An IC package correction device

Abstract

The utility model relates to a patching machine technical field especially, it is IC encapsulation correcting device, including the case, set up on the work platform of case, the conveying line for conveying PCB baseplate is traversed along the length direction of work platform is used to, and the vacuum suction nozzle for picking up IC is set up in the conveying line top, the position adjusting mechanism for adjusting IC encapsulation position is connected between vacuum suction nozzle and work platform, the position adjusting mechanism includes three -axis mobile platform, rotation adjusting assembly and attitude fine adjustment assembly, one end of rotation adjusting assembly is connected on three -axis mobile platform, and the other end is connected with vacuum suction nozzle transmission, attitude fine adjustment assembly and rotation adjusting assembly linkage connection. The utility model through position adjusting mechanism carries out accurate adjustment to the position and angle deviation that appears in the IC encapsulation process, effectively avoided the problem that the pin virtual welding, short circuit etc. appear when IC and electric connector assembly, thereby improved the accuracy and reliability of IC encapsulation.

Description

Technical Field

[0001] This utility model relates to the field of chip mounter technology, and in particular to an IC packaging correction device. Background Technology

[0002] IC is a general term for semiconductor components, including integrated circuits (ICs), diodes, transistors, and special electronic components. In automated production, it is often necessary to bend the pins of ICs into specified shapes and fix them on printed circuit boards (PCBs). Most IC packages are mounted on the PCB using electrical connectors, which establish an electrical connection between the two to ultimately enable data and signal transmission.

[0003] When using surface mount technology (SMT) to mount ICs onto printed circuit boards (PCBs), the pick-and-place machine places the ICs in designated positions according to a pre-set program. However, due to physical position deviations caused by the IC components during pickup and transportation, the actual placement position and angle of the IC may deviate slightly from the ideal state (i.e., the state of being perfectly aligned with the PCB pads). This can lead to problems such as cold solder joints and short circuits between the IC and the pins of the electrical connector when assembling the electrical connector.

[0004] To address this issue, existing technologies typically employ multi-axis motion structures in pick-and-place machines to compensate for the placement position of the IC components. They also integrate 2D / 3D vision inspection modules to scan and acquire the three-dimensional topographic data of the IC components and PC pads, thereby reducing errors generated when the nozzle picks up the IC components. However, this method only addresses the offset of the IC components in the multi-axis directions. It fails to resolve the issue of the IC component's center position shifting or rotating on the nozzle during pick-up, resulting in a slight angular deviation between the IC component and the PCB board during placement, which in turn affects the accuracy of subsequent processing. Utility Model Content

[0005] In order to address the technical defects mentioned in the background art, the purpose of this utility model is to provide an IC packaging correction device, which aims to solve the problem that poor pin connection and PCB board processing accuracy are caused by position and angle deviations in the IC packaging process in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] An IC packaging correction device includes a chassis, a work platform mounted on the chassis, a conveyor line running laterally along the length of the work platform for transporting a PCB substrate, and a vacuum nozzle positioned above the conveyor line for picking up ICs. A position adjustment mechanism for adjusting the IC package position is connected between the vacuum nozzle and the work platform. The position adjustment mechanism includes a three-axis moving platform for driving the vacuum nozzle to move along the X, Y, and Z axes, a rotation adjustment component for driving the vacuum nozzle to rotate on a horizontal plane, and an attitude fine-tuning component for adjusting the tilt angle of the vacuum nozzle. One end of the rotation adjustment component is connected to the three-axis moving platform, and the other end is drivenly connected to the vacuum nozzle. The attitude fine-tuning component is connected between the vacuum nozzle and the rotation adjustment component, and the attitude fine-tuning component is linked to the rotation adjustment component to achieve precise adjustment of the rotational position and angular deviation of the vacuum nozzle.

[0008] Preferably, the rotation adjustment assembly includes a fixed base, a rotary motor, and a rotary shaft. The fixed base is fixedly connected to the three-axis moving platform. The rotary motor is mounted on the fixed base, and a coupling is used to link the output end of the rotary motor with the rotary shaft. One end of the rotary shaft is connected to the coupling, and the other end is rotatably connected to the attitude fine-tuning assembly.

[0009] Preferably, the rotation adjustment assembly further includes an angle sensor, which is fixed to the three-axis moving platform by a mounting bracket and is positioned on the side facing the vacuum nozzle. The angle sensor is connected to the rotary motor and the attitude fine-tuning assembly via signal interaction.

[0010] Preferably, the attitude fine-tuning component includes a flexible hinge and a piezoelectric ceramic actuator. One end of the flexible hinge is hinged to the rotation shaft, and the other end is drivenly connected to the piezoelectric ceramic actuator. The piezoelectric ceramic actuator is installed at the bottom end of the flexible hinge, and one side of the piezoelectric ceramic actuator is connected to the vacuum nozzle.

[0011] Preferably, the vacuum nozzle includes a connecting rod and a patch head. One end of the connecting rod is connected to the rotating shaft for transmission, and the other end is fixedly connected to the patch head. The vacuum nozzle is externally connected to an air source.

[0012] Preferably, a positioning fixture for clamping and fixing a PCB substrate is slidably connected on the conveyor line, and the positioning fixture is provided with a positioning groove adapted to the PCB substrate; clamping strips for fixing the positioning fixture are provided on both sides of the conveyor line at the positioning fixture, the clamping strips are L-shaped and are provided with pressure plates.

[0013] Preferably, the three-axis moving platform includes a Y-axis moving platform for driving the vacuum nozzle to move along the width direction of the chassis, an X-axis moving platform for driving the vacuum nozzle to move along the length direction of the chassis, and a Z-axis moving platform for driving the vacuum nozzle to move along the height direction of the chassis; the bottom end of the Y-axis moving platform is connected to the work platform by a fixed bracket, and the moving trajectory of the movable end of the Y-axis moving platform is perpendicular to the conveying direction of the conveyor line; the X-axis moving platform is located at the movable end of the Y-axis moving platform, and the moving trajectory of the movable end of the X-axis moving platform is parallel to the conveying direction of the conveyor line; the Z-axis moving platform is located at the movable end of the X-axis moving platform.

[0014] Preferably, the work platform is also provided with a feeding track for conveying ICs. The feeding track is set perpendicular to the conveyor line, and one end of the feeding track is externally connected to the feeding system.

[0015] In summary, the beneficial effects of this utility model are as follows:

[0016] This invention utilizes the coordinated operation of a three-axis moving platform, a rotation adjustment component, and a posture fine-tuning component in a position adjustment mechanism to precisely adjust the position and angle deviations that occur during IC packaging. This effectively avoids problems such as poor soldering and short circuits during IC and electrical connector assembly, ensuring correct connection between pins and thus improving the accuracy and reliability of IC packaging. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the IC packaging correction device of this utility model;

[0018] Figure 2 This is a front view of the IC packaging correction device of this utility model;

[0019] Figure 3 This is a top view of the IC packaging correction device of this utility model;

[0020] Figure 4 This is a schematic diagram of the internal structure of the IC packaging correction device of this utility model;

[0021] Figure 5 yes Figure 4 Enlarged view of the structure at point a;

[0022] Figure 6 This is a partial cross-sectional view of the IC packaging correction device of this utility model;

[0023] Figure 7 yes Figure 6 Enlarged view of the structure at point b;

[0024] Figure 8 yes Figure 6 Enlarged view of the structure at point c.

[0025] Explanation of the reference numerals in the figure:

[0026] 1. Chassis; 11. Working platform; 2. Conveyor line; 3. Vacuum nozzle; 31. Connecting rod; 32. Placement head; 4. Position adjustment mechanism; 41. Three-axis moving platform; 411. X-axis moving platform; 412. Y-axis moving platform; 413. Z-axis moving platform; 414. Fixed bracket; 42. Rotation adjustment assembly; 421. Fixed seat; 422. Rotary motor; 423. Rotary shaft; 424. Coupling; 425. Angle sensor; 43. Attitude fine-tuning assembly; 431. Flexible hinge; 432. Piezoelectric ceramic actuator; 5. Vision inspection mechanism; 6. Positioning fixture; 61. Positioning groove; 7. Clamping strip; 8. Pressing plate; 9. Feeding track. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model are within the protection scope of the present utility model.

[0028] Those skilled in the art should understand that, in the disclosure of this utility model, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on this utility model.

[0029] In the description of this utility model, the use of terms such as "several" means one or more, with "multiple" meaning two or more. Terms like "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of terms like "first," "second," and "third" is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, the quantity of indicated technical features, or the sequential relationship between indicated technical features.

[0030] The following is in conjunction with the appendix Figure 1-8 The present invention provides a more detailed description of an embodiment of an IC packaging correction device.

[0031] An IC package correction device, such as Figures 1 to 3As shown, the system includes a chassis 1, a work platform 11 mounted on the chassis 1, a conveyor line 2 running laterally along the length of the work platform 11 for transporting PCB substrates, and a vacuum nozzle 3 positioned above the conveyor line 2 for picking up ICs. A position adjustment mechanism 4 for adjusting the IC package position is connected between the vacuum nozzle 3 and the work platform 11. The position adjustment mechanism 4 includes a three-axis moving platform 41 for driving the vacuum nozzle 3 to move along the X, Y, and Z axes, a rotation adjustment component 42 for driving the vacuum nozzle 3 to rotate on a horizontal plane, and an attitude fine-tuning component 43 for adjusting the tilt angle of the vacuum nozzle 3. One end of the rotation adjustment component 42 is connected to the three-axis moving platform 41, and the other end is connected to the vacuum nozzle 3. The attitude fine-tuning component 43 is connected between the vacuum nozzle 3 and the rotation adjustment component 42, and the attitude fine-tuning component 43 is linked to the rotation adjustment component 42 to achieve precise adjustment of the rotation position and angle deviation of the vacuum nozzle 3.

[0032] Specifically, firstly, the three-axis moving platform 41 is controlled to drive the vacuum nozzle 3 to move in the X, Y, and Z directions to initially adjust the position of the vacuum nozzle 3 and eliminate the positional deviation of the IC in the horizontal and vertical directions. Then, the main control unit controls the rotation adjustment component 42 and drives the vacuum nozzle 3 to rotate according to the angular deviation information of the IC to correct the angular deviation of the IC. Finally, for any slight posture deviation that the IC may have, the main control unit controls the posture fine-tuning component 43 to produce a slight deformation and performs posture fine-tuning of the vacuum nozzle 3 through the flexible hinge 431 to ensure that the electrical connector and the pins of the IC are precisely aligned.

[0033] A vision inspection mechanism 5 for photographic inspection is also located on one side of the vacuum nozzle 3. The vision inspection mechanism 5 is mounted on a three-axis moving platform 41 and is electrically connected to the position adjustment mechanism 4. The vision inspection mechanism 5 includes an industrial camera module, a light source module, and an image processor. It utilizes machine vision to detect the position and angular deviation of the sampled component in real time, calculates precise compensation values ​​through image processing and coordinate transformation, and drives a high-precision motion system to dynamically adjust at the moment of placement. The industrial camera module uses a high-resolution, high-frame-rate industrial camera, positioned directly above and to the side of the IC placement station, capturing image information of the IC from multiple angles. For example, the top camera can clearly capture the pin layout on the top surface of the IC, while the side camera can observe the vertical relationship between the pins and the PCB substrate, thus comprehensively acquiring details such as the actual position, orientation, and pin status of the IC, providing accurate data for subsequent position analysis. The light source module is equipped with a ring-shaped shadowless light source and bar-shaped light sources. The ring-shaped shadowless light source is installed around the industrial camera to uniformly illuminate the IC surface, avoid shadows, and ensure clear display of IC surface features. The bar-shaped light sources are installed on both sides of the worktable to provide auxiliary lighting from the side, highlighting the IC pin outlines, improving image quality, and facilitating accurate identification of IC-related information by the industrial camera. The image processor receives image data transmitted from the industrial camera and uses advanced image processing algorithms, such as edge detection and template matching, to quickly and accurately calculate the IC's position, angle, and pin offset. Simultaneously, it converts the calculation results into signals that can be recognized by the control system, providing a basis for subsequent position adjustments.

[0034] Specifically, after the IC is placed on the printed circuit board (PCB) by the pick-and-place machine, the industrial camera of the vision inspection mechanism 5, under the auxiliary illumination of the light source module, acquires multi-angle images of the IC. The acquired image data is transmitted to the image processor, which uses image processing algorithms to analyze and calculate information such as the IC's position, angle, and pin offset to determine the deviation data of the IC relative to the standard position, and transmits this data to the main control unit of the control system. After receiving the IC's position deviation data, the main control unit generates corresponding control commands according to the preset control strategy and algorithm.

[0035] It's worth noting that the principle behind the vision inspection mechanism 5 for detecting deviations is to use an industrial camera module to capture images and transmit them to the image processor of the pick-and-place machine. Then, based on a preset component type template, the system identifies key positioning features in the image (such as the outline edges, pins, and markings of the IC). The system uses edge detection algorithms (such as the Canny operator) to find the component boundaries and calculate its center position. For QFP, QFN, and other packages with pins, the system accurately identifies the pin position, width, and spacing. Since IC package surfaces typically have polarity markings (such as dots, grooves, and bevels), pin markings, or manufacturer logos / model markings, these markings are crucial for determining the component angle (orientation) and identifying whether the component type / direction is correct. The system precisely locates the positions of these markings.

[0036] Simultaneously, after the position adjustment mechanism 4 completes the position and orientation adjustment of the vacuum nozzle 3, the vision inspection mechanism 5 can again detect the relative position of the IC and the PCB substrate, acquire new image data, and transmit it to the image processor for analysis. The image processor compares the current positional relationship between the IC and the PCB substrate with the standard position to determine whether the pin alignment requirements are met. If the detection result shows that the deviation is within the allowable range, the control system sends a signal to instruct the next soldering or assembly operation; if the deviation is still large, the main control unit will regenerate control commands to drive the position adjustment mechanism 4 again for correction until the pins of the IC and the PCB substrate are accurately aligned.

[0037] In this embodiment, as Figure 4 As shown, the rotation adjustment assembly 42 includes a fixed base 421, a rotary motor 422, and a rotary shaft 423. The fixed base 421 is fixedly connected to the three-axis moving platform 41. The rotary motor 422 is mounted on the fixed base 421, and a coupling 424 is used to link the output end of the rotary motor 422 with the rotary shaft 423. One end of the rotary shaft 423 is connected to the coupling 424, and the other end is rotatably connected to the attitude fine-tuning assembly 43. The rotation adjustment assembly 42 also includes an angle sensor 425, which is fixed to the three-axis moving platform 41 by a mounting bracket. The angle sensor 425 is positioned facing the vacuum nozzle 3. The angle sensor 425 is connected to the rotary motor 422 and the attitude fine-tuning assembly 43 via signal communication.

[0038] Specifically, after the vacuum nozzle 3 picks up the IC, position compensation is first performed in the X, Y, and Z directions by the three-axis moving platform 41. Then, the rotary motor 422 drives the rotary shaft 423 to rotate the vacuum nozzle 3 on the horizontal plane, thereby correcting the angular deviation of the IC. The angle sensor 425 can provide real-time feedback of the rotation angle information to ensure precise control of the rotation angle, so that the position of the PCB substrate pads is perfectly matched with the pin angle of the IC.

[0039] In this embodiment, as Figure 4 , 5 As shown, the attitude fine-tuning component 43 includes a flexible hinge 431 and a piezoelectric ceramic actuator 432. One end of the flexible hinge 431 is hinged to the rotating shaft 423, and the other end is connected to the piezoelectric ceramic actuator 432. The piezoelectric ceramic actuator 432 is mounted on the bottom end of the flexible hinge 431, and one side of the piezoelectric ceramic actuator 432 is connected to the vacuum nozzle 3.

[0040] Specifically, when the IC exhibits a slight tilt deviation, the piezoelectric ceramic driver 432 can generate a minute deformation according to the control system's instructions. This deformation is transmitted through the flexible hinge 431, enabling precise fine-tuning of the vacuum nozzle 3's posture. This completes the fine-tuning of the IC's deviation, ensuring the parallelism and perpendicularity between the IC pins. The structural design of the rotation adjustment component 42 and the posture fine-tuning component 43 achieves multi-angle, high-precision adjustment of the vacuum nozzle, adapting to the packaging requirements of different types of ICs and enhancing the device's versatility and practicality.

[0041] In this embodiment, as Figure 6 , 7 As shown, the vacuum nozzle 3 includes a connecting rod 31 and a patch head 32. One end of the connecting rod 31 is connected to the rotating shaft 423 for transmission, and the other end is fixedly connected to the patch head 32. The vacuum nozzle 3 is externally connected to an air source.

[0042] Specifically, when the placement head 32 moves the IC to the target placement position on the PCB substrate, the three-axis moving platform 41 adds additional compensation displacement in the X and Y directions to correct the offset generated during pickup. Then, based on the information fed back by the vision inspection mechanism 5, the vacuum nozzle 3 is further controlled to rotate the connecting rod 31 to adjust the angle before or simultaneously with the IC placement on the Z-axis via the rotation adjustment component 42, correcting the rotational deviation generated during pickup. For minor angular deviations, a fine-tuning component is used for further adjustment. Finally, the IC is precisely placed on the PCB pads coated with solder paste at the corrected position and angle.

[0043] It is worth noting that in addition to vacuum adsorption, pneumatic grippers can also be used. Vacuum adsorption uses a vacuum pump to generate negative pressure to adsorb the IC onto the adsorption head, which is suitable for ICs with flat surfaces and ensures that the IC will not shift during the correction process. Pneumatic grippers, on the other hand, use the extension and retraction of a cylinder to open and close the grippers, thereby controlling the grippers to hold the IC stably and stably.

[0044] In this embodiment, as Figure 8 As shown, a positioning fixture 6 for clamping and fixing a PCB substrate is slidably connected on the conveyor line 2. The positioning fixture 6 has a positioning groove 61 that is adapted to the PCB substrate. Clamping bars 7 for fixing the positioning fixture 6 are provided on both sides of the conveyor line 2. The clamping bars 7 have an L-shaped structure and pressure plates 8 are provided on the clamping bars 7.

[0045] Specifically, the positioning fixture 6 and clamping strips 7 ensure the stability of the PCB substrate during transport, further improving the accuracy and reliability of IC packaging. When the conveyor line 2 transports the PCB substrate into the preset placement station, the clamping strips 7 and pressure plates 8 located on both sides of the conveyor line 2 move synchronously towards the center, gradually reducing the gap between them to accommodate the PCB substrate, until the clamping strips 7 and pressure plates clamp the upper and lower sides of the PCB substrate respectively, preventing the PCB substrate from shifting during the packaging process, which would affect the IC placement effect. A silicone buffer pad can be installed at the end of the pressure plate 8, causing elastic deformation when it contacts the PCB board, ensuring both fixing force and preventing damage to the board surface.

[0046] In this embodiment, as Figure 4 , 5 As shown, the three-axis moving platform 41 includes a Y-axis moving platform 412 for driving the vacuum nozzle 3 to move along the width direction of the housing 1, an X-axis moving platform 411 for driving the vacuum nozzle 3 to move along the length direction of the housing 1, and a Z-axis moving platform 413 for driving the vacuum nozzle 3 to move along the height direction of the housing 1. The bottom end of the Y-axis moving platform 412 is connected to the working platform 11 by a fixed bracket 414, and the moving trajectory of the movable end of the Y-axis moving platform 412 is perpendicular to the conveying direction of the conveyor line 2. The X-axis moving platform 411 is located at the movable end of the Y-axis moving platform 412, and the moving trajectory of the movable end of the X-axis moving platform 411 is parallel to the conveying direction of the conveyor line 2. The Z-axis moving platform 413 is located at the movable end of the X-axis moving platform.

[0047] Specifically, the three-axis moving platform 41 consists of high-precision linear guides, servo motors, and ball screws. The X and Y axes are used to move the vacuum nozzle 3 left and right, and forward and backward on the horizontal plane, while the Z axis is used to control the vertical movement of the vacuum nozzle 3. Through the coordinated movement of the three axes, the vacuum nozzle 3 can be accurately moved to the target position. For example, when the vision inspection system detects that the IC has shifted by 0.5mm in the X direction, the servo motor on the X axis will drive the linear guides and ball screws to move the vacuum nozzle 3 by 0.5mm in the X direction for position compensation.

[0048] To facilitate rapid IC loading via the vacuum nozzle 3, a feeding track 9 for transporting ICs is also provided on the work platform 11. The feeding track 9 is set perpendicular to the conveyor line 2, and one end of the feeding track 9 is externally connected to the loading system. Through the cooperation of the feeding track 9 and the loading system, automated IC transport is achieved, improving production efficiency and reducing labor costs.

[0049] It is worth noting that this device also requires a high-performance industrial-grade PLC control system as the core control component of the entire correction device. It receives IC position deviation data transmitted from the vision inspection system and, based on a preset control algorithm, generates corresponding control commands, which are then sent to the various drive components of the position adjustment mechanism 4. This coordinates the actions of each component, achieving precise control of the position and attitude of the vacuum nozzle 3, thereby completing the correction of the IC offset.

[0050] The working principle of this utility model:

[0051] The feeding system transports the IC to the feeding track 9, and the vacuum nozzle 3 picks up the IC through the placement head 32 under the action of the air source. The vision inspection mechanism 5 takes pictures of the IC picked up by the vacuum nozzle 3 to obtain the position and angle information of the IC, and transmits the information to the position adjustment mechanism 4 in the form of an electrical signal.

[0052] If a positional deviation of the IC is detected, the three-axis moving platform 41 drives the vacuum nozzle 3 to move along the X, Y, and Z axes according to the received electrical signals, adjusting the IC's position in space. If an angular deviation of the IC is detected, the rotary motor 422 of the rotary adjustment component 42 drives the rotary shaft 423 to rotate through the coupling 424, causing the vacuum nozzle 3 to rotate on the horizontal plane, correcting the angular deviation of the IC. If the IC has a slight tilt angle deviation, the angle sensor 425 detects the tilt angle information and transmits the signal to the piezoelectric ceramic driver 432. The piezoelectric ceramic driver 432 deforms and adjusts the tilt angle of the vacuum nozzle 3 through the flexible hinge 431, achieving fine adjustment of the IC's attitude.

[0053] After adjustment by the position adjustment mechanism 4, the vision inspection mechanism 5 inspects the IC again to confirm that the IC's position and angle meet the requirements. At this time, the vacuum nozzle 3 places the adjusted IC on the corresponding position of the PCB substrate held by the positioning fixture 6 on the conveyor line 2, completing the IC packaging operation.

[0054] Throughout the IC packaging process, the vision inspection mechanism 5 continuously monitors the status of the IC. If any deviation is detected, it promptly feeds back to the position adjustment mechanism 4 for readjustment, ensuring the accuracy and reliability of IC packaging.

[0055] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be included within the scope of protection of this application.

Claims

1. An IC packaging correction device, comprising a chassis, a work platform disposed on the chassis, a conveyor line extending laterally along the length of the work platform for conveying a PCB substrate, and a vacuum nozzle disposed above the conveyor line for picking up ICs, characterized in that, A position adjustment mechanism for adjusting the IC package position is connected between the vacuum nozzle and the working platform. The position adjustment mechanism includes a three-axis moving platform for driving the vacuum nozzle to move along the X, Y, and Z axes, a rotation adjustment component for driving the vacuum nozzle to rotate on a horizontal plane, and an attitude fine-tuning component for adjusting the tilt angle of the vacuum nozzle. One end of the rotation adjustment component is connected to the three-axis moving platform, and the other end is drivenly connected to the vacuum nozzle. The attitude fine-tuning component is connected between the vacuum nozzle and the rotation adjustment component, and the attitude fine-tuning component is linked to the rotation adjustment component to achieve precise adjustment of the rotational position and angle deviation of the vacuum nozzle.

2. The IC packaging correction device according to claim 1, characterized in that, The rotation adjustment assembly includes a fixed base, a rotary motor, and a rotary shaft. The fixed base is fixedly connected to the three-axis moving platform. The rotary motor is mounted on the fixed base, and a coupling is used to link the output end of the rotary motor with the rotary shaft. One end of the rotary shaft is connected to the coupling, and the other end is rotatably connected to the attitude fine-tuning assembly.

3. The IC packaging correction device according to claim 2, characterized in that, The rotation adjustment assembly also includes an angle sensor, which is fixed to the three-axis moving platform by a mounting bracket and is positioned on the side facing the vacuum nozzle. The angle sensor is connected to the rotary motor and the attitude fine-tuning assembly via signal coordination.

4. The IC packaging correction device according to claim 1, characterized in that, The attitude fine-tuning component includes a flexible hinge and a piezoelectric ceramic actuator. One end of the flexible hinge is hinged to the rotation shaft, and the other end is connected to the piezoelectric ceramic actuator. The piezoelectric ceramic actuator is installed at the bottom end of the flexible hinge, and one side of the piezoelectric ceramic actuator is connected to the vacuum nozzle.

5. The IC packaging correction device according to claim 1, characterized in that, The vacuum nozzle includes a connecting rod and a patch head. One end of the connecting rod is connected to the rotating shaft for transmission, and the other end is fixedly connected to the patch head. The vacuum nozzle is externally connected to an air source.

6. The IC packaging correction device according to claim 1, characterized in that, The conveyor line is slidably connected to a positioning fixture for clamping and fixing a PCB substrate. The positioning fixture has a positioning groove adapted to the PCB substrate. The conveyor line is provided with clamping bars on both sides of the positioning fixture for fixing the positioning fixture. The clamping bars have an L-shaped structure and are provided with pressure plates.

7. The IC packaging correction device according to claim 1, characterized in that, The three-axis moving platform includes a Y-axis moving platform for driving the vacuum nozzle to move along the width direction of the chassis, an X-axis moving platform for driving the vacuum nozzle to move along the length direction of the chassis, and a Z-axis moving platform for driving the vacuum nozzle to move along the height direction of the chassis. The bottom end of the Y-axis moving platform is connected to the working platform by a fixed bracket, and the moving trajectory of the movable end of the Y-axis moving platform is perpendicular to the conveying direction of the conveyor line. The X-axis moving platform is located at the movable end of the Y-axis moving platform, and the moving trajectory of the movable end of the X-axis moving platform is parallel to the conveying direction of the conveyor line. The Z-axis moving platform is located at the movable end of the X-axis moving platform.

8. The IC packaging correction device according to claim 1, characterized in that, The work platform is also equipped with a feeding track for conveying ICs. The feeding track is set perpendicular to the conveyor line, and one end of the feeding track is connected to the loading system.

Images