Packaging structure for improving brightness of LED

Abstract

The utility model discloses a kind of packaging structures of promoting LED brightness, including support, flip chip and annular white glue layer, the bowl cup bottom of the support is equipped with partition structure, and is fixed with metal substrate groove clamping;The flip chip is fixed on the top of partition structure, and is electrically connected with metal substrate;The annular white glue layer is coated in bowl cup bottom and surrounds chip four around, its height is less than 1 / 2 of chip height, realizes chip stable positioning by partition structure, cooperates low annular white glue layer reflection lateral light and avoids blocking light, under the condition that cost increases less than 0.001 yuan per, light efficiency is promoted about 9%, satisfy high energy efficiency backlight display demand.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and more specifically, to a packaging structure for improving LED brightness. Background Technology

[0002] Industry Demand: With the implementation of the home appliance energy efficiency subsidy policy in 2025, the market demand for Level 1 / Level 2 energy efficiency TVs has surged (sales increased by 28.41% year-on-year), requiring LEDs to improve brightness while reducing operating current. Traditional solutions face bottlenecks: the size of conventional chips has reached its limit (25×51mil dual parallel luminous efficacy is only 115lm / W); increasing the area of ​​flip-chips (48×48mil) cannot significantly improve luminous efficacy.

[0003] Existing technology defects: Insufficient light efficiency: Conventional packaging does not utilize side light emission, resulting in severe light loss around the chip; Cost pressure: Increasing brightness requires increasing the number of LEDs or using high-cost quantum dot films (such as 65-inch QD films costing 120-140 yuan); Structural limitations: The bowl-cup design without partitions results in low reflection efficiency, and excessive white glue coverage will block side light emission.

[0004] Therefore, there is an urgent need to develop a packaging structure that can improve light efficiency while solving the cost problem. Utility Model Content

[0005] In view of this, in order to solve the above problems, this utility model discloses a packaging structure for improving LED brightness, including a bracket 1, a flip chip 2, and an annular white adhesive layer 3. The bottom of the cup of the bracket 1 is provided with a partition structure 11, which is fixedly engaged with the groove of the metal substrate 4. The flip chip 2 is fixed above the partition structure 11 and electrically connected to the metal substrate 4. The annular white adhesive layer 3 is coated on the bottom of the cup and surrounds the chip. Its height is less than 1 / 2 of the chip height. The partition structure realizes the stable positioning of the chip. With the low annular white adhesive layer reflecting side light and avoiding blocking light output, the luminous efficiency is improved by about 9% under the condition of increasing the cost by less than 0.001 yuan / chip, which meets the requirements of high energy efficiency backlight display.

[0006] An LED brightness enhancement packaging structure is characterized by comprising: a support 1 having a cup structure, the bottom of which is provided with a partition structure 11 configured to engage with a corresponding groove on a metal substrate 4; a flip chip 2 fixedly disposed in the central region of the cup above the partition structure 11 and partially electrically connected to the metal substrate 4; and an annular white adhesive layer 3 coated on the bottom of the cup structure and surrounding the flip chip 2, wherein the height of the annular white adhesive layer 3 is less than half the height of the flip chip 2.

[0007] Furthermore, the upper surface of the metal substrate 4 is provided with positive and negative electrode pads, separated by grooves. The bottom of the flip chip 2 is provided with positive and negative electrodes. The positive electrode pad is electrically connected to the positive electrode of the flip chip 2, and the negative electrode pad is electrically connected to the negative electrode of the flip chip 2. The separating structure 11 is a straight ridge. The ridge is engaged and fixed with the groove on the metal substrate 4, completely separating the positive and negative electrode pads so that they are not connected to each other, and symmetrically dividing the cup structure into two semi-circular reflective areas.

[0008] Furthermore, the cross-section of the annular white adhesive layer 3 is trapezoidal, wherein the height of the two edges is greater than the height of the middle.

[0009] Furthermore, the annular white adhesive layer 3 contains 20% to 40% by mass of titanium dioxide (TiO2) reflective particles and has a viscosity of 1000 to 2000 millipascals (mPa·s).

[0010] Furthermore, the support 1 is made of either epoxy molding compound (EMC) or unsaturated polyester molding compound (SMC).

[0011] Furthermore, the flip chip 2 has a square structure with a side length of 30-52 mil.

[0012] Furthermore, the inclination angle of the bottom sidewall of the bowl-cup structure is 30°-60°.

[0013] Furthermore, the encapsulation structure is applied to the backlight display module, and the surface of the flip chip 2 is covered with a phosphor layer 5.

[0014] Furthermore, the fluorescent adhesive layer 5 completely covers the flip chip 2 and the annular white adhesive layer 3.

[0015] The beneficial effects of this utility model are as follows: This utility model discloses a packaging structure for improving LED brightness, including a bracket 1, a flip chip 2, and an annular white adhesive layer 3. The bottom of the cup of the bracket 1 is provided with a partition structure 11, which is fixedly engaged with the groove of the metal substrate 4. The flip chip 2 is fixed above the partition structure 11 and electrically connected to the metal substrate 4. The annular white adhesive layer 3 is coated on the bottom of the cup and surrounds the chip. Its height is less than 1 / 2 of the chip height. The partition structure enables stable positioning of the chip. The low annular white adhesive layer reflects side light and avoids blocking light output. Under the condition of increasing the cost by less than 0.001 yuan / chip, the luminous efficiency is improved by about 9%, which meets the requirements of high energy efficiency backlight display. Attached Figure Description

[0016] Figure 1 This is a cross-sectional view of the entire utility model.

[0017] Figure 2 This is a structural diagram of the bracket of this utility model.

[0018] Figure 3 This is a top view of the bracket of this utility model.

[0019] Explanation of symbols for key components.

[0020] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model.

[0021] 1. Support structure 11. Flip chip 2. Flip chip 2. Annular white adhesive layer 3. Metal substrate 4. Fluorescent adhesive layer 5. Detailed Implementation

[0022] The following embodiments are described to aid in understanding this application. These embodiments are not, and should not be, construed in any way as limiting the scope of protection of this application.

[0023] In the following description, those skilled in the art will recognize that throughout this discussion, components may be described as individual functional units (which may include subunits), but those skilled in the art will recognize that various components or portions thereof may be divided into individual components or may be integrated together (including integrated within a single system or component).

[0024] Furthermore, the connection between components or systems is not intended to be limited to a direct connection; on the contrary, data between these components may be modified, reformatted, or otherwise altered by intermediate components. Additionally, other or fewer connections may be used. It should also be noted that the terms "connection," "link," or "input" should be understood to include direct connections, indirect connections via one or more intermediate devices, and wireless connections.

[0025] Example 1:

[0026] like Figure 1-2 As shown, a packaging structure for improving LED brightness includes: a support 1 having a cup-shaped structure, with a partition structure 11 at the bottom of the cup-shaped structure, the partition structure 11 being configured to engage with a corresponding groove on a metal substrate 4; a flip chip 2 fixedly disposed in the central area of ​​the cup-shaped structure above the partition structure 11, and partially electrically connected to the metal substrate 4; and an annular white adhesive layer 3 coated on the bottom of the cup-shaped structure and surrounding the flip chip 2, with the height of the annular white adhesive layer 3 being less than half the height of the flip chip 2. The flip chip is fixed by engaging with the metal substrate 4 through the bottom partition structure of the cup-shaped structure. Combined with the design of the low annular white adhesive layer, the luminous efficacy is improved by about 9% with almost no increase in cost, while ensuring that the light emitted from the side of the chip is not blocked.

[0027] The upper surface of the metal substrate 4 is provided with positive and negative pads, separated by grooves. The bottom of the flip chip 2 is provided with positive and negative electrodes. The positive pad is electrically connected to the positive electrode of the flip chip 2, and the negative pad is electrically connected to the negative electrode of the flip chip 2. The separating structure 11 is a straight ridge. The ridge is engaged and fixed with the groove on the metal substrate 4, completely separating the positive and negative pads so that they are not connected to each other. It also symmetrically divides the cup structure into two semi-circular reflection areas. The straight ridge separating structure achieves complete isolation of the positive and negative pads, and at the same time divides the cup symmetrically into two semi-circular reflection areas, enhancing the uniformity of light reflection and preventing the risk of short circuit.

[0028] The cross-section of the annular white adhesive layer 3 is trapezoidal, with the height of the two edges being greater than the height of the middle. The edges of the trapezoidal white adhesive layer are higher than the middle, forming a centripetal reflective surface that effectively gathers lateral light and reduces light loss.

[0029] The annular white adhesive layer 3 contains 20% to 40% by mass of titanium dioxide (TiO2) reflective particles and has a viscosity of 1000 to 2000 mPa·s. The specific proportion of titanium dioxide reflective particles (20%-40%) and the viscosity range (1000-2000 mPa·s) ensure the high reflectivity and dispensing flow of the white adhesive layer and improve process stability.

[0030] The bracket 1 is made of either epoxy molding compound (EMC) or unsaturated polyester molding compound (SMC). The EMC / SMC material bracket provides high heat resistance and low moisture absorption, ensuring the dimensional stability of the cup structure in a high-temperature packaging environment.

[0031] The flip chip 2 has a square structure with a side length of 30-52mil. The square flip chip (30-52mil) matches the cup-shaped partition design, maximizing current carrying capacity and light output efficiency within a limited area.

[0032] The bottom sidewall of the bowl-shaped structure has an inclination angle of 30°-60°. This 30°-60° inclination angle optimizes the light reflection path, expands the light emission angle, and improves the uniformity of the backlight module.

[0033] The encapsulation structure is applied to the backlight display module, and the surface of the flip chip 2 is covered with a phosphor layer 5. The phosphor layer 5 directly covers the chip and the white adhesive layer, replacing the high-cost QD film to achieve white light conversion, and significantly reducing the manufacturing cost of the terminal display module.

[0034] The fluorescent adhesive layer 5 completely covers the flip chip 2 and the annular white adhesive layer 3. The fluorescent adhesive layer 5 completely covers the structure, preventing light leakage and improving color temperature consistency, thus meeting the stringent requirements of backlight display for color uniformity.

[0035] The beneficial effects of this utility model are as follows: This utility model discloses a packaging structure for improving LED brightness, including a bracket 1, a flip chip 2, and an annular white adhesive layer 3. The bottom of the cup of the bracket 1 is provided with a partition structure 11, which is fixedly engaged with the groove of the metal substrate 4. The flip chip 2 is fixed above the partition structure 11 and electrically connected to the metal substrate 4. The annular white adhesive layer 3 is coated on the bottom of the cup and surrounds the chip. Its height is less than 1 / 2 of the chip height. The partition structure enables stable positioning of the chip. The low annular white adhesive layer reflects side light and avoids blocking light output. Under the condition of increasing the cost by less than 0.001 yuan / chip, the luminous efficiency is improved by about 9%, which meets the requirements of high energy efficiency backlight display.

[0036] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A packaging structure for improving LED brightness, characterized in that, include: A support (1) having a bowl-shaped structure, wherein a partition structure (11) is provided at the bottom of the bowl-shaped structure, the partition structure (11) being configured to engage with a corresponding groove on a metal substrate (4); a flip chip (2) being fixedly disposed in the central area of ​​the bowl above the partition structure (11) and partially electrically connected to the metal substrate (4); and an annular white adhesive layer (3) being coated on the bottom of the bowl-shaped structure and surrounding the flip chip (2), wherein the height of the white adhesive layer (3) is less than half the height of the flip chip (2).

2. The packaging structure according to claim 1, characterized in that: The upper surface of the metal substrate (4) is provided with a positive electrode pad and a negative electrode pad, which are separated by a groove. The bottom of the flip chip (2) is provided with a positive electrode and a negative electrode. The positive electrode pad is electrically connected to the positive electrode of the flip chip (2), and the negative electrode pad is electrically connected to the negative electrode of the flip chip (2). The separation structure (11) is a straight convex strip. The convex strip is engaged and fixed with the groove on the metal substrate (4), completely separating the positive electrode pad and the negative electrode pad, which are not connected to each other, and symmetrically dividing the cup structure into two semi-circular reflective areas.

3. The packaging structure according to claim 1, characterized in that: The cross-section of the annular white glue layer (3) is trapezoidal, with the height of the two edges being greater than the height of the middle.

4. The packaging structure according to claim 1, characterized in that: The white adhesive layer (3) contains 20% to 40% TiO2 reflective particles by mass and has a viscosity of 1000 to 2000 mPa·s.

5. The packaging structure according to claim 1, characterized in that: The support (1) is made of EMC or SMC. One of them.

6. The packaging structure according to claim 1, characterized in that: The flip chip (2) has a square structure with a side length of 30-52 mil.

7. The packaging structure according to claim 1, characterized in that: The bottom sidewall inclination angle of the bowl-cup structure is 30°-60°.

8. The packaging structure according to claim 1, characterized in that: The encapsulation structure is applied to the backlight display module, and the surface of the flip chip (2) is covered with a phosphor layer (5).

9. The packaging structure according to claim 8, characterized in that: The fluorescent adhesive layer (5) completely covers the flip chip (2) and the annular white adhesive layer (3).

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