Ceramic led structure

Abstract

The utility model relates to a kind of ceramic LED structure, belong to the technical field of chip packaging, including ceramic lamp pearl support, LED chip, first fluorescent film and second fluorescent film, wherein LED chip is at least provided with two, is set on ceramic lamp pearl support and is connected with ceramic lamp pearl support, first fluorescent film is attached in at least one LED chip back ceramic lamp pearl support one side surface, second fluorescent film is attached in at least one LED chip back ceramic lamp pearl support one side surface, the color temperature of second fluorescent film is higher than the color temperature of first fluorescent film, second fluorescent film includes fluorescent layer and silica gel layer, fluorescent layer is attached on LED chip, silica gel layer is set on fluorescent layer back LED chip side, silica gel layer back fluorescent layer one side and first fluorescent film back LED chip one side are in the same plane, the utility model has realized the effect that membrane surface is flat, thereby effectively solve the overflow problem generated when white glue is flowed unevenly due to the difference in thickness in subsequent steps point white glue.

Description

Technical Field

[0001] This utility model relates to the technical field of ceramic LED packaging, and in particular to a ceramic LED structure. Background Technology

[0002] Light-emitting diodes (LEDs), as a highly efficient, energy-saving, and long-life solid-state light source, have been widely used in lighting and display fields. Among the various technical routes for realizing white LEDs, the most mature and common method is to coat or cover the surface of a blue-emitting LED chip with a layer of yellow phosphor material. Part of the blue light emitted by the blue chip excites the phosphor to emit yellow light, and the blue and yellow light mix to ultimately form the visually white light. In recent years, in the field of ceramic substrate LED packaging, in order to pursue higher reliability, luminous efficiency, and precise color temperature control, various white light realization processes have been developed, including phosphor spraying, single-layer silicone phosphor film technology, and ceramic phosphor sheet technology. Among them, dual-color film-mounted LED chips are an important product form. They achieve dual-color temperature luminous efficiency or more flexible color temperature adjustment capabilities within a single LED chip by attaching phosphor films of different color temperatures, usually cool white and warm white, or other special color temperatures, to a ceramic substrate.

[0003] In the production of dual-color film-coated LED chips, the most common process currently is the use of a single-layer fluorescent silicone film process. This process typically involves pre-preparing silicone material containing specific phosphors, and then using a coating machine to create a single-layer fluorescent film with a certain thickness and optical properties. Then, according to design requirements, two fluorescent films with different formulations corresponding to cool white light and warm white light are precisely attached to the blue light chip area carried on the ceramic substrate. This process is widely used because it has advantages such as relatively controllable process, stable optical performance, and suitability for automated production.

[0004] However, due to the color temperature difference, the cool white fluorescent film and the warm white fluorescent film in this dual-color film-coated LED chip have different physical thicknesses after curing. When white glue is applied later, the difference in film thickness will cause uneven glue flow during application, and white glue overflow is very likely to occur at the edge of the thinner film area, affecting the product appearance and light efficiency. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a ceramic LED structure to solve the technical problem in the prior art where the thickness of films with different color temperatures varies, and white glue easily overflows at the edges of thinner film areas when applying white glue.

[0006] This utility model provides a ceramic LED structure, including:

[0007] Ceramic LED bead holder;

[0008] At least two LED chips are provided, which are mounted on the ceramic lamp bead bracket and connected to the ceramic lamp bead bracket;

[0009] A first fluorescent film is attached to the surface of at least one LED chip on the side facing away from the ceramic lamp bead bracket, for changing the spectrum of the light emitted by the corresponding LED chip;

[0010] A second fluorescent film is attached to the surface of at least one LED chip on the side facing away from the ceramic lamp bead bracket, and is used to change the spectrum of the light emitted by the corresponding LED chip. The color temperature of the second fluorescent film is higher than that of the first fluorescent film. The second fluorescent film includes a fluorescent layer and a silicone layer. The fluorescent layer is attached to the LED chip, and the silicone layer is disposed on the side of the fluorescent layer facing away from the LED chip. The side of the silicone layer facing away from the fluorescent layer and the side of the first fluorescent film facing away from the LED chip are on the same plane.

[0011] Optionally, the first fluorescent film is configured as a warm white fluorescent film, and the second fluorescent film is configured as a cool white fluorescent film.

[0012] Optionally, the dimensions of both the first fluorescent film and the second fluorescent film are larger than the corresponding LED chip, so that a stepped shape is formed between the first fluorescent film and the corresponding LED chip, and between the second fluorescent film and the corresponding LED chip.

[0013] Optionally, it also includes:

[0014] The first white adhesive layer is disposed between two adjacent LED chips and is bonded to the two adjacent LED chips and the first or second fluorescent film on the LED chips.

[0015] The second white adhesive layer is disposed on the side of the LED chip facing away from the other LED chip, and is bonded to the corresponding LED chip and the first or second fluorescent film on the LED chip.

[0016] Optionally, the side of the first white adhesive layer and the second white adhesive layer facing away from the ceramic lamp bead bracket are on the same plane as the side of the second fluorescent film facing away from the ceramic lamp bead bracket.

[0017] Optionally, the second white adhesive layer is flush with the side facing away from the LED chip and the side of the ceramic lamp bead bracket.

[0018] Optionally, the side of the first fluorescent film facing the first white adhesive layer and the side of the first fluorescent film facing the second white adhesive layer are both set as inclined surfaces. The inclined surfaces are inclined from the side close to the ceramic lamp bead bracket to the side away from the corresponding first fluorescent film. The inclined surfaces on the first fluorescent film are attached to the corresponding first white adhesive layer and second white adhesive layer.

[0019] Optionally, both the side of the second fluorescent film facing the first white adhesive layer and the side of the second fluorescent film facing the second white adhesive layer are provided as inclined surfaces. The inclined surfaces are inclined from the side close to the ceramic lamp bead bracket to the side away from the corresponding second fluorescent film. The inclined surfaces on the second fluorescent film are attached to the corresponding first white adhesive layer and second white adhesive layer.

[0020] Optionally, the ceramic lamp bead holder includes:

[0021] A ceramic substrate, wherein the LED chip is disposed on the ceramic substrate and connected to the ceramic substrate;

[0022] A heat dissipation pad is disposed on the side of the ceramic substrate facing away from the LED chip;

[0023] The positive and negative electrodes are disposed on the side of the ceramic substrate facing away from the LED chip.

[0024] Optionally, the silicone layer is made of transparent silicone, and the first fluorescent film and the fluorescent layer are made of phosphor and transparent silicone.

[0025] The technical solution of this utility model has the following advantages:

[0026] The ceramic LED structure provided by this utility model sets the second fluorescent film, which has a higher color temperature than the first fluorescent film, as a double-layer structure. A silicone layer is added to the side of the fluorescent layer facing away from the LED chip, so that the side of the second fluorescent film facing away from the LED chip and the first fluorescent film can be on the same plane. This directly eliminates the thickness difference between the first and second fluorescent films caused by the color temperature difference, and achieves a flat film surface. This effectively solves the problem of glue overflow caused by uneven glue flow during subsequent white glue application due to thickness difference, and meets the strict requirements for the overall thickness uniformity of the LED structure. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a cross-sectional view of the overall structure of the ceramic LED structure in this utility model;

[0029] Figure 2 This is a cross-sectional view of another embodiment of the ceramic LED structure in this utility model.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. LED chip; 2. First fluorescent film; 3. Second fluorescent film; 31. Fluorescent layer; 32. Silicone layer; 4. Ceramic lamp bead bracket; 41. Ceramic substrate; 42. Heat dissipation pad; 43. Positive and negative electrodes; 5. First white adhesive layer; 6. Second white adhesive layer. Detailed Implementation

[0032] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this utility model. Based on the description of this utility model, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this utility model.

[0033] Unless otherwise explicitly specified and limited, the terms "setup," "installation," and "connection" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of these terms based on the specific circumstances.

[0034] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0035] The terms “first,” “second,” “third,” etc., are used merely to distinguish elements with similar properties, not to indicate or imply relative importance or a specific order.

[0036] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0037] Example

[0038] Reference Figure 1 and Figure 2As shown, this utility model provides a ceramic LED structure, including a ceramic lamp bead bracket 4, an LED chip 1, a first fluorescent film 2, and a second fluorescent film 3. At least two LED chips 1 are provided. In this embodiment, for ease of description, two LED chips 1 are provided, but it is not limited to only two. Multiple LED chips can also be provided.

[0039] LED chip 1 is disposed on the top surface of ceramic lamp bead bracket 4 and connected to ceramic lamp bead bracket 4. First fluorescent film 2 is attached to one of the LED chips 1 and located on the surface of LED chip 1 facing away from ceramic lamp bead bracket 4. First fluorescent film 2 is used to change the spectrum of light of the corresponding LED chip 1. Second fluorescent film 3 is attached to another LED chip 1 and located on the surface of the LED chip 1 facing away from ceramic lamp bead bracket 4. Second fluorescent film 3 is also used to change the spectrum of light of the corresponding LED chip 1. At the same time, the color temperature of second fluorescent film 3 is higher than that of first fluorescent film 2.

[0040] Specifically, the second fluorescent film 3 includes a fluorescent layer 31 and a silicone layer 32. The fluorescent layer 31 and the silicone layer 32 are arranged in parallel, and the fluorescent layer 31 is directly attached to the top surface of the corresponding LED chip 1. The silicone layer 32 is disposed on the side of the fluorescent layer 31 facing away from the corresponding LED chip 1. The fluorescent layer 31 and the silicone layer 32 are the same size, and the side of the silicone layer 32 facing away from the fluorescent layer 31 and the side of the first fluorescent film 2 facing away from the LED chip 1 are on the same plane.

[0041] By setting the second fluorescent film 3, which has a higher color temperature than the first fluorescent film 2, as a double-layer structure, and adding a silicone layer 32 on the side of the fluorescent layer 31 facing away from the LED chip 1, the entire second fluorescent film 3 facing away from the LED chip 1 can be on the same plane as the first fluorescent film 2. This directly eliminates the thickness difference between the first fluorescent film 2 and the second fluorescent film 3 caused by the color temperature difference, and achieves a flat film surface. This effectively solves the problem of glue overflow caused by uneven glue flow during subsequent white glue application due to thickness difference, and meets the strict requirements for the overall thickness uniformity of the LED structure.

[0042] As a specific implementation, the silicone layer 32 is made of transparent silicone, which ensures the high light transmittance of the silicone layer 32 and avoids unnecessary absorption or scattering of the light emitted by the LED chip 1 below after reaching the silicone layer 32, thus maximizing the light efficiency. The first fluorescent film 2 and the fluorescent layer 31 are both composed of phosphor and transparent silicone. During preparation, the corresponding phosphor and silicone are mixed and stirred in a certain proportion into a glue cup, and then another glue cup is used to separately prepare and stir the silicone. The film is then formed by vacuum heating coating machine to form a single-layer first fluorescent film 2 and a double-layer second fluorescent film 3.

[0043] In this embodiment, the first fluorescent film 2 is a warm white fluorescent film, and the second fluorescent film 3 is a cool white fluorescent film. Since the color temperature of cool white is higher than that of warm white, and the lower the color temperature, the thicker the film, the thickness of the fluorescent layer 31 of the second fluorescent film 3 is less than the thickness of the first fluorescent film 2. In other embodiments, it is not limited to the first fluorescent film 2 being a warm white fluorescent film and the second fluorescent film 3 being a cool white fluorescent film; other color temperatures can also be set, as long as the film with the higher color temperature is double-layered, with an additional silicone layer 32, and the first fluorescent film 2 and the second fluorescent film 3 are flush with the side facing away from the LED chip 1.

[0044] Specifically, the dimensions of the first fluorescent film 2 and the second fluorescent film 3 are both larger than the corresponding LED chip 1, so that a stepped shape is formed between the first fluorescent film 2 and the corresponding LED chip 1, as well as between the second fluorescent film 3 and the corresponding LED chip 1. At this time, the periphery of the first fluorescent film 2 extends outward, thus making the periphery of the first fluorescent film 2 protrude beyond the periphery of the LED chip 1. The periphery of the second fluorescent film 3 also extends outward, thus making the periphery of the second fluorescent film 3 protrude beyond the periphery of the corresponding LED chip 1, thereby preventing the blue light emitted by the LED chip 1 from leaking out and reducing brightness loss.

[0045] In addition, the ceramic lamp bead bracket 4, in this embodiment, includes a ceramic substrate 41, a heat dissipation pad 42, and positive and negative electrodes 43. The ceramic substrate 41 is plate-shaped. The LED chips 1 are all disposed and connected to the top surface of the ceramic substrate 41 and are evenly arranged. The heat dissipation pad 42 and the positive and negative electrodes 43 are all connected to the side of the ceramic substrate 41 facing away from the LED chips 1. The heat dissipation pad 42 and the ceramic substrate 41 are integrally formed. The LED chips 1 are electrically connected to the positive and negative electrodes 43 through the through holes on the ceramic substrate 41.

[0046] In one specific implementation, the ceramic LED structure further includes a first white adhesive layer 5 and a second white adhesive layer 6. Both the first white adhesive layer 5 and the second white adhesive layer 6 are white wall adhesives. The first white adhesive layer 5 is disposed between two adjacent LED chips 1 and is attached to the side of the LED chip 1. The first white adhesive layer 5 is also attached to the corresponding side of the first phosphor film 2 and the second phosphor film 3 above the LED chip 1. The second white adhesive layer 6 is disposed on the side of the LED chip 1 facing away from the other LED chip 1 and is attached to the corresponding side of the corresponding LED chip 1. The second white adhesive layer 6 is also attached to the corresponding side of the first phosphor film 2 or the second phosphor film 3 above the corresponding LED chip 1. By setting the first white adhesive layer 5, the gaps between adjacent LED chips 1 are filled, while the second white adhesive layer 6 covers the outside of the LED chip 1 array, protecting the sides of the LED chips 1 from damage. Furthermore, the first white adhesive layer 5 and the second white adhesive layer 6 can prevent the LED chips 1 from leaking blue light, while increasing internal light reflection and reducing brightness loss.

[0047] Furthermore, the side of the first white adhesive layer 5 and the second white adhesive layer 6 facing away from the ceramic LED bead bracket 4 are on the same plane as the side of the second fluorescent film 3 facing away from the ceramic LED bead bracket 4. This ensures that the side of the first white adhesive layer 5 facing away from the ceramic LED bead bracket 4, the side of the second white adhesive layer 6 facing away from the ceramic LED bead bracket 4, the side of the first fluorescent film 2 facing away from the ceramic LED bead bracket 4, and the side of the second fluorescent film 3 facing away from the ceramic LED bead bracket 4 are all on the same plane. The side of the second white adhesive layer 6 facing away from the LED chip 1 is flush with the side of the ceramic LED bead bracket 4, ensuring the flatness of the surface of the ceramic LED structure.

[0048] As another implementation method, refer to Figure 2 As shown, the side of the first fluorescent film 2 facing the first white adhesive layer 5 and the side of the first fluorescent film 2 facing the second white adhesive layer 6 are both set as inclined surfaces. The inclined surfaces are inclined from the side close to the ceramic lamp bead bracket 4 to the side away from the corresponding first fluorescent film 2. The inclined surfaces on the first fluorescent film 2 are attached to the corresponding first white adhesive layer 5 and second white adhesive layer 6.

[0049] Both the side of the second fluorescent film 3 facing the first white adhesive layer 5 and the side of the second fluorescent film 3 facing the second white adhesive layer 6 are set as inclined surfaces. The inclined surfaces on the second fluorescent film 3 are inclined from the side close to the ceramic lamp bead bracket 4 to the side away from the corresponding second fluorescent film 3. The inclined surfaces on the second fluorescent film 3 are attached to the corresponding first white adhesive layer 5 and second white adhesive layer 6. When the light from the LED chip 1 reaches the side of the first white adhesive layer 5 and second white adhesive layer 6 that are attached to the inclined surfaces, it can be directly reflected to the light-emitting surface under the action of the first white adhesive layer 5 and second white adhesive layer 6, which enhances the light-gathering and reflection effect of the ceramic LED structure and improves the light efficiency of the ceramic LED structure.

[0050] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A ceramic LED structure, characterized in that, include: Ceramic LED bead holder (4); At least two LED chips (1) are provided, which are disposed on the ceramic lamp bead bracket (4) and connected to the ceramic lamp bead bracket (4); A first fluorescent film (2) is attached to the surface of at least one of the LED chips (1) on the side facing away from the ceramic lamp bead bracket (4) to change the spectrum of the light from the corresponding LED chip (1); The second fluorescent film (3) is attached to the surface of at least one LED chip (1) on the side facing away from the ceramic lamp bead bracket (4) to change the spectrum of the light of the corresponding LED chip (1). The color temperature of the second fluorescent film (3) is higher than that of the first fluorescent film (2). The second fluorescent film (3) includes a fluorescent layer (31) and a silicone layer (32). The fluorescent layer (31) is attached to the LED chip (1), and the silicone layer (32) is disposed on the side of the fluorescent layer (31) facing away from the LED chip (1). The side of the silicone layer (32) facing away from the fluorescent layer (31) and the side of the first fluorescent film (2) facing away from the LED chip (1) are on the same plane.

2. The ceramic LED structure as described in claim 1, characterized in that, The first fluorescent film (2) is configured as a warm white fluorescent film, and the second fluorescent film (3) is configured as a cool white fluorescent film.

3. The ceramic LED structure as described in claim 1, characterized in that, The size of the first fluorescent film (2) and the second fluorescent film (3) is larger than the corresponding LED chip (1), so that a stepped shape is formed between the first fluorescent film (2) and the corresponding LED chip (1) and between the second fluorescent film (3) and the corresponding LED chip (1).

4. The ceramic LED structure as described in claim 1, characterized in that, Also includes: The first white adhesive layer (5) is disposed between two adjacent LED chips (1) and is bonded to the two adjacent LED chips (1) and the first fluorescent film (2) or the second fluorescent film (3) on the LED chip (1); The second white adhesive layer (6) is disposed on the side of the LED chip (1) facing away from the other LED chip (1), and is bonded to the corresponding LED chip (1) and the first fluorescent film (2) or the second fluorescent film (3) on the LED chip (1).

5. The ceramic LED structure as described in claim 4, characterized in that, The first white adhesive layer (5) and the second white adhesive layer (6) are on the same plane as the side of the second fluorescent film (3) facing away from the ceramic lamp bead bracket (4).

6. The ceramic LED structure as described in claim 4, characterized in that, The second white adhesive layer (6) is flush with the side facing away from the LED chip (1) and the side of the ceramic lamp bead bracket (4).

7. The ceramic LED structure as described in claim 4, characterized in that, The side of the first fluorescent film (2) facing the first white adhesive layer (5) and the side of the first fluorescent film (2) facing the second white adhesive layer (6) are both set as inclined surfaces. The inclined surfaces are inclined from the side close to the ceramic lamp bead bracket (4) to the side away from the corresponding first fluorescent film (2). The inclined surfaces on the first fluorescent film (2) are attached to the corresponding first white adhesive layer (5) and second white adhesive layer (6).

8. The ceramic LED structure as described in claim 4, characterized in that, The side of the second fluorescent film (3) facing the first white adhesive layer (5) and the side of the second fluorescent film (3) facing the second white adhesive layer (6) are both set as inclined surfaces. The inclined surfaces are inclined from the side close to the ceramic lamp bead bracket (4) to the side away from the corresponding second fluorescent film (3). The inclined surfaces on the second fluorescent film (3) are attached to the corresponding first white adhesive layer (5) and second white adhesive layer (6).

9. The ceramic LED structure as described in claim 1, characterized in that, The ceramic lamp bead holder (4) includes: A ceramic substrate (41) is provided, and the LED chip (1) is disposed on the ceramic substrate (41) and connected to the ceramic substrate (41); A heat dissipation pad (42) is disposed on the side of the ceramic substrate (41) facing away from the LED chip (1); Positive and negative electrodes (43) are disposed on the side of the ceramic substrate (41) facing away from the LED chip (1).

10. The ceramic LED structure as described in claim 1, characterized in that, The silicone layer (32) is made of transparent silicone.

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