Thermal compression pressure equalization device for chip packaging

Abstract

The application discloses a kind of hot-pressing pressure equalization devices for chip packaging, and relate to chip packaging equipment technical field.The device includes workbench, hot-pressing mechanism, buffer component, pressure regulating component, pressure detection component and controller.Hot-pressing mechanism is driven by driving member to move hot-pressing head vertically, and spiral cooling channel is arranged in hot-pressing head to realize temperature regulation and control;Buffer component includes buffer plate and high-temperature-resistant silica gel pad layer, and is movably connected with hot-pressing head through guide column to ensure accurate guidance in vertical direction;Pressure detection component adopts 6x6 grid arrangement of pressure sensing array, and real-time acquisition of each area pressure distribution data;Pressure regulating component is composed of multiple independent fine adjustment units, each unit realizes local pressure compensation through piezoelectric ceramic driver, power transmission rod and ball hinge connection structure, cooperates with pre-pressing disc spring to ensure power transmission stability, and controller receives pressure sensing data, independently controls each driver extension and retraction through gradient descent algorithm to form closed-loop control.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and specifically to a thermal pressure equalization device for chip packaging. Background Technology

[0002] In the chip packaging manufacturing process, the hot pressing process is a key step to ensure a reliable connection between the chip and components such as the substrate and lead frame. Its core requirement is to achieve a uniform distribution of pressure during the hot pressing process.

[0003] However, traditional hot pressing devices have many technical drawbacks:

[0004] 1. The contact surface between the hot press head and the chip to be packaged is prone to microscopic unevenness due to processing errors, insufficient assembly precision, or thermal deformation, resulting in local pressure concentration or insufficient pressure.

[0005] 2. Traditional pressure regulation mostly adopts the overall pressure control method, which cannot accurately compensate for local pressure deviations, making it difficult to meet the stringent requirements of pressure uniformity for high-precision chip packaging (usually the pressure deviation needs to be controlled within ±2%).

[0006] 3. Temperature stability during hot pressing has a significant impact on packaging quality. Overheating of the hot pressing head can easily lead to deterioration of the packaging material performance, while traditional cooling structures are difficult to achieve precise temperature control.

[0007] 4. The response speed of pressure detection and regulation is insufficient, and it is impossible to track the dynamic pressure changes during the hot pressing process in real time. It is prone to defects such as poor soldering and over-soldering due to pressure drift, which seriously affects the chip packaging yield and reliability.

[0008] Therefore, those skilled in the art have provided a thermal pressure equalization device for chip packaging to solve the problems mentioned in the background art. Utility Model Content

[0009] To solve the above-mentioned technical problems, this utility model provides a thermo-pressure equalization device for chip packaging.

[0010] Includes a work frame, a hot pressing mechanism, a buffer assembly, a pressure regulating assembly, and a pressure detection assembly;

[0011] The hot pressing mechanism includes a drive component fixedly connected to the upper end of the fixed frame, and a hot pressing head threadedly connected to the telescopic end of the drive component via a flange. The hot pressing head has an annular boss at the center of its bottom.

[0012] The cushioning assembly includes a cushioning plate located directly below the hot press head and a high-temperature resistant silicone pad layer bonded to the bottom surface of the cushioning plate;

[0013] The buffer plate is movably connected to the hot press head via four guide pillars:

[0014] The pressure detection component includes a matrix mounting slot opened on the lower end face of the buffer plate and a pressure sensing array embedded inside the matrix mounting slot;

[0015] The pressure regulating assembly includes multiple independent fine-tuning units evenly distributed along the circumference of the annular boss.

[0016] Preferably, the independent fine-tuning unit includes a piezoelectric ceramic actuator vertically fixed to the top of the hot press head by screws, a force transmission rod whose upper end is inserted into a blind hole at the output end of the piezoelectric ceramic actuator and locked by a set screw, and a hard alloy ball head fixedly connected to the lower end of the force transmission rod. The buffer plate has a hard alloy ball socket on its upper surface, and the hard alloy ball head is rotatably disposed inside the hard alloy ball socket to form a ball joint.

[0017] Preferably, the independent fine-tuning unit further includes a preloaded disc spring sleeved on the outside of the force transmission rod, a limiting flange is fixed on the outside of the force transmission rod, and the preloaded disc spring is abutted between the limiting flange and the annular boss.

[0018] Preferably, it also includes a controller, which is electrically connected to the piezoelectric ceramic actuator and the pressure sensor array, respectively.

[0019] Preferably, the upper end of the guide post is interference-fitted to the mounting hole opened on the side wall of the hot press head, the four corners of the buffer plate are provided with guide holes, the lower end of the guide post passes through the guide hole, and the guide post is a stepped shaft structure, including an upper large-diameter section and a lower guide section.

[0020] Preferably, the contact surface between the ball head and the ball socket is coated with a molybdenum disulfide solid lubricant layer.

[0021] Preferably, the hot press head is further provided with a spiral cooling channel inside, and the inlet and outlet of the spiral cooling channel both pass through the flange.

[0022] Preferably, the detection units of the pressure sensing array are arranged in a 6×6 grid.

[0023] Preferably, the annular boss has multiple disc spring positioning posts evenly distributed on its inner circumference, and the inner hole of the preloaded disc spring is clearance-fitted with the disc spring positioning posts.

[0024] The technical effects and advantages of this utility model are as follows:

[0025] 1. The pressure distribution in each area is captured in real time by a 6×6 grid-arranged pressure sensor array. It can accurately identify local pressure concentration or insufficiency caused by processing errors, insufficient assembly precision or thermal deformation. Combined with the piezoelectric ceramic actuator with an independent fine-tuning unit, it forms a closed-loop control and can perform targeted pressure compensation for abnormal areas. This fundamentally improves the problem of uneven pressure distribution caused by micro-unevenness of the contact surface and ensures uniform pressure transmission.

[0026] 2. Abandoning the traditional overall pressure control mode, a local adjustment structure with one-to-one correspondence between "detection unit and fine-tuning unit" is adopted. Each pressure sensor array detection unit corresponds to an independent fine-tuning unit. After analyzing the pressure deviation through the gradient descent algorithm, the piezoelectric ceramic actuator realizes micron-level precise expansion and contraction adjustment, strictly controlling the pressure deviation within ±2%, which fully meets the stringent requirements of high-precision chip packaging for pressure uniformity and solves the technical bottleneck of traditional methods that cannot provide local compensation.

[0027] 3. The hot press head is designed with a spiral cooling channel inside. By adjusting the flow rate of the cooling medium, the temperature can be dynamically controlled, which can effectively avoid the degradation of the encapsulation material performance caused by overheating of the hot press head. At the same time, the heat insulation design is adopted to block the heat from being transferred to the pressure sensing array, which not only ensures temperature stability, but also avoids the impact of thermal interference on the pressure detection accuracy, thus achieving precise temperature control in the hot pressing process.

[0028] 4. The pressure sensor array acquires pressure data in real time in high-frequency mode. Combined with a piezoelectric ceramic actuator with a response time of ≤10ms, it forms a fast-response "detection-adjustment" mechanism. It can track dynamic pressure changes during hot pressing in real time. When pressure drift occurs, it can immediately start compensation adjustment, effectively avoiding defects such as poor soldering and over-soldering caused by pressure lag. It significantly improves chip packaging yield and reliability and solves the problem of slow response in traditional devices.

[0029] 5. The design combines a ball joint structure with a pre-compressed disc spring. The pre-compressed disc spring provides continuous preload to ensure close contact between the force transmission rod and the buffer plate, avoiding adjustment backlash. The ball joint structure allows the buffer plate to adaptively fine-tune its angle according to the pressure distribution, ensuring smooth pressure transmission. This design enables the device to respond to pressure drift in real time during hot pressing, quickly compensating for pressure changes caused by temperature fluctuations and chip deformation. Furthermore, the precise fit between the guide post of the stepped shaft structure and the guide hole of the buffer plate limits the horizontal offset of the buffer plate, ensuring the coaxiality of the hot pressing head and the buffer assembly, and avoiding pressure deviation caused by off-center loading.

[0030] 6. The controller achieves fully automated pressure regulation by integrating the pressure sensor array and the piezoelectric ceramic actuator for communication control, reducing manual intervention. The application of the gradient descent algorithm makes the pressure regulation process more intelligent, which can autonomously identify pressure deviations and perform compensation actions, improving the consistency and stability of the packaging process and providing reliable equipment support for large-scale chip packaging production. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of a thermal pressure equalization device for chip packaging provided in an embodiment of this application;

[0032] Figure 2This is a schematic diagram of the structure of a thermal pressure equalization device for chip packaging provided in an embodiment of this application;

[0033] Figure 3 This is a partial side cross-sectional view of a thermal pressure equalization device for chip packaging provided in an embodiment of this application. Figure 1 ;

[0034] Figure 4 This is a partial side cross-sectional view of a thermal pressure equalization device for chip packaging provided in an embodiment of this application. Figure 2 ;

[0035] Figure 5 This is a partial bottom cross-sectional view of a thermal pressure equalization device for chip packaging provided in an embodiment of this application. Figure 1 ;

[0036] Figure 6 This is a partial bottom cross-sectional view of a thermal pressure equalization device for chip packaging provided in an embodiment of this application. Figure 2 ;

[0037] In the picture:

[0038] 100. Hot pressing mechanism; 200. Buffer assembly; 101. Hot pressing head; 102. Driving component; 103. Flange; 104. Annular boss; 105. Disc spring positioning post; 201. Buffer plate; 202. High temperature resistant silicone pad; 203. Guide post; 204. Guide hole; 301. Pressure sensor array; 401. Independent fine-tuning unit; 402. Piezoelectric ceramic actuator; 403. Force transmission rod; 404. Preloaded disc spring; 406. Ball head; 407. Limiting flange; 408. Ball socket. Detailed Implementation

[0039] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical applications of the present invention, and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for a particular purpose.

[0040] Example 1

[0041] Please see Figures 1-6This embodiment provides a hot-press pressure equalization device for chip packaging, including a work stand, a hot-press mechanism 100, a buffer component 200, a pressure regulating component, and a pressure detection component. The work stand serves as the mounting base of the device, providing stable support and positioning for core components such as the hot-press mechanism and the buffer component, and ensuring the relative position accuracy of each component.

[0042] The hot pressing mechanism 100 includes a drive member 102 fixedly connected to the upper end of the fixed frame, and a hot pressing head 101 threadedly connected to the telescopic end of the drive member 102 via a flange 103; the bottom center of the hot pressing head 101 is provided with an annular boss 104, and multiple disc spring positioning pins 105 are evenly distributed on the inner circumference of the boss.

[0043] The drive unit 102 is fixed to the upper end of the work frame, providing vertical driving force for the hot press head and controlling the downward pressure and upward reset actions of the hot press head; the hot press head 101 is connected to the telescopic end of the drive unit through a flange, and is the main carrier for transmitting hot pressure, and its bottom annular boss provides an installation reference for the pressure regulating assembly.

[0044] The buffer assembly 200 includes a buffer plate 201 located directly below the hot press head 101 and a high-temperature resistant silicone pad 202 bonded to the bottom surface of the buffer plate 201. The distance H between the upper surface of the buffer plate 201 and the bottom surface of the hot press head 101 satisfies: 0.5mm≤H≤3mm.

[0045] The buffer plate 201 is movably connected to the hot press head 101 via four guide pillars 203;

[0046] The buffer plate 201 serves as an intermediate carrier for pressure transmission. Its upper surface is connected to the pressure regulating component via a ball joint, and its lower surface carries the pressure sensor array and silicone pad. The 0.5-3mm gap H between the buffer plate 201 and the bottom surface of the hot press head is reserved for the pressure regulation stroke space.

[0047] The high-temperature resistant silicone pad 202 is bonded to the bottom surface of the buffer plate and directly contacts the chip to be packaged. It achieves pressure buffering through its own elastic deformation, while avoiding direct contact between hard components and the chip, thus preventing damage.

[0048] The upper end of the guide post 203 is interference-fitted to the mounting hole on the side wall of the hot press head 101. Guide holes 204 are provided at the four corners of the buffer plate 201. The lower end of the guide post 203 passes through the guide hole 204. The diameter D1 of the guide hole 204 and the diameter D2 of the guide post satisfy: D1-D2=0.08±0.02mm. The guide post 203 is a stepped shaft structure, including an upper large-diameter section and a lower guide section. The diameter of the large-diameter section is Φ6h6, and the diameter of the guide section is Φ4g6. The upper end is interference-fitted to the side wall of the hot press head, and the lower end passes through the guide hole of the buffer plate to realize the vertical guidance of the hot press head and the buffer assembly, and limit the horizontal displacement of the buffer plate. Its 0.08±0.02mm fit clearance ensures that the buffer plate can move up and down flexibly without jamming.

[0049] The pressure detection component includes a matrix mounting groove opened on the lower end face of the buffer plate and a pressure sensor array 301 embedded inside the matrix mounting groove. The interior of the matrix mounting groove is coated with a ceramic heat insulation layer. The detection surface of the pressure sensor array 301 is flush with the lower end face of the buffer plate 201 and directly contacts the upper surface of the high-temperature resistant silicone pad layer 202.

[0050] The pressure regulating component includes multiple independent fine-tuning units 401 evenly distributed circumferentially along the annular boss 104, each unit corresponding to a detection area of ​​the pressure sensing array.

[0051] The independent fine-tuning unit 401 includes a piezoelectric ceramic actuator 402 vertically fixed to the top of the hot press head 101 by screws, a force transmission rod 403 whose upper end is inserted into a blind hole at the output end of the piezoelectric ceramic actuator 402 and locked by a set screw, and a hard alloy ball head 406 fixedly connected to the lower end of the force transmission rod 403. A hard alloy ball socket 408 is opened on the upper surface of the buffer plate 201. The hard alloy ball head 406 is rotatably disposed inside the hard alloy ball socket 408 and forms a ball joint. The transmission rod 403 passes through the hot press head and is slidably disposed inside the hot press head. The radius of curvature R1 of the ball socket is 0.05-0.1mm larger than the radius of curvature R2 of the ball head.

[0052] The independent fine-tuning unit 401 also includes a preloaded disc spring 404 sleeved on the outside of the force transmission rod 403. A limiting flange 407 is fixed on the outside of the force transmission rod 403. The preloaded disc spring 404 is abutted between the limiting flange 407 and the annular boss 104. The inner hole of the disc spring is clearance-fitted with the disc spring positioning post 105, with a fit clearance ≤0.03mm. The annular boss provides an upper support surface for the preloaded disc spring. The disc spring positioning post restricts the radial displacement of the preloaded disc spring to ensure stable transmission of preload.

[0053] It also includes a controller, which is electrically connected to the piezoelectric ceramic actuator 402 and the pressure sensor array 301 respectively. The controller receives data from the pressure sensor array 301 and independently controls the extension and retraction stroke of each piezoelectric ceramic actuator 402 through a gradient descent algorithm, with a response time ≤10ms.

[0054] The contact surfaces of the ball head 406 and the ball socket 408 are coated with a molybdenum disulfide solid lubricant layer with a coating thickness of 3-5μm and a curing temperature of 80±5℃, which ensures both force transmission efficiency and allows for slight angle adjustment of the buffer plate.

[0055] The hot press head 101 is also equipped with a spiral cooling channel. The inlet and outlet of the spiral cooling channel both pass through the flange 103. The cooling medium flow rate is 0.5-1.0L / min. The spiral cooling channel is opened inside the hot press head. The cooling medium flow rate of 0.5-1.0L / min is introduced through the inlet and outlet to achieve temperature control during the hot pressing process and avoid the hot press head from overheating and causing a decrease in packaging accuracy.

[0056] The pressure sensor array 301 has a 6×6 grid of detection units with a center-to-center spacing of 4.5±0.1mm, a range of 0-100N, and an accuracy of 0.5%FS. It can collect pressure distribution data in various areas in real time and provide accurate feedback for pressure regulation.

[0057] The inner hole of the disc spring and the disc spring positioning post 105 are clearance-fitted, with a clearance ≤ 0.03mm.

[0058] The usage process of this solution is as follows:

[0059] After the device is started, it enters the standby state. The hot press head 101 is in the initial high position, the drive component 102 is not started, the piezoelectric ceramic actuator 402 of the pressure regulating component is in the initial extension position, the pre-compression disc spring 404 is kept pre-tight under the limit of the disc spring positioning post 105, the force transmission rod 403 is hinged to the ball socket 408 of the buffer plate 201 through the ball head 406, the pressure sensor array 301 is powered on for self-test, the controller completes the communication connection test, the spiral cooling channel 106 begins to introduce cooling medium, the hot press head is preheated to the process temperature, the chip to be packaged is positioned on the work stand directly below the silicone pad layer 202 by the conveying mechanism, and the chip is locked by existing technology, such as vacuum chuck.

[0060] The controller sends a downward command to the drive unit 102. The drive unit drives the hot press head 101 to descend vertically through the flange 103. The guide column 203 slides along the guide hole 204 of the buffer plate to ensure the coaxiality of the hot press head and the buffer assembly. When the hot press head descends to the preset distance, the silicone pad 202 first contacts the chip surface. As the hot press head continues to descend, the silicone pad is squeezed and deformed. The pressure is transmitted to the pressure sensing array 301 through the buffer plate 201. The array begins to collect the initial pressure data and transmit it to the controller. At this time, the pressure value gradually increases with the increase of the downward distance, but the distribution is not yet uniform.

[0061] When the hot press head approaches the preset pressure threshold, the pressure sensor array 301 enters a high-frequency detection mode with a sampling frequency ≥1kHz. The 6×6 grid unit provides real-time feedback of the pressure values ​​of each area. After receiving the data, the controller calculates the pressure distribution deviation using a gradient descent algorithm. If the detected pressure in a certain area is lower than the standard value, the controller sends an extension command to the piezoelectric ceramic actuator 402 of the corresponding independent fine-tuning unit 401. The actuator pushes the force transmission rod 403 downward, and the ball head 406 applies additional pressure to the buffer plate 201. The pre-compression disc spring 404 is further compressed by the limiting flange 407. If the pressure in a certain area is too high, the controller commands the corresponding actuator to shorten, and the force transmission rod moves upward under the rebound of the disc spring, reducing the local pressure. During the adjustment process, the clearance fit between the ball head and the ball socket and the lubrication layer ensure that the buffer plate can adaptively adjust the angle according to the pressure distribution. The guide column limits the horizontal offset, ensuring the stability of the adjustment.

[0062] When the pressure sensor array 301 detects that the pressure values ​​in all areas are stable within the allowable process range with a deviation of ≤±2%, the device enters the pressure holding stage. The controller maintains the current state of each piezoelectric ceramic actuator 402 and continuously monitors pressure changes, updating the data every 10ms. If local pressure drift occurs due to temperature fluctuations or chip deformation, the controller immediately initiates dynamic compensation, maintaining pressure uniformity by fine-tuning the actuator extension and retraction. During this stage, the spiral cooling channel 106 adjusts the cooling medium flow rate according to the real-time temperature of the hot press head, ensuring that the temperature remains stable within the set range with fluctuations of ≤±1℃.

[0063] After the holding time reaches the preset value, the controller sends an upward command to the drive unit 102, and the hot pressing head 101 begins to reset upward. The guide post 203 slides along the guide hole to guide the hot pressing head away from the buffer assembly. At the same time, the controller commands all piezoelectric ceramic actuators 402 to reset to their initial positions. The force transmission rod 403 returns to its initial height under the action of the pre-compression disc spring 404. The pressure sensor array 301 stops high-frequency detection and stores the pressure distribution curve for process optimization analysis. After the hot pressing head is fully reset, the cooling channel gradually reduces the flow rate, the device returns to standby state, and the current packaging cycle is completed, waiting for the next chip to be loaded.

[0064] Through the above closed-loop control process, the device can realize real-time monitoring and precise adjustment of hot pressing pressure, effectively solving the problem of uneven pressure caused by uneven contact surfaces and temperature deformation in chip packaging, and significantly improving the packaging yield.

[0065] The drive components in this solution are common parts such as cylinders, hydraulic cylinders, and electric telescopic rods. Users can choose according to their needs, and this solution will not elaborate further.

[0066] The hot press head in this solution can be equipped with a heating wire inside as needed to achieve a heating effect, or other heating devices that have a heating effect and are commercially available and suitable for use in this field. This is common knowledge in this field, and this solution will not elaborate further.

[0067] All electrical components mentioned in this article are electrically connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer for control. The detailed description of known functions and known components is omitted in the specific embodiments disclosed herein. To ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0068] In this solution, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this solution according to the specific circumstances.

[0069] Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of this utility model without creative effort should fall within the protection scope of this utility model. Structures, devices, and operating methods not specifically described and explained in this utility model, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A thermo-pressing pressure equalization device for chip packaging, comprising a work stand, a thermo-pressing mechanism (100), a buffer assembly (200), a pressure regulating assembly, and a pressure detection assembly, characterized in that, The hot pressing mechanism (100) includes a drive member (102) fixedly connected to the upper end of the fixed frame, and a hot pressing head (101) threadedly connected to the telescopic end of the drive member (102) via a flange (103). The hot pressing head (101) has an annular boss (104) at the bottom center. The buffer assembly (200) includes a buffer plate (201) located directly below the hot press head (101) and a high-temperature resistant silicone pad (202) bonded to the bottom surface of the buffer plate (201). The buffer plate (201) is movably connected to the hot press head (101) via four guide posts (203): The pressure detection component includes a matrix mounting slot opened on the lower end face of the buffer plate and a pressure sensing array (301) embedded inside the matrix mounting slot. The pressure regulating assembly includes multiple independent fine-tuning units (401) evenly distributed circumferentially along the annular boss (104).

2. The thermal pressure equalization device for chip packaging according to claim 1, characterized in that, The independent fine-tuning unit (401) includes a piezoelectric ceramic actuator (402) vertically fixed to the top of the hot press head (101) by screws, a force transmission rod (403) inserted into the blind hole of the output end of the piezoelectric ceramic actuator (402) and locked by a set screw, and a hard alloy ball head (406) fixedly connected to the lower end of the force transmission rod (403). The upper surface of the buffer plate (201) is provided with a hard alloy ball socket (408). The hard alloy ball head (406) is rotatably disposed inside the hard alloy ball socket (408) and forms a ball hinge.

3. The thermal pressure equalization device for chip packaging according to claim 2, characterized in that, The independent fine-tuning unit (401) also includes a preloaded disc spring (404) sleeved on the outside of the force transmission rod (403). A limiting flange (407) is fixed on the outside of the force transmission rod (403), and the preloaded disc spring (404) is abutted between the limiting flange (407) and the annular boss (104).

4. The thermal pressure equalization device for chip packaging according to claim 2, characterized in that, It also includes a controller, which is electrically connected to the piezoelectric ceramic actuator (402) and the pressure sensing array (301), respectively.

5. The thermal pressure equalization device for chip packaging according to claim 1, characterized in that, The upper end of the guide post (203) is fixed to the mounting hole opened on the side wall of the hot press head (101) by interference fit. The four corners of the buffer plate (201) are provided with guide holes (204). The lower end of the guide post (203) passes through the guide hole (204). The guide post (203) is a stepped shaft structure, including an upper large diameter section and a lower guide section.

6. The thermal pressure equalization device for chip packaging according to claim 2, characterized in that, The contact surfaces of the ball head (406) and the ball socket (408) are coated with a molybdenum disulfide solid lubricant layer.

7. The thermal pressure equalization device for chip packaging according to claim 1, characterized in that, The hot press head (101) is also provided with a spiral cooling channel inside, and the inlet and outlet of the spiral cooling channel both pass through the flange (103).

8. The thermal pressure equalization device for chip packaging according to claim 1, characterized in that, The detection units of the pressure sensing array (301) are arranged in a 6×6 grid.

9. The thermal pressure equalization device for chip packaging according to claim 3, characterized in that, The annular boss (104) has multiple disc spring positioning posts (105) evenly distributed on its inner circumference, and the inner hole of the pre-compressed disc spring (404) is clearance-fitted with the disc spring positioning posts (105).

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