A tin paste detection device applied to an SMT production line
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YIXING FASTPRINT ELECTRONICS CO LTD
- Filing Date
- 2025-07-23
- Publication Date
- 2026-08-07
AI Technical Summary
[0002]在SMT生产过程中,锡膏印刷是关键环节之一,其质量直接影响后续电子元件的贴装和焊接效果,然而,由于多种因素的影响,如钢网与PCB板的对齐精度、刮刀压力和速度的控制等,锡膏印刷可能会出现缺陷,如锡膏塌陷、印刷偏位、漏印少锡等一系列问题,而这些缺陷最终会导致锡膏印刷不牢固
[0015] This utility model provides a solder paste inspection device for SMT production lines, which has the following advantages:
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Figure CN224611130U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of SMT production line technology, specifically to a solder paste testing device applied to an SMT production line. Background Technology
[0002] In the SMT production process, solder paste printing is one of the key steps, and its quality directly affects the subsequent placement and soldering of electronic components. However, due to various factors, such as the alignment accuracy between the stencil and the PCB board, and the control of squeegee pressure and speed, solder paste printing may have defects, such as solder paste collapse, printing misalignment, and insufficient solder. These defects will ultimately lead to poor solder paste printing.
[0003] Existing solder paste inspection devices mainly use optical inspection systems. These systems use high-precision optical imaging and image processing technology to detect parameters such as the shape, size, and position of the solder paste. However, this type of inspection method has certain limitations and cannot effectively detect problems such as poor solder paste printing. A large number of products with potential defects flow into the next process, ultimately leading to a significant drop in product yield. To address this, we propose a solder paste inspection device for SMT production lines. Utility Model Content
[0004] (a) Technical problems to be solved
[0005] In view of the shortcomings of the prior art, this utility model provides a solder paste inspection device for SMT production lines to solve the above-mentioned problems in the prior art.
[0006] (II) Technical Solution
[0007] To achieve the above objectives, this utility model is implemented through the following technical solution: a solder paste inspection device applied to an SMT production line, comprising a main body, wherein two conveyor rails are symmetrically arranged inside the main body, each conveyor rail is provided with an inner edge for supporting a support plate, the support plate is provided with an inner edge around its inner wall for supporting a PCB board, and its bottom is hollowed out so that the fixing holes at the four corners of the PCB board are fully exposed.
[0008] The main body is equipped with a vibration component for driving PCB vibration. The vibration component includes a lifting plate, and lifting frames are symmetrically arranged on both sides of the lifting plate. Each lifting frame is symmetrically provided with a pin at the top for insertion into the fixing holes at the four corners of the PCB. The bottom of the lifting plate is provided with a vibration unit to drive it to vibrate up and down.
[0009] Furthermore, the vibration unit includes a drive frame, which is integrally formed by a front inclined plate and a rear wave section. The bottom of the lifting plate is rotatably connected to a roller that cooperates with the drive frame, so as to realize the lifting plate vibrating up and down after moving upward. A cylinder is provided inside the main body along its conveying rail direction, and the output end of the cylinder is connected to the drive frame to drive the drive frame to move along the conveying rail direction.
[0010] Furthermore, the main body is provided with a pair of positioning components, each including a support plate. The bottom of the support plate is provided with a pair of elastic telescopic rods, and the bottom of the elastic telescopic rods is provided with a sleeve rod that cooperates with the insertion post, so as to be sleeved on the outer wall at the top of the insertion post when the insertion post moves upward.
[0011] Furthermore, the inclined plate is inclined downward, and the top of the wave section is provided with several arc-shaped grooves at equal intervals, wherein the diameter of the grooves is larger than the diameter of the roller.
[0012] Furthermore, the lifting plate is provided with limiting plates on both sides, and a pair of vertical plates are provided inside the main body. The vertical plates are provided with vertical grooves that cooperate with the limiting plates, so as to restrict the movement direction of the lifting plate.
[0013] Furthermore, the insertion post includes, from top to bottom, a positioning rod, a positioning plate, and an extension rod. The diameter of the outer wall of the positioning rod is adapted to the diameter of the four corner fixing holes of the PCB board, and the diameter of the positioning plate is larger than the diameter of the four corner fixing holes of the PCB board.
[0014] (III) Beneficial Effects
[0015] This utility model provides a solder paste inspection device for SMT production lines, which has the following advantages:
[0016] 1. Before testing, lift the PCB board to separate it from the carrier board. Then, control the PCB board to vibrate up and down to make the poorly printed solder paste fall off, avoiding testing errors caused by poor solder paste printing, ensuring the accuracy of subsequent optical testing results, and effectively improving the product yield.
[0017] 2. When the PCB board is lifted and vibrates, the insert and sleeve rod hold the upper and lower sides of the PCB board to prevent it from vibrating and falling off, thus improving the stability and reliability of the PCB board vibration. Attached Figure Description
[0018] Figure 1 This is a three-dimensional schematic diagram of the overall structure of this utility model;
[0019] Figure 2 This is a three-dimensional schematic diagram of the main structure of this utility model;
[0020] Figure 3This is a three-dimensional schematic diagram of the support plate structure of this utility model;
[0021] Figure 4 This is a three-dimensional schematic diagram of the lifting plate structure of this utility model;
[0022] Figure 5 This is a three-dimensional schematic diagram of the roller structure of this utility model;
[0023] Figure 6 This is a three-dimensional schematic diagram of the drive frame structure of this utility model;
[0024] Figure 7 This is a three-dimensional schematic diagram of the insert structure of this utility model;
[0025] Figure 8 This utility model Figure 1 Enlarged schematic diagram of structure A in the middle.
[0026] In the diagram: 1. Main body; 2. Conveyor rail; 3. Bearing plate; 41. Lifting plate; 42. Lifting frame; 43. Insert column; 431. Positioning rod; 432. Positioning plate; 433. Extension rod; 44. Roller; 45. Limiting plate; 51. Drive frame; 52. Inclined plate section; 53. Wave section; 54. Cylinder; 61. Support plate; 62. Elastic telescopic rod; 63. Sleeve rod; 7. Vertical plate; 8. Vertical groove. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0028] See attached document Figure 1-8 A solder paste inspection device for SMT production line includes a main body 1. Two conveyor rails 2 are symmetrically arranged inside the main body 1. Each conveyor rail 2 has an inner edge to keep parallel and the spacing is adapted to the size of the carrier plate 3 for carrying the carrier plate 3. The carrier plate 3 has a frame structure with an inner edge on all four sides of its inner wall for carrying the PCB board. Its bottom is hollowed out so that the fixing holes at the four corners of the PCB board are fully exposed.
[0029] The main body 1 is equipped with a vibration assembly for driving PCB vibration. The vibration assembly includes a lifting plate 41, with lifting frames 42 symmetrically arranged on both sides of the lifting plate 41. Each lifting frame 42 is symmetrically provided with a pin 43 at the top for insertion into the fixing holes at the four corners of the PCB. The bottom of the lifting plate 41 is provided with a vibration unit to drive it to vibrate up and down.
[0030] During use, the lifting plate 41 first drives the lifting frame 42 to move upward, so that the four pins 43 are precisely inserted into the fixing holes at the four corners of the PCB board. Then, the lifting plate 41 continues to move, using the pins 43 to lift the PCB board as a whole, so that it is completely separated from the support plate 3. Next, the vibration unit is activated and controls the lifting plate 41 to vibrate. This vibration is transmitted to the PCB board through the lifting frame 42, causing the poorly printed solder paste on the PCB board to fall off. In this way, when the solder paste on the top of the PCB board is subsequently inspected using an optical inspection system, the inspection error caused by the poorly printed solder paste can be effectively avoided, providing a strong guarantee for improving the product yield.
[0031] In this embodiment, the vibration unit includes a drive frame 51, which is integrally formed by a front inclined plate portion 52 and a rear wave portion 53. The bottom of the lifting plate 41 is rotatably connected to a roller 44 that cooperates with the drive frame 51, so as to realize the up-and-down vibration after the lifting plate 41 moves upward. A cylinder 54 is provided inside the main body 1 along its conveying rail 2. The output end of the cylinder 54 is connected to the drive frame 51 to drive the drive frame 51 to move along the conveying rail 2. When the cylinder 54 is started, the output end of the cylinder 54 immediately starts to move, driving the drive frame 51 connected to it to move smoothly in the direction of the roller 44. During the movement of the drive frame 51, its inclined plate 52 will first contact the roller 44, generating an upward thrust that pushes the roller 44 upward. This action is further transmitted to the insertion post 43, allowing the insertion post 43 to accurately insert into the fixing holes at the four corners of the PCB board, and causing the PCB board to lift upward as a whole. As the drive frame 51 continues to move, when the roller 44 moves to contact the wave part 53 on the drive frame 51, the situation changes. The roller 44 begins to slide along the surface of the wave part 53. Because the surface of the wave part 53 is undulating, the roller 44 will drive the lifting plate 41 to vibrate up and down during the sliding process. This vibration is transmitted to the PCB board through the insertion post 43, causing the PCB board to also vibrate up and down. During the up and down vibration of the PCB board, it always remains separated from the support plate 3 and will not come into contact with it. In this way, it can effectively vibrate off the solder paste that is not printed firmly on the surface of the PCB board, and also avoid the PCB board from being damaged. The plate was damaged during vibration due to the pressure from the bearing plate 3, which provided a reliable guarantee for subsequent processes.
[0032] In this embodiment, the main body 1 is provided with a pair of positioning components. The positioning components include a support plate 61. The bottom of the support plate 61 is provided with a pair of elastic telescopic rods 62. The bottom of the elastic telescopic rods 62 is provided with a sleeve rod 63 that cooperates with the insertion post 43. When the insertion post 43 moves upward, it will be sleeved on the outer wall of its top. When the insertion post 43 moves upward, it will be inserted into the sleeve rod 63 and drive the sleeve rod 63 to move upward. At this time, the elastic telescopic rod 62 will retract. During the reciprocating vibration of the PCB board, the bottom of the sleeve rod 63 always abuts against the top of the PCB board to limit it and prevent the PCB board from falling off the insertion post 43 during vibration, which greatly improves the stability of the device.
[0033] In this embodiment, the inclined plate portion 52 is inclined downward, and the top of the wave portion 53 is provided with several arc-shaped grooves at equal intervals. The diameter of the grooves is larger than the diameter of the roller 44. When the roller 44 moves along the inclined plate portion 52, the inclined plate portion 52 can convert the horizontal displacement of the roller 44 into a vertical force, thereby pushing the lifting plate 41 to rise, so that the insertion post 43 can be inserted into the PCB board to complete the lifting action. After the roller 44 smoothly enters the wave portion 53, the several grooves distributed on the wave portion 53 begin to play a role. As the roller 44 rolls on these grooves, it will continuously generate periodic up and down forces, thereby driving the lifting plate 41 to vibrate up and down. The entire structure design is simple and clear, not only with high reliability, but also with very convenient operation and control, which can efficiently meet various needs in the production process.
[0034] In this embodiment, limiting plates 45 are provided on both sides of the lifting plate 41, and a pair of vertical plates 7 are provided inside the main body 1. Vertical grooves 8 that cooperate with the limiting plates 45 are opened in the vertical plates 7 to restrict the movement direction of the lifting plate 41. Through the cooperation of the limiting plates 45 and the vertical grooves 8, it can be ensured that the lifting plate 41 always maintains the vertical direction during the movement and will not deviate in the horizontal direction, thereby improving the stability and reliability of the entire vibration assembly.
[0035] In this embodiment, the insertion post 43 adopts a split structure design, which includes a positioning rod 431, a positioning plate 432, and an extension rod 433 from top to bottom. The diameter of the outer wall of the positioning rod 431 is adapted to the diameter of the four corner fixing holes of the PCB board. This not only ensures that the positioning rod 431 can be accurately inserted into the fixing holes, but also provides stable support for the PCB board after insertion, effectively preventing the PCB board from shaking in the horizontal direction and avoiding the adverse effects on subsequent reset operations that may be caused by offset. The diameter of the positioning plate 432 is larger than the diameter of the four corner fixing holes of the PCB board. When the positioning rod 431 is inserted into the fixing holes, the positioning plate 432 can fit tightly against the bottom of the PCB board to form a reliable limiting structure, which facilitates the subsequent upward movement of the PCB board by external force, ensuring the stability and accuracy of the entire operation process.
[0036] Working principle: Before testing, cylinder 54 is started, driving drive frame 51 to move towards roller 44. Inclined plate 52 first contacts roller 44, converting horizontal displacement into vertical force, pushing lifting plate 41 to rise. Lifting frame 42 drives insertion post 43 to insert into PCB board fixing hole and lift PCB board, separating it from carrier plate 3.
[0037] Subsequently, the roller 44 enters the wave section 53 and rolls along its surface groove, generating a periodic up-and-down force that drives the lifting plate 41 to vibrate up and down, thereby causing the PCB board to vibrate and causing poorly printed solder paste to fall off, thus avoiding subsequent inspection errors.
[0038] When the insert 43 moves upward, it will insert into the sleeve 63. Under the action of the elastic telescopic rod 62, the bottom of the sleeve 63 abuts against the top of the PCB board, which can prevent it from vibrating and falling off.
[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0040] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A solder paste inspection device for SMT production lines, comprising a main body (1), wherein two conveyor rails (2) are symmetrically arranged inside the main body (1), characterized in that: Each of the conveying rails (2) is provided with an inner edge for supporting the support plate (3). The inner wall of the support plate (3) is provided with an inner edge around its perimeter for supporting the PCB board, and its bottom is hollowed out so that the fixing holes at the four corners of the PCB board are fully exposed. The main body (1) is provided with a vibration component for driving PCB vibration. The vibration component includes a lifting plate (41). The lifting plate (41) is provided with lifting frames (42) symmetrically on both sides. Each lifting frame (42) is provided with a symmetrical insert post (43) at the top for insertion into the fixing holes at the four corners of the PCB. The bottom of the lifting plate (41) is provided with a vibration unit to drive it to vibrate up and down.
2. The solder paste inspection device for SMT production lines as described in claim 1, characterized in that: The vibration unit includes a drive frame (51), which is integrally formed by a front inclined plate (52) and a rear wave section (53). The bottom of the lifting plate (41) is rotatably connected to a roller (44) that cooperates with the drive frame (51) so that the lifting plate (41) vibrates up and down after moving upward. The main body (1) is provided with a cylinder (54) along its conveying rail (2). The output end of the cylinder (54) is connected to the drive frame (51) to drive the drive frame (51) to move along the conveying rail (2).
3. The solder paste inspection device for SMT production lines as described in claim 2, characterized in that: The main body (1) is provided with a pair of positioning components, the positioning components include a support plate (61), the bottom of the support plate (61) is provided with a pair of elastic telescopic rods (62), the bottom of the elastic telescopic rods (62) is provided with a sleeve rod (63) that cooperates with the insertion post (43) so that it can be sleeved on the outer wall at the top when the insertion post (43) moves upward.
4. The solder paste inspection device for SMT production lines as described in claim 2, characterized in that: The inclined plate (52) is inclined downward, and the top of the wave section (53) is provided with several arc-shaped grooves at equal intervals, wherein the diameter of the grooves is larger than the diameter of the roller (44).
5. The solder paste inspection device for SMT production lines as described in claim 2, characterized in that: The lifting plate (41) is provided with limiting plates (45) on both sides, and the main body (1) is provided with a pair of vertical plates (7). The vertical plates (7) are provided with vertical grooves (8) that cooperate with the limiting plates (45) to restrict the movement direction of the lifting plate (41).
6. The solder paste inspection device for SMT production lines as described in claim 2, characterized in that: The insert (43) includes, from top to bottom, a positioning rod (431), a positioning plate (432), and an extension rod (433). The diameter of the outer wall of the positioning rod (431) is adapted to the diameter of the four corner fixing holes of the PCB board, and the diameter of the positioning plate (432) is larger than the diameter of the four corner fixing holes of the PCB board.