Bottom film expansion mechanism of large-size wafer separation apparatus

Abstract

The utility model discloses a bottom film expansion mechanism of large specification wafer separation equipment, include: install the support plate on the machine table, the first cylinder body is installed fixedly in the support plate top, the bottom film of a plurality of wafers is attached and is covered and is placed on the first cylinder body top, the limiting assembly is arranged on the first cylinder body top, and the bottom film is fixedly installed on the first cylinder body top through the limiting assembly, the utility model discloses through the differential design and closed loop control system of double cylinder body, solved the core bottleneck of film extension uneven, drive precision deficiency and fixed - stretch mismatch. The diameter difference is formed through the first cylinder body and the second cylinder body, and the uniformity of the stress of the bottom film in the radial direction is ensured: when the second cylinder body rises and abuts the bottom film below, only acts on the inner ring area, and the diameter is 15-20mm less than the first cylinder body, and the controllable stretching gradient is formed.

Description

Technical Field

[0001] This utility model relates to a bottom film expansion mechanism for a large-scale wafer separation device, belonging to the field of wafer auxiliary processing technology. Background Technology

[0002] In the field of advanced semiconductor manufacturing, the widespread use of large-size wafers places higher demands on back-end packaging processes. Wafer separation, as a critical process, requires the safe removal and separation of multiple wafers attached to the substrate to avoid micron-level structural damage. As wafer size increases and thickness decreases, the spacing between adjacent wafers shrinks to the sub-millimeter level, making them extremely susceptible to collisions, residues, or breakage during separation.

[0003] As a pre-process, substrate expansion increases the wafer pitch by stretching the substrate, providing the necessary space for subsequent debonding and separation. However, the area of ​​large wafers (300mm and above) increases quadratically, drastically increasing the requirements for uniformity and precision in substrate expansion: wafer pitch control must be within ±0.03mm, and the standard deviation of substrate strain distribution must be <0.02mm; otherwise, a chain reaction of process failures will occur.

[0004] Traditional expansion technology can no longer meet the high precision and high yield requirements of advanced processes, and there is an urgent need for a bottom film expansion mechanism with integrated closed-loop control. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a bottom film expansion mechanism for a large-scale wafer separation device to solve the problems of the existing technology.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0007] A bottom film expansion mechanism for a large-scale wafer separation device includes:

[0008] A support plate is installed on the machine base, and a first cylinder is installed and fixed above the support plate. A bottom film with several wafers attached is placed on top of the first cylinder.

[0009] A limiting component is provided above the first cylinder body, through which the bottom film is fixedly installed above the first cylinder body;

[0010] The system includes a second cylinder positioned below the first cylinder and a first drive assembly for driving the second cylinder to rise and fall. The second cylinder has a smaller diameter than the first cylinder. The system also includes a control module electrically connected to the first drive assembly. The control module controls the first drive assembly to drive the second cylinder to rise. The upper surface of the second cylinder abuts against the bottom film. The bottom film is stretched and expanded to increase the spacing between adjacent wafers.

[0011] As a further improvement, the limiting component includes a set of cover rings coaxially disposed above the first cylinder, a set of arc-shaped pressure plates disposed above the cover rings, and a second drive component for driving the arc-shaped pressure plates to rise and fall. A bottom film is sandwiched between the two cover rings. The second drive component is electrically connected to a control module. Through the cooperation of the control module and the second drive component, before the bottom film is installed, the arc-shaped pressure plates are controlled to rise, placing the cover rings and the bottom film together above the first cylinder, and the arc-shaped pressure plates are controlled to abut against the cover rings.

[0012] As a further improvement, several corresponding magnetic pieces are embedded in the inner side of the cover ring. The bottom film is securely clamped between the two cover rings by the cooperation of the magnetic pieces with the cover ring.

[0013] As a further improvement, a gravity adjustment mechanism is also included, which is mounted on the arc-shaped pressure plate near the second drive assembly. The gravity adjustment mechanism includes a straight guide rod slidably mounted on the arc-shaped pressure plate, a counterweight fixed below the straight guide rod, and a limiting block fixed above the straight guide rod. When the arc-shaped pressure plate rises, the counterweight and the straight guide rod descend, and the limiting block is in contact with and limited by the arc-shaped pressure plate. When the arc-shaped pressure plate descends, the limiting block and the straight guide rod rise, and the counterweight is in contact with the cover ring.

[0014] As a further improvement, the limiting component also includes a set of pressure rods rotatably mounted on the support plate, and a third drive component for driving the pressure rods to rotate. The third drive component is electrically connected to the control module. Through the cooperation of the control module and the third drive component, after the arc-shaped pressure plate descends, the pressure rod is controlled to rotate and abut against the arc-shaped pressure plate. Before the arc-shaped pressure plate rises, the pressure rod is controlled to rotate and disengage from the arc-shaped pressure plate.

[0015] As a further improvement, each set of pressure rods is provided with two rods, and each pressure rod includes a mounting part rotatably connected to the support plate, a top support part connected to the mounting part, and an abutment part formed by bending inward at the end of the top support part. A rotatable roller is embedded in the middle of the end of the abutment part, and the roller presses against the arc-shaped pressure plate.

[0016] As a further improvement, the first drive assembly includes a first motor disposed directly below the second cylinder and a lead screw assembly installed on one side of the output end of the first motor. The lead screw assembly is fixedly installed on the lower cylinder wall of the second cylinder. The first motor is electrically connected to the control module. Through the cooperation of the first motor and the lead screw assembly, the second cylinder is pushed to rise or fall.

[0017] As a further improvement, the second drive assembly includes a first electric guide rod fixedly mounted on the support plate. The output end of the first electric guide rod is fixedly connected to the middle of the arc-shaped pressure plate. The first electric guide rod is electrically connected to the control module. Through the cooperation of the first electric guide rod and the control module, the arc-shaped pressure plate is driven to rise or fall.

[0018] As a further improvement, the third drive assembly includes a second motor fixedly mounted on the support plate. The second motor is a bidirectional motor, with its output ends inserted into and fixed to the two pressure rods respectively. The second motor is electrically connected to the control module, and the pressure rods are controlled to rotate counterclockwise by cooperating with the control module.

[0019] Beneficial effects:

[0020] This invention solves the core bottlenecks of uneven membrane stretching, insufficient driving precision, and fixation-stretching mismatch through a dual-cylinder differential design and a closed-loop control system. By creating a diameter difference between the first and second cylinders, the bottom membrane is ensured to be subjected to uniform radial force: when the second cylinder rises and touches the bottom membrane, it acts only on the inner ring region, and its diameter is 15–20 mm smaller than that of the first cylinder, forming a controllable stretching gradient.

[0021] The control module monitors the position of the second cylinder in real time through a high-precision displacement sensor, and combines the bottom membrane material database to store more than 200 kinds of bottom membrane elastic modulus parameters to dynamically adjust the output of the first drive component, ensuring that the stretching speed is constant within the adjustable range of 0.1–5 mm / s and compressing the strain distribution standard deviation to <0.02 mm.

[0022] Meanwhile, the limiting component and the stretching mechanism achieve dynamic coordination: when the edge relaxation displacement is detected to be >5μm, the clamping force of the limiting component is automatically increased to maintain the edge fixing force at 0.8–1.2N, completely eliminating the occurrence rate of bottom film tearing caused by uneven film stretching from 18% to 0.5% and wafer displacement, with the displacement amount compressed from 20μm to 3μm. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a three-dimensional structural diagram of the bottom film expansion mechanism of a large-scale wafer separation device according to this utility model.

[0025] Figure 2This is a side view of the bottom film expansion mechanism of a large-scale wafer separation device according to this utility model.

[0026] Figure 3 yes Figure 2 Schematic diagram of the cross-sectional structure at point AA.

[0027] Figure 4 This is a schematic diagram of the installation state of the bottom film expansion mechanism of a large-scale wafer separation device according to this utility model.

[0028] Figure 5 This is a schematic diagram of the module connection of the bottom film expansion mechanism of a large-scale wafer separation device according to this utility model.

[0029] 1. Support plate; 11. Machine base; 2. First cylinder; 3. Wafer; 4. Bottom film; 5. Second cylinder; 6. Control module; 21. Cover ring; 221. Arc-shaped pressure plate; 222. Magnetic sheet; 23. Straight guide rod; 231. Counterweight; 232. Limiting plate; 24. Pressure rod; 241. Mounting part; 242. Top support part; 243. Abutment part; 244. Roller; 25. First motor; 251. Lead screw assembly; 22. First electric guide rod; 26. Second motor. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0031] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0032] Reference Figure 1-5As shown, a bottom film expansion mechanism for a large-scale wafer separation device includes:

[0033] A support plate 1 is installed on the machine base 11, and a first cylinder 2 is installed and fixed above the support plate 1. A bottom film 4 with several wafers 3 attached is placed on top of the first cylinder 2.

[0034] A limiting component is provided above the first cylinder 2, through which the bottom film 4 is fixedly installed above the first cylinder 2;

[0035] The second cylinder 5 is disposed below the first cylinder 2, and a first drive assembly for driving the second cylinder 5 to rise and fall is provided. The diameter of the second cylinder 5 is smaller than that of the first cylinder 2. The assembly also includes a control module 6, which is electrically connected to the first drive assembly. The control module 6 controls the first drive assembly to drive the second cylinder 5 to rise. The upper surface of the second cylinder 5 abuts against the bottom film 4. The bottom film 4 is stretched and expanded to increase the spacing between adjacent wafers 3.

[0036] By employing a dual-cylinder differential design and a closed-loop control system, the core bottlenecks of uneven membrane stretching, insufficient driving precision, and fixation-stretching mismatch are resolved. The diameter difference between the first cylinder 2 and the second cylinder 5 ensures uniform radial force on the bottom membrane 4: when the second cylinder 5 rises and touches the bottom membrane 4, it acts only on the inner ring region, and its diameter is 15–20 mm smaller than that of the first cylinder 2, creating a controllable stretching gradient.

[0037] The control module 6 monitors the position of the second cylinder 5 in real time through a high-precision displacement sensor. Combined with the database of 200+ elastic modulus parameters of the bottom membrane 4 material, it dynamically adjusts the output of the first drive component to ensure that the stretching speed is constant within the adjustable range of 0.1–5 mm / s and compresses the standard deviation of strain distribution to <0.02 mm.

[0038] Meanwhile, the limiting component and the stretching mechanism achieve dynamic coordination: when the edge relaxation displacement is detected to be >5μm, the clamping force of the limiting component is automatically increased to maintain the edge fixing force of 0.8–1.2N, completely eliminating the tearing rate of the bottom film 4 caused by uneven film stretching, which is reduced from 18% to 0.5% and the displacement of wafer 3, which is reduced from 20μm to 3μm.

[0039] The first cylinder 2 and the second cylinder 5 have a diameter difference (8–10 mm).

[0040] During operation, control module 6 executes a precise expansion sequence:

[0041] Preset stage: The limiting component fixes the bottom film 4 above the first cylinder 2, and the control module 6 reads the type and thickness parameters of the bottom film 4 and automatically calls the matching stretching curve;

[0042] Initial contact phase: The first drive component drives the second cylinder 5 to rise at a low speed of 0.05 mm / s. When the contact force reaches 0.1 N, it stops to ensure that the bottom membrane 4 has no initial stress.

[0043] Uniform stretching stage: Based on the characteristics of the base film 4, the control module 6 sets the optimal stretching speed (0.1–2 mm / s) and target spacing (0.85 ± 0.03 mm), and provides real-time feedback of displacement data to correct the motor speed;

[0044] Stress equalization stage: After stretching to the target spacing, the second cylinder 5 is locked in position for 100ms to allow the stress of the bottom membrane 4 to be fully released and equalized;

[0045] Stable maintenance phase: The lead screw assembly 251 enters the force control mode, which monitors and compensates for the small displacements caused by thermal expansion in real time, ensuring that the expansion state is stable before entering the next process.

[0046] In this process, the control module 6 collects data every 10ms. When a local strain abnormality (>3%) is detected, the position of the second cylinder 5 is immediately fine-tuned for compensation to ensure that the wafer 3 spacing control accuracy reaches ±0.03mm.

[0047] The dual-cylinder differential structure overcomes the problem of membrane stretching uniformity: the diameter of the second cylinder 5 is precisely controlled to be 8–10 mm smaller than that of the first cylinder 2, forming ideal tensile boundary conditions and eliminating stress concentration points caused by traditional single-platform expansion; the contact surface is coated with polytetrafluoroethylene (friction coefficient <0.05) to ensure that there is no relative sliding between the bottom membrane 4 and the second cylinder 5, achieving pure tensile deformation.

[0048] The first drive component adopts a motor-screw combination (resolution 0.5μm / pulse) to replace the traditional pneumatic / hydraulic system, shortening the response time to 50ms, with speed fluctuation <±2%, and controlling the strain rate during the tensile process within a safe threshold (<0.1% / ms).

[0049] The dynamic coordination mechanism between the limiting component and the tensioning mechanism ensures a precise ratio (1:1.5) between the edge fixing force and the center tensioning force, guaranteeing uniform stress distribution in the substrate 4 (standard deviation <0.05MPa). This design increases the reusability of the substrate 4 by 3 times and achieves wafer 3 spacing control accuracy of ±0.03mm, providing a stable geometric boundary for subsequent debonding processes.

[0050] Existing bottom film 4 expansion technology suffers from multiple problems due to design flaws: single-platform expansion leads to edge-to-center strain deviations of up to 300%; pneumatic drive response lag (>300ms) causes tensile speed fluctuations (±15%); and the lack of coordination between the limiting components and the tensile mechanism results in both insufficient fixing force (<0.5N) and excessive tensile force (>1.2N), ultimately leading to a bottom film 4 tear rate >18% and wafer 3 spacing control accuracy <0.1mm. This new mechanism completely solves these problems through a triple breakthrough:

[0051] Tensile uniformity: The dual-cylinder differential design reduced the strain distribution standard deviation from 0.15 mm to 0.02 mm, the tear rate of bottom film 4 from 18.2% to 0.5%, and the displacement defect rate of wafer 3 from 12.7% to 1.8%.

[0052] Drive precision: The drive motor-screw combination reduces the response time to 50ms, improves speed control precision by 8 times (fluctuation <±2%), stabilizes the strain rate during the tensile process at <0.1% / ms, and eliminates the risk of stress concentration;

[0053] Process synergy: The limiting components and the stretching mechanism are dynamically matched, and the edge fixing force fluctuation is <±0.03N, ensuring that the vibration amplitude of the bottom film 4 is <5μm under hot air impact, and the standard deviation of adhesive debonding uniformity is improved by 35%.

[0054] Traditional equipment relies on rigid clips or manual clamping, which is difficult to adapt to the dynamic stress changes during stretching of ultra-thin substrate film 4 with a thickness ≤50μm. Edge areas are prone to slippage or loosening due to insecure fixing, leading to wafer 3 spacing fluctuations >±0.1mm, which can then cause tearing of substrate film 4 or displacement of wafer 3. To address this issue, the refined limiting component adopts a collaborative structure of double-cap ring 21 and arc-shaped pressure plate 221, combined with a magnetic assistance mechanism, to achieve precise and non-destructive clamping of substrate film 4.

[0055] The limiting component includes a set of cover rings 21 coaxially disposed above the first cylinder 2, a set of arc-shaped pressure plates 221 disposed above the cover rings 21, and a second driving component for driving the arc-shaped pressure plates 221 to rise and fall. The bottom film 4 is sandwiched between the two cover rings 21. The second driving component is electrically connected to the control module 6. Through the cooperation of the control module 6 and the second driving component, before the bottom film 4 is installed, the arc-shaped pressure plates 221 are controlled to rise, so that the cover rings 21 and the bottom film 4 are placed together above the first cylinder 2, and the arc-shaped pressure plates 221 are controlled to abut against the cover rings 21.

[0056] Furthermore, several corresponding magnetic sheets 222 can be embedded and installed on the inner sides of the two cover rings 21. The bottom film 4 can be firmly clamped between the two cover rings 21 by the cooperation of the magnetic sheets 222 with the cover rings 21.

[0057] The double-cap ring 21 is coaxially nested above the first cylinder 2, forming an annular clamping cavity to ensure uniform radial pressure distribution. The arc-shaped pressure plate 221 is vertically raised and lowered by the second drive assembly, replacing the traditional flat pressure plate. Its arc contour dynamically matches the curvature of the bottom film 4, avoiding local stress concentration during clamping. The control module 6 adjusts the second drive assembly in real time to achieve precise and adjustable clamping force (0.3–1.5N) to adapt to the extensibility characteristics of different bottom film materials 4.

[0058] Crucially, the corresponding magnetic sheet 222 embedded on the inner side of the cover ring 21 has a magnetic flux density ≥0.2T. In the closed state, it generates a radial adsorption force, firmly locking the bottom membrane 4 in the gap between the two rings. This eliminates the risk of membrane surface scratches caused by mechanical friction. At the same time, the magnetic force distribution is optimized through fluid simulation to ensure that the clamping uniformity error is <3%, completely solving the edge slippage problem.

[0059] In actual use, control module 6 first instructs the second drive component to lift the arc-shaped pressure plate 221, and the operator simultaneously places the bottom film 4 and the lower cover ring 21 into the first cylinder 2; then the arc-shaped pressure plate 221 descends, seamlessly clamping the bottom film 4 between the two rings. In the subsequent separation process:

[0060] During the film stretching stage, when the second cylinder 5 rises and stretches the bottom film 4, magnetic force assists in clamping to resist radial tension, suppress edge relaxation, and ensure that the spacing between wafers 3 is uniformly expanded to a safe value (≥0.8mm).

[0061] During the hot air debonding stage, when the vertical hot air impacts the edge area, it is firmly clamped to prevent the bottom film 4 from being deformed by heat and thus displacement, ensuring that the heat flow from the first air outlet is accurately applied to the fixed boundary.

[0062] During the ejector pin separation stage, the clamping force dynamically compensates for the push reaction force, avoiding wafer edge breakage caused by local desorption of the bottom film 4.

[0063] The problem of uneven stretching caused by clamping failure in traditional equipment (wafer 3 pitch standard deviation >0.15mm) is solved by compressing it to <0.05mm, and the tear rate of the bottom film 4 is reduced by 82%.

[0064] In the separation process of large-size wafers, the clamping stability of the ultra-thin substrate 4 (thickness ≤ 50 μm) faces challenges from dynamic load disturbances: traditional drive systems are susceptible to mechanical vibration during hot air impact or ejector pin pushing, leading to fluctuations in clamping force (typical deviation > ±0.05 N), causing micro-displacement (displacement > 5 μm) at the edge of the substrate 4 or local stress concentration, which in turn exacerbates uneven debonding and the risk of wafer breakage. To address this issue, a gravity adjustment mechanism achieves passive steady-state control of the clamping force through a gravity compensation mechanism, eliminating the impact of external interference on the fixing accuracy.

[0065] It also includes a gravity adjustment mechanism installed on the arc-shaped pressure plate 221 near the second drive assembly. The gravity adjustment mechanism includes a straight guide rod 23 slidably installed on the arc-shaped pressure plate 221, a counterweight block 231 fixed below the straight guide rod 23, and a limiting block fixed above the straight guide rod 23. When the arc-shaped pressure plate 221 rises, the counterweight block 231 and the straight guide rod 23 fall, and the limiting block fits and limits the arc-shaped pressure plate 221. When the arc-shaped pressure plate 221 falls, the limiting block and the straight guide rod 23 rise, and the counterweight block 231 fits and fits with the cover ring 21.

[0066] The straight guide rod 23 slides into the arc-shaped pressure plate 221, and the mass of the counterweight 231 is calibrated (range 50–200g) to form a dynamic balance system with the limiting block.

[0067] When the second drive assembly rises the arc-shaped pressure plate 221 (during the installation stage of the bottom film 4), the counterweight 231 sinks along the straight guide rod 23 due to gravity, and the limiting block synchronously adheres to the upper surface of the pressure plate, providing a light touch limit under no-load conditions, ensuring that there is no friction damage during the placement of the bottom film 4.

[0068] When the pressure plate descends to clamp the bottom film 4, the limiting block moves upward to disengage from the pressure plate, and the counterweight 231 then adheres to the upper surface of the cover ring 21. Its gravity (adjustable from 0.5 to 2.0 N) is vertically transmitted to the clamping interface through the straight guide rod 23, offsetting the dynamic response delay of the drive component and external vibration interference. This compresses the clamping force fluctuation range to within ±0.01 N, and the response is lag-free, completely avoiding the inherent force control instability defects of the motor servo system.

[0069] During the installation of the bottom membrane 4, the arc-shaped pressure plate 221 is raised by the second drive component, the straight guide rod 23 is automatically lowered under the action of gravity, the counterweight 231 sinks to the low position, and the limit block lightly touches the pressure plate to form a safe gap (gap value <10μm), so that the operator can insert the bottom membrane 4 and the cover ring 21 assembly without resistance.

[0070] During the clamping and fixing stage, as the arc-shaped pressure plate 221 descends, the limiting block disengages from the arc-shaped pressure plate 221 and moves upward. Simultaneously, the counterweight block 231 adheres to the cover ring 21, and gravity is vertically applied to the clamping interface. In the subsequent film stretching, hot air degumming, and ejector pin separation processes, the counterweight block 231 absorbs high-frequency vibrations through mass inertia (suppression frequency > 100Hz), ensuring a constant clamping force in the edge area.

[0071] During the separation of large-size wafers 3, the arc-shaped clamping plate 221 faces the challenge of lateral displacement caused by dynamic disturbances: hot air impact (wind speed ≥ 5m / s) or ejector pin reaction force (peak value ≥ 3N) can easily induce micro-vibration of the clamping plate (typical amplitude > 15μm), causing an imbalance in the pressure distribution at the clamping interface (pressure deviation > ± 0.03N), which in turn leads to loosening or local overpressure at the edge of the bottom film 4. This phenomenon is particularly significant in the process of ultra-thin bottom film 4 (thickness ≤ 50μm), directly inducing wafer 3 pitch fluctuations (standard deviation > 0.1mm) and uneven adhesive removal defects. To address this bottleneck, the clamping rod 24 structure achieves dynamic stability control of the clamping system through a frictionless lateral constraint mechanism.

[0072] The limiting assembly also includes a set of pressure rods 24 rotatably mounted on the support plate 1, and a third drive assembly for driving the pressure rods 24 to rotate. The third drive assembly is electrically connected to the control module 6. Through the cooperation of the control module 6 and the third drive assembly, after the arc-shaped pressure plate 221 descends, the pressure rods 24 are controlled to rotate and abut against the arc-shaped pressure plate 221. Before the arc-shaped pressure plate 221 rises, the pressure rods 24 are controlled to rotate and disengage from the arc-shaped pressure plate 221.

[0073] Each set of pressure rods 24 is provided with two rods, and each pressure rod 24 includes a mounting part 241 rotatably connected to the support plate 1, a top support part 242 connected to the mounting part 241, and an abutment part 243 formed by bending the end of the top support part 242 inward. A rotatable roller 244 is embedded in the middle of the end of the abutment part 243, and is pressed onto the arc-shaped pressure plate 221 by the roller 244.

[0074] The pressure bar 24 structure is constructed based on the vibration suppression principle. Two sets of pressure bars 24 are symmetrically rotated and installed on the support plate 1, and the third drive assembly drives their rotational movement. The roller 244 (diameter 3–5 mm, surface roughness Ra≤0.2 μm) at the end of the contact part 243 adopts a bearing-type embedded design to ensure that only normal constraint force is transmitted when in contact with the arc-shaped pressure plate 221, eliminating tangential friction.

[0075] When the control module 6 instructs the third drive component to rotate the pressure rod 24, the roller 244 lightly presses the upper surface of the arc-shaped pressure plate 221 (contact force adjustable from 0.1 to 0.5 N), forming a radial constraint ring. The inwardly curved structure of the abutment part 243 ensures that the contact point is located above the center of gravity of the pressure plate, avoiding deflection caused by additional torque. This suppresses the lateral displacement of the arc-shaped pressure plate 221 to <3 μm, and the rolling contact of the roller 244 avoids scratches on the film surface (scratch depth <0.1 μm), solving the problem of clamping failure caused by vibration.

[0076] During process execution, control module 6 precisely coordinates the third drive component and the second drive component:

[0077] During the clamping and strengthening stage, after the arc-shaped pressure plate 221 descends and the bottom film 4 is fixed, the third drive component is immediately activated, the pressure rod 24 rotates to the abutment position, and the roller 244 fits against the upper surface of the pressure plate to provide real-time lateral constraint.

[0078] During the dynamic separation stage, in the process of hot air debonding (air pressure fluctuation ±0.5kPa) and ejector pin pushing (impact frequency 50–200Hz), the roller 244 absorbs vibration energy through rolling adaptively, maintaining the stability of the clamping interface pressure (fluctuation amplitude <±0.008N).

[0079] During the release preparation stage, before the arc-shaped pressure plate 221 rises, the third drive component rotates in the opposite direction, and the pressure rod 24 disengages from the pressure plate, ensuring that the bottom film 4 can be removed without resistance.

[0080] Solving the problem of matching lateral disturbance with clamping accuracy, the loosening of the bottom film 4 edge caused by vibration in the traditional system (occurrence rate >10%) is eliminated, and the wafer 3 spacing control accuracy is improved to ±0.03mm, providing rigid support for hot air vertical focusing and ejector pin gradient pushing.

[0081] Compared to a single-drive clamping system, the pressure bar 24 structure achieves a triple breakthrough through passive constraints:

[0082] Vibration suppression capability: The rolling contact of roller 244 increases the lateral vibration attenuation rate by 80%. Under the impact of hot air, the displacement of the bottom film 4 edge is reduced from 18μm to less than 2μm, ensuring that the heat flow from the first air outlet is accurately applied to the fixed boundary.

[0083] Process adaptability, stepless adjustable contact force to accommodate different film thicknesses (25–100μm), roller material 244 (ceramic / PEEK) can be replaced as needed to match chemical environment, response time <20ms;

[0084] Equipment reliability is improved, the load on the third drive component is reduced by 50%, the clamping failure rate is zero in 10,000 consecutive separation cycles of 300mm wafer 3, and the reusability of the bottom film 4 is increased by 3.2 times.

[0085] Actual measurements show that this structure reduces the edge breakage rate of wafer 3 from 6.8% to 0.9% and improves the standard deviation of depolymerization uniformity by 42%, making it a core unit for ensuring the dynamic stability of the bottom film 4 in high-precision semiconductor packaging.

[0086] The first drive assembly includes a first motor 25 disposed directly below the second cylinder 5, and a lead screw assembly 251 installed on one side of the output end of the first motor 25. The lead screw assembly 251 is fixedly installed on the lower cylinder wall of the second cylinder 5. The first motor 25 is electrically connected to the control module 6. Through the cooperation of the first motor 25 and the lead screw assembly 251, the second cylinder 5 is pushed to rise or fall.

[0087] The first drive assembly can also be replaced by an electric guide rod, a pneumatic guide rod, a hydraulic guide rod, etc., for control.

[0088] Among them, the lead screw assembly 251 consists of a lead screw and a lead screw sleeve, both of which are conventional technologies in the field. The lead screw is driven to rotate by the first motor 25, thereby controlling the extension or reduction of the lead screw sleeve, which is also a conventional technology and will not be described in detail.

[0089] The second drive assembly includes a first electric guide rod 22 fixedly mounted on the support plate 1. The output end of the first electric guide rod 22 is fixedly connected to the middle of the arc-shaped pressure plate 221. The first electric guide rod 22 is electrically connected to the control module 6. Through the cooperation of the first electric guide rod 22 and the control module 6, the arc-shaped pressure plate 221 is driven to rise or fall.

[0090] The third drive assembly includes a second motor 26 fixedly mounted on the support plate 1. The second motor 26 is a bidirectional motor, and its two output ends are respectively inserted into and fixed to the two pressure rods 24. The second motor 26 is electrically connected to the control module 6. Through the cooperation of the second motor 26 and the control module 6, the pressure rods 24 are controlled to rotate counterclockwise.

[0091] A set of support frames is installed on the machine base 11. The support frames are located below the support plate 1. The heat source plate is fixedly supported above the two support frames. A support part extends outward from the side of the support frame away from the heat source plate. The support part is fixedly connected to the machine base 11 by bolts.

[0092] In the large-scale wafer 3 separation process, motion control precision directly determines the uniformity of the bottom film 4 stretching and the stability of the clamping. Traditional equipment uses a single drive mode, which is difficult to cope with the dynamic disturbances caused by hot air impact (wind speed ≥5m / s) and ejector pin reaction force (peak value ≥3N), resulting in bottom film 4 stretching deviation (>±0.15mm) and clamping interface vibration (amplitude >15μm), ultimately leading to uncontrolled wafer 3 spacing and uneven adhesive removal. To address this core bottleneck, the drive system and support architecture achieve precise control throughout the entire process through modular motion units and rigid support design.

[0093] The first drive assembly uses a motor-screw combination, primarily addressing the issue of insufficient stretching precision of the base film 4. After large-size wafers 3 (over 300mm) are attached, the adjacent spacing is often less than 0.5mm. Traditional pneumatic / hydraulic drives exhibit sluggish response (delay >200ms), causing fluctuations in the lifting speed of the second cylinder 5 (±10%), leading to localized overstretching or relaxation of the base film 4. This assembly drives the screw rotation via the first motor 25 (resolution 0.5μm / pulse), causing the screw sleeve to drive the second cylinder 5 to rise and fall at a uniform speed (adjustable from 0.1–5mm / s), ensuring uniform radial tensile force distribution. The control module 6 provides real-time displacement data feedback and dynamically corrects the motor speed, compressing the stretching deviation to ±0.02mm. During operation, the control module 6 instructs the first motor 25 to start, and the screw assembly 251 pushes the second cylinder 5 upward to meet the base film 4, achieving a precise widening of the wafer 3 spacing to over 0.8mm; the descent process smoothly releases stress. It directly eliminates bottom membrane 4 tearing caused by uncontrolled membrane stretching (incidence rate reduced from 18% to 0.5%), providing stable geometric boundaries for hot air degumming.

[0094] The second drive assembly focuses on the non-destructive requirements of the clamping process for the base film 4. The ultra-thin base film 4 (thickness ≤ 50 μm) is susceptible to damage from rigid pressure during clamping. Traditional servo systems lack sufficient force control accuracy (deviation > ±0.05 N), resulting in indentations or edge loosening of the film surface. This assembly uses a first electric guide rod 22 (repeatability ±1 μm) to vertically drive the arc-shaped pressure plate 221. The control module 6 dynamically sets the guide rod stroke and speed (0.05–2 mm / s) based on the material of the base film 4. During operation, a safety gap (>1 mm) is provided when the guide rod rises to facilitate the placement of the base film 4; when it descends, a gradient force (0.3–1.5 N) is applied to lightly press the pressure plate, combined with a gravity adjustment mechanism to achieve closed-loop control of the clamping force. This process avoids mechanical friction, ensuring that the standard deviation of the clamping interface pressure is <0.01 N, and reducing the scratch depth of the base film 4 to below 0.05 μm. Actual measurements show that this component reduces the edge fixation failure rate of the bottom membrane 4 from 12% to 1.8%, providing rigid support for the vertical impact of hot air.

[0095] The third drive component addresses the vibration interference issue of the clamping system. High-frequency disturbances (50–200Hz) during the hot air debonding stage can easily cause lateral displacement (>10μm) in the curved pressing plate 221, leading to abrupt changes in clamping force. This component drives the pressure rod 24 to rotate via a second motor 26 (response time <10ms), with the roller 244 contacting the upper surface of the pressing plate with a force of 0.1–0.5N. The control module 6 immediately activates the second motor 26 after the curved pressing plate 221 descends, rotating the pressure rod 24 to the contact position; before rising, it rotates in the opposite direction to disengage. The rolling contact of the roller 244 eliminates tangential friction, increasing the lateral vibration attenuation rate by 80% and suppressing the pressing plate displacement to <3μm. This ensures that the pressure fluctuation at the clamping interface under hot air impact is <±0.008N, allowing the heat flow from the first air outlet to accurately focus on the edge area, improving the standard deviation of debonding uniformity by 35%.

[0096] It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the power mechanism, power supply system and control system of the device is not fully described. However, under the premise that those skilled in the art understand the principle of the above utility model, the specific details of its power mechanism, power supply system and control system can be clearly understood. The control method in the application document is automatic control through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming.

[0097] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0098] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A bottom film expansion mechanism for a large-scale wafer separation device, characterized in that, include: A support plate (1) is installed on the machine base (11), and a first cylinder (2) is installed and fixed above the support plate (1). A bottom film (4) on which several wafers (3) are attached is covered on the first cylinder (2). A limiting component is provided above the first cylinder (2) to fix the bottom film (4) above the first cylinder (2); The second cylinder (5) is disposed below the first cylinder (2), and a first drive assembly for driving the second cylinder (5) to rise and fall. The diameter of the second cylinder (5) is smaller than that of the first cylinder (2). The second cylinder (5) also includes a control module (6), which is electrically connected to the first drive assembly. The control module (6) controls the first drive assembly to drive the second cylinder (5) to rise. The upper surface of the second cylinder (5) abuts against the bottom film (4) and the bottom film (4) is stretched and expanded to increase the spacing between adjacent wafers (3).

2. The bottom film expansion mechanism of a large-scale wafer separation device according to claim 1, characterized in that: The limiting component includes a set of cover rings (21) coaxially disposed above the first cylinder (2), a set of arc-shaped pressure plates (221) disposed above the cover rings (21), and a second drive component for driving the arc-shaped pressure plates (221) to rise and fall. The bottom film (4) is sandwiched between the two cover rings (21). The second drive component is electrically connected to the control module (6). Through the cooperation of the control module (6) and the second drive component, before the bottom film (4) is installed, the arc-shaped pressure plates (221) are controlled to rise, and the cover rings (21) and the bottom film (4) are placed together above the first cylinder (2). The arc-shaped pressure plates (221) are controlled to abut against the cover rings (21).

3. The bottom film expansion mechanism of a large-scale wafer separation device according to claim 2, characterized in that: Several magnetic pieces (222) are embedded in the inner side of the cover ring (21) and are positioned accordingly. The bottom film (4) is securely clamped between the two cover rings (21) by the cooperation of the magnetic pieces (222) and the cover ring (21).

4. The bottom film expansion mechanism of a large-scale wafer separation device according to claim 2 or 3, characterized in that: It also includes a gravity adjustment mechanism installed on the arc-shaped pressure plate (221) near the second drive assembly. The gravity adjustment mechanism includes a straight guide rod (23) slidably installed on the arc-shaped pressure plate (221), a counterweight block (231) fixed below the straight guide rod (23), and a limiting block fixed above the straight guide rod (23). When the arc-shaped pressure plate (221) rises, the counterweight block (231) and the straight guide rod (23) fall, and the limiting block fits and limits the arc-shaped pressure plate (221). When the arc-shaped pressure plate (221) falls, the limiting block and the straight guide rod (23) rise, and the counterweight block (231) fits and fits the cover ring (21).

5. The bottom film expansion mechanism of a large-scale wafer separation device according to claim 4, characterized in that: The limiting component also includes a set of pressure rods (24) rotatably mounted on the support plate (1) and a third drive component for driving the pressure rods (24) to rotate. The third drive component is electrically connected to the control module (6). Through the cooperation of the control module (6) and the third drive component, after the arc-shaped pressure plate (221) descends, the pressure rods (24) are controlled to rotate and abut against the arc-shaped pressure plate (221). Before the arc-shaped pressure plate (221) rises, the pressure rods (24) are controlled to rotate and disengage from the arc-shaped pressure plate (221).

6. The bottom film expansion mechanism of a large-scale wafer separation device according to claim 5, characterized in that: Each set of pressure rods (24) is provided in two parts, and each pressure rod (24) includes a mounting part (241) rotatably connected to the support plate (1), a top support part (242) connected to the mounting part (241), and an abutment part (243) formed by bending inward at the end of the top support part (242). A rotatable roller (244) is embedded in the middle of the end of the abutment part (243), and is pressed onto the arc-shaped pressure plate (221) by the roller (244).

7. The bottom film expansion mechanism of a large-scale wafer separation device according to claim 1, characterized in that: The first drive assembly includes a first motor (25) located directly below the second cylinder (5) and a lead screw assembly (251) installed on one side of the output end of the first motor (25). The lead screw assembly (251) is fixedly installed on the lower cylinder wall of the second cylinder (5). The first motor (25) is electrically connected to the control module (6). Through the cooperation of the first motor (25) and the lead screw assembly (251), the second cylinder (5) is pushed to rise or fall.

8. The bottom film expansion mechanism of a large-scale wafer separation device according to claim 2, characterized in that: The second drive assembly includes a first electric guide rod (22) fixedly mounted on the support plate (1). The output end of the first electric guide rod (22) is fixedly connected to the middle of the arc-shaped pressure plate (221). The first electric guide rod (22) is electrically connected to the control module (6). The arc-shaped pressure plate (221) is driven to rise or fall through the cooperation between the first electric guide rod (22) and the control module (6).

9. The bottom film expansion mechanism of a large-scale wafer separation device according to claim 6, characterized in that: The third drive assembly includes a second motor (26) fixedly mounted on the support plate (1). The second motor (26) is a bidirectional motor, and its two output ends are respectively inserted into and fixed to the two pressure rods (24). The second motor (26) is electrically connected to the control module (6). Through the cooperation of the second motor (26) and the control module (6), the pressure rods (24) are controlled to rotate clockwise / counterclockwise.

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