Busbar, photovoltaic module and photovoltaic system

Abstract

The utility model provides a kind of busbar, photovoltaic module and photovoltaic system, it is related to solar energy technical field, can reduce the risk of cell piece hidden crack in the process of making photovoltaic module, improve insulation performance.Busbars include: core layer, including opposite first surface and second surface;First welding layer, located on the first surface of core layer, for being connected with solder strip;Second welding layer, located on the second surface of core layer, the thickness of first welding layer is greater than the thickness of second welding layer.

Description

Technical Field

[0001] This utility model relates to the field of solar energy technology, and in particular to busbars, photovoltaic modules and photovoltaic systems. Background Technology

[0002] A busbar consists of a core layer and a solder layer covering the surface of the core layer. The core layer is the conductive core of the busbar and is usually made of a highly conductive metal (such as pure copper, copper alloy, or aluminum). It directly undertakes the main task of current transmission. The solder layer can improve the solderability of the busbar and is usually made of tin-containing materials.

[0003] In some cases, one surface of the busbar is welded to the solder strip, while the other surface of the busbar is in contact with the insulation layer. During the welding process, due to the high welding temperature, the weld layer in contact with the insulation layer melts and forms spikes after cooling. These spikes can pierce the insulation layer, posing a risk of microcracks to the battery cells underneath, leading to insulation failure and short circuit. Summary of the Invention

[0004] This invention provides a busbar, a photovoltaic module, and a photovoltaic system, which can reduce the risk of microcracks in solar cells and improve insulation performance during the manufacturing process of photovoltaic modules.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] In a first aspect, a busbar is provided, comprising: a core layer including opposing first and second surfaces; a first welding layer located on the first surface of the core layer for connection with a welding strip; and a second welding layer located on the second surface of the core layer, wherein the thickness of the first welding layer is greater than the thickness of the second welding layer.

[0007] Based on this solution, compared to existing solutions, the busbar provided by this utility model has a thicker first welding layer on the first surface connected to the welding strip than the thicker second welding layer on the second surface. During welding, both the first and second welding layers melt and subsequently cool to form spikes. These spikes can pierce the insulation layer, posing a risk of microcracks to the solar cells beneath the insulation layer, potentially leading to insulation failure and short circuits. Since the second welding layer is thinner, the spikes formed after melting and cooling are also smaller, reducing the risk of spikes piercing the insulation layer. This reduces the risk of microcracks in solar cells and improves insulation performance during photovoltaic module manufacturing. In some embodiments of the first aspect, the thickness of the first welding layer ranges from 8μm to 25μm.

[0008] In conjunction with the first aspect, in some embodiments of the first aspect, the thickness of the second weld layer ranges from 5 μm to 20 μm.

[0009] In conjunction with the first aspect, in some embodiments of the first aspect, the busbar further includes a heat insulation layer located between the second surface of the core layer and the second weld layer.

[0010] In conjunction with the first aspect, in some embodiments of the first aspect, the heat insulation layer is a polymer resin layer.

[0011] In conjunction with the first aspect, in some embodiments of the first aspect, the thermal conductivity of the polymer resin layer ranges from 0.1 W / (m·K) to 6 W / (m·K).

[0012] In conjunction with the first aspect, in some embodiments of the first aspect, the heat insulation layer is an aerogel coating.

[0013] In conjunction with the first aspect, in some embodiments of the first aspect, the thermal conductivity of the aerogel coating ranges from 0.012 W / (m·K) to 0.03 W / (m·K).

[0014] In a second aspect, a photovoltaic module is provided, comprising: a photovoltaic cell; a solder strip connected to the photovoltaic cell; a busbar provided in the first aspect and any embodiment thereof, including opposing third and fourth surfaces, the third surface of the busbar being connected to the solder strip; and an insulating layer in contact with the fourth surface of the busbar.

[0015] Thirdly, a photovoltaic system is provided, which includes the photovoltaic modules provided in the second aspect. Attached Figure Description

[0016] Figure 1 A schematic diagram of the structure of a photovoltaic module provided by this utility model;

[0017] Figure 2 This is a schematic diagram of the structure of another photovoltaic module provided by this utility model;

[0018] Figure 3 A schematic diagram of the structure of a busbar provided by this utility model;

[0019] Figure 4 A schematic diagram of another busbar provided by this utility model;

[0020] Figure 5 A schematic diagram of another busbar provided by this utility model;

[0021] Figure 6 This is a schematic diagram of another type of busbar provided by this utility model. Detailed Implementation

[0022] In this embodiment of the invention, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this embodiment of the invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner to facilitate understanding.

[0023] Furthermore, to facilitate a clear description of the technical solutions of the embodiments of this utility model, the terms "first" and "second" are used in the embodiments of this utility model to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" are not necessarily different.

[0024] It is understood that the term "embodiment" used throughout the specification means that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of the present invention. Therefore, the various embodiments throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It is understood that in the various embodiments of the present invention, the sequence number of each process does not imply the order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0025] It is understood that in this utility model, "when," "if," and "if" all refer to the corresponding processing that will be carried out under certain objective circumstances, and are not limited to a specific time, nor do they require a judgment action to be performed, nor do they imply any other limitations.

[0026] It is understood that some optional features in the embodiments of this utility model can be implemented independently in certain scenarios without relying on other features, such as the current solution on which they are based, to solve the corresponding technical problems and achieve the corresponding effects. Alternatively, they can be combined with other features as needed in certain scenarios. Correspondingly, the device given in the embodiments of this utility model can also implement these features or functions, which will not be elaborated here.

[0027] In this utility model, unless otherwise specified, the same or similar parts between the various embodiments can be referred to each other. In the various embodiments and implementation methods of this utility model, unless otherwise specified or logically conflicting, the terminology and / or descriptions between different embodiments and between the implementation methods of different embodiments are consistent and can be mutually referenced. The technical features in different embodiments and between the implementation methods of different embodiments can be combined according to their inherent logical relationships to form new embodiments, implementation methods, implementation methods, or implementation approaches. The following embodiments of this utility model do not constitute a limitation on the scope of protection of this utility model.

[0028] A busbar consists of a core layer and a solder layer covering the surface of the core layer. The core layer is the conductive core of the busbar and is usually made of a highly conductive metal (such as pure copper, copper alloy, or aluminum). It directly undertakes the main task of current transmission. The solder layer can improve the solderability of the busbar and is usually made of tin-containing materials.

[0029] Figure 1 This is a structural schematic diagram of a photovoltaic module provided by the present invention. Figure 2 This is a schematic diagram of another photovoltaic module provided by this utility model, as shown below. Figure 1 or Figure 2 As shown, the photovoltaic module 10 includes: a photovoltaic cell 101; a solder ribbon 102 connected to the photovoltaic cell 101; a busbar 103 including a third surface 1036 and a fourth surface 1037 opposite to each other, the third surface 1036 of the busbar 103 being connected to the solder ribbon 102; and an insulating layer 104 in contact with the fourth surface 1037 of the busbar 103.

[0030] The insulating layer 104 can be an additional insulating material added to the solar cell, or it can be an insulating adhesive layer on the solar cell.

[0031] During the welding process of busbar 103, due to the high welding temperature, the weld layer in contact with the insulation layer 104 of busbar 103 melts when heated. After cooling, it will form spikes. The spikes will pierce the insulation layer 104, which will cause the battery cell 105 under the insulation layer to have a risk of microcracks, resulting in insulation failure and short circuit.

[0032] In some embodiments, such as Figure 1 As shown, the photovoltaic cell 101 and the cell 105 below the insulating layer can be two different cells, and the photovoltaic cell 101 and the cell 105 below the insulating layer can be stacked or not.

[0033] In other embodiments, such as Figure 2 As shown, the solar cell 105 below the insulating layer and the photovoltaic cell 101 can also be the same solar cell. To solve the above problems, this utility model provides the following multiple embodiments:

[0034] Example 1:

[0035] This utility model provides a busbar 103. Figure 3 A schematic diagram of a busbar structure provided by this utility model is shown below. Figure 3 As shown, the busbar 103 includes: a core layer 1031, including a first surface 10311 and a second surface 10312 opposite to each other; a first welding layer 1032, located on the first surface 10311 of the core layer 1031, for connection with the welding strip 102; and a second welding layer 1033, located on the second surface 10312 of the core layer 1031, wherein the thickness d1 of the first welding layer 1032 is greater than the thickness d2 of the second welding layer 1033.

[0036] In this embodiment, the second welding layer 1033 is in contact with the insulating layer 104, that is, the fourth surface 1037 of the busbar 103 is the surface of the second welding layer 1033 away from the core layer.

[0037] The thickness of the first weld layer 1032 ranges from 8μm to 25μm. For example, the thickness of the first weld layer 1032 is 8μm, 10μm, 15μm, 20μm, or 25μm.

[0038] The thickness of the second weld layer 1033 ranges from 5 μm to 20 μm. For example, the thickness of the second weld layer 1033 is 5 μm, 10 μm, 15 μm, or 20 μm.

[0039] Based on this embodiment, compared with the existing solution, in the busbar 103 provided by this utility model, since the thickness of the first welding layer 1032 on the first surface 10311 connected to the welding strip 102 is greater than the thickness of the second welding layer 1033 on the second surface 10312, during welding, the first welding layer 1032 and the second welding layer 1033 will melt and subsequently cool to form spikes. The spikes will pierce the insulation layer 104, which will cause the battery cell 105 below the insulation layer 104 to have a risk of microcracks, thereby leading to insulation failure and short circuit. Since the thickness of the second welding layer 1033 is smaller, the spikes formed after the second welding layer 1033 melts and cools will also be smaller, thereby reducing the risk of the spikes piercing the insulation layer 104. In the process of manufacturing photovoltaic modules, the risk of microcracks in the battery cell 105 can be reduced and the insulation performance can be improved.

[0040] Example 2:

[0041] This utility model provides a busbar 103. Figure 4 A schematic diagram of another busbar provided by this utility model is shown below. Figure 4As shown, the busbar 103 includes: a core layer 1031, including a first surface 10311 and a second surface 10312 opposite to each other; a first weld layer 1032, located on the first surface 10311 of the core layer 1031, for connection with the weld strip 102; and a second weld layer 1033, located on the second surface 10312 of the core layer 1031, wherein the highest temperature of the melting range of the first weld layer 1032 is lower than the melting point of the second weld layer 1033.

[0042] In this embodiment, the second welding layer 1033 is in contact with the insulating layer 104, that is, the fourth surface 1037 of the busbar 103 is the surface of the second welding layer 1033 away from the core layer.

[0043] The first weld layer 1032 has a melting range of 100℃-180℃. For example, the melting range of the first weld layer 1032 is 100℃-150℃, 140℃-170℃, or 150℃-180℃.

[0044] The first welding layer 1032 can be a tin-bismuth alloy layer, or, as... Figure 4 As shown, the first welding layer 1032 can be a tin-lead-bismuth alloy layer.

[0045] The melting point range of the second weld layer 1033 is 160℃-220℃. For example, the melting points of the second weld layer 1033 are 160℃, 170℃, 180℃, 190℃, 200℃, 210℃, and 220℃.

[0046] The second welding layer 1033 can be a tin-lead alloy layer.

[0047] Based on this embodiment, compared with the existing solution, in the busbar 103 provided by this utility model, since the highest temperature of the melting range of the first welding layer 1032 on the first surface 10311 connected to the welding strip 102 is lower than the melting point of the second welding layer 1033 on the second surface 10312, the first welding layer 1032 and the second welding layer 1033 will melt during welding, and subsequently cool to form spikes. The spikes will pierce the insulation layer 104, which will cause the battery cell 105 under the insulation layer 104 to have a risk of microcracks, thereby leading to insulation failure and short circuit. The welding temperature can be set to a temperature between the highest temperature of the melting range of the first welding layer 1032 and the melting point of the second welding layer 1033, so that the first welding layer 1032 melts to complete the welding, while the second welding layer 1033 does not reach the melting point and does not melt. This minimizes the melting of the second welding layer 1033, reduces the generation of spikes, and thus reduces the risk of spikes piercing the insulation layer 104. This can reduce the risk of microcracks in the solar cell 105 during the manufacturing of photovoltaic modules and improve insulation performance.

[0048] Example 3:

[0049] This utility model provides a busbar 103. Figure 5 A schematic diagram of another busbar provided by this utility model is shown below. Figure 5 As shown, the busbar 103 includes: a core layer 1031, including a first surface 10311 and a second surface 10312 opposite to each other; a first welding layer 1032, located on the first surface 10311 of the core layer 1031, for connection with the welding strip 102; a heat insulation layer 1034, located on the second surface 10312 of the core layer 1031; and a second welding layer 1033, located on the heat insulation layer 1034.

[0050] In this embodiment, the second welding layer 1033 is in contact with the insulating layer 104, that is, the fourth surface 1037 of the busbar 103 is the surface of the second welding layer 1033 away from the core layer.

[0051] As an example, the insulation layer 1034 can be an aluminum-based composite material layer. The thermal conductivity of the aluminum-based composite material layer ranges from 10 W / (m·K) to 20 W / (m·K). For example, the thermal conductivity of the aluminum-based composite material layer is 10 W / (m·K), 12 W / (m·K), 14 W / (m·K), 16 W / (m·K), 18 W / (m·K), and 20 W / (m·K).

[0052] The thickness of the aluminum-based composite layer ranges from 10 μm to 60 μm. For example, the thickness of the aluminum-based composite layer is 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, and 60 μm.

[0053] As another example, the insulation layer 1034 can be a polymer resin layer. The thermal conductivity of the polymer resin layer ranges from 0.1 W / (m·K) to 6 W / (m·K). For example, the thermal conductivity of the polymer resin layer is 0.1 W / (m·K), 0.2 W / (m·K), 0.3 W / (m·K), 0.4 W / (m·K), 0.5 W / (m·K), and 0.6 W / (m·K).

[0054] The thickness of the polymer resin layer ranges from 10μm to 40μm. For example, the thickness of the polymer resin layer is 10μm, 20μm, 30μm, or 40μm.

[0055] As another example, the insulation layer 1034 can be an aerogel coating. The thermal conductivity of the aerogel coating ranges from 0.012 W / (m·K) to 0.03 W / (m·K). For example, the thermal conductivity of the aerogel coating is 0.012 W / (m·K), 0.015 W / (m·K), 0.020 W / (m·K), 0.025 W / (m·K), and 0.03 W / (m·K).

[0056] The thickness of the aerogel coating ranges from 10 μm to 40 μm. For example, the thickness of the aerogel coating is 10 μm, 20 μm, 30 μm, and 40 μm.

[0057] Based on this embodiment, compared to existing solutions, in the busbar 103 provided by this utility model, since the first welding layer 1032 for connection with the welding ribbon 102 is located on the first surface 10311 of the core layer 1031, and a heat insulation layer 1034 is provided between the second welding layer 1033 and the second surface 10312 of the core layer 1031, during welding, the first welding layer 1032 and the second welding layer 1033 will melt, and subsequently cool to form spikes. These spikes can pierce the insulation layer 104, which may cause microcracks in the solar cell 105 below the insulation layer 104, leading to insulation failure and short circuit. The heat insulation layer 1034 can provide heat insulation, reducing the heat transferred from the first welding layer 1032 to the second welding layer 1033, minimizing the melting of the second welding layer 1033, reducing the generation of spikes, and thus reducing the risk of spikes piercing the insulation layer 104. This can reduce the risk of microcracks in the solar cell 105 during the manufacturing of photovoltaic modules and improve insulation performance.

[0058] Example 4:

[0059] This utility model provides a busbar 103. Figure 6 A schematic diagram of another busbar provided by this utility model is shown below. Figure 6 As shown, the busbar 103 includes: a core layer 1031, including a first surface 10311 and a second surface 10312 opposite to each other; a first welding layer 1032, located on the first surface 10311 of the core layer 1031, for connection with the welding strip 102; a second welding layer 1033, located on the second surface 10312 of the core layer 1031; and a protective layer 1035, located on the second welding layer 1033.

[0060] In this embodiment, the protective layer 1035 is in contact with the insulating layer 104, that is, the fourth surface 1037 of the busbar 103 is the surface of the protective layer 1035 away from the core layer.

[0061] The protective layer 1035 can be made of silicone, fiberglass silicone, EVA, POE or PVB.

[0062] The thickness of the protective layer 1035 ranges from 15 μm to 500 μm. For example, the thickness of the protective layer 1035 is 15 μm, 50 μm, 100 μm, 200 μm, 300 μm, 400 μm, and 500 μm.

[0063] The protective layer 1035 and the busbar 103 can be manufactured separately and then bonded together by lamination or coating processes. Alternatively, the protective layer 1035 can be integrally formed with the busbar 103. Preferably, the protective layer 1035 and the busbar 103 are integrally formed, which can improve the overall integrity of the busbar 103.

[0064] Based on this embodiment, compared to existing solutions, in the busbar 103 provided by this utility model, since the first welding layer 1032 for connection with the welding strip 102 is located on the first surface 10311 of the core layer 1031, and a protective layer 1035 is provided on the second welding layer 1033, during welding, the first welding layer 1032 and the second welding layer 1033 will melt and subsequently form spikes upon cooling. These spikes can pierce the insulation layer 104, which may cause microcracks in the solar cell 105 below the insulation layer 104, leading to insulation failure and short circuit. The protective layer 1035 can prevent the spikes formed by the second welding layer 1033 from piercing the insulation layer 104, thereby reducing the risk of the spikes piercing the insulation layer 104. This can reduce the risk of microcracks in the solar cell 105 during the manufacturing of photovoltaic modules and improve insulation performance.

[0065] In the four embodiments provided by this utility model, each embodiment can be implemented individually, or at least two embodiments can be combined.

[0066] For example, based on Embodiment 1 and in conjunction with Embodiment 3, that is, while the thickness of the first welding layer 1032 is greater than the thickness of the second welding layer 1033, a heat insulation layer 1034 is provided between the core layer 1031 and the second welding layer 1033. The specific description of the heat insulation layer 1034 can be referred to Embodiment 3, and will not be repeated here.

[0067] For example, based on Embodiment 1 and combined with Embodiment 3 and / or Embodiment 4, that is, while the highest temperature of the melting range of the first welding layer 1032 is less than the melting point of the second welding layer 1033, a heat insulation layer 1034 is provided between the core layer 1031 and the second welding layer 1033. The specific description of the heat insulation layer 1034 can be referred to Embodiment 3, and will not be repeated here. And / or, a protective layer 1035 is provided on the second welding layer 1033. The specific description of the protective layer 1035 can be referred to Embodiment 4, and will not be repeated here.

[0068] For example, based on Embodiment 4 and combined with Embodiment 1, that is, while a protective layer 1035 is provided on the surface of the second welding layer 1033, the thickness of the first welding layer 1032 is greater than the thickness of the second welding layer 1033. For a detailed description of the thickness of the welding layer, please refer to Embodiment 1. This utility model will not be repeated here.

[0069] The above are merely examples illustrating the combinations of the four embodiments. There can be many more combinations among the four embodiments, and this utility model does not impose any specific limitations on them.

[0070] This utility model also provides a photovoltaic module 10, which includes: a photovoltaic cell 101; a solder ribbon 102 connected to the photovoltaic cell 101; a busbar 103 provided in the above embodiments, including a third surface 1036 and a fourth surface 1037 opposite to each other, the third surface 1036 of the busbar 103 being connected to the solder ribbon 102; and an insulating layer 104 in contact with the fourth surface 1037 of the busbar 103.

[0071] It should be noted that the specific structural diagram of photovoltaic module 10 can be found in the following reference. Figure 1 or Figure 2 .

[0072] Furthermore, the photovoltaic module 10 may also include a metal frame, a backsheet, photovoltaic glass, and an encapsulant film. The encapsulant film can be filled between the front and back of the photovoltaic cells 101, the photovoltaic glass, and adjacent photovoltaic cells 101. As a filler, it can be a transparent colloid with good light transmittance and aging resistance. For example, the encapsulant film can be EVA film or POE film, and the specific choice can be made according to the actual situation, without limitation.

[0073] Photovoltaic glass can be applied to the encapsulating film on the front side of the photovoltaic cell 101. The photovoltaic glass can be ultra-clear glass, which has high light transmittance, high transparency, and superior physical, mechanical, and optical properties. For example, ultra-clear glass can achieve a light transmittance of over 93%. It can protect the photovoltaic cell 101 while minimizing any impact on its efficiency. Simultaneously, the encapsulating film bonds the photovoltaic glass and the photovoltaic cell 101 together, providing sealing, insulation, waterproofing, and moisture protection for the photovoltaic cell 101.

[0074] The backsheet can be attached to the adhesive film on the back of the photovoltaic cell 101. The backsheet protects and supports the photovoltaic cell 101, and has reliable insulation, water resistance, and aging resistance. Multiple options are available for the backsheet, typically tempered glass, acrylic glass, aluminum alloy TPT composite adhesive film, etc., and the specific choice depends on the specific circumstances and is not limited here. The backsheet, photovoltaic cell 101, adhesive film, and photovoltaic glass can be housed within a metal frame. The metal frame serves as the main external support structure for the entire photovoltaic module 10, providing stable support and installation for the photovoltaic module 10. For example, the photovoltaic module 10 can be installed at the desired location using the metal frame.

[0075] This utility model embodiment provides a photovoltaic system, including the photovoltaic module 10 described above.

[0076] In this embodiment, the photovoltaic system can be applied in photovoltaic power plants, such as ground-mounted power plants, rooftop power plants, and floating power plants. It can also be applied to equipment or devices that utilize solar energy to generate electricity, such as user solar power supplies, solar streetlights, solar cars, and solar buildings. Of course, it is understood that the application scenarios of the photovoltaic system are not limited to these; that is, the photovoltaic system can be applied in all fields that require solar energy to generate electricity. Taking a photovoltaic power generation system network as an example, the photovoltaic system may include a photovoltaic array, a combiner box, and an inverter. The photovoltaic array may be an array combination of multiple photovoltaic modules 10. For example, multiple photovoltaic modules 10 can form multiple photovoltaic arrays. The photovoltaic array is connected to the combiner box, which can collect the current generated by the photovoltaic array. The collected current flows through the inverter and is converted into AC power required by the mains power grid before being connected to the mains power grid to achieve solar power supply.

[0077] Although the present invention has been described herein in conjunction with various embodiments, those skilled in the art will understand and implement other variations of the disclosed embodiments by reviewing the accompanying drawings, the disclosure, and the appended claims in carrying out the claimed invention. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit can implement several functions listed in the claims. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce good results.

[0078] Although the present invention has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made thereto without departing from the spirit and scope of the present invention. Accordingly, this specification and drawings are merely exemplary descriptions of the present invention as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of the present invention. Clearly, those skilled in the art can make various alterations and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and modifications of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and modifications.

Claims

1. A busbar, characterized in that, The busbar includes: The core layer includes opposing first and second surfaces; The first welding layer, located on the first surface of the core layer, is used to connect with the welding strip; The second welding layer is located on the second surface of the core layer, and the thickness of the first welding layer is greater than the thickness of the second welding layer.

2. The busbar according to claim 1, characterized in that, The thickness of the first weld layer ranges from 8μm to 25μm.

3. The busbar according to claim 1, characterized in that, The thickness of the second weld layer ranges from 5μm to 20μm.

4. The busbar according to claim 1, characterized in that, The busbar also includes a heat insulation layer located between the second surface of the core layer and the second weld layer.

5. The busbar according to claim 4, characterized in that, The heat insulation layer is a polymer resin layer.

6. The busbar according to claim 5, characterized in that, The thermal conductivity of the polymer resin layer ranges from 0.1 W / (m·K) to 6 W / (m·K).

7. The busbar according to claim 4, characterized in that, The heat insulation layer is an aerogel coating.

8. The busbar according to claim 7, characterized in that, The thermal conductivity of the aerogel coating ranges from 0.012 W / (m·K) to 0.03 W / (m·K).

9. A photovoltaic module, characterized in that, The photovoltaic module includes: Photovoltaic cells; The solder strip is connected to the photovoltaic cell; The busbar according to any one of claims 1-8 includes opposing third and fourth surfaces, wherein the third surface of the busbar is connected to the solder strip; An insulating layer is in contact with the fourth surface of the busbar.

10. A photovoltaic system, characterized in that, The photovoltaic system includes the photovoltaic module as described in claim 9.

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