Wafer fixture

Abstract

Some embodiments of the present application provide a wafer jig, comprising: an upper cover; and a replaceable carrier connected with the upper cover and disposed below the upper cover, wherein the carrier has a plurality of grooves, each groove of the plurality of grooves has a stepped structure inside, the stepped structure is used to accommodate a wafer to prevent wafer warping, and wherein the replaceable carrier is used to adopt different stepped structures according to different carried wafers. The present application effectively suppresses the warping of the wafer by using the upper cover and the carrier in combination.

Description

Technical Field

[0001] This application relates to the field of semiconductor structure technology, and more specifically, to a wafer fixture. Background Technology

[0002] Current larger-sized products (such as wafers and panels) still suffer from warpage issues in heating or manufacturing processes (such as flip-chip bond reflow). Figure 1 As shown, larger wafers 11 and panels 12 may warp during heating or processing. Therefore, there is an urgent need to provide a new wafer fixture to solve the above problems. Utility Model Content

[0003] To address the aforementioned issues, this application utilizes a combination of a top cover and a carrier to suppress wafer warpage. Furthermore, magnets can be embedded in the carrier at the bottom to hold the top cover in place, further ensuring a tight seal between the top cover and the carrier to suppress warpage.

[0004] Some embodiments of this application provide a wafer fixture, including: a top cover; and a replaceable carrier connected to and disposed below the top cover, wherein the carrier has a plurality of grooves, each of the plurality of grooves having a stepped structure for accommodating a wafer to prevent the wafer from warping, and wherein the replaceable carrier is used to employ different stepped structures depending on the wafer being carried.

[0005] In some embodiments, the shape of the stepped structure corresponds to the shape of the wafer.

[0006] In some embodiments, a plurality of magnets are embedded in the carrier.

[0007] In some embodiments, the top cover is attracted by the magnet.

[0008] In some embodiments, the groove is circular or rectangular in shape.

[0009] In some embodiments, the stepped structure surrounds the entire groove.

[0010] In some embodiments, the wafer is disposed within the groove and supported by the stepped structure within the groove.

[0011] In some embodiments, the stepped structure surrounds a portion of the groove and forms a full stepped structure with the stepped structures of a plurality of adjacent grooves.

[0012] In some embodiments, the wafer is disposed in the plurality of grooves and supported by the full-step structure.

[0013] In some embodiments, the plurality of magnets are arranged in a cross shape.

[0014] In some embodiments, the plurality of magnets are distributed along the edge of the carrier.

[0015] In some embodiments, the top surface of the plurality of magnets is lower than the top surface of the carrier.

[0016] In some embodiments, the top surfaces of the plurality of magnets are flush with the top surface of the carrier.

[0017] In some embodiments, the stepped structure has an upper wall and a lower wall, the upper wall being spaced apart from the edge of the wafer, and the lower wall being covered by the wafer.

[0018] In some embodiments, the vertical distance between the top of the upper wall and the lower wall is greater than the thickness of the wafer.

[0019] In some embodiments, the plurality of magnets are disposed within the stepped structure.

[0020] In some embodiments, the carrier further has a recess for receiving the top cover.

[0021] Other embodiments of this application provide a wafer fixture, including: a top cover; and a replaceable carrier disposed below the top cover, wherein the carrier has a plurality of grooves, each of the plurality of grooves having a stepped structure, the stepped structure surrounding a portion or all of the grooves to accommodate a portion or all of a wafer, and wherein the replaceable carrier is used to employ different stepped structures depending on the wafer being carried.

[0022] In some embodiments, a plurality of magnets are embedded in the carrier.

[0023] In some embodiments, the top cover is attracted by the magnet.

[0024] In this application, the combination of a top cover and a carrier effectively suppresses wafer warpage. Furthermore, the top cover of this wafer fixture, along with the replaceable carrier below, can be used simultaneously for wafers of different sizes; that is, different carriers can be used depending on the wafer. Therefore, the top cover designed in this application can accommodate carriers for different products, thereby reducing overall costs. Attached Figure Description

[0025] The various aspects of this utility model can be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard industrial practice, the various components are not drawn to scale. In fact, for clarity of discussion, the dimensions of the various components may be arbitrarily increased or decreased.

[0026] Figure 1 The structure of the prior art is shown.

[0027] Figures 2A to 2D , Figures 3A to 3B , Figures 4A to 4B as well as Figures 5A to 5D A wafer fixture according to some embodiments of this application is shown. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art are within the scope of protection of this application. In addition, when using terms such as "approximately," "about," "substantial," or "basically" to describe numerical values ​​or numerical ranges, unless otherwise stated, the term is intended to cover values ​​within ±10% of the described value. For example, the term "about 5nm" covers a size range from 4.5nm to 5.5nm.

[0029] To address the aforementioned issues, this application utilizes a top clamp (upper cover) and a bottom carrier to suppress wafer or panel warpage. Specifically, see [link to relevant documentation]. Figure 2A The wafer fixture 100 includes a top cover 101 and a replaceable carrier 102. The carrier 102 is connected to the top cover 101 and disposed below the top cover 101. The carrier 102 has multiple grooves 102R, each groove having a stepped structure 102Rs for accommodating a wafer 103 to prevent warping. The replaceable carrier 102 employs different stepped structures 102Rs depending on the wafer 103 it supports. Therefore, in this application, the top cover 101 and carrier 102 are used to solve the warping problem of the wafer 103. Furthermore, the top cover of the wafer fixture 100, combined with the replaceable carrier 102 below, can be used simultaneously for wafers 103 of different sizes; that is, different carriers 102 can be replaced depending on the wafer 103. Further, from... Figure 2A As can be seen, the shape of the stepped structure 102Rs corresponds to the shape of the wafer 103. When a wafer 103 is placed in each groove 102R, the stepped structure 102Rs surrounds the entire groove 102R. That is, each groove 102R has a complete stepped structure 102Rs corresponding to the wafer 103. The wafer 103 is disposed within the groove 102R and supported by the stepped structure 102Rs within the groove 102R. In this embodiment, both the groove 102R and the stepped structure 102Rs have a circular shape corresponding to the wafer 103. Figure 2BA schematic diagram is shown showing a stepped structure 102Rs in which a wafer 103 is placed in a recess 102R. From Figure 2B As can be seen, the cooperation between the top cover 101 and the carrier 102 (e.g., the stepped structure 102Rs in the groove 102R) can prevent the wafer 103 from warping.

[0030] Further, see Figure 2A The stepped structure 102Rs has an upper wall 102Rst and a lower wall 102Rsd, as shown in... Figure 2B When placing the wafer 103 as shown, the upper wall 102Rst is spaced apart from the edge 103e of the wafer 103, and the lower wall 102Rsd is covered by the wafer 103. In some embodiments, the vertical distance between the top of the upper wall 102Rst and the lower wall 102Rsd is greater than the thickness of the wafer 103, that is, the vertical height of the upper wall 102Rst is greater than the thickness of the wafer 103, so that the wafer 103 is completely disposed within the stepped structure 102Rs.

[0031] Next, as Figure 2C As shown, multiple magnets 102C are embedded within the carrier 102, allowing the top cover 101 to be attracted by the magnets 102C. Figure 2C As can be seen, multiple 102C magnets are arranged in a cross shape. (For example...) Figure 2D As shown, a plurality of magnets 102C are distributed along the edge of the carrier 102, which can be determined according to the actual situation. In some embodiments, the plurality of magnets 102C may be disposed only in the central portion of the carrier 102. In some embodiments, the plurality of magnets 102C are disposed within the stepped structure 102Rs to better fix the wafer 103. In some embodiments, the plurality of magnets are embedded in the carrier 102, so that the top surface of the plurality of magnets 102C may be lower than or flush with the top surface of the carrier 102. In some embodiments, the portion of the top cover 101 corresponding to the plurality of magnets 102C is made of metal (such as copper). In a further embodiment, the portion of the top cover 101 not corresponding to the plurality of magnets 102C may be made of any suitable material, such as resin or metal. In some embodiments, the carrier 102 may be made of any suitable material, such as glass, ceramic, or silicon. Figure 2B It can also be seen that the carrier 102 also has a recess 102g for accommodating the cover 101, so that the cover 101 is better fixed on the carrier 102.

[0032] See Figure 3A , Figure 3A It shows the relationship with Figure 2A The wafer jig 100 shown is similar to the wafer jig 100-1, except that, in Figure 3AIn the wafer fixture 100 shown, the wafer 103 is rectangular in shape. In this case, the groove 102R and the corresponding stepped structure 102Rs are also rectangular in shape corresponding to the wafer 103. Therefore, combined with Figure 2A and Figure 3A It can be seen that the groove 102R can be circular or rectangular. Figure 3B A schematic diagram is shown showing a stepped structure 102Rs in which a wafer 103 is placed in a recess 102R. From Figure 3B As can be seen, the cooperation between the top cover 101 and the carrier 102 (e.g., the stepped structure 102Rs in the groove 102R) can prevent the wafer 103 from warping.

[0033] See Figure 4A , Figure 4A It shows the relationship with Figure 2A The wafer jig 100 shown is similar to the wafer jig 100-2, except that, in Figure 4A In the wafer fixture 100 shown, the stepped structure 102Rs surrounds a portion of the groove 102R and forms a full stepped structure 102Rsf with the stepped structures 102Rs of a plurality of adjacent grooves 102R, thereby being used to fit the corresponding wafer 103. Figure 4B A schematic diagram is shown of a fully stepped structure 102Rsf in which wafer 103 is placed in a recess 102R. From Figure 4B As can be seen, wafer 103 is disposed in multiple recesses 102R and is supported by a full-step structure 102Rsf.

[0034] Return to reference Figures 2A to 2D Other embodiments of this application also provide a wafer jig 100, which includes a top cover 101 and a replaceable carrier 102 disposed below the top cover 101. The carrier 102 has a plurality of recesses 102R, each recess 102R having a stepped structure 102Rs surrounding a portion or all of the recesses 102R for accommodating a portion or all of a wafer 103. The replaceable carrier 102 is configured to employ different stepped structures 102Rs depending on the wafer 103 being carried. Figures 2C to 2D As can be seen, multiple magnets 102C are embedded in the carrier 102. In some embodiments, the cover 101 is attracted by the magnets 102C. In some specific embodiments, the portion of the cover 101 corresponding to the magnets 102C can be made of metal.

[0035] Next, see Figures 5A to 5D , Figures 5A to 5D The corresponding dimensions of the top cover 101, carrier 102, and wafer 103 are shown. See also Figure 5A , Figure 5AThe dimensions of the corresponding carrier 102 for a 300×300mm wafer (i.e., a wafer with a diameter of 300mm) are shown. Figure 5A As shown, the wafer 103 has a diameter of R and a thickness of A. In this case, the vertical height H (i.e., the height of the cavity) of the upper wall 102Rst of the stepped structure 102Rs can be A + 0.05 mm, and the diameter t (i.e., the diameter of the formed hole) of the upper wall 102Rst can be R + 0.05 mm. In some embodiments, in order to support the wafer 103, the diameter d of the lower wall 102Rsd can be R - 0.05 mm, or any suitable size. The frame wall thickness z of the carrier 102 can be 10 mm.

[0036] Figure 5B The dimensions of the corresponding carrier 102 are shown for a panel with a wafer 103 of 300 × 300 mm. Figure 5A Similarly, if the length / width of wafer 103 is P and its thickness is A, then the vertical height H (i.e., the height of the cavity) of the upper wall 102Rst of the recess 102R can be P + 0.05 mm, and the length / width tp of the upper wall 102Rst can be P + 0.05 mm. In some embodiments, to support wafer 103, the length / width dp of the lower wall 102Rsd can be R - 0.05 mm, or any suitable size. The frame wall thickness z of the carrier 102 can be 10 mm.

[0037] Figure 5C The dimensions of the corresponding carrier 102 are shown for a panel with a wafer 103 of 600 × 600 mm. Figure 5A Similarly, if the length / width of wafer 103 is P and its thickness is A, then the vertical height H (i.e., the height of the cavity) of the upper wall 102Rst of the recess 102R can be P + 0.05 mm, and the length / width tfp of the upper wall 102Rst of the fully stepped structure 102Rsf can be P + 0.05 mm. In this embodiment, the lower wall 102Rsd can be any suitable size. The frame wall thickness z of the carrier 102 can be 10 mm.

[0038] Figure 5D The dimensions of the corresponding top cover 101 are shown. From Figure 5D As can be seen from the above, the wall thickness U of the top cover 101 can be 5mm or any suitable size. In some embodiments, the recess 102g that accommodates the top cover 101 can correspond to the size of the top cover 101, that is, when the length / width of the top cover 101 is L, the length / width of the recess 102g can be greater than L.

[0039] In summary, this application utilizes an upper cover 101 (top clamp) and a replaceable carrier 102 (bottom carrier) to suppress the warping of the wafer 103 (or panel). Furthermore, a magnet 102C is embedded in the bottom carrier 102 to hold the upper cover 101 in place, making the wafer fixtures 100, 100-1, and 100-2 more tightly integrated to suppress the warping of the wafer 103. That is, this application utilizes the top clamp (upper cover 101) and the bottom carrier 102 to suppress the warping of the wafer 103 (or panel), and the magnet 102C embedded in the bottom carrier 102 promotes the tight fit between the top clamp and the bottom carrier 102 to effectively suppress the warping of the wafer 103 (or panel). This solves the warping problem of larger-sized products (such as wafer 103 (or panel)) during heating or processing, and can be applied to wafer and panel-level products. Furthermore, in this application, the upper cover 101 of the wafer fixtures 100, 100-1, and 100-2 can be used with different lower carriers 102 (replaceable carriers 102) to be used simultaneously for different products (wafers 103 (or panels) of different sizes). That is, the replaceable carrier 102 is used to adopt different stepped structures 102Rs depending on the wafer 103 it supports. Therefore, the upper cover 101 designed in this application can correspond to the carriers 102 of different products, thereby reducing the overall cost.

[0040] The features of several embodiments have been summarized above to enable those skilled in the art to better understand aspects of the present invention. Those skilled in the art should understand that they can readily use the present invention as a basis to design or modify other processes and structures for implementing the same purposes and / or achieving the same advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present invention, and that various changes, substitutions, and alterations can be made therein without departing from the spirit and scope of the present invention.

Claims

1. A wafer fixture, comprising: Top cover; as well as A replaceable carrier is connected to and disposed below the top cover, wherein the carrier has a plurality of grooves, each of the plurality of grooves having a stepped structure for accommodating a wafer to prevent the wafer from warping, and wherein the replaceable carrier is configured to employ different stepped structures depending on the wafer it carries.

2. The wafer fixture according to claim 1, wherein, The shape of the stepped structure corresponds to the shape of the wafer.

3. The wafer fixture according to claim 1, wherein, The carrier contains multiple embedded magnets.

4. The wafer fixture according to claim 3, wherein, The top cover is attracted by the magnet.

5. The wafer fixture according to claim 1, wherein, The groove is circular or rectangular in shape.

6. The wafer fixture according to claim 1, wherein, The stepped structure surrounds the entire groove.

7. The wafer fixture according to claim 1, wherein, The stepped structure has an upper wall and a lower wall, the upper wall being spaced apart from the edge of the wafer, and the lower wall being covered by the wafer.

8. The wafer fixture according to claim 7, wherein, The vertical distance between the top of the upper wall and the lower wall is greater than the thickness of the wafer.

9. The wafer fixture according to claim 3, wherein, The plurality of magnets are disposed within the stepped structure.

10. The wafer fixture according to claim 1, wherein, The carrier also has a recess for accommodating the top cover.

Images