Wafer clamping device

Abstract

The utility model relates to clamping frock technical field discloses a kind of wafer clamping devices, comprising: substrate, limiting piece and extrusion assembly, by setting article groove on substrate, and using limiting piece and extrusion assembly respectively from different directions to the outer edge of wafer exert partial pressure, realize the firm clamping of wafer in article groove.The advantages, such as simple structure, convenient operation, do not need complex adjustment mechanism or multi-axis control device, reduce the overall complexity of equipment.Meanwhile, by limiting piece and extrusion assembly to the relative support and extrusion of wafer, make the uniform stress of wafer in clamping process, can effectively avoid the wafer displacement, deflection or damage caused by unstable clamping, so as to improve the positioning accuracy and stability of wafer in detection process.The utility model improves wafer clamping efficiency by simplifying the structure configuration of wafer clamping mechanism, and then helps to improve the overall wafer detection efficiency, and ensure the consistency and reliability of detection result.

Description

Technical Field

[0001] This utility model relates to the field of clamping tooling technology, specifically to a wafer clamping device. Background Technology

[0002] With the rapid development of the semiconductor industry, quality inspection of wafers during the production process has become particularly important. To effectively identify wafer defects, contamination, or structural anomalies, current technologies generally employ dedicated wafer inspection equipment and matching clamping and inspection fixtures for high-precision wafer inspection. However, existing wafer inspection equipment is typically expensive, and the clamping and inspection fixtures used with it must be custom-made according to different types of wafers and equipment interfaces, resulting in high overall system procurement costs. This places a significant economic burden on small and medium-sized semiconductor manufacturing enterprises, limiting its widespread application in production lines.

[0003] Furthermore, existing customized clamping testing fixtures are generally complex in structure and operation. Operators require extensive professional training to master the installation, commissioning, and testing procedures, which hinders rapid deployment and personnel turnover within enterprises. At the same time, the complex operating procedures increase the probability of errors, affecting testing efficiency and the stability of results. Utility Model Content

[0004] In view of this, the present invention provides a wafer clamping device to solve the problems of complex clamping devices and difficult operation in the prior art, which lead to low wafer inspection efficiency and poor stability of inspection results.

[0005] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows:

[0006] This utility model provides a wafer clamping device, including: a substrate, a limiting member, and a pressing assembly. The substrate has a storage groove, and the wafer is placed in the storage groove. The limiting member is fixedly disposed on the substrate and located at the outer edge of the storage groove. The outer edge of the wafer is tangent to and abuts against one side of the limiting member. The pressing assembly is disposed on the substrate and located at the outer edge of the storage groove. The pressing assembly is adapted to reciprocate along its normal direction to the wafer, so that the pressing assembly abuts against the wafer tangentially. The pressing assembly is adapted to provide a downward partial pressure to the wafer, and the limiting member is adapted to provide an upward partial pressure to the wafer, so that the wafer is fixed in the storage groove.

[0007] It has the following advantages:

[0008] This invention provides a wafer clamping device that uses a placement groove on a substrate and applies partial pressure to the outer edge of the wafer from different directions using limiting members and a pressing component, achieving stable clamping of the wafer within the placement groove. This device offers advantages such as simple structure and convenient operation, eliminating the need for complex adjustment mechanisms or multi-axis control devices, thus reducing the overall complexity of the equipment. Simultaneously, the relative support and pressing of the wafer by the limiting members and the pressing component ensures uniform force distribution during clamping, effectively preventing wafer displacement, deflection, or damage caused by unstable clamping, thereby improving the positioning accuracy and stability of the wafer during inspection. This invention improves wafer clamping efficiency by simplifying the structural configuration of the wafer clamping mechanism, thereby contributing to improved overall wafer inspection efficiency and ensuring the consistency and reliability of inspection results.

[0009] According to some embodiments of the present invention, at least two limiting members are provided, both located at the lower part of the storage groove, and symmetrically distributed about the longitudinal central axis of the storage groove. The two limiting members intersect the normal extension line of the wafer and are set at an angle.

[0010] According to some embodiments of the present invention, the extrusion assembly includes a fixing block, a first elastic element, and a pressing block. The fixing block is fixed on the substrate. One end of the first elastic element is connected to the fixing block, and the other end of the first elastic element is connected to the pressing block. The first elastic element drives the pressing block to reciprocate along the normal direction of the wafer and the pressing block.

[0011] According to some embodiments of the present invention, the pressing block is provided with a waist-shaped hole, the length direction of the waist-shaped hole is consistent with the normal direction of the wafer and the pressing block, the substrate is provided with a fixing hole, and the extrusion assembly further includes a locking member, the locking member is inserted through the waist-shaped hole to extend into the fixing hole and is fixedly connected to the substrate, so that the pressing block is moved away from the wafer.

[0012] According to some embodiments of the present invention, the wafer clamping device further includes an adjusting member disposed on the substrate and along the outer edge of the placement groove. The adjusting member is rotatably configured to adjust the eccentric position of the wafer in the placement groove.

[0013] According to some embodiments of the present invention, at least two adjustment members are provided, and they are symmetrically distributed about the longitudinal central axis of the storage slot.

[0014] According to some embodiments of the present invention, the wafer clamping device further includes a floating clamping component, which is rotatably disposed on the substrate and arranged along the outer edge of the placement groove. The lower end face of the floating clamping component is adapted to abut against the upper end face of the wafer to provide pressure perpendicular to the upper end face of the wafer to the wafer.

[0015] According to some embodiments of the present invention, the floating clamping assembly includes a fixing member, a floating plate, and a second elastic member. One end of the floating plate is provided with a through hole, and the fixing member passes through the through hole to fix it on the substrate. One end of the second elastic member is connected to the upper end face of one end of the floating plate, and the other end of the second elastic member is connected to the upper end of the fixing member. The lower end face of the other end of the floating plate can abut against the wafer.

[0016] According to some embodiments of the present invention, multiple floating clamping components may be provided, and the multiple floating clamping components may be arranged at intervals along the circumference of the storage slot.

[0017] According to some embodiments of the present invention, the substrate is further provided with a retrieval slot, which is connected to the placement slot. Attached Figure Description

[0018] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a wafer clamping device provided in some embodiments of the present invention;

[0020] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle;

[0021] Figure 3 for Figure 1 A magnified view of a portion of point B in the middle.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Substrate; 11. Storage slot; 12. Retrieval slot; 2. Limiting component; 3. Extrusion assembly; 31. Fixing block; 32. First elastic component; 33. Pressing block; 34. Locking component; 331. Waist-shaped hole; 4. Adjusting component; 5. Floating clamping assembly; 51. Fixing component; 52. Second elastic component; 53. Floating plate; 6. Wafer. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0025] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0028] Reference Figure 1 As shown, this utility model provides a wafer 6 clamping device, including: a substrate 1, a limiting member 2, and a pressing assembly 3. The substrate 1 is provided with a storage groove 11, and the wafer 6 is placed in the storage groove 11. The limiting member 2 is fixedly disposed on the substrate 1 and located at the outer edge of the storage groove 11. The outer edge of the wafer 6 is tangent to one side of the limiting member 2 and abuts against each other. The pressing assembly 3 is disposed on the substrate 1 and located at the outer edge of the storage groove 11. The pressing assembly 3 is adapted to slide back and forth along its normal direction with the wafer 6 so that the pressing assembly 3 abuts against the wafer 6 tangentially. The pressing assembly 3 is adapted to provide a downward partial pressure to the wafer 6, and the limiting member 2 is adapted to provide an upward partial pressure to the wafer 6 so that the wafer 6 is fixed in the storage groove 11.

[0029] Specifically, this utility model provides a wafer 6 clamping device. By setting a placement groove 11 on a substrate 1, and using a limiting member 2 and a pressing component 3 to apply partial pressure to the outer edge of the wafer 6 from different directions, the wafer 6 is stably clamped within the placement groove 11. This structure is simple and easy to operate, eliminating the need for complex adjustment mechanisms or multi-axis control devices, thus reducing the overall complexity of the equipment. Simultaneously, the limiting member 2 and the pressing component 3 provide relative support and compression to the wafer 6, ensuring uniform force distribution during clamping. This effectively prevents wafer 6 displacement, deflection, or damage caused by unstable clamping, thereby improving the positioning accuracy and stability of the wafer 6 during the inspection process. This utility model simplifies the structural configuration of the wafer 6 clamping mechanism, improves wafer 6 clamping efficiency, and thus helps improve the overall wafer 6 inspection efficiency, ensuring the consistency and reliability of the inspection results.

[0030] In some embodiments of this utility model, at least two limiting members 2 are provided, both located at the lower part of the storage groove 11, and symmetrically distributed around the longitudinal central axis of the storage groove 11. The two limiting members 2 intersect with the normal extension line of the wafer 6 and are set at an angle.

[0031] Specifically, the limiting member 2 is fixedly mounted on the substrate 1 and located at the outer edge of the storage groove 11. Specifically, the limiting member 2 includes two symmetrically arranged wedge-shaped limiting members 2, respectively located at the lower part on both sides of the longitudinal central axis of the storage groove 11. Each limiting member 2 intersects the normal extension line of the wafer 6 at an angle, and is used to provide an upward force and a horizontal force to the edge of the wafer 6, preventing the wafer 6 from shifting due to gravity or vibration.

[0032] Reference Figure 2 As shown, in some embodiments of this utility model, the extrusion assembly 3 includes a fixing block 31, a first elastic member 32 and a pressing block 33. The fixing block 31 is fixed on the substrate 1. One end of the first elastic member 32 is connected to the fixing block 31, and the other end of the first elastic member 32 is connected to the pressing block 33. The first elastic member 32 drives the pressing block 33 to slide back and forth along the normal of the wafer 6 and the pressing block 33.

[0033] In some embodiments of this utility model, the pressure block 33 is provided with a waist-shaped hole 331, the length direction of the waist-shaped hole 331 is consistent with the normal direction of the wafer 6 and the pressure block 33, the substrate 1 is provided with a fixing hole, and the extrusion assembly 3 also includes a locking member 34, which passes through the waist-shaped hole 331 to extend into the fixing hole and is fixedly connected to the substrate 1 so that the pressure block 33 is away from the wafer 6.

[0034] Specifically, the extrusion assembly 3 is located on the upper outer edge of the placement groove 11, and mainly includes a fixing block 31, a first elastic element 32, and a pressure block 33. The fixing block 31 is fixed to the substrate 1 by threads or welding. The first elastic element 32 is a spring structure, with one end fixed to the fixing block 31 and the other end connected to the pressure block 33, so as to drive the pressure block 33 to slide back and forth along its normal direction with respect to the wafer 6. The pressure block 33 is used to provide downward pressure on the outer edge of the wafer 6, thereby forming a clamping engagement with the limiting element 2 to fix the position of the wafer 6. The pressure block 33 is provided with an oblong hole 331 extending along the normal direction. The locking element 34 passes through the oblong hole 331 and extends into the fixing hole on the substrate 1, so as to lock the pressure block 33 in a position away from the wafer 6 when needed, so as to facilitate the placement or replacement of the wafer 6.

[0035] In some embodiments of this utility model, the wafer 6 clamping device further includes an adjusting member 4, which is disposed on the substrate 1 and along the outer edge of the storage groove 11. The adjusting member 4 is rotatably configured to adjust the eccentric position of the wafer 6 in the storage groove 11.

[0036] In some embodiments of this utility model, at least two adjustment members 4 are provided, and they are symmetrically distributed about the longitudinal central axis of the storage slot 11.

[0037] Specifically, the adjustment component 4 is disposed on the substrate 1 and symmetrically distributed along the outer edge of the placement groove 11. The adjustment component 4 is a knob-type eccentric wheel structure, which can be manually rotated to finely adjust the eccentric position of the wafer 6 in the placement groove 11, thereby improving the positioning accuracy of the wafer 6.

[0038] In some embodiments of the present invention, the wafer 6 clamping device further includes a floating clamping component 5, which is rotatably disposed on the substrate 1 and disposed along the outer edge of the placement groove 11. The lower end surface of the floating clamping component 5 is adapted to abut against the upper end surface of the wafer 6 to provide pressure perpendicular to the upper end surface of the wafer 6 to the wafer 6.

[0039] In some embodiments of this utility model, the floating clamping assembly 5 includes a fixing member 51, a floating plate 53, and a second elastic member 52. One end of the floating plate 53 is provided with a through hole, and the fixing member 51 passes through the through hole to be fixed on the substrate 1. One end of the second elastic member 52 is connected to the upper end face of one end of the floating plate 53, and the other end of the second elastic member 52 is connected to the upper end of the fixing member 51. The lower end face of the other end of the floating plate 53 can abut against the wafer 6.

[0040] Reference Figure 3As shown in the diagram, the floating clamping assembly 5 provides clamping force from above the wafer 6. It includes a fixing member 51, a floating plate 53, and a second elastic member 52. One end of the floating plate 53 has a through hole, through which the fixing member 51 passes and hinges the floating plate 53 to the substrate 1. The second elastic member 52 is a compression spring structure, with one end connected to the upper surface of the floating plate 53 and the other end connected to the fixing member 51, used to push the free end of the floating plate 53 downwards to abut against the upper surface of the wafer 6.

[0041] In some embodiments of this utility model, multiple floating clamping components 5 may be provided, and multiple floating clamping components 5 may be arranged at intervals along the circumferential direction of the storage slot 11.

[0042] Specifically, multiple floating clamping components 5 can be arranged at circumferential intervals along the storage slot 11 to achieve multi-point floating support, so as to adapt to the clamping requirements of wafers 6 of different sizes and thicknesses.

[0043] In some embodiments of this utility model, the substrate 1 is further provided with a retrieval slot 12, which is connected to the storage slot 11.

[0044] Specifically, the substrate 1 is provided with a storage slot 11 for accommodating the wafer 6. The bottom of the storage slot 11 is machined with several positioning protrusions to assist in the initial alignment of the wafer 6. The substrate 1 is also provided with a retrieval slot 12 that communicates with the storage slot 11, forming a clearance space to facilitate the removal of the wafer 6 and improve operational convenience.

[0045] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A wafer clamping device, characterized in that, include: A substrate (1) is provided with a storage groove (11), and a wafer (6) is placed in the storage groove (11); The limiting member (2) is fixedly disposed on the substrate (1) and located at the outer edge of the placement groove (11). The outer edge of the wafer (6) is tangent to one side of the limiting member (2) and abuts against each other. An extrusion assembly (3) is disposed on the substrate (1) and located at the outer edge of the storage groove (11). The extrusion assembly (3) is adapted to reciprocate along its normal direction with the wafer (6) so that the extrusion assembly (3) tangentially abuts against the wafer (6). The extrusion assembly (3) is adapted to provide a downward partial pressure to the wafer (6). The limiting member (2) is adapted to provide an upward partial pressure to the wafer (6) so that the wafer (6) is fixed in the storage groove (11).

2. The wafer clamping device according to claim 1, characterized in that, At least two limiting members (2) are provided, both located at the lower part of the storage slot (11), and symmetrically distributed with respect to the longitudinal central axis of the storage slot (11). The two limiting members (2) intersect with the normal extension line of the wafer (6) and are set at an angle.

3. The wafer clamping device according to claim 1, characterized in that, The extrusion assembly (3) includes a fixing block (31), a first elastic element (32), and a pressing block (33). The fixing block (31) is fixed on the substrate (1). One end of the first elastic element (32) is connected to the fixing block (31), and the other end of the first elastic element (32) is connected to the pressing block (33). The first elastic element (32) drives the pressing block (33) to reciprocate along the normal of the wafer (6) and the pressing block (33).

4. The wafer clamping device according to claim 3, characterized in that, The pressing block (33) is provided with a waist-shaped hole (331), the length direction of the waist-shaped hole (331) is consistent with the normal direction of the wafer (6) and the pressing block (33), the substrate (1) is provided with a fixing hole, and the extrusion assembly (3) further includes a locking member (34), the locking member (34) passes through the waist-shaped hole (331) to extend into the fixing hole and is fixedly connected to the substrate (1) so that the pressing block (33) is away from the wafer (6).

5. The wafer clamping device according to any one of claims 1 to 4, characterized in that, It also includes an adjustment member (4), which is disposed on the substrate (1) and along the outer edge of the storage groove (11). The adjustment member (4) is rotatably disposed to adjust the eccentric position of the wafer (6) in the storage groove (11).

6. The wafer clamping device according to claim 5, characterized in that, At least two adjustment members (4) are provided, and they are symmetrically distributed about the longitudinal central axis of the storage slot (11).

7. The wafer clamping device according to any one of claims 1 to 4, characterized in that, It also includes a floating clamping assembly (5), which is rotatably disposed on the substrate (1) and disposed along the outer edge of the placement groove (11). The lower end face of the floating clamping assembly (5) is adapted to abut against the upper end face of the wafer (6) to provide pressure perpendicular to the upper end face of the wafer (6) to the wafer (6).

8. The wafer clamping device according to claim 7, characterized in that, The floating clamping assembly (5) includes a fixing member (51), a floating plate (53), and a second elastic member (52). One end of the floating plate (53) is provided with a through hole. The fixing member (51) passes through the through hole to fix it on the substrate (1). One end of the second elastic member (52) is connected to the upper end face of one end of the floating plate (53), and the other end of the second elastic member (52) is connected to the upper end of the fixing member (51). The lower end face of the other end of the floating plate (53) can abut against the wafer (6).

9. The wafer clamping device according to claim 8, characterized in that, Multiple floating clamping components (5) may be provided, and multiple floating clamping components (5) may be arranged at circumferential intervals along the storage slot (11).

10. The wafer clamping device according to claim 1, characterized in that, The substrate (1) is also provided with a retrieval slot (12), which is connected to the storage slot (11).

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