A precision controlled roll coating device

Abstract

The utility model is suitable for roller coating device field provides a kind of precision control roller coating device, it includes first rotating roller, second rotating roller, driving part and telescopic link, and first rotating roller is at least partly located in liquid storage tank.Second rotating roller part is contacted with first rotating roller, and extrude first rotating roller in the process of rotating, to control the glue-carrying amount on first rotating roller.The end of telescopic link away from driving part is connected with second rotating roller, and driving part is used to drive telescopic link telescopic motion in the case of working, and second rotating roller is driven to move towards the direction of approaching or away from first rotating roller in the case of telescopic link telescopic motion, to adjust the contact distance of second rotating roller and first rotating roller.Through the setting of first rotating roller, second rotating roller, driving part and telescopic link, the problem of uneven film thickness, material waste and insufficient film thickness control precision in traditional roller coating process is solved, and the utility model has the advantages of improving coating uniformity and improving film thickness control precision.

Description

Technical Field

[0001] This utility model belongs to the technical field of roller coating equipment, and in particular relates to a precision control roller coating equipment. Background Technology

[0002] In the manufacturing process of solar cells, masking technology is widely used in key process steps such as selective emitter (SE) fabrication, localized back surface field (BSF) formation, and fine grid line patterning. The main methods for coating masking adhesives include roll coating, spin coating, and spray coating. While spin coating can achieve high film thickness uniformity and pattern accuracy, it suffers from low production capacity and insufficient material utilization, making it difficult to meet the needs of large-scale production in the photovoltaic industry. Spray coating technology, although suitable for coating complex surfaces, has high equipment costs and is prone to fogging pollution, leading to increased production costs and hindering cost reduction and efficiency improvement in photovoltaic cells. In contrast, roll coating technology, due to its high production efficiency and low equipment cost, has become the mainstream choice for masking adhesive coating in the photovoltaic industry.

[0003] However, traditional roller coating technology still faces the following technical bottlenecks:

[0004] 1. Poor film thickness uniformity and high material consumption per unit area.

[0005] Traditional roller coating processes rely on mechanical roller pressure to transfer the adhesive. This is susceptible to fluctuations in adhesive viscosity, roller speed, and pressure, which can easily lead to uneven film thickness, resulting in streaks or edge buildup. Furthermore, to ensure adequate adhesive coverage, excessive adhesive supply is often required, leading to material waste and increased production costs.

[0006] 2. Difficulty in controlling film thickness at the micrometer level and insufficient pattern accuracy.

[0007] The precision requirements for mask patterns in high-efficiency solar cells (such as TOPCon and HJT) are increasing. Traditional roll coating technology is difficult to achieve submicron-level film thickness control, especially in fine grid lines (<20μm) or selective doping processes, which can easily lead to uneven linewidth or pattern distortion, affecting the photoelectric conversion efficiency of the cell.

[0008] 3. Limitations of single-sided coating and risk of contamination transfer

[0009] Existing roll coating technologies typically only support single-sided coating; double-sided coating requires secondary processing, reducing production efficiency. Furthermore, during the transfer process, coated silicon wafers are prone to scratches or contamination of the adhesive surface due to mechanical contact, affecting the reliability of subsequent etching or diffusion processes and leading to a decrease in cell yield.

[0010] To address the aforementioned issues, there is an urgent need to develop a new type of roller coating device that can achieve high-precision and high-uniformity mask coating while ensuring high production capacity and low cost, and reduce the risk of damage during silicon wafer transfer, so as to meet the stringent requirements of high-efficiency solar cell manufacturing. Utility Model Content

[0011] The precision control roller coating device provided in this embodiment aims to solve the technical problems of low coating accuracy and uneven coating in existing roller coating devices.

[0012] This utility model embodiment is implemented as follows: a precision-controlled roller coating device is used to apply masking adhesive to one side of a silicon wafer. The precision-controlled roller coating device includes:

[0013] A first rotating roller, at least partially located within a liquid storage tank, carries colloid from the liquid storage tank during rotation;

[0014] The second rotating roller partially contacts the first rotating roller and squeezes the first rotating roller during rotation to control the amount of adhesive carried on the first rotating roller and to make the adhesive on the first rotating roller spread evenly.

[0015] The device includes a drive unit and a telescopic rod that is driven to connect with the drive unit. One end of the telescopic rod away from the drive unit is connected to the second rotating roller. When the drive unit is in operation, it drives the telescopic rod to extend and retract. When the telescopic rod extends and retracts, it drives the second rotating roller to move towards or away from the first rotating roller, thereby adjusting the contact distance between the second rotating roller and the first rotating roller.

[0016] Furthermore, the surface of the first rotating roller is covered with a rubber layer, and the surface of the rubber layer is provided with a plurality of annular grooves;

[0017] The plurality of annular grooves are arranged at intervals along the length of the first rotating roller;

[0018] The spacing between two adjacent annular grooves is the same;

[0019] The annular groove is arranged radially around the first rotating roller.

[0020] Furthermore, the first rotating roller and the second rotating roller are arranged horizontally;

[0021] The axis of the first rotating roller is aligned with the axis of the second rotating roller, and the size of the second rotating roller is smaller than the size of the first rotating roller.

[0022] Furthermore, the precision control roller coating device also includes a first drive assembly and a second drive assembly;

[0023] The first drive component is connected to the first rotating roller and is used to drive the first rotating roller to rotate;

[0024] The second drive assembly is connected to the second rotating roller and is used to drive the second rotating roller to rotate.

[0025] Furthermore, the deviation between the linear velocity of the surface of the first rotating roller and the linear velocity of the surface of the second rotating roller is less than 0.5%, and the rotation directions of the first rotating roller and the second rotating roller are opposite.

[0026] Furthermore, the driving component includes a linear motor and a telescopic rod. One end of the telescopic rod is connected to the linear motor, and the other end of the telescopic rod is connected to the second rotating roller. The linear motor operates to drive the second rotating roller to move toward the first rotating roller, or to drive the second rotating roller to move away from the first rotating roller.

[0027] Furthermore, the precision roller coating device also includes a transport roller, which is arranged at intervals with the first rotating roller. The upper surface of the transport roller is flush with the upper surface of the first rotating roller. The transport roller and the first rotating roller cooperate to drive the silicon wafer to move and make the lower surface of the silicon wafer contact the first rotating roller so that the silicon wafer is coated with the colloid.

[0028] Furthermore, the precision control roller coating device also includes at least one ejector roller, which is arranged at intervals with the first rotating roller. The outer surface of the ejector roller is provided with protrusions at intervals, and the protrusions are in the shape of equilateral triangles. The upper surface of the first rotating roller is flush with the upper surface of the ejector roller.

[0029] Furthermore, the precision control roller coating apparatus also includes a transfer mechanism, which comprises:

[0030] A rotating part, one end of which is provided with a flip motor, the rotating part includes a first state and a second state, and the flip motor is used to drive the rotating part to move between the first state and the second state;

[0031] An adsorption assembly is located on one side of the rotating part. When the rotating part is in the first state, the adsorption assembly can be used to adsorb the silicon wafer. When the rotating part is in the second state, the adsorption assembly can be used to release the silicon wafer to place the silicon wafer on the conveyor belt.

[0032] Furthermore, the transfer mechanism also includes a detection sensor electrically connected to the flip motor. When the detection sensor detects a silicon wafer on the ejector roller, the flip motor rotates to cause the adsorption assembly to adsorb the silicon wafer.

[0033] The beneficial effects achieved by this utility model are as follows: since the first rotating roller is at least partially located in the liquid storage tank, it can continuously carry the colloid during the rotation of the first rotating roller. Due to the setting of the driving component and the telescopic rod, when the driving component is working, it drives the second rotating roller to move towards or away from the first rotating roller, thereby adjusting the contact distance between the second rotating roller and the first rotating roller. Therefore, it can change the mutual extrusion force between the second rotating roller and the first rotating roller, thereby achieving precise control of the amount of colloid carried and achieving uniform extension. Thus, it solves the problems of uneven film thickness, material waste and insufficient film thickness control accuracy in traditional roller coating processes, and has the advantages of improving coating uniformity, reducing material waste and improving film thickness control accuracy. Attached Figure Description

[0034] Figure 1 This is a plan view of the precision control roller coating device provided in this embodiment of the utility model;

[0035] Figure 2 This is a partial plan view of the precision control roller coating device provided in this embodiment of the utility model;

[0036] Figure 3 This is an enlarged schematic diagram of the first rotating roller. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0038] In existing technologies, the coating of masking adhesive in solar cell manufacturing commonly employs roller coating processes. However, traditional roller coating equipment suffers from problems such as poor film thickness uniformity, high adhesive consumption, and difficulty in controlling micron-level film thickness. Conventional roller coating equipment relies on rotating rollers with fixed spacing for adhesive transfer. When the adhesive viscosity or roller speed fluctuates, it can easily lead to streaks or edge buildup on the coated surface. This application, through the arrangement of a first rotating roller, a second rotating roller, a driving component, and a telescopic rod, ensures that the first rotating roller, at least partially located within the liquid storage tank, continuously carries the colloid during its rotation. The driving component and telescopic rod, when activated, cause the telescopic rod to extend and retract, which in turn moves the second rotating roller closer to or further away from the first rotating roller. This adjusts the contact distance between the second and first rotating rollers, altering the mutual pressure between them. Consequently, it achieves precise control of the colloid carrying capacity and uniform spreading, thus solving the problems of uneven film thickness, material waste, and insufficient film thickness control accuracy in traditional roller coating processes. It offers advantages such as improved coating uniformity, reduced material waste, and enhanced film thickness control accuracy.

[0039] Example 1

[0040] Please see Figures 1 to 3 The present invention is implemented as follows: a precision roller coating device 1000 is used to apply masking adhesive to one side of a silicon wafer. The precision roller coating device 1000 includes:

[0041] The first rotating roller 10 is at least partially located inside the liquid storage tank 50, and the first rotating roller 10 carries the colloid from the liquid storage tank 50 during rotation.

[0042] The second rotating roller 20 is in at least partial contact with the first rotating roller 10. During rotation, the second rotating roller 20 squeezes the first rotating roller 10 to control the amount of adhesive carried on the first rotating roller 10 and to make the adhesive on the first rotating roller 10 spread evenly.

[0043] The driving component 401 and the telescopic rod 402 driven and connected to the driving component 401 are provided. The end of the telescopic rod 402 away from the driving component 401 is connected to the second rotating roller 20. When the driving component 401 is working, it is used to drive the telescopic rod 402 to extend and retract. When the telescopic rod 402 extends and retracts, it drives the second rotating roller 20 to move towards or away from the first rotating roller 10, thereby adjusting the contact distance between the second rotating roller 20 and the first rotating roller 10.

[0044] Specifically, the first rotating roller 10 refers to a cylindrical roller whose surface can adhere to colloids. This can be achieved by covering a metal roller core with an elastic material layer, which enhances the colloid's adsorption capacity. The second rotating roller 20 refers to a cylindrical roller that forms contact pressure with the first rotating roller 10. This can be achieved by using a smooth, hard metal roller, generating a uniform squeezing effect through rigid contact. The driving component 401 and the telescopic rod 402, which is driven and connected to the driving component 401, are mechanical structures that can change the distance between the two rollers. This can be achieved by using a linear motor 401 to drive the telescopic rod 402, adjusting the contact pressure between the two rollers through linear displacement.

[0045] In this embodiment, the second rotating roller 20 is made of stainless steel (Rockwell hardness HRC≥50) or a ceramic-coated roller (surface roughness Ra≤0.2μm). It is understood that in other embodiments, the second rotating roller 20 may also be made of other materials, which can be considered according to the actual situation and are not limited here.

[0046] Furthermore, when the first rotating roller 10 rotates within the liquid storage tank 50, it is immersed in the tank, allowing the adhesive to be absorbed onto its surface and form an adhesive film. The second rotating roller 20 contacts the surface of the first rotating roller 10 in a reverse rotation, removing excess adhesive through rigid extrusion, thus achieving a more uniform adhesive film thickness. The driving component 401 and the telescopic rod 402, which is connected to the driving component 401, adjust the contact distance (spacing) between the first and second rotating rollers 10 and 20 in real time according to changes in adhesive viscosity. When the adhesive viscosity increases, the spacing increases to increase the amount of adhesive carried; when the viscosity decreases, the spacing decreases to reduce the amount of adhesive carried. This dynamic adjustment process eliminates the influence of adhesive parameter fluctuations on coating quality, thereby controlling the amount of adhesive transferred. The extruded adhesive falls back into the liquid storage tank 50, preventing adhesive waste. The spacing adjustment range of the first and second rotating rollers 10 can be between 0.1 and 2 mm, achieving more precise control. The structure is simple and easy to implement.

[0047] It should be noted that in this embodiment, the liquid storage tank 50 maintains the liquid level so that the immersion depth of the first rotating roller 10 is 1 / 3 of the diameter of the first rotating roller 10. At the same time, the first rotating roller 10 and the second rotating roller 20 are detachable, so different rotating rollers can be replaced to perform roller coating on different products. The structure is simple and easy to implement. The detachable connection can be a snap-fit, screw connection, etc., which is not limited here.

[0048] In other words, this embodiment achieves real-time control of the adhesive carrying amount through an adjustable-pitch extrusion roller structure, effectively solving the problem of adhesive layer thickness fluctuation and realizing dynamic control of the adhesive coating thickness, significantly improving film uniformity. The quantitative removal function of the second rotating roller 20 (extrusion roller) reduces material waste caused by excessive adhesive carrying. The drive component 401 and the telescopic rod 402 driven by the drive component 401 enable the precision roller coating device 1000 to adapt to adhesives of different viscosities, enhancing process adaptability.

[0049] Example 2

[0050] Please see Figure 3 Furthermore, the surface of the first rotating roller 10 is covered with a rubber layer, and the surface of the rubber layer is provided with a plurality of annular grooves 101;

[0051] Multiple annular grooves 101 are arranged at intervals along the length of the first rotating roller 10;

[0052] The spacing between two adjacent annular grooves 101 is the same;

[0053] The annular groove 101 is arranged radially around the first rotating roller 10.

[0054] In this embodiment, the rubber layer refers to the elastic material layer covering the surface of the metal roller. It is mainly made of EPDM (Ethylene Propylene Diene Monomer) rubber (Shore hardness 30-50A). Because its main chain is composed of chemically stable saturated hydrocarbons and contains unsaturated double bonds only in the side chains, it has excellent aging resistance such as ozone resistance, heat resistance, and weather resistance, which helps to extend its service life. Of course, in other embodiments, nitrile rubber or silicone rubber can also be used. Its elastic modulus can be adapted to the viscosity of the colloid to buffer the contact pressure between the rotating rollers and enhance the colloid adsorption capacity. Among them, the annular groove 101 refers to the groove structure continuously distributed along the circumference of the roller. Specifically, it can be laser-engraved. The cross-sectional shape of the groove can be rectangular or trapezoidal, which is used to accommodate and uniformly release the colloid and reduce the flow resistance of the colloid layer.

[0055] The distance between two adjacent annular grooves 101 is between 50 and 500 μm, and the groove depth is between 50 and 200 μm.

[0056] Specifically, when the first rotating roller 10 is immersed in the liquid storage tank 50, the rubber layer surface adsorbs the colloid. During rotation, the annular groove 101 divides the colloid into strip-shaped liquid films evenly distributed along the length of the roller. The equidistant arrangement of adjacent grooves creates a periodic pressure gradient of the colloid on the roller surface. Under the squeezing action between the rollers, the colloid extends radially, eliminating local accumulation or flow interruption. The radial arrangement of the grooves ensures that the colloid is evenly distributed circumferentially on the roller surface, avoiding coating streaks caused by roller speed fluctuations.

[0057] In this embodiment, the uniform distribution of the adhesive on the surface of the first rotating roller 10 effectively suppresses edge accumulation and streak defects during the coating process, reducing material waste. At the same time, the annular groove 101 structure enhances the adhesion between the adhesive layer and the roller surface, avoids adhesive splashing during high-speed rotation, and improves the stability of the coating process.

[0058] Example 3

[0059] Please see Figure 1 and Figure 2 Furthermore, the first rotating roller 10 and the second rotating roller 20 are arranged horizontally;

[0060] The axis of the first rotating roller 10 is aligned with the axis of the second rotating roller 20, and the size of the second rotating roller 20 is smaller than the size of the first rotating roller 10.

[0061] Specifically, "alignment" means that the axes of the two rotating rollers are on the same horizontal plane. This can be achieved using a rigid support frame and a leveling device, eliminating the influence of gravity on the distribution of the colloid and ensuring that the colloid is evenly spread on the roller surface. "Parallel axes" means that the axes of the two rotating rollers are kept parallel. This can be achieved using precision bearings and locating pins, avoiding fluctuations in colloid transfer caused by axis misalignment. "Size difference" means that the diameter of the second rotating roller 20 is smaller than the diameter of the first rotating roller 10. Specifically, the diameter ratio of the second rotating roller 20 to the first rotating roller 10 can be 1:3, 1:3.5, or 1:4. By reducing the contact area of ​​the second rotating roller 20, the accuracy of colloid adjustment on the first rotating roller 10 is enhanced.

[0062] Furthermore, since the first rotating roller 10 and the second rotating roller 20 are horizontally arranged, their parallel axes create a stable contact area. During the extrusion process, the second rotating roller 20 applies uniform pressure to the colloid on the surface of the first rotating roller 10. The dimensional difference reduces the volume of colloid that the second rotating roller 20 contacts per unit time, thereby precisely controlling the amount of colloid transferred. During the silicon wafer coating process, the colloid on the surface of the first rotating roller 10 forms a uniform film through the extrusion of the second rotating roller 20. The horizontal layout further prevents the colloid from sagging or accumulating at the edges due to gravity.

[0063] In this embodiment, the problem of insufficient control precision of colloid transfer amount in traditional roller coating process is effectively solved, and stable control of micron-level colloid film thickness is achieved. At the same time, material waste caused by uneven colloid distribution is avoided, which can meet the stringent requirements for mask pattern precision in the manufacturing of high-efficiency solar cells.

[0064] Example 4

[0065] Please see Figure 1 and Figure 2 Furthermore, the precision control roller coating device 1000 also includes a first drive assembly 60 and a second drive assembly 70;

[0066] The first drive assembly 60 is connected to the first rotating roller 10 and is used to drive the first rotating roller 10 to rotate.

[0067] The second drive assembly 70 is connected to the second rotating roller 20 and is used to drive the second rotating roller 20 to rotate.

[0068] Furthermore, the first drive assembly 60 refers to a mechanical transmission unit that independently controls the rotation of the first rotating roller 10. Specifically, it can be implemented using a servo motor in conjunction with a reduction gearbox. By adjusting the motor speed, the linear velocity of the first rotating roller 10 is changed, thereby controlling the amount of colloid carried from the storage tank 50. The second drive assembly 70 refers to a mechanical transmission unit that independently controls the rotation of the second rotating roller 20. Specifically, it can be implemented using a stepper motor in conjunction with a synchronous belt drive mechanism. By adjusting the motor's direction and speed, the second rotating roller 20 applies a controllable squeezing action to the first rotating roller 10, thereby adjusting the uniformity of colloid spreading.

[0069] Specifically, the first drive assembly 60 and the second drive assembly 70 independently drive the first rotating roller 10 and the second rotating roller 20, respectively, allowing for precise control of the rotational speed and direction of the two rollers. When the first rotating roller 10 carries the colloid upwards, the second rotating roller 20 rotates in the opposite direction and applies pressure. By synchronously adjusting the surface linear velocity of the two rollers, thickness fluctuations caused by speed deviations during colloid transfer are eliminated. The independent control of the drive assemblies allows for dynamic adjustment of the contact pressure and relative speed between the two rollers, thereby adapting to the coating requirements of colloids with different viscosities.

[0070] In existing technologies, roller coating devices typically use a single drive source to control the rotation of two rollers via gears or chains. This results in forced synchronization of the two roller speeds, which cannot be independently adjusted. Speed ​​deviations easily occur when the viscosity of the colloid changes or the roller surface wears, leading to uneven coating thickness. This embodiment, by setting independent first drive assembly 60 and second drive assembly 70, achieves precise matching and dynamic compensation of the rotational speeds of the first rotating roller 10 and the second rotating roller 20, effectively solving the problem of unstable colloid transfer caused by mechanical transmission errors in traditional linkage mechanisms.

[0071] In other words, in this embodiment, the rotational speeds of the first rotating roller 10 and the second rotating roller 20, as well as the contact pressure between them, can be adjusted in real time according to the properties of the colloid. This forms a uniformly thick colloid film on the silicon wafer surface, reducing stripe defects caused by speed mismatch and avoiding material waste due to excessive colloid accumulation. The independent drive mechanism also improves the equipment's adaptability to different process parameters, maintaining stable coating quality even when the silicon wafer transport speed changes.

[0072] Example 5

[0073] Furthermore, the deviation between the linear velocity of the surface of the first rotating roller 10 and the linear velocity of the surface of the second rotating roller 20 is less than 0.5%, and the rotation directions of the first rotating roller 10 and the second rotating roller 20 are opposite.

[0074] In this embodiment, the linear velocity deviation value refers to the ratio of the difference in tangential velocity at the contact point between the surfaces of the first rotating roller 10 and the second rotating roller 20. Specifically, it can be achieved through closed-loop speed control using a servo motor and encoder, thereby precisely matching the rotational speeds of the first rotating roller 10 and the second rotating roller 20. This reduces shear force fluctuations caused by speed differences during colloid transfer. The opposite rotation direction means that the movement directions of the contact points of the first rotating roller 10 and the second rotating roller 20 are opposite to each other. As described in Embodiment 4 above, this can be achieved by adjusting the first drive assembly 60 and the second drive assembly 70. The reverse movement creates a squeezing and shearing effect on the colloid, preventing colloid accumulation between the rollers.

[0075] Specifically, the first rotating roller 10 and the second rotating roller 20 rotate in opposite directions via independent drive systems, forming tangential movements in opposite directions in the contact area. With the linear velocity deviation between the first rotating roller 10 and the second rotating roller 20 controlled within 0.5%, the shear force experienced by the colloid during transfer remains stable, preventing film tearing or localized thickening due to speed differences. The squeezing action generated by the counter-rotation of the first rotating roller 10 and the second rotating roller 20 extends the colloid into a uniform film on the roller surface. Simultaneously, the friction generated by the counter-movement removes residual colloid particles from the roller surface, ensuring a uniform thickness layer is formed during film extension. This avoids colloid waste and improves the precision of the coating pattern, meeting the requirements for submicron-level film thickness control in high-efficiency solar cell manufacturing.

[0076] Example 6

[0077] Please refer to it again. Figure 1 and Figure 2 Furthermore, the drive unit 401 includes a linear motor 401 and a telescopic rod 402. One end of the telescopic rod 402 is connected to the linear motor 401, and the other end of the telescopic rod 402 is connected to the second rotating roller 20. The linear motor 401 works to drive the second rotating roller 20 to move toward the first rotating roller 10, or to drive the second rotating roller 20 to move away from the first rotating roller 10.

[0078] In this embodiment, the linear motor 401 refers to a drive device that directly generates linear motion through electromagnetic action. Specifically, it can be implemented using a coreless linear motor or a voice coil motor. The displacement accuracy is controlled by electrical signals, enabling micron-level position adjustment. The telescopic rod 402 refers to a transmission component with axial telescopic function. Specifically, it can be implemented using a ball screw or a hydraulic cylinder. It is used to transmit the linear motion of the linear motor 401 to the second rotating roller 20, thereby precisely adjusting the contact distance between the two rollers.

[0079] It should be noted that there are two linear motors 401, which are located at the two ends of the second rotating roller 20. The two linear motors 401 operate at the same frequency, which enables more precise pushing. The structure is simple and easy to implement.

[0080] Specifically, after receiving a control signal, the linear motor 401 drives the telescopic rod 402 to extend and retract axially. The telescopic rod 402 pushes the second rotating roller 20 to move closer to or away from the first rotating roller 10, thus changing the gap between the second rotating roller 20 and the first rotating roller 10. When it is necessary to reduce the amount of adhesive carried on the surface of the first rotating roller 10, the linear motor 401 drives the second rotating roller 20 closer to the first rotating roller 10, and scrapes off excess adhesive through the squeezing action between the two rollers. When it is necessary to increase the amount of adhesive carried, the linear motor 401 drives the second rotating roller 20 away from the first rotating roller 10, reducing the squeezing intensity. By adjusting the gap between the two rollers in real time, the amount of adhesive transferred can be dynamically controlled, ensuring that the adhesive layer thickness remains uniform during the coating process. This allows for precise control of the contact pressure between the second rotating roller 20 and the first rotating roller 10, eliminating uneven film thickness caused by unstable gaps during colloid transfer, and improving coating uniformity. In addition, the dynamic adjustment function reduces colloid waste, lowers material consumption per unit, and avoids edge accumulation caused by over-coating, thereby improving mask pattern accuracy and battery manufacturing yield.

[0081] Example 7

[0082] Please see Figure 1 Furthermore, the precision control roller coating device 1000 also includes a transport roller 80, which is arranged at intervals with the first rotating roller 10. The upper surface of the transport roller 80 is flush with the upper surface of the first rotating roller 10. The transport roller 80 and the first rotating roller 10 cooperate to drive the silicon wafer to move and make the lower surface of the silicon wafer contact the first rotating roller 10 so that the silicon wafer is coated with colloid.

[0083] Furthermore, the transport roller 80 refers to a transmission component with a cylindrical structure, specifically a chrome-plated metal roller body. Its diameter can match that of the first rotating roller 10, serving to support the silicon wafer and cooperate with the first rotating roller 10 to form a continuous transport plane. The "interval arrangement" refers to maintaining a fixed distance between the transport roller 80 and the first rotating roller 10, with the distance controlled between one-fifth and one-third of the silicon wafer length. This ensures that the silicon wafer does not shift or sag during movement. The second rotating roller 20 is located between the first rotating roller 10 and the transport roller 80. The "flush upper surfaces" means that the highest points of the transport roller 80 and the first rotating roller 10 are on the same horizontal plane. This can be achieved by adjusting the installation height using a laser calibration device, maintaining the contact stability between the silicon wafer and the first rotating roller 10 during transport.

[0084] Specifically, the transport rollers 80 and the first rotating roller 10 are arranged parallel to each other, and the silicon wafer is placed on the transport plane formed by the two. When the transport rollers 80 and the first rotating roller 10 rotate synchronously, the silicon wafer is clamped between them and moves in a straight line. During this process, the lower surface of the silicon wafer is always in contact with the first rotating roller 10, and the colloid is evenly transferred to the surface of the silicon wafer by the rotation of the first rotating roller 10. The supporting role of the transport rollers 80 can prevent the silicon wafer from bending due to its own weight, and the spaced arrangement design can prevent the silicon wafer from vibrating or slipping during movement.

[0085] Through the configuration of this embodiment, the problem of adhesive layer thickness fluctuation caused by insufficient support during the coating process of silicon wafers is reduced, the excessive accumulation of adhesive at the edge of the silicon wafer is decreased, and the displacement deviation of the silicon wafer caused by vibration is reduced. The synergistic effect of the transport roller 80 and the first rotating roller 10 realizes the smooth transport of silicon wafers, ensuring the uniformity and consistency of the adhesive transfer process, thereby improving the coating yield and material utilization rate.

[0086] Example 8

[0087] Please see Figure 1 Furthermore, the precision control roller coating device 1000 also includes at least one ejector roller 90, which is arranged at intervals with the first rotating roller 10. The outer surface of the ejector roller 90 is formed with protrusions at intervals, and the protrusions are in the shape of equilateral triangles. The upper surface of the first rotating roller 10 is flush with the upper surface of the ejector roller 90.

[0088] In this embodiment, the ejector roller 90 refers to an auxiliary support component with a specific surface structure. Specifically, it can be implemented using a stainless steel roller with regularly protruding surfaces, and its axis is parallel to the first rotating roller 10. The protrusions refer to the periodically distributed geometric structure on the surface of the ejector roller 90, which can be implemented using an array of equilateral triangular prisms. The tips of the protrusions are 1-1.5 times the thickness of the coating film, the tip diameter is less than 0.5 mm, and the distance between two adjacent protrusions is 5-20 mm. The flush upper surfaces refer to the relative position of the ejector roller 90 and the first rotating roller 10 in the vertical direction. Specifically, the height consistency of the working surfaces of the two rollers can be achieved through a precision leveling mechanism.

[0089] Furthermore, the ejector roller 90 is positioned along the extension direction of the first rotating roller 10, forming a support plane for silicon wafer movement together with the transport roller 80. That is, the first rotating roller 10 is positioned between the ejector roller 90 and the transport roller 80. When the silicon wafer moves between the transport roller 80 and the first rotating roller 10, the triangular protrusions of the ejector roller 90 support the edge area of ​​the silicon wafer in point contact. The contact points are distributed in an equilateral triangle, forming a stable three-point support structure. The upper surface of the first rotating roller 10 is flush with the upper surface of the ejector roller 90, ensuring the silicon wafer remains horizontal during movement and preventing fluctuations in adhesive layer thickness due to height differences. The sharp corners of the triangular protrusions reduce the contact area with the silicon wafer, minimizing surface friction while maintaining positioning accuracy.

[0090] This design optimizes the contact point distribution through equilateral triangular protrusions, significantly reducing the contact area while ensuring support stability and effectively lowering the risk of surface damage to the silicon wafer. Furthermore, the ridges of the triangular protrusions form a specific angle with the direction of silicon wafer movement, guiding the adhesive to spread evenly and avoiding adhesive layer disturbances caused by traditional circular protrusions.

[0091] This embodiment enables precise positioning and stable transport of silicon wafers during the coating process, reducing surface contamination and adhesive layer damage caused by mechanical contact, and improving the reliability of the coating process and product yield. The triangular protrusions form discrete contact points during the support process, ensuring smooth movement of the silicon wafer while avoiding adhesive adhesion caused by large-area contact, thus solving the technical problem of scratches and contamination easily generated during silicon wafer transfer in traditional roller coating equipment.

[0092] Example 9

[0093] Please refer to it again. Figure 1 Furthermore, the precision control roller coating apparatus 1000 also includes a transfer mechanism 100, which includes:

[0094] The rotating part 1001 has a flip motor 110 at one end. The rotating part 1001 includes a first state 150 and a second state 160. The flip motor 110 is used to drive the rotating part 1001 to move between the first state 150 and the second state 160.

[0095] The adsorption component 120 is located on one side of the rotating part 1001. When the rotating part 1001 is in the first state 150, the adsorption component 120 can be used to adsorb silicon wafers. When the rotating part 1001 is in the second state 160, the adsorption component 120 can be used to release silicon wafers to place them on the conveyor belt 140.

[0096] In this embodiment, the rotating part 1001 refers to a mechanical structure with a rotation function, specifically a metal bracket with a rotating shaft. The rotating shaft is connected to the frame via bearings to achieve smooth rotation. The flip motor 110 refers to a power device that drives the rotating shaft to rotate, specifically a servo motor in conjunction with a reducer. The servo motor can precisely control the rotation angle to achieve the switching between the first state 150 and the second state 160. In addition, the switching between the first state 150 and the second state 160 requires a 180-degree rotation, so that the side of the silicon wafer after coating faces upward, avoiding contact between the coated side of the silicon wafer and the external structure during the operation of the transfer mechanism 100, which could lead to damage to the coated side. The adsorption component 120 refers to a device that generates negative pressure adsorption force, specifically a vacuum chuck array in conjunction with a vacuum generator. The surface of the vacuum chuck is covered with a flexible material to avoid scratching the surface of the silicon wafer.

[0097] Specifically, after the ejector roller 90 completes the silicon wafer positioning, the detection sensor 121 identifies that the silicon wafer has reached the predetermined position and sends a signal to the control system. Upon receiving the signal, the flip motor 110 drives the rotating part 1001 to switch from the second state 160 to the first state 150, and the adsorption assembly 120 moves directly above the silicon wafer and initiates vacuum adsorption. After adsorption is complete, the flip motor 110 rotates in the opposite direction, causing the rotating part 1001 to switch to the second state 160. The adsorption assembly 120 carries the silicon wafer to above the conveyor belt 140 and closes the vacuum adsorption. The uncoated side of the silicon wafer falls smoothly onto the surface of the conveyor belt 140 under gravity. The entire process, through the timing coordination of sensor triggering and motor drive, achieves automated transfer of the silicon wafer from the coating station to the conveyor station.

[0098] In this embodiment, the adsorption component 120 is a Bernoulli suction cup, a common non-contact adsorption technology that uses the effect of airflow to fix objects onto the suction cup. Based on Bernoulli's principle, it uses high-speed airflow to create a low-pressure area on the surface of the suction cup, thereby generating adsorption force. The Bernoulli suction cup allows for almost no physical contact between the silicon wafer and the suction cup. This helps reduce potential mechanical damage and contamination, and it can use inert gas as an air cushion, allowing it to operate stably in various temperature and chemical environments. Furthermore, the airflow can be adjusted to accommodate silicon wafers of different sizes and shapes. Of course, in other embodiments, the adsorption component 120 can use other types of suction cups; the specific design can be tailored to the actual situation and is not limited here.

[0099] Furthermore, a cylinder 130 is provided between the rotating part 1001 and the adsorption component 120 to adjust the distance between the adsorption component 120 and the rotating part 1001, thereby achieving a telescopic effect. This facilitates the adsorption component 120 to move closer to or further away from the silicon wafer, and also makes it easier for the adsorption component 120 to adsorb the silicon wafer.

[0100] This embodiment avoids physical damage to the adhesive layer by non-contact adsorption and flipping release. At the same time, it uses sensor triggering to achieve precise timing control, reducing positioning errors caused by manual intervention. It effectively solves the problems of adhesive surface scratches and positioning deviations during silicon wafer transfer. The automated adsorption and release mechanism reduces the risk of manual operation, improves the transfer accuracy and process reliability of coated silicon wafers, and provides a contamination-free silicon wafer surface for subsequent etching or diffusion processes.

[0101] Example 10

[0102] Please continue reading. Figure 1 Furthermore, the transfer mechanism 100 also includes a detection sensor 121, which is electrically connected to the flip motor 110. When the detection sensor 121 detects a silicon wafer on the ejector roller 90, the flip motor 110 rotates to cause the adsorption assembly 120 to adsorb the silicon wafer.

[0103] In this embodiment, the detection sensor 121 refers to a sensing device used to identify whether a silicon wafer exists on the surface of the ejector roller 90. Specifically, it can be implemented using a photoelectric sensor or an infrared sensor, which determines the position of the silicon wafer by emitting a light beam and receiving the reflected signal.

[0104] The detection sensor 121 is disposed on the adsorption assembly 120. Specifically, when the rotating part 1001 is in the first state 150, the detection sensor 121 is located on the side of the adsorption assembly 120 close to the ejector roller 90. This makes it convenient for the detection sensor 121 to detect the state of the silicon wafer on the ejector roller 90. The structure is simple and easy to implement.

[0105] Specifically, when the detection sensor 121 detects a silicon wafer on the surface of the ejector roller 90, it sends a trigger signal to the flip motor 110. The flip motor 110 then drives the rotating part 1001 to switch from the first state 150 to the second state 160. During this process, the adsorption component 120 moves above the silicon wafer, and the cylinder 130 moves the suction cup to a position close to the silicon wafer and activates the vacuum adsorption function. The flip motor 110 then drives the rotating part 1001 to switch from the second state 160 to the first state 150. Afterward, the cylinder 130 slowly returns to its initial state. At this time, the silicon wafer remains on the conveyor belt 140, and the side in contact with the conveyor belt 140 is not coated. That is to say, the transfer mechanism 100 can smoothly transfer the silicon wafer from the surface of the ejector roller 90 to the conveyor belt 140, avoiding surface scratches caused by manual intervention or mechanical clamping.

[0106] The precision roller coating device 1000 in this embodiment realizes fully automatic, contactless transfer of silicon wafers from the coating station to the conveyor belt 140, effectively preventing the adhesive layer from being scratched or contaminated during the transfer process, while reducing manual operation steps and improving the efficiency of continuous production line operation and product yield.

[0107] The beneficial effects achieved by this utility model are as follows: Since the first rotating roller 10 is at least partially located within the liquid storage tank 50, it can continuously carry the colloid during its rotation. Due to the arrangement of the driving member 401 and the telescopic rod 402, when the driving member 401 is working, it drives the telescopic rod 402 to extend and retract. This extension and retraction of the telescopic rod 402 causes the second rotating roller 20 to move towards or away from the first rotating roller 10, thereby adjusting the contact distance between the second rotating roller 20 and the first rotating roller 10. This changes the mutual squeezing force between the second rotating roller 20 and the first rotating roller 10, thus achieving precise control of the colloid carrying capacity and uniform spreading. Therefore, it solves the problem of film thickness in traditional roller coating processes. This invention addresses the problems of uneven coating, material waste, and insufficient film thickness control precision, offering advantages such as improved coating uniformity, reduced material waste, and enhanced film thickness control precision. Through the arrangement of the ejector roller 90 and the transfer mechanism 100, the contact area between the coated side of the silicon wafer and the ejector roller 90 is significantly reduced during wafer transfer due to the equilateral triangular protrusions formed on the surface of the ejector roller 90. The rotating part 1001, the adsorption component 120, and the flipping motor 110 allow the adsorption component 120 to adsorb the uncoated side of the silicon wafer, and the flipping motor 110 to flip it so that the uncoated side is placed on the conveyor belt 140. Therefore, during wafer transfer, the risk of contamination and scratches on the silicon wafer can be avoided, improving the yield rate.

[0108] It is understood that those skilled in the art can combine various implementation methods in the above embodiments under the guidance of the above examples to obtain technical solutions with multiple implementation methods.

[0109] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A precision roll coating apparatus for applying masking adhesive to one side of a silicon wafer, characterized in that, The precision control roller coating device includes: A first rotating roller, at least partially located within a liquid storage tank, carries colloid from the liquid storage tank during rotation; The second rotating roller partially contacts the first rotating roller and squeezes the first rotating roller during rotation to control the amount of adhesive carried on the first rotating roller and to make the adhesive on the first rotating roller spread evenly. The device includes a drive unit and a telescopic rod that is driven to connect with the drive unit. One end of the telescopic rod away from the drive unit is connected to the second rotating roller. When the drive unit is in operation, it drives the telescopic rod to extend and retract. When the telescopic rod extends and retracts, it drives the second rotating roller to move towards or away from the first rotating roller, thereby adjusting the contact distance between the second rotating roller and the first rotating roller.

2. The precision control roller coating apparatus as described in claim 1, characterized in that, The surface of the first rotating roller is covered with a rubber layer, and the surface of the rubber layer is provided with a plurality of annular grooves; The plurality of annular grooves are arranged at intervals along the length of the first rotating roller; The spacing between two adjacent annular grooves is the same; The annular groove is arranged radially around the first rotating roller.

3. The precision control roller coating apparatus as described in claim 2, characterized in that, The first rotating roller and the second rotating roller are arranged horizontally; The axis of the first rotating roller is aligned with the axis of the second rotating roller, and the size of the second rotating roller is smaller than the size of the first rotating roller.

4. The precision control roller coating apparatus as described in claim 1, characterized in that, The precision control roller coating device also includes a first drive assembly and a second drive assembly; The first drive component is connected to the first rotating roller and is used to drive the first rotating roller to rotate; The second drive assembly is connected to the second rotating roller and is used to drive the second rotating roller to rotate.

5. The precision control roller coating apparatus as described in claim 4, characterized in that, The deviation between the linear velocity of the surface of the first rotating roller and the linear velocity of the surface of the second rotating roller is less than 0.5%, and the rotation directions of the first rotating roller and the second rotating roller are opposite.

6. The precision control roller coating apparatus as described in claim 1, characterized in that, The driving component includes a linear motor. One end of the telescopic rod is connected to the linear motor, and the other end of the telescopic rod is connected to the second rotating roller. The linear motor operates to drive the second rotating roller to move toward the first rotating roller, or to drive the second rotating roller to move away from the first rotating roller.

7. The precision control roller coating apparatus as described in claim 1, characterized in that, The precision control roller coating device further includes a transport roller, which is arranged at intervals with the first rotating roller. The upper surface of the transport roller is flush with the upper surface of the first rotating roller. The transport roller and the first rotating roller cooperate to drive the silicon wafer to move and make the lower surface of the silicon wafer contact the first rotating roller so that the silicon wafer is coated with the colloid.

8. The precision control roller coating apparatus as described in claim 7, characterized in that, The precision control roller coating device further includes at least one ejector roller, which is arranged at intervals with the first rotating roller. The outer surface of the ejector roller is provided with protrusions at intervals, and the protrusions are in the shape of equilateral triangles. The upper surface of the first rotating roller is flush with the upper surface of the ejector roller.

9. The precision control roller coating apparatus as described in claim 8, characterized in that, The precision roller coating device further includes a transfer mechanism, which comprises: A rotating part, one end of which is provided with a flip motor, the rotating part includes a first state and a second state, and the flip motor is used to drive the rotating part to move between the first state and the second state; An adsorption assembly is located on one side of the rotating part. When the rotating part is in the first state, the adsorption assembly can be used to adsorb the silicon wafer. When the rotating part is in the second state, the adsorption assembly can be used to release the silicon wafer to place the silicon wafer on the conveyor belt.

10. The precision control roller coating apparatus as described in claim 9, characterized in that, The transfer mechanism also includes a detection sensor electrically connected to the flip motor. When the detection sensor detects a silicon wafer on the ejector roller, the flip motor rotates to allow the adsorption assembly to adsorb the silicon wafer.

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