Vacuum wafer rapid in-out sample device

Abstract

This utility model discloses a vacuum wafer rapid sample loading and unloading device, specifically relating to the field of wafer sample loading and unloading technology. It includes a vacuum chamber, with a wafer lifting module fixedly installed at the bottom of the chamber, and the wafer lifting module is fixedly connected to the bottom of the wafer clamp. A door opening / closing assembly and a replacement plate are respectively arranged on both sides of the vacuum chamber. A vacuum angle valve and a vacuum isolation valve are fixedly installed on the replacement plate, and a turbomolecular pump is fixedly installed at the other end of the vacuum isolation valve. A door opening / closing detection assembly is provided on the door opening / closing assembly. A first detection assembly and a second detection assembly are arranged inside the vacuum chamber, and a transfer isolation valve is fixedly installed on the side of the vacuum chamber. This utility model utilizes multiple valves on the replacement plate to achieve rapid vacuuming, significantly shortening the switching time between atmospheric and vacuum states for the wafer clamp. The first and second detection assemblies achieve a closed loop for accurate wafer detection and wafer sliding action detection.

Description

Technical Field

[0001] This utility model relates to the field of wafer loading and unloading technology, and more specifically, to a vacuum wafer rapid loading and unloading device. Background Technology

[0002] It is known that thin film deposition equipment uses wafer loading / unloading modules for wafer transfer; the wafer loading / unloading module is an important component of the vacuum wafer transfer platform, located between the atmospheric environment and the vacuum environment. Its main purpose is to realize the transfer of wafers between the atmospheric environment and the vacuum environment. Therefore, the wafer loading / unloading module plays a transit role and is a key transition link connecting the vacuum transfer cavity.

[0003] However, in practical use, the vacuum state switching time of the existing wafer loading and unloading modules is relatively long, which affects the wafer transfer efficiency. Therefore, a vacuum wafer rapid loading and unloading device is proposed as a further improvement. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the embodiments of this utility model provide a vacuum wafer rapid sample loading and unloading device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a vacuum wafer rapid sample loading and unloading device, comprising: a vacuum chamber and a wafer clip disposed inside the vacuum chamber; A wafer lifting module is fixedly installed at the bottom of the vacuum chamber, and the wafer lifting module, which drives the wafer clamp to lift, is fixedly connected to the bottom of the wafer clamp. A door opening and closing assembly is rotatably connected to one side of the vacuum chamber; a replacement plate is fixedly installed on the other side of the vacuum chamber, a vacuum angle valve and a vacuum isolation valve are fixedly installed on the replacement plate, and a turbomolecular pump is fixedly installed at the other end of the vacuum isolation valve. The door opening and closing assembly is equipped with a door opening and closing detection assembly; The vacuum chamber is equipped with a first detection component for detecting whether the wafer is in place and a second detection component for detecting whether the wafer has slipped out. A transmission isolation valve is fixedly installed on the side of the vacuum chamber near the second detection component.

[0006] Furthermore, the door opening and closing assembly includes: a quick-opening door body and a glass viewing window; The glass viewing window is fixedly installed on the quick-opening door body; One side of the quick-opening door body is rotatably connected to the vacuum chamber via a door hinge, and a sealing handle is fixedly installed on the other side of the quick-opening door body. The sealing handle is used for sealing and closing the vacuum chamber and the quick-opening door body.

[0007] Furthermore, the door opening and closing detection assembly includes two magnetic sensors located on both sides of the wafer clip. One magnetic sensor is fixedly installed on the quick-opening door body near the sealing handle; the other magnetic sensor is fixedly installed on the inside of the vacuum chamber. When the vacuum chamber and the quick-opening door body are sealed closed, the two magnetic sensors are parallel to each other.

[0008] Furthermore, the first detection component includes: a first sensor transmitter and a first sensor receiver; The first sensor receiver is fixedly mounted on the glass viewing port, and the first sensor transmitter is fixedly mounted on the inner wall of the vacuum chamber; the movement direction of the wafer inside the wafer holder is set as the sliding direction; the first sensor transmitter emits a laser signal to the first sensor receiver, and the emission path of the laser signal is set as the first laser path; the plane of the sliding direction is parallel to the first laser path.

[0009] Furthermore, the second detection component includes: a second sensor transmitter and a second sensor receiver; The second sensor transmitter is fixedly installed on the top of the vacuum chamber, and the second sensor receiver is fixedly installed on the bottom of the vacuum chamber; the movement direction of the wafer inside the wafer holder is set as the sliding direction; the second sensor transmitter emits a laser signal to the second sensor receiver, and the emission path of the laser signal is set as the second laser path; the plane of the sliding direction is perpendicular to the second laser path.

[0010] Furthermore, the wafer lifting module includes: a sealing flange, a clamping base plate, a ball nut assembly, a ball screw, and a drive motor; The top of the sealing flange is fixedly installed at the bottom of the vacuum chamber, and a welded bellows is fixedly installed at the bottom of the sealing flange. The welded bellows passes upward through the sealing flange, and the top of the welded bellows is fixedly installed at the bottom of the clamp base plate. The wafer clamp is fixedly installed on the upper surface of the clamp base plate, and a lifting sleeve that slides inside the welded bellows is fixedly installed at the bottom of the clamp base plate. The top of the ball nut assembly is fixedly connected to the bottom of the lifting sleeve. The ball nut assembly rolls with the helical raceway on the outer surface of the ball screw through an internal circulating ball group. The balls form a closed circulation path within the ball nut assembly, converting the rotational motion of the ball screw into the axial linear motion of the ball nut assembly. The ball screw passes through the interior of the lifting sleeve. A guide rail bracket is fixedly installed on the side of the sealing flange. The drive motor is fixedly installed at the bottom of the guide rail bracket. A linear slide rail parallel to the ball screw is fixedly installed inside the guide rail bracket. A slider is slidably connected on the linear slide rail. The slider is fixedly connected to the ball nut assembly. The bottom of the ball screw is connected to the output shaft of the drive motor through a belt module.

[0011] Furthermore, the special-specification wafer clip is fixedly mounted on the top of the clip base plate via an adapter plate.

[0012] The technical effects and advantages of this utility model are as follows: 1. Compared with existing technologies, by setting up a vacuum chamber and a replacement plate, and using multiple valves on the replacement plate, a rapid vacuuming effect can be achieved, which greatly shortens the time for the wafer cassette to switch between atmospheric and vacuum states. The first and second detection components achieve a closed loop for accurate detection of the wafer in the wafer cassette and detection of the wafer sliding out, solving the problem of real-time feedback of the wafer's status and achieving a logical closed loop in the system.

[0013] 2. Compared with existing technologies, by setting up a wafer lifting module and optimizing the internal movement structure of the wafer lifting module using welded corrugated pipes, the generation of contaminant dust is reduced, and wafers are prevented from being contaminated. By setting up an adapter plate, the clamp base plate can fix wafer clamps of different sizes, thereby achieving compatibility and solving the problem of multi-size wafer compatibility in products. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the opening and closing door assembly of this utility model.

[0016] Figure 3 This is a schematic diagram of the structure of the first detection component of this utility model. Figure 1 .

[0017] Figure 4 This is a schematic diagram of the structure of the first detection component of this utility model. Figure 2 .

[0018] Figure 5 This is a schematic diagram of the structure of the second detection component of this utility model.

[0019] Figure 6 This is a three-dimensional schematic diagram of the wafer lifting module of this utility model.

[0020] Figure 7 This is a cross-sectional structural diagram of the wafer lifting module of this utility model.

[0021] Figure 8 This is a schematic diagram of the structure of the adapter plate of this utility model.

[0022] Figure 9 This is a schematic diagram of the structure of the wafer clip of this utility model.

[0023] The attached figures are labeled as follows: 10. Vacuum chamber; 11. Transmission isolation valve; 20. Wafer clamp; 21. Wafer; 30. Wafer lifting module; 31. Sealing flange; 32. Clamp base plate; 33. Ball nut assembly; 34. Ball screw; 35. Drive motor; 351. Belt module; 36. Welded bellows; 37. Lifting sleeve; 38. Guide rail bracket; 39. Linear slide rail; 391. Slider; 40. Door opening and closing assembly; 41. Quick-opening door body; 42. Glass viewing port; 43. Sealed handle; 50. Replacement plate; 51. Vacuum angle valve; 52. Vacuum isolation valve; 53. Turbomolecular pump; 60. Door opening and closing detection assembly; 61. Magnetic sensor; 70. First detection assembly; 71. First sensor transmitter; 72. First sensor receiver; 80. Second detection assembly; 81. Second sensor transmitter; 82. Second sensor receiver; 90. Adapter plate. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0025] As attached Figure 1 and attached Figure 2 The vacuum wafer rapid loading and unloading device shown includes: a vacuum chamber 10 and a wafer clip 20 disposed inside the vacuum chamber 10; wherein, the vacuum chamber 10 is made of aluminum alloy, and each side of it is reserved with rubber ring sealing interfaces, such as ISO, KF, oring grooves, so that the interfaces can be used to install other auxiliary components and achieve the sealing requirements of the high vacuum environment. A wafer lifting module 30 is fixedly installed at the bottom of the vacuum chamber 10. The wafer lifting module 30, which is used to drive the wafer clamp 20 to move up and down, is fixedly connected to the bottom of the wafer clamp 20. That is, the wafer lifting module 30 is mainly used to drive the wafer clamp 20 to move up and down, so as to facilitate the picking and placing of wafers located in the wafer clamp 20.

[0026] A door assembly 40 is rotatably connected to one side of the vacuum chamber 10; a replacement plate 50 is fixedly installed on the other side of the vacuum chamber 10, and a vacuum angle valve 51 and a vacuum isolation valve 52 are fixedly installed on the replacement plate 50. A turbomolecular pump 53 is fixedly installed at the other end of the vacuum isolation valve 52. The vacuum chamber 10 is sealed with the replacement plate 50, and the vacuum angle valve 51 is installed on the replacement plate 50 through a kf interface. The vacuum angle valve 51 is used to control the on / off relationship between itself and the pre-vacuum pump. When the vacuum angle valve 51 is open, the pre-vacuum pump draws gas molecules from inside the vacuum chamber 10 to reduce the vacuum level to a low vacuum state. The replacement board 50 is equipped with a vacuum isolation valve 52 via an ISO 100 interface. This isolation vacuum chamber 10 is used to control its vacuum relationship with the turbomolecular pump 53. By controlling the opening and closing of the vacuum isolation valve 52, the vacuum chamber 10 and the turbomolecular pump 53 are isolated and made independent. The turbomolecular pump 53 is used to reduce the low vacuum state of the vacuum chamber 10 to a high vacuum state when it reaches a low vacuum state, that is, to obtain a higher vacuum degree. Therefore, considering that the replacement board 50 needs to meet the configuration and connection of different products, the connection interface and method on the replacement board 50 can be replaced. Therefore, the replacement board 50 is designed to be replaceable.

[0027] A door opening and closing detection component 60 is provided on the door opening and closing assembly 40; The vacuum chamber 10 is equipped with a first detection component 70 for detecting whether the wafer is in place and a second detection component 80 for detecting whether the wafer has slipped out.

[0028] The wafer lifting module 30 is used to drive the lifting action of the wafer clip 20 located in the vacuum chamber 10. The lifting action of the wafer clip 20 cooperates with the first detection component 70 to detect whether the wafer on the wafer clip 20 is in place.

[0029] A transfer isolation valve 11 is fixedly installed on the side of the vacuum chamber 10, close to the second detection component 80. When the transfer isolation valve 11 on the side of the vacuum chamber 10 is opened, and the wafer cassette 20 is raised or lowered to a suitable position, the second detection component 80 can detect the wafer sliding out of the wafer cassette 20.

[0030] In a preferred embodiment, as shown in the appendix Figure 2 As shown, the door opening and closing assembly 40 includes: a quick-opening door body 41 and a glass viewing window 42; The glass viewing port 42 is fixedly installed on the quick-opening door body 41; wherein, the glass viewing port 42 is used to achieve the requirements of vacuum sealing and good light transmission; One side of the quick-opening door body 41 is rotatably connected to the vacuum chamber 10 via a door hinge. The specific structure of the door hinge is as follows: the stationary end of the door hinge is connected to the vacuum chamber 10 by bolts, while the moving end of the door hinge is connected to the quick-opening door body 41. The hinge components of the door hinge are connected by a rotating shaft, so that the axis of the rotating shaft is perpendicular to the opening and closing direction of the quick-opening door body 41, allowing the quick-opening door body 41 to rotate around the axis, thereby realizing the opening and closing of the quick-opening door body 41.

[0031] A sealing handle 43 is fixedly installed on the other side of the quick-opening door body 41. The sealing handle 43 is used for sealing and closing the vacuum chamber 10 and the quick-opening door body 41. The sealing handle 43 is threaded onto the quick-opening door body 41. When locked, the sealing handle 43 can apply a certain pressure to the quick-opening door body 41 to make it press tightly against the vacuum chamber 10, thereby forming a seal at the contact part between the quick-opening door body 41 and the vacuum chamber 10. Therefore, the sealing handle 43 is used to achieve a quick seal between the vacuum chamber 10 and the quick-opening door body 41.

[0032] In a preferred embodiment, as shown in the appendix Figure 2 As shown, the door opening / closing detection assembly 60 includes two magnetic sensors 61 located on either side of the wafer clip 20. One magnetic sensor 61 is fixedly installed on the quick-opening door body 41 near the sealing handle 43; the other magnetic sensor 61 is fixedly installed inside the vacuum chamber 10. When the vacuum chamber 10 and the quick-opening door body 41 are sealed closed, the two magnetic sensors 61 are parallel to each other. The two magnetic sensors 61 detect the opening and closing of the quick-opening door body 41 using the principle of magnetic induction. That is, when the quick-opening door body 41 is closed, the two magnetic sensors 61 are closest to each other, and at this time, the two magnetic sensors 61 induce each other to form a closed loop, i.e., the detection result is that the quick-opening door body 41 is closed. When the quick-opening door body 41 is open, the distance between the two magnetic sensors 61 increases, and thus the two magnetic sensors 61 can no longer induce each other, i.e., the detection result is that the quick-opening door body 41 is open.

[0033] In a preferred embodiment, as shown in the appendix Figure 1 Appendix Figure 3 and attached Figure 4 As shown, the first detection component 70 includes: a first sensor transmitter 71 and a first sensor receiver 72; The first sensor receiver 72 is fixedly mounted on the glass viewing port 42, and the first sensor transmitter 71 is fixedly mounted on the inner wall of the vacuum chamber 10. The direction of movement of the wafer inside the wafer holder 20 is set as the sliding direction. The first sensor transmitter 71 emits a laser signal to the first sensor receiver 72, and the emission path of the laser signal is set as the first laser path. The plane of the sliding direction is parallel to the first laser path. The first sensor receiver 72, which is placed parallel to the glass viewing port 42, is fixed to the adjustment groove reserved on the quick-opening door body 41 by bolts, so as to ensure that the laser signal emitted by the first sensor transmitter 71 placed in the vacuum chamber 10 is received by the first sensor receiver 72.

[0034] Among them, such as Figure 9 As shown, the wafer holder 20 has multiple uniformly distributed layers from top to bottom, capable of holding wafers 21. The spacing between the layers is fixed at 6.55 mm, and the thickness of wafer 21 is 0.75 mm. Therefore, the first laser path is parallel to wafer 21. Combined with the wafer lifting module 30, the lifting and lowering of the wafer holder 20 is controlled. Thus, based on whether wafer 21 is located in the first laser path blocking the laser circuit, i.e., based on the laser signal transmission status obtained from the first detection component 70, the state of wafer 21 in each layer inside the wafer holder 20 can be determined: present, absent, misaligned, or stacked. like Figure 9 As shown, when the laser signal transmission state between the first sensor transmitter 71 and the first sensor receiver 72 is a path, it is determined that the card layer is a fabless 21. When the laser signal transmission state between the first sensor transmitter 71 and the first sensor receiver 72 changes as follows: first the circuit is broken, and then as the wafer lifting module 30 drives the wafer clip 20 to move up or down, the sum of the moving values ​​is equal to the thickness of a wafer 21 (0.75mm), the laser signal transmission state becomes a circuit, and it is determined that the card layer contains a wafer 21. Subsequently, as Figure 9 As shown in b, if the laser signal transmission state remains open after moving the thickness of two wafers 21, it is determined that wafers 21 with this card layer have stacking; Figure 9 As shown in c, if the laser signal transmission remains continuous after moving a distance greater than the thickness of two wafers 21, then wafer 21 is determined to be misaligned; Figure 9 As shown in a, if the moving distance from the previous wafer 21 exceeds one card layer spacing of 6.55mm, and the laser signal transmission status is still open, then it is determined that there is no wafer 21 in this layer.

[0035] In a preferred embodiment, as shown in the appendix Figure 5 As shown, the second detection component 80 includes: a second sensor transmitter 81 and a second sensor receiver 82; The second sensor transmitter 81 is fixedly installed on the top of the vacuum chamber 10, and the second sensor receiver 82 is fixedly installed on the bottom of the vacuum chamber 10; the movement direction of the wafer inside the wafer holder 20 is set as the sliding direction; the second sensor transmitter 81 emits a laser signal to the second sensor receiver 82, and the emission path of the laser signal is set as the second laser path; the plane where the sliding direction is located is perpendicular to the second laser path.

[0036] The second sensor transmitter 81 and the second sensor receiver 82 are placed coaxially and parallel. When there is no wafer obstruction, the laser signal emitted by the second sensor transmitter 81 is transmitted to the second sensor receiver 82 to form a closed state. When the wafer slides out of the wafer holder 20 in the sliding direction, the wafer obstructs the transmission of the laser signal, that is, the transmission state of the laser signal is open. At this time, it is considered that a wafer has slid out of the wafer holder 20. Therefore, the function of the second detection component 80 can be used to detect the state of the wafer in the wafer holder 20, determine whether the wafer has exceeded the position of the wafer holder 20, and ensure the accuracy of the wafer position in the sliding direction.

[0037] In a preferred embodiment, as shown in the appendix Figure 6 and attached Figure 7 As shown, the wafer lifting module 30 includes: a sealing flange 31, a clamping base plate 32, a ball nut assembly 33, a ball screw 34, and a drive motor 35; The top of the sealing flange 31 is fixedly installed at the bottom of the vacuum chamber 10. That is, the upper end face of the sealing flange 31 is positioned by a pin and fixed to the bottom of the vacuum chamber 10 by bolts. A sealing ring is placed between the two to achieve vacuum sealing.

[0038] A welded bellows 36 is fixedly installed at the bottom of the sealing flange 31. The welded bellows 36 passes through the sealing flange 31 upwards, and the top end of the welded bellows 36 is fixedly installed at the bottom of the clamp base plate 32. The welded bellows 36 is connected to the bottom of the sealing flange 31 on one side to achieve a seal. The outside of the welded bellows 36 is exposed to the inside of the vacuum chamber 10, while the inside of the welded bellows 36 is exposed to the atmosphere. Therefore, this utility model not only reduces the vacuum volume of the vacuum chamber 10 during vacuuming, but also reduces the pollution of the internal environment of the vacuum chamber 10 by dust generated at the welding point inside the welded bellows 36.

[0039] The wafer clip 20 is fixedly installed on the upper surface of the clip base plate 32. The bottom of the clip base plate 32 is fixedly installed with a lifting sleeve 37 that slides inside the welded bellows 36. The top of the ball nut assembly 33 is fixedly connected to the bottom of the lifting sleeve 37. The ball nut assembly 33 rolls with the helical raceway on the outer surface of the ball screw 34 through an internal circulating ball set. The balls form a closed circulation path within the ball nut assembly 33, converting the rotational motion of the ball screw 34 into the axial linear motion of the ball nut assembly 33. The ball screw 34 passes through the interior of the lifting sleeve 37. The ball screw 34 is concentrically arranged with the circular hole of the sealing flange 31. The rotation of the ball screw 34 drives the ball nut assembly 33 to rise and fall. That is, the rising and falling of the ball nut assembly 33 drives the rising and falling of the lifting sleeve 37, thereby causing the clamping base plate 32 at the top of the lifting sleeve 37 to compress or extend the welded bellows 36.

[0040] A guide rail bracket 38 is fixedly installed on the side of the sealing flange 31. The drive motor 35 is fixedly installed at the bottom of the guide rail bracket 38. A linear slide rail 39 parallel to the ball screw 34 is fixedly installed inside the guide rail bracket 38. A slider 391 is slidably connected to the linear slide rail 39. The slider 391 is fixedly connected to the ball nut assembly 33. The guide rail bracket 38 has a slide rail groove for installing the linear slide rail 39, thereby ensuring the straightness of the slider 391's movement. The linear movement of the slider 391 will restrict the ball nut assembly 33, preventing the ball nut assembly 33 from deviating due to long-term lifting and lowering.

[0041] The bottom of the ball screw 34 is connected to the output shaft of the drive motor 35 via a belt module 351. The belt module 351 includes, for example, a drive pulley, a driven pulley, and a transmission belt. Specifically, the output shaft of the drive motor 35 is fixedly fitted with the drive pulley, and the bottom of the ball screw 34 is fixedly fitted with the driven pulley. The drive pulley is connected to the driven pulley via the transmission belt. Therefore, the drive motor 35 provides rotational power, which drives the ball screw 34 to rotate via the belt module 351. The rotation of the ball screw 34 causes the slider 391 and the ball nut assembly 33 to perform linear motion, moving up and down.

[0042] In a preferred embodiment, as shown in the appendix Figure 8 As shown, the special-specification wafer clip 20 is fixedly mounted on the top of the clip base plate 32 via an adapter plate 90. Since the clip base plate 32 is mounted on the upper end of the welded corrugated pipe 36, to achieve compatibility with 8-inch wafer clips 20, the wafer clip 20 can be directly placed on top and fixed, with the wafer placed in the slot of each layer of the wafer clip 20. If compatibility with other special wafer sizes is required, an adapter plate 90 is mounted on the upper part of the clip base plate 32, allowing for the installation of custom-sized wafer clips 20 to meet different needs.

[0043] Working principle of this utility model: During use, the vacuum chamber 10 is in atmospheric condition. Open the sealing handle 43 and manually pull open the quick-opening door body 41 to take out the wafer cassette 20. In atmospheric condition, accurately place the wafer into each layer of the wafer cassette 20. After placement, place the wafer cassette 20 on the top of the cassette base plate 32 and confirm. Then close the quick-opening door body 41 and lock the sealing handle 43. Open the vacuum angle valve 51 to evacuate the vacuum level in the vacuum chamber 10 to a low vacuum, close the vacuum angle valve 51, and turn on the turbomolecular pump 53 to reduce the vacuum level to a high vacuum. At this time, the drive motor 35 moves, driving the wafer cassette 20 to move up and down. The first detection component 70 detects the wafer status of all layers of the wafer cassette 20 and provides feedback. When the wafer is to be removed, the transfer isolation valve 11 located on the side of the vacuum chamber 10 is opened, and the wafer clamp 20 is raised or lowered to a suitable position; the second detection component 80 is used to detect and record the wafer sliding out status.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vacuum wafer rapid sample loading and unloading device, comprising: A vacuum chamber (10) and a wafer clip (20) disposed inside the vacuum chamber (10); characterized in that: A wafer lifting module (30) is fixedly installed at the bottom of the vacuum chamber (10). The wafer lifting module (30) used to drive the wafer clamp (20) to rise and fall is fixedly connected to the bottom of the wafer clamp (20). A door opening and closing assembly (40) is rotatably connected to one side of the vacuum chamber (10); a replacement plate (50) is fixedly installed on the other side of the vacuum chamber (10), a vacuum angle valve (51) and a vacuum isolation valve (52) are fixedly installed on the replacement plate (50), and a turbomolecular pump (53) is fixedly installed at the other end of the vacuum isolation valve (52). The door opening and closing detection component (60) is provided on the door opening and closing assembly (40). The vacuum chamber (10) is provided with a first detection component (70) for detecting whether the wafer is in place and a second detection component (80) for detecting whether the wafer has slipped out. A transmission isolation valve (11) is fixedly installed on the side of the vacuum chamber (10) near the second detection component (80).

2. The vacuum wafer rapid sample loading and unloading device according to claim 1, characterized in that: The door opening and closing assembly (40) includes: a quick-opening door body (41) and a glass viewing window (42); The glass viewing window (42) is fixedly installed on the quick-opening door body (41); One side of the quick-opening door body (41) is rotatably connected to the vacuum chamber (10) via a door hinge, and a sealing handle (43) is fixedly installed on the other side of the quick-opening door body (41). The sealing handle (43) is used for sealing and closing the vacuum chamber (10) and the quick-opening door body (41).

3. The vacuum wafer rapid sample loading and unloading device according to claim 2, characterized in that: The door opening and closing detection assembly (60) includes two magnetic sensors (61) located on both sides of the wafer clip (20). One of the magnetic sensors (61) is fixedly installed on the quick-opening door body (41) near the sealing handle (43); the other magnetic sensor (61) is fixedly installed on the inside of the vacuum chamber (10). When the vacuum chamber (10) and the quick-opening door body (41) are sealed and closed, the two magnetic sensors (61) are parallel to each other.

4. The vacuum wafer rapid sample loading and unloading device according to claim 2, characterized in that: The first detection component (70) includes: a first sensor transmitter (71) and a first sensor receiver (72); The first sensor receiver (72) is fixedly mounted on the glass viewing port (42), and the first sensor transmitter (71) is fixedly mounted on the inner wall of the vacuum cavity (10); the movement direction of the wafer inside the wafer holder (20) is set as the sliding direction; the first sensor transmitter (71) emits a laser signal to the first sensor receiver (72), and the emission line of the laser signal is set as the first laser path; the plane where the sliding direction is located is parallel to the first laser path.

5. The vacuum wafer rapid sample loading and unloading device according to claim 1, characterized in that: The second detection component (80) includes: a second sensor transmitter (81) and a second sensor receiver (82); The second sensor transmitter (81) is fixedly installed on the top of the vacuum chamber (10), and the second sensor receiver (82) is fixedly installed on the bottom of the vacuum chamber (10); the movement direction of the wafer inside the wafer holder (20) is set as the sliding direction; the second sensor transmitter (81) emits a laser signal to the second sensor receiver (82), and the emission line of the laser signal is set as the second laser path; the plane where the sliding direction is located is perpendicular to the second laser path.

6. The vacuum wafer rapid sample loading and unloading device according to claim 1, characterized in that: The wafer lifting module (30) includes: a sealing flange (31), a clamp base plate (32), a ball nut assembly (33), a ball screw (34), and a drive motor (35). The top of the sealing flange (31) is fixedly installed at the bottom of the vacuum chamber (10), and a welded bellows (36) is fixedly installed at the bottom of the sealing flange (31). The welded bellows (36) passes through the sealing flange (31) upwards. The top of the welded bellows (36) is fixedly installed at the bottom of the clamp base plate (32). The wafer clamp (20) is fixedly installed on the upper surface of the clamp base plate (32). A lifting sleeve (37) that slides inside the welded bellows (36) is fixedly installed at the bottom of the clamp base plate (32). The top of the ball nut assembly (33) is fixedly connected to the bottom of the lifting sleeve (37). The ball nut assembly (33) is in rolling contact with the spiral raceway on the outer surface of the ball screw (34) through the internal circulating ball group. The balls form a closed circulation path in the ball nut assembly (33), converting the rotational motion of the ball screw (34) into the axial linear motion of the ball nut assembly (33). The ball screw (34) is inserted into the interior of the lifting sleeve (37). A guide rail bracket (38) is fixedly installed on the side of the sealing flange (31). The drive motor (35) is fixedly installed at the bottom of the guide rail bracket (38). A linear slide rail (39) parallel to the ball screw (34) is fixedly installed inside the guide rail bracket (38). A slider (391) is slidably connected on the linear slide rail (39). The slider (391) is fixedly connected to the ball nut assembly (33). The bottom of the ball screw (34) is connected to the output shaft of the drive motor (35) through a belt module (351).

7. A vacuum wafer rapid sample loading and unloading device according to claim 6, characterized in that: The special-specification wafer clip (20) is fixedly mounted on the top of the clip base plate (32) via an adapter plate (90).

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