and / or the heat dissipation fins 114.

[0053] In this embodiment, the plate 112 is perpendicular to the heat dissipation fins 114, and the first segment 122 and the second segment 124 of the copper pipe 120 are located on different planes (e.g., the YZ plane of the plate 112 and the XY plane of the heat dissipation fins 114). Figure 4 In this embodiment, the plate 112 is parallel to the heat dissipation fins 114, and the first segment 122b and the second segment 124b of the copper pipe 120b are located on different planes parallel to the XY plane. The arrangement of the plate 112 and the heat dissipation fins 114 can be determined according to the power supply 10 ( Figure 1 The internal component layout can be flexibly adjusted, and the shape of the copper tubes 120 and 120b can also be adjusted accordingly, as long as the copper tubes 120 and 120b are connected to the board 112 and the heat sink 114 at the same time.

[0054] It is worth noting that in this embodiment, the heating element 190 is disposed on the first surface F1 of the plate 112, and at least a portion of the copper tube 120 (e.g., the first segment 122) is disposed on the second surface F2 of the plate 112. Since the copper tube 120 and the heating element 190 are disposed on different surfaces of the plate 112, the copper tube 120 will not interfere with the configuration space of the heating element 190, thus providing greater freedom for the layout of the heating element 190 and making the assembly process more convenient.

[0055] When the heat-generating element 190 operates, the heat generated by the heat-generating element 190 is not only transferred to the heat sink 114 through the plate 112, but also conducted to the first section 122 of the copper pipe 120 through the portion of the plate 112 adjacent to the heat-generating element 190. Since the thermal conductivity of the copper pipe 120 is greater than that of the plate 112, it provides an efficient heat conduction path. Heat can be rapidly conducted to the heat sink 114 along the first section 122 and the second section 124 of the copper pipe 120, and then by the fan 150 adjacent to the heat sink 114. Figure 2 The airflow generated will carry away the heat, thus effectively improving heat dissipation efficiency.

[0056] Actual testing shows that, compared to traditional heat sinks without copper pipe 120, this design can reduce the temperature of the heat dissipation structure by at least 7-15 degrees Celsius (8-15% cooling), resulting in excellent heat dissipation. This allows the heat-generating element 190 to operate stably under high loads and helps extend its service life.

[0057] Furthermore, in this embodiment, at least a portion of the surface of the copper tube 120 may be coated with nickel to facilitate welding to the heat sink 110, thereby firmly bonding the copper tube 120 to the heat sink 110. In another embodiment, the copper tube 120 is fixed to the heat sink 110 by a locking accessory. Of course, the method of bonding the copper tube 120 to the heat sink 110 is not limited to this.

[0058] In addition, this embodiment shows two copper tubes 120, but the number of copper tubes 120 can be determined according to actual needs, and the number of recesses P1 and P2 can be adjusted according to the number of copper tubes 120.

[0059] Figure 5A This is a schematic diagram of a heat dissipation structure according to another embodiment of the present invention. Figure 5B yes Figure 5A Another perspective of the heat dissipation structure. Figure 5A and Figure 5B The illustrated embodiments and Figure 3A The main difference in the illustrated embodiment lies in the configuration of the copper tube 120.

[0060] Specifically, in the heat dissipation structure 100c of this embodiment, the heating element 190 is disposed on the first surface F1 of the plate 112c of the heat sink 110c, and at least a portion of the copper tube 120 is disposed on the first surface F1 and in contact with the heating element 190.

[0061] More in detail, such as Figure 5B As shown, the first surface F1 of the plate 112c may have a recess P1, and the first segment 122 of the copper tube 120 is disposed in the recess P1. That is, the first segment 122 of the copper tube 120 and the heating element 190 are located on the same surface of the plate 112c, so that at least a portion of the heating element 190 can contact the copper tube 120.

[0062] Since the heating element 190 is in contact with the copper tube 120, when the heating element 190 is in operation, the heat generated by the heating element 190 can be directly conducted to the copper tube 120, and then quickly conducted to the heat dissipation fins 114 through the first section 122 and the second section 124 of the copper tube 120, further improving the heat dissipation performance.

[0063] The remaining components and configurations of the heat dissipation structure 100c in this embodiment are the same as or similar to those in this embodiment. Figure 3A The heat dissipation structure 100 in the illustrated embodiment will not be described in detail here.

[0064] In summary, in the heat dissipation structure of this utility model, the heat sink is thermally coupled to the heat-generating element and includes a plate and heat dissipation fins connected to each other, with copper pipes connecting the plate and the heat dissipation fins. Because the copper pipes provide an efficient heat conduction path, the heat emitted by the heat-generating element is not only transferred to the heat dissipation fins through the plate, but also quickly transferred to the heat dissipation fins through the copper pipes, where it exchanges heat with the air, thereby achieving excellent heat dissipation.

[0065] Furthermore, the heating element and copper pipe in this design can be placed on different sides of the board. Since the copper pipe does not interfere with the placement space of the heating element, it not only ensures the flexibility of the heating element layout but also makes the assembly process more convenient. Alternatively, the heating element and copper pipe can be placed on the same side of the board, allowing the heating element to contact the copper pipe. In this way, the heat generated by the heating element can be directly conducted to the copper pipe, and then from the copper pipe to the heat sink fins, further improving heat dissipation efficiency.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions or combinations can be made to some or all of the technical features. Such modifications, combinations or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A heat dissipation structure suitable for dissipating heat from a heat-generating element, characterized in that, include: Heat dissipation components, including the plate and heat dissipation fins; A heating element is disposed on the plate. as well as A copper tube is connected to the plate and the heat dissipation fins, and the end of the copper tube is closed.

2. The heat dissipation structure according to claim 1, characterized in that, The plate has a first side and a second side facing each other, the heating element is disposed on the first side, and at least a portion of the copper tube is disposed on the second side.

3. The heat dissipation structure according to claim 1, characterized in that, The plate has a first side and a second side facing each other. The heating element is disposed on the first side of the plate, and at least a portion of the copper tube is disposed on the first side and in contact with the heating element.

4. The heat dissipation structure according to claim 1, characterized in that, The plate is parallel or perpendicular to the heat dissipation fins.

5. The heat dissipation structure according to claim 1, characterized in that, The fins of the heat dissipation fins are perpendicular or inclined relative to the plate.

6. The heat dissipation structure according to claim 1, characterized in that, The plate has a recess, and at least a portion of the copper tube is accommodated in the recess.

7. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation fins have recesses, and at least a portion of the copper tube is accommodated in the recesses.

8. The heat dissipation structure according to claim 1, characterized in that, The copper tube has a first section and a second section that are bent and connected together. The first section is disposed on the plate body and the second section is disposed on the heat dissipation fins.

9. A power supply, characterized in that, include: Heating element; as well as The heat dissipation structure described in any of the above items.

10. The power supply according to claim 9, characterized in that, It also includes a housing, a fan, and heat dissipation holes. The housing is provided with the heat dissipation holes, and the fan is disposed inside the housing and adjacent to the heat dissipation fins.

Images