A cleaning and polishing apparatus for wafer production

Abstract

The utility model relates to wafer production technical field, and disclose a kind of cleaning and polishing equipment for wafer production, including machine body, the inside movable mounting of machine body is equipped with cleaning spray head, the inside fixed mounting of machine body is equipped with backwater cylinder, the inside movable mounting of backwater cylinder is equipped with wafer fixing disc, wafer fixing disc is equipped with fixed assembly, and the inside of backwater cylinder is equipped with including extension shaft and protruding disc drive assembly. The utility model is provided with wafer fixing disc and drive assembly, wafer fixing disc is supported and fixed when wafer cleaning, in cleaning process, by protruding disc rotation drive extension shaft does 360 ° inclined rotation movement with extension shaft as center in backwater cylinder, in cleaning process, cleaning fluid is exported through cleaning spray head to clean wafer, and the residue of cleaning is accelerated to discharge along the inclined wafer surface, avoid wafer surface residue adhesion, improve cleaning effect.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing technology, and in particular to a cleaning and polishing device for wafer manufacturing. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, then slowly pulled out to form cylindrical single-crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod is formed into a silicon wafer, which is a crystal. To remove particulate matter adhering to the surface of the wafer before polishing and to remove debris adhering to the surface after polishing, surface cleaning is usually required before and after wafer polishing. During cleaning, the wafer is held in a fixture, and the cleaning fluid is sprayed onto the wafer surface by rotating the wafer and oscillating the nozzle to achieve surface cleaning. Since the wafer is fixed horizontally during cleaning, residual cleaning fluid and some adhering substances may remain on the wafer surface and not be completely removed, resulting in incomplete wafer cleaning.

[0003] Therefore, we propose a cleaning and polishing equipment for wafer production. Utility Model Content

[0004] The present invention aims to solve the technical problems existing in the prior art and provide a cleaning and polishing equipment for wafer production.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a cleaning and polishing device for wafer production, comprising a body, a cleaning nozzle movably installed inside the body, a water return cylinder fixedly installed inside the body, a wafer fixing disk movably installed inside the water return cylinder, a fixing component provided on the wafer fixing disk, and a drive component including an extension shaft and a raised disk provided inside the water return cylinder. The extension shaft is fixedly installed at the bottom of the wafer fixing disk. A groove is provided at the bottom of the extension shaft, and a raised disk is rotatably installed on the lower side of the extension shaft. One end of the raised disk is curved upward.

[0006] Preferably, the drive assembly further includes a connecting block, which is fixedly installed on the top of the raised disc and movably installed inside the groove at the bottom of the extension shaft. The connecting block is located at the raised end of the raised disc. A positioning shaft is fixedly installed at the bottom of the inner wall of the return water cylinder, and a positioning clamp is slidably installed on the positioning shaft. The positioning clamp is rotatably connected to the extension shaft.

[0007] Preferably, a water outlet pipe is fixedly installed at the bottom of the return water cylinder, and a connecting component is provided inside the machine body, through which the cleaning nozzle is movably installed inside the machine body.

[0008] Preferably, the connecting assembly includes a movable frame, which is rotatably mounted inside the machine body. A cleaning nozzle is fixedly mounted on one side of the movable frame, and a rotating tube is fixedly mounted on the side of the movable frame away from the cleaning nozzle. The cleaning nozzle is connected to the rotating tube through a pipe.

[0009] Preferably, the fixing assembly includes positioning clamps, with three positioning clamps slidably mounted on top of the wafer fixing disk.

[0010] Preferably, the fixing component also includes a chassis, which is rotatably mounted on the bottom of the wafer fixing disk. An adjustment groove is provided on the chassis corresponding to the three positioning clamps. A synchronous shaft is slidably installed inside the adjustment groove, and the synchronous shaft is fixedly connected to the corresponding positioning clamp.

[0011] Preferably, an extension block is fixedly installed on the outer circular wall of the chassis, an installation short cylinder is fixedly installed on the extension block, a positioning short shaft is slidably installed inside the installation short cylinder, a spring is fixedly installed inside the installation short cylinder, the spring is sleeved with the positioning short shaft, one end of the spring is fixedly connected to the positioning short shaft, a lever is fixedly installed on one end of the positioning short shaft extending to the lower side of the installation short cylinder, and fixing holes are evenly opened at the bottom of the wafer fixing disk.

[0012] This utility model provides a cleaning and polishing equipment for wafer production, which has the following improvements and advantages compared with the prior art: By setting a wafer fixing disk and a driving component, the wafer fixing disk supports and fixes the wafer during cleaning. During the cleaning process, the extension shaft is driven by the rotation of the raised disk to make a 360° inclined rotation movement with the extension shaft as the center inside the return water cylinder. During the cleaning process, the cleaning fluid is discharged through the cleaning nozzle to clean the wafer. The cleaning residue is discharged faster along the inclined wafer surface, avoiding the adhesion of residue on the wafer surface and improving the cleaning effect. Attached Figure Description

[0013] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0014] Figure 1 A schematic diagram of the structure of a cleaning and polishing device for wafer production proposed in this utility model; Figure 2 A schematic diagram illustrating the installation of a water return cylinder in a cleaning and polishing equipment for wafer production, as proposed in this utility model. Figure 3A schematic diagram of the drive component in a cleaning and polishing device for wafer production, as proposed in this utility model; Figure 4 A schematic diagram of the structure of a fixing component in a cleaning and polishing equipment for wafer production, as proposed in this utility model; Figure 5 A schematic diagram of the installation of a fixing component in a cleaning and polishing equipment for wafer production, as proposed in this utility model. Figure 6 This is a schematic diagram of the internal structure of a short cylinder installed in a cleaning and polishing device for wafer production, as proposed in this utility model.

[0015] Legend: 1. Main body; 2. Movable frame; 3. Rotating tube; 4. Cleaning nozzle; 5. Water return tube; 6. Water outlet tube; 7. Wafer fixing plate; 8. Extension shaft; 9. Raised plate; 10. Connecting block; 11. Positioning shaft; 12. Positioning clamp; 13. Base; 14. Adjustment groove; 15. Fixing hole; 16. Extension block; 17. Synchronous shaft; 18. Mounting short cylinder; 19. Positioning short shaft; 20. Spring; 21. Handle. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] A cleaning and polishing device for wafer fabrication, such as Figure 1 - Figure 6As shown, the device includes a body 1. A cleaning nozzle 4 is movably installed inside the body 1. Cleaning fluid is discharged through the cleaning nozzle 4 and sprayed onto the wafer surface for cleaning. A connecting assembly is provided inside the body 1, through which the cleaning nozzle 4 is movably installed. A return water cylinder 5 is fixedly installed inside the body 1. The return water cylinder 5 has a hollow structure with an opening at the top. The interior of the return water cylinder 5 is the cleaning area. During cleaning, the wafer is fixed inside the return water cylinder 5 for cleaning. A water outlet pipe 6 is fixedly installed at the bottom of the return water cylinder 5, connecting to an external circulation tank. The water outlet pipe 6 can recycle the cleaning fluid recovered during cleaning back to the external circulation tank. A wafer holding plate 7 is movably installed inside the return water cylinder 5, and a mechanism for driving the wafer is provided inside the return water cylinder 5. The drive assembly of the wafer holder 7, after the wafer is fixed on the wafer holder 7, drives the wafer to rotate and tilt during cleaning, accelerating the discharge of cleaning fluid on the wafer surface. The wafer holder 7 is equipped with a fixing assembly that can fix wafers of different specifications. With the wafer holder 7 and drive assembly, when the wafer is pre-washed to remove surface impurities before polishing or cleaned to remove polishing fluid after polishing, the wafer is fixed inside the wafer holder 7. The cleaning nozzle 4 swings back and forth regularly on the upper side of the wafer, and works with the drive assembly to drive the wafer holder 7 to rotate and tilt 360° inside the machine body 1, so that the wafer rotates in an inclined position inside the machine body 1. While achieving comprehensive cleaning of the wafer surface, it also accelerates the discharge of cleaning fluid, impurities or polishing fluid from the wafer surface.

[0018] Furthermore, the connecting assembly includes a movable frame 2, which is rotatably mounted inside the body 1. A cleaning nozzle 4 is fixedly mounted on one side of the movable frame 2. A rotating tube 3 is fixedly mounted on the side of the movable frame 2 away from the cleaning nozzle 4. The rotating tube 3 has a hollow structure and is rotatably mounted inside the body 1. The cleaning nozzle 4 is connected to the rotating tube 3 via a pipe. The rotating tube 3 is connected to an external cleaning fluid tank via a flexible hose. The cleaning fluid in the external cleaning fluid tank is introduced into the flexible hose by a water pump and then enters the cleaning nozzle 4 through the rotating tube 3 and the pipe, spraying it onto the wafer surface. The rotating tube 3 is driven by a servo motor, which is electrically connected to an external controller. The rotating tube 3 is fixedly connected to the output shaft of the servo motor. With this connecting assembly, during cleaning before and after wafer polishing, the rotating tube 3 is driven by the servo motor to swing back and forth rhythmically on the upper side of the wafer, coordinating with the 360° rotation of the wafer, to achieve comprehensive cleaning of the wafer surface and ensure cleaning effectiveness.

[0019] Furthermore, the fixing assembly includes positioning clamps 12. Three positioning clamps 12 are slidably mounted on the top of the wafer fixing disk 7. The included angle between any two positioning clamps 12 is 120°. The positioning clamps 12 are slidably mounted on the top of the wafer fixing disk 7 through the cooperation of sliding grooves and sliders. The sliding grooves are formed on the wafer fixing disk 7, and the sliders are fixedly mounted on the bottom of the positioning clamps 12. A base 13 is rotatably mounted on the bottom of the wafer fixing disk 7. Adjustment grooves 14 are formed on the base 13 corresponding to the three positioning clamps 12. The adjustment grooves 14 are arc-shaped grooves. Synchronous shafts 17 are slidably mounted inside the adjustment grooves 14. The synchronous shafts 17 are fixedly connected to the corresponding positioning clamps 12. An extension block 16 is fixedly mounted on the outer circular wall of the base 13. An installation short cylinder 18 is fixedly mounted on the extension block 16. The installation short cylinder 18 is a hollow structure and extends to the upper and lower sides of the extension block 16. A positioning short shaft 19 is slidably mounted inside the installation short cylinder 18. A spring 20 is fixedly installed inside the mounting short cylinder 18. The spring 20 is sleeved with the positioning short shaft 19. One end of the spring 20 is fixedly connected to the positioning short shaft 19. A ring is fixedly installed inside the mounting short cylinder 18. The ring is fixedly connected to one end of the spring 20. The positioning short shaft 19 is sleeved with the ring. A lever 21 is fixedly installed on one end of the positioning short shaft 19 extending to the lower side of the mounting short cylinder 18. Fixing holes 15 are evenly opened at the bottom of the wafer fixing disk 7. The positions of multiple fixing holes 15 are set according to the size difference of wafers of different specifications. With the fixing components, the wafer fixing disk 7 supports the wafer during cleaning before and after wafer polishing. During support, the three positioning clamps 12 are adjusted by adjusting the base 13 and cooperating with the synchronous shaft 17 and the adjusting groove 14 to ensure that the three positioning clamps 12 clamp and fix the wafer from the outer circular wall. The base 13 can be rotated and adjusted according to the size of wafers of different specifications to adapt to the cleaning and fixing of wafers of different specifications.

[0020] Furthermore, the drive assembly includes an extension shaft 8, which is fixedly mounted on the bottom of the wafer mounting disk 7. A groove is formed at the bottom of the extension shaft 8. A raised disk 9 is rotatably mounted on the lower side of the extension shaft 8, with one end of the raised disk 9 tilted upwards. The raised disk 9 is driven by a motor, which is electrically connected to an external controller. The output shaft of the motor is fixedly connected to the raised disk 9. A connecting block 10 is fixedly mounted on the top of the raised disk 9. The connecting block 10 is composed of a spherical block and a short cylindrical shaft. The connecting block 10 is movably mounted inside the groove at the bottom of the extension shaft 8. The connecting block 10 is positioned on the tilted end of the raised disk 9. At the end, a positioning shaft 11 is fixedly installed on the bottom of the inner wall of the return water cylinder 5. A positioning clamp 12 is slidably installed on the positioning shaft 11 and is rotatably connected to the extension shaft 8. By setting a drive assembly, the wafer fixing disk 7 supports and fixes the wafer during cleaning. During the cleaning process, the extension shaft 8 is driven to make a 360° tilting rotation inside the return water cylinder 5 with the extension shaft 8 as the center. During the cleaning process, the cleaning fluid is discharged through the cleaning nozzle 4 to clean the wafer. The cleaning residue is discharged faster along the tilted wafer surface to avoid the adhesion of residue on the wafer surface and improve the cleaning effect.

[0021] The working principle of this utility model is as follows: When cleaning the wafer before and after polishing, the wafer is fixed inside the wafer fixing disk 7. The extension block 16 is rotated, and the rotation of the extension block 16 drives the base 13 to rotate. When the base 13 rotates, it drives the synchronous shaft 17 to rotate and adjust inside the adjustment groove 14. According to the wafer of different sizes and specifications, the base 13 is rotated and adjusted to the target position. The three positioning clamps 12 clamp and fix the wafer from the outside. The positioning short shaft 19 moves up under the action of the spring 20 and is inserted into the corresponding fixing hole 15, and the wafer is fixed. After the wafer is fixed, it is ready for cleaning. The cleaning fluid is drawn into the elastic tube by the external water pump and then introduced into the cleaning nozzle 4 through the elastic tube and pipe and sprayed out. At the same time, the servo motor drives the rotating tube 3 to swing back and forth on the upper side of the wafer. The cleaning fluid swings back and forth on the upper side of the wafer and sprays out to different positions on the wafer surface. Simultaneously, the control motor drives the raised disk 9 to rotate. When the raised disk 9 rotates, it can drive the extension shaft 8 to drive the wafer fixing disk 7 to tilt and rotate 360° inside the return water cylinder 5 with the extension shaft 8 as the center. After the cleaning fluid is sprayed onto the wafer surface, the cleaning fluid and the adhering substances can be discharged downward along the tilted wafer surface. The cleaning fluid and deposits discharged along the surface of the return water cylinder 5 flow through the outlet pipe 6 to the external circulation tank for centralized collection and treatment.

[0022] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A cleaning and polishing device for wafer production, comprising a body (1), wherein a cleaning nozzle (4) is movably installed inside the body (1), and a water return cylinder (5) is fixedly installed inside the body (1), characterized in that: The return water cylinder (5) is movably installed with a wafer fixing disk (7), and a fixing component is provided on the wafer fixing disk (7). The return water cylinder (5) is provided with a drive component including an extension shaft (8) and a raised disk (9). The extension shaft (8) is fixedly installed at the bottom of the wafer fixing disk (7). A groove is provided at the bottom of the extension shaft (8). A raised disk (9) is rotatably installed on the lower side of the extension shaft (8). One end of the raised disk (9) is raised upward.

2. The cleaning and polishing equipment for wafer production according to claim 1, characterized in that: The drive assembly also includes a connecting block (10), which is fixedly installed on the top of the raised disc (9). The connecting block (10) is movably installed inside the groove at the bottom of the extension shaft (8). The connecting block (10) is located at the raised end of the raised disc (9). A positioning shaft (11) is fixedly installed at the bottom of the inner wall of the return water cylinder (5). A positioning clamp (12) is slidably installed on the positioning shaft (11). The positioning clamp (12) is rotatably connected to the extension shaft (8).

3. The cleaning and polishing equipment for wafer production according to claim 1, characterized in that: The bottom of the return water cylinder (5) is fixedly installed with a water outlet pipe (6), and the inside of the body (1) is provided with a connecting component. The cleaning nozzle (4) is movably installed inside the body (1) through the connecting component.

4. The cleaning and polishing equipment for wafer production according to claim 3, characterized in that: The connecting assembly includes a movable frame (2), which is rotatably installed inside the body (1). A cleaning nozzle (4) is fixedly installed on one side of the movable frame (2). A rotating tube (3) is fixedly installed on the side of the movable frame (2) away from the cleaning nozzle (4). The cleaning nozzle (4) is connected to the rotating tube (3) through a pipe.

5. The cleaning and polishing equipment for wafer production according to claim 1, characterized in that: The fixing assembly includes positioning clamps (12), three of which are slidably mounted on top of the wafer fixing disk (7).

6. The cleaning and polishing equipment for wafer production according to claim 5, characterized in that: The fixing component also includes a chassis (13), which is rotatably mounted on the bottom of the wafer fixing disk (7). An adjustment groove (14) is provided on the chassis (13) at each of the three positioning clamps (12). A synchronous shaft (17) is slidably installed inside the adjustment groove (14), and the synchronous shaft (17) is fixedly connected to the corresponding positioning clamp (12).

7. The cleaning and polishing equipment for wafer production according to claim 6, characterized in that: An extension block (16) is fixedly installed on the outer circular wall of the chassis (13). An installation short cylinder (18) is fixedly installed on the extension block (16). A positioning short shaft (19) is slidably installed inside the installation short cylinder (18). A spring (20) is fixedly installed inside the installation short cylinder (18). The spring (20) is sleeved with the positioning short shaft (19). One end of the spring (20) is fixedly connected to the positioning short shaft (19). A lever (21) is fixedly installed on one end of the positioning short shaft (19) extending to the lower side of the installation short cylinder (18). Fixing holes (15) are evenly opened at the bottom of the wafer fixing disk (7).

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