Chip suction head module

Abstract

The utility model relates to chip transfer technology field, and disclose a kind of chip's suction head module, including multiple negative pressure components, with the number of negative pressure components corresponding elastic component and suction head component;The negative pressure component includes negative pressure pipe, and one end of negative pressure pipe is connected with negative pressure source;The elastic component includes the elastic ring of setting in the other end of negative pressure pipe, and the elastic ring is used to carry out axial compensation and inclination compensation to suction head component;Suction head component is detachably connected with elastic ring, and is communicated with negative pressure pipe, for driven to get negative pressure and carry out adsorption after chip abutment. The suction head module of this chip can make chip batch transfer, and multiple suction heads can realize high-precision lamination and stable adsorption simultaneously, to further improve the efficiency of transfer.

Description

Technical Field

[0001] This utility model relates to the field of chip transfer technology, specifically to a chip pick-up module. Background Technology

[0002] In the chip manufacturing process, the chip is usually fixed on a carrier, and a robotic arm picks up the carrier carrying the chip and moves it. Existing picking methods are usually vacuum pick-up or magnetic pick-up. Vacuum pick-up requires a flat and regular contact surface to prevent air leakage.

[0003] In the field of semiconductor packaging and advanced packaging, chip mounting accuracy and reliability directly determine the performance and lifespan of the final device. During the batch transfer process of chip mounting, multiple pick-up heads simultaneously pick up the corresponding chips and then transfer them. If any pick-up head assembly fails to make complete contact due to uneven substrate or chip height tolerance, it will affect the adsorption effect and transfer efficiency. Currently, multi-pickup head modules generally use rigid connections with springs for height compensation for adsorption. The pick-up head assembly is fixed by a rigid bracket and relies on the linear deformation of the spring to compensate for height differences. However, if the pick-up head assembly is subjected to mechanical vibration or substrate tilt, resulting in an angle, that is, the end face of the pick-up head assembly cannot be attached to the chip, and the spring will cause the pick-up head to wobble, resulting in adsorption loss and affecting the stability of adsorption. This makes it difficult for multiple pick-up heads to achieve high-precision bonding and stable adsorption simultaneously, thus affecting the transfer efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a chip suction head module that enables multiple suction heads to simultaneously achieve high-precision bonding and stable adsorption during batch chip transfer, thereby improving transfer efficiency.

[0005] To achieve the above objectives, this utility model provides the following technical solution: Design a chip suction head module, including multiple negative pressure components, elastic components corresponding to the number of negative pressure components, and suction head components; The negative pressure assembly includes a negative pressure pipe, one end of which is connected to a negative pressure gas source; The elastic component includes an elastic ring disposed at the other end of the negative pressure tube, the elastic ring being used for axial and tilt compensation of the suction head assembly; The suction head assembly is detachably connected to the elastic ring and communicates with the negative pressure tube, and is used to contact the chip and adsorb the chip.

[0006] Optionally, the elastic component further includes a heat-insulating ceramic sheet, which is disposed at the end of the elastic ring away from the negative pressure tube, and the other end of the heat-insulating ceramic sheet is threadedly connected to the suction head assembly. The diameter of the heat-insulating ceramic sheet is smaller than the diameter of the elastic ring.

[0007] Optionally, the suction head assembly includes a suction head block threaded onto the heat-insulating ceramic sheet, the suction head block having the same diameter as the heat-insulating ceramic sheet.

[0008] Optionally, a negative pressure chamber is provided inside the negative pressure tube, with one end of the negative pressure chamber connected to a negative pressure air source and the other end connected to the suction head assembly.

[0009] Optionally, a baffle is provided inside the negative pressure chamber, and the baffle is spirally arranged along the extension direction of the negative pressure chamber, forming a spiral air passage with the negative pressure chamber.

[0010] Optionally, it also includes a support assembly, which includes a support plate and an installation tube. The installation tube passes through the support plate and corresponds to the number of negative pressure components. Multiple installation tubes are arranged sequentially along the extension direction of the support plate. One end of the installation tube is connected to a negative pressure air source through a hose, and the other end of the installation tube is threadedly connected to a negative pressure pipe.

[0011] This utility model provides a chip pick-up module, which has the following advantages: The chip's suction head module uses a negative pressure tube to connect to a negative pressure air source and introduce negative pressure into the tube. The negative pressure tube is connected to the suction head assembly via an elastic ring. The negative pressure passes through the tube and then through the elastic ring into the suction head assembly, where it comes into contact with the chip surface to be adsorbed. The negative pressure within the suction head assembly adsorbs the chip. When multiple negative pressure tubes descend synchronously through a connecting component, multiple suction head assemblies need to simultaneously contact multiple corresponding chips for adsorption. The elastic ring provides axial compensation in the lifting direction, preventing some suction head assemblies from failing to adsorb chips due to uneven heights, or preventing damage to the chip surface caused by rigid connections. At the same time, the non-linear stiffness of the elastic ring dynamically compensates for changes in contact area caused by deformation of the suction head assembly, preventing unstable adsorption caused by the suction head assembly being tilted and unable to adhere to the chip surface. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the installation structure of the chip suction head module in this utility model; Figure 2 This is a three-dimensional structural diagram of the chip suction head module in this utility model; Figure 3 This is a cross-sectional structural diagram of the negative pressure component in this utility model; Figure 4 This is a cross-sectional structural diagram of the suction head assembly in this utility model.

[0013] In the diagram: 10, negative pressure assembly; 11, negative pressure pipe; 12, negative pressure chamber; 13, baffle; 20, elastic assembly; 21, heat insulation ceramic sheet; 22, elastic ring; 30, suction head assembly; 31, suction head block; 40, support assembly; 41, support plate; 42, mounting pipe; 43, flexible hose. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0015] This utility model provides a suction head module, specifically applied to the application scenario of batch adsorption and transfer of chips. Taking the batch transfer of chips as an example, it is therefore a preferred solution in this embodiment.

[0016] Please see Figures 1 to 4 The present invention provides a technical solution: a chip suction head module, comprising multiple negative pressure components 10, elastic components 20 corresponding to the number of negative pressure components 10, and suction head components 30; The negative pressure assembly 10 includes a negative pressure pipe 11, one end of which is connected to a negative pressure gas source; The elastic component 20 includes an elastic ring 22 disposed at the other end of the negative pressure tube 11. The elastic ring 22 is used to provide axial and tilt compensation for the suction head assembly 30. The suction head assembly 30 is detachably connected to the elastic ring 22 and communicates with the negative pressure tube 11 for contacting and adsorbing the chip. Multiple negative pressure tubes 11 are driven to descend synchronously by an external drive mechanism, which drives each suction head assembly 30 to approach the target chip array. When the suction head assembly 30 contacts the chip surface, the axial compensation mechanism of the elastic ring 22 responds immediately. If one suction head assembly 30 does not make complete contact due to uneven substrate or chip height tolerance, the other elastic rings 22 are compressed and contracted to ensure that all suction head end faces are tightly attached to the chip surface. If the suction head assembly 30 is subjected to mechanical vibration or substrate tilt and deflection occurs, that is, the end face of the suction head assembly 30 cannot be attached to the chip, the radial elastic deformation of the elastic ring 22 can absorb the lateral force, so that the suction head end face self-adaptively levels and maintains vacuum sealing. After the negative pressure air source is started, the airflow enters the suction head assembly 30 through the negative pressure tube 11 and the internal flow channel of the elastic ring 22 in sequence, forming a negative pressure on the suction head end face. After adsorption is completed, the drive mechanism lifts the array of negative pressure tubes 11. During the reset process, the elastic ring 22 releases the stored deformation energy to help the suction head assembly 30 smoothly detach from the chip surface. The drive mechanism is existing known technology and is only referenced here without further details. Specifically, it can be a lift or lifting arm used to raise and lower the negative pressure tube 11. The negative pressure tube 11 is designed to be connected to a negative pressure air source to introduce negative pressure into the tube. The negative pressure tube 11 is connected to the suction head assembly 30 through an elastic ring 22. The negative pressure passes through the negative pressure tube 11 and then transitions into the suction head assembly 30 through the elastic ring 22. The suction head assembly 30 then comes into contact with the surface of the chip to be adsorbed, and the negative pressure within the suction head assembly 30 adsorbs the chip. When multiple negative pressure tubes 11 are connected through a single component... When the drive mechanism descends synchronously, multiple suction head assemblies 30 need to contact multiple corresponding chips simultaneously for adsorption. The elastic ring 22 can provide axial compensation in the lifting direction, preventing some suction head assemblies 30 from failing to adsorb chips due to uneven heights, or from damaging the chip surface due to hard connections. At the same time, the nonlinear stiffness characteristics of the elastic ring 22 can dynamically compensate for changes in contact area caused by deformation of the suction head assembly 30, preventing unstable adsorption caused by the suction head assembly 30 not being able to adhere to the chip surface after tilting.

[0017] The elastic component 20 also includes a heat-insulating ceramic sheet 21, which is disposed at the end of the elastic ring 22 away from the negative pressure tube 11. The other end of the heat-insulating ceramic sheet 21 is threadedly connected to the suction head assembly 30. The diameter of the heat-insulating ceramic sheet 21 is smaller than the diameter of the elastic ring 22. When the suction head assembly 30 contacts a high-temperature substrate (such as in an environment where it is transferred after reflow soldering), heat is transferred through the suction head assembly 30 to the heat-insulating ceramic sheet 21, blocking heat conduction to the elastic ring 22 and preventing the elastic ring 22 from deforming due to heat and affecting its performance. The suction head assembly 30 and the heat-insulating ceramic sheet... The threaded connection 21 facilitates quick replacement of the suction head assembly 30. The thermal expansion coefficient of the heat-insulating ceramic sheet 21 forms a gradient transition with that of the suction head assembly 30, preventing the elastic ring 22 from being heated. When disassembling the suction head assembly 30, the heat-insulating ceramic sheet 21 remains on the elastic ring 22 as a thermal barrier, preventing high temperature from being directly conducted to the negative pressure tube 11 and extending the sealing life between the elastic ring 22 and the negative pressure tube 11. At the same time, both the installation of the elastic ring 22 on the negative pressure tube 11 and the installation of the heat-insulating ceramic sheet 21 on the elastic ring 22 are sealed connections, ensuring the negative pressure effect and negative pressure stability. By using a ceramic insulating sheet 21 with a diameter smaller than that of the elastic ring 22, when the ceramic insulating sheet 21 compresses the elastic ring 22, causing the elastic ring 22 to deform, an annular gap is formed between the outer edge of the ceramic insulating sheet 21 and the end face of the elastic ring 22. This allows the elastic ring 22 to expand freely radially during axial compression (Poisson effect), avoiding stiffness hardening caused by the constraint of the ceramic sheet sidewall. Without lateral constraint, the elastic ring 22 exhibits progressive hardening characteristics; that is, when compressed, the compressed portion of the elastic ring 22 gradually increases in density and hardness, making it less prone to tilting or wobbling. The initial stiffness is low to absorb contact impact, and the later stiffness is high to maintain adsorption stability, adapting to chips of different thicknesses. After the diameter of the ceramic insulating sheet 21 is reduced, the area of ​​the elastic ring 22 not covered by the ceramic insulating sheet 21 forms a flexible hinge area. (See reference for details.) Figure 4 In this flexible hinge area, initially, the surfaces of the elastic ring 22 and the heat-insulating ceramic sheet 21 in contact with the elastic ring 22 are relatively parallel. The portion of the elastic ring 22 outside the heat-insulating ceramic sheet 21 is compressed and wrapped around the outside of the heat-insulating ceramic sheet 21. The heat-insulating ceramic sheet 21 has a first recess 211 and a second recess 212 formed inside the elastic ring 22. Due to the compression of the elastic ring 22, the first recess 211 compresses the elastic ring 22, forming a first recess 221. The second recess 212 compresses the elastic ring 22, forming a second recess 222. The second recess 222 and the first recess... 221 is relatively inclined, that is, the first recess 221 is relatively higher than the second recess 222, in order to match the inclination of the suction head assembly 30. Similarly, when the inclination direction of the suction head assembly 30 is opposite, the first recess 221 is relatively lower than the second recess 222. At this time, the first recess 211 is lower than the second recess 212, thereby allowing the suction head assembly 30 to swing slightly with the heat insulation ceramic sheet 21 when tilted. That is, the first recess 211 and the second recess 212 squeeze the elastic ring 22, so that the end of the suction head assembly 30 that contacts the chip is horizontal or nearly horizontal, thereby causing the end of the suction head assembly 30 to adhere to the surface of the chip.

[0018] The suction head assembly 30 includes a suction head block 31 threaded onto the heat-insulating ceramic sheet 21. The suction head block 31 has the same diameter as the heat-insulating ceramic sheet 21. After the suction head block 31 is manually unscrewed, the heat-insulating ceramic sheet 21 remains fixed to the elastic ring 22, avoiding wear on the ceramic interface caused by frequent disassembly and assembly. At the same time, the threaded connection facilitates quick installation or disassembly and easy replacement.

[0019] The negative pressure tube 11 has a negative pressure chamber 12 inside. One end of the negative pressure chamber 12 is connected to the negative pressure gas source, and the other end is connected to the suction head assembly 30. After the negative pressure gas source is started, the airflow flows into the negative pressure chamber 12 at high speed from the inlet end of the negative pressure tube 11, thereby generating negative pressure. The inlet end of the negative pressure chamber 12 is connected to the suction head assembly 30. The suction head assembly 30 can adopt a conical flow channel design to increase the gas flow rate, increase the intensity of the negative pressure, and thus improve the stability of adsorption.

[0020] A baffle 13 is provided inside the negative pressure chamber 12. The baffle 13 is spirally arranged along the extension direction of the negative pressure chamber 12. The baffle 13 and the negative pressure chamber 12 form a spiral air passage. Through the spiral air passage, specifically, the baffle 13 extends around the axis of the negative pressure chamber 12 at a spiral angle of 60°, forming a continuous spiral flow channel. This can reduce the flow channel area and increase the gas flow velocity. The increased flow velocity enhances the negative pressure efficiency. When the negative pressure is activated, the airflow rotates and moves forward along the spiral flow channel. Centrifugal force causes the airflow to adhere to the chamber wall, forming a laminar core-turbulent boundary layer structure. The flow velocity is increased compared to a straight passage, and the edge negative pressure adsorption force is enhanced. When the airflow reverses, that is, when the gas is blown out from the suction head assembly 30, positive pressure cleaning can be achieved. The airflow rotates in the opposite direction along the spiral channel, generating Coriolis vortices and shear boundary layers, forming vortex shear force. Due to the reduction of the boundary layer and the increase in flow velocity, the cleaning rate of dust in the channel can be improved. The spiral airflow forms annular convection on the inner wall of the cavity, which quickly dissipates the heat conducted from the suction head to the negative pressure cavity 12. At the same time, it can also blow on the elastic ring 22 to help cool down the elastic ring 22 and prevent the elastic ring 22 from overheating and affecting its elasticity. It can also dissipate heat from the heat insulation ceramic sheet 21, making it convenient for reuse and improving its service life.

[0021] It also includes a support assembly 40, which includes a support plate 41 and an installation pipe 42. The installation pipe 42 passes through the support plate 41 and corresponds to the number of negative pressure components 10. Multiple installation pipes 42 are arranged sequentially along the extension direction of the support plate 41. One end of the installation pipe 42 is connected to the negative pressure air source through a hose 43, and the other end of the installation pipe 42 is threaded to the negative pressure pipe 11. The negative pressure air source is connected to the installation pipe 42 through the hose 43. The hose 43 and the installation pipe 42 are connected by a quick-connect sealing joint. The quick-connect sealing joint is a known technology and is only cited here. It can ensure airtightness. The installation pipe 42 is connected to the negative pressure pipe 11, so that the negative pressure air source is connected to the negative pressure pipe 11. The support plate 41 is used to connect to the elevator or lifting arm (i.e., the drive mechanism). The elevator or lifting arm drives the support plate 41 to rise and fall, which drives the installation pipes 42 set on the support plate 41 to rise and fall synchronously. Through the connection between the installation pipe 42 and the negative pressure pipe 11, the negative pressure pipe 11 rises and falls synchronously.

[0022] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip pick-up module, characterized in that: It includes multiple negative pressure components (10), elastic components (20) corresponding to the number of negative pressure components (10), and suction head components (30). The negative pressure assembly (10) includes a negative pressure pipe (11), one end of which is connected to a negative pressure gas source; The elastic component (20) includes an elastic ring (22) disposed at the other end of the negative pressure tube (11), the elastic ring (22) being used to provide axial and tilt compensation for the suction head assembly (30); The suction head assembly (30) is detachably connected to the elastic ring (22) and communicates with the negative pressure tube (11) for contacting the chip and adsorbing the chip.

2. The chip pick-up module according to claim 1, characterized in that: The elastic component (20) also includes a heat-insulating ceramic sheet (21), which is disposed at one end of the elastic ring (22) away from the negative pressure tube (11). The other end of the heat-insulating ceramic sheet (21) is threadedly connected to the suction head assembly (30). The diameter of the heat-insulating ceramic sheet (21) is smaller than the diameter of the elastic ring (22).

3. The chip pick-up module according to claim 1, characterized in that: The suction head assembly (30) includes a suction head block (31) threaded onto a heat-insulating ceramic sheet (21), the suction head block (31) having the same diameter as the heat-insulating ceramic sheet (21).

4. The chip pick-up module according to claim 1, characterized in that: The negative pressure tube (11) has a negative pressure chamber (12) inside. One end of the negative pressure chamber (12) is connected to the negative pressure air source, and the other end is connected to the suction head assembly (30).

5. The chip pick-up module according to claim 4, characterized in that: A baffle (13) is provided inside the negative pressure chamber (12). The baffle (13) is spirally arranged along the extension direction of the negative pressure chamber (12), and the baffle (13) and the negative pressure chamber (12) form a spiral airway.

6. The chip pick-up module according to claim 1, characterized in that: It also includes a support assembly (40), which includes a support plate (41) and an installation tube (42). The installation tube (42) passes through the support plate (41) and corresponds to the number of negative pressure components (10). Multiple installation tubes (42) are arranged sequentially along the extension direction of the support plate (41). One end of the installation tube (42) is connected to the negative pressure air source through a hose (43), and the other end of the installation tube (42) is threadedly connected to the negative pressure pipe (11).

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