Novel integrated circuit plastic sealing device

Abstract

The utility model relates to novel integrated circuit plastic package device technical field discloses novel integrated circuit plastic package device, including cutting device main part, and fixedly arranged with support column on cutting device main part, and the sliding plate is equipped with on support column slidingly, transmission track, the upper both sides of cutting device main part are arranged, are used for transmission discharge place, discharge place, be arranged in the top of transmission track, and the fiber optic sensor is equipped on the discharge place, and a plurality of groups of grooves are equipped on the discharge place, are used for loading material strip, and the both sides fixed connection of discharge place carry the trolley, are used for moving discharge place, the device of the diagonal of discharge place setting can real -time monitoring material strip's deviation, has provided accurate position information for production process, once the misalignment deviation of diagonal monitoring data appears, the system will immediately trigger alarm stop, and the quick response mechanism can stop production in time, avoid the product cutting loss caused by material strip deviation, thereby effectively reduce the defective rate, improve product quality.

Description

Technical Field

[0001] This utility model relates to the technical field of novel integrated circuit molding and packaging devices, specifically to novel integrated circuit molding and packaging devices. Background Technology

[0002] In novel integrated circuit molding processes, the performance of the molding equipment plays a crucial role in product quality and production efficiency. Traditional integrated circuit molding equipment suffers from numerous problems. During the spool cutting process, the lack of precise monitoring and control makes the spool prone to deviation, leading to inaccurate cutting positions, product damage, and increased defect rates. Furthermore, traditional equipment suffers from insufficient structural stability; the sliding plate is prone to wobbling during lifting and lowering, affecting the cutting accuracy of the cutting components and reducing the reliability and lifespan of the equipment.

[0003] With the continuous development of integrated circuit technology, higher requirements are placed on the precision and stability of molding compounding devices. This utility model relates to a novel integrated circuit molding compounding device that incorporates fiber optic sensors to monitor material strip deviation in real time. Once the material strip deviation exceeds a set range, the system immediately triggers an alarm and stops, effectively preventing quality abnormalities caused by material strip deviation. Simultaneously, the support columns in the device provide stable support for the sliding plate, ensuring the smoothness of the sliding plate's lifting process and improving the cutting precision of the cutting components. This improvement not only enhances product yield but also strengthens engineering capabilities, meeting the high precision and high stability requirements of integrated circuit manufacturing for molding compounding devices. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a novel integrated circuit molding device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a novel integrated circuit molding device, comprising a cutting device body, a support column fixedly arranged on the cutting device body, and a sliding plate slidably provided on the support column;

[0006] The conveyor rails are arranged on both sides of the upper part of the cutting device body and are used to convey the material feeding area;

[0007] The material feeding point is located above the conveying track. The material feeding point is equipped with fiber optic sensors and multiple sets of slots for loading material strips. A transport vehicle is fixedly connected to both sides of the material feeding point. The transport vehicle slides on the conveying track to move the material feeding point.

[0008] A cutting assembly is provided below the sliding plate for cutting the material.

[0009] As a further description of the above technical solution:

[0010] The cutting assembly includes:

[0011] The cutting head is fixedly arranged below the sliding plate, and the cutting head is equipped with multiple sets of cutting blades for cutting material strips.

[0012] As a further description of the above technical solution:

[0013] The fiber optic sensors are provided in two sets, arranged at opposite corners of the feeding area, to identify material strip deviation.

[0014] As a further description of the above technical solution:

[0015] A sensor signal processor is fixedly arranged on one side of the feeding point, and the output end of the sensor signal processor is connected to the fiber optic sensor through a cable for transmitting the cutting strip signal.

[0016] As a further description of the above technical solution:

[0017] When the fiber optic sensor detects a misalignment of the material strip of ≥2mm, the sensor signal processor immediately triggers an alarm and stops the machine.

[0018] This utility model has the following beneficial effects:

[0019] Fiber optic sensors installed at the diagonal corners of the feeding area can monitor the material strip's offset in real time, providing precise positional information for the cutting process. Once the diagonal monitoring data shows misalignment, the system will immediately trigger an alarm and stop production. This rapid response mechanism can stop production in time, avoiding product damage caused by material strip offset, thereby effectively reducing the defect rate and improving product quality. Attached Figure Description

[0020] Figure 1 This is an overall schematic diagram of the novel integrated circuit molding device proposed in this utility model;

[0021] Figure 2 This is a schematic diagram of the fiber optic sensor for the novel integrated circuit encapsulation device proposed in this utility model; Legend: 1. Main body of the cutting device; 11. Support column; 12. Sliding plate; 2. Transport vehicle; 3. Discharge point; 4. Sensor signal processor; 5. Cutting head; 6. Transmission track; 7. Fiber optic sensor. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1:

[0024] like Figures 1 to 2 As shown, the novel integrated circuit molding device provided in this embodiment includes a cutting device body 1, a support column 11 fixedly arranged on the cutting device body 1, and a sliding plate 12 slidably arranged on the support column 11; a transmission track 6 arranged on the upper two sides of the cutting device body 1 for transmitting the material feeding point 3; the material feeding point 3 arranged above the transmission track 6, the material feeding point 3 is provided with an optical fiber sensor 7, and the material feeding point 3 is provided with multiple sets of grooves for loading material strips, and a transport vehicle 2 is fixedly connected to both sides of the material feeding point 3. The transport vehicle 2 slides on the transmission track 6 for moving the material feeding point 3; a cutting component is provided below the sliding plate 12 for cutting the material.

[0025] In this embodiment, a cutting assembly is fixedly connected below the sliding plate 12 to realize the lifting and lowering of the cutting assembly. The transmission track 6 transmits the material feeding point 3 to the cutting position, so that the material strip to be cut is in a suitable position. Then the cutting assembly performs the cutting operation, realizing flexible adjustment of the material strip position and precise positioning of the cutting position, reducing manual intervention.

[0026] Specifically, the cutting component includes:

[0027] The cutting head 5 is fixedly arranged below the sliding plate 12, and the cutting head 5 is equipped with multiple sets of cutting blades for cutting material strips.

[0028] In this embodiment, the sliding plate 12 stably supports the cutting assembly. When the cutting head 5 moves downward, the two sets of cutting blades contact the material strip. The material strip is cut by the downward pressure of the cutting head 5 and the shearing force of the blade. The two sets of cutting blades work synchronously, which improves the single cutting efficiency, ensures a long service life of the cutting blades, and reduces the replacement frequency and maintenance costs.

[0029] Specifically, the fiber optic sensor 7 is provided in two sets, arranged at opposite corners of the feeding point 3, for identifying material strip deviation.

[0030] As a preferred implementation, the fiber optic sensor 7 continuously monitors the position of the material strip. If the material strip deviates beyond the set range, the laser signal changes, and the fiber optic sensor 7 transmits an electrical signal as feedback. This provides real-time and accurate monitoring of the material strip's deviation status, offering a basis for subsequent adjustments, avoiding cutting errors caused by material strip deviation, and ensuring cutting accuracy.

[0031] Specifically, a sensor signal processor 4 is fixedly arranged on one side of the feeding point 3, and the output end of the sensor signal processor 4 is connected to the fiber optic sensor 7 via a cable for transmitting the cutting strip signal.

[0032] It should be noted that the fiber optic sensor 7 transmits the detected strip offset signal to the sensor signal processor 4. The processor performs filtering, amplification, and analysis on the signal to determine the strip offset. If the cutting conditions are met, a cutting strip signal is issued to control the cutting component to perform the cutting action. This realizes automated control from strip offset detection to cutting command issuance, ensuring timely and accurate execution of the cutting operation and improving the intelligence level and operational stability of the entire sealing device.

[0033] Specifically, when the fiber optic sensor 7 detects a misalignment offset of the material strip ≥ 2mm, the sensor signal processor 4 immediately triggers an alarm and stops the machine.

[0034] It should be noted that once the diagonal monitoring data at feeding point 3 shows a misalignment of ≥2mm, the system will immediately trigger an alarm and stop the machine, effectively avoiding quality abnormalities caused by material strip misalignment and improving product yield.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel integrated circuit molding and packaging device, characterized in that: It includes a cutting device body (1), a support column (11) is fixedly arranged on the cutting device body (1), and a sliding plate (12) is slidably provided on the support column (11). The conveying track (6) is arranged on both sides of the upper part of the cutting device body (1) for conveying the material discharge point (3). The material feeding point (3) is arranged above the transmission track (6). The material feeding point (3) is equipped with an optical fiber sensor (7) and multiple sets of slots for loading material strips. The two sides of the material feeding point (3) are fixedly connected to the transport vehicle (2). The transport vehicle (2) slides on the transmission track (6) to move the material feeding point (3). A cutting assembly is provided below the sliding plate (12) for cutting the material.

2. The novel integrated circuit molding device according to claim 1, characterized in that: The cutting assembly includes: The cutting head (5) is fixedly arranged below the sliding plate (12), and the cutting head (5) is equipped with multiple sets of cutting blades for cutting the material strip.

3. The novel integrated circuit molding device according to claim 2, characterized in that: The fiber optic sensor (7) is provided in two sets, arranged at opposite corners of the feeding point (3), for identifying material strip offset.

4. The novel integrated circuit molding device according to claim 3, characterized in that: A sensor signal processor (4) is fixedly arranged on one side of the feeding point (3), and the output end of the sensor signal processor (4) is connected to the fiber optic sensor (7) through a cable for transmitting the cutting strip signal.

5. The novel integrated circuit molding device according to claim 4, characterized in that: When the fiber optic sensor (7) detects a misalignment offset of ≥2mm in the material strip, the sensor signal processor (4) immediately triggers an alarm and stops the machine.

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