A ring-shaped heat sink structure for a semiconductor device

Abstract

The utility model relates to the field of semiconductor, especially relates to a ring heat sink structure for semiconductor device, including semiconductor, the top outer wall of semiconductor is bonded with fixed box, and the centre place of fixed box is equipped with contact mouth, the heat conduction sheet is placed to the contact mouth department of semiconductor outer wall, and the both ends outer wall of fixed box is equipped with circulation structure, circulation structure includes the circulation pipe connected in the centre place of fixed box both sides outer wall, the heat dissipation pipe connected in the other end outer wall of circulation pipe, the micro pump of installation in circulation pipe one end and the communication port of opening in fixed box located circulation pipe department, the utility model discloses oil liquid is driven along circulation pipe and heat dissipation pipe and carries out one -way movement under the micro pump, and oil liquid circulates in heat dissipation pipe and circulation pipe cooperation fan and scatters the heat in oil liquid, and the heat dissipation efficiency is improved to facilitate circulation cooling.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a ring-shaped heat sink structure for semiconductor devices. Background Technology

[0002] Semiconductor devices are electronic devices with conductivity between that of good conductors and insulators, utilizing the special electrical properties of semiconductor materials to perform specific functions. Semiconductor integrated circuit devices are devices that integrate multiple semiconductor devices onto a single semiconductor chip according to a certain pattern, forming a device with a specific circuit function. Discrete semiconductor devices include crystal diodes, bipolar transistors, and field-effect transistors. Crystal diodes utilize the unidirectional conductivity of the PN junction and can be used for rectification, detection, etc., such as rectifier diodes and Zener diodes.

[0003] The operating frequency and power density of modern power devices have increased significantly, leading to a surge in heat flux density per unit area, which traditional planar heat dissipation structures can hardly meet. Utility Model Content

[0004] The purpose of this invention is to address the aforementioned problems and shortcomings by proposing a ring-shaped heat sink structure for semiconductor devices.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A ring-shaped heat sink structure for a semiconductor device includes a semiconductor. A fixing box is adhered to the top outer wall of the semiconductor, and a contact port is provided at the center of the fixing box. A heat-conducting sheet is placed on the outer wall of the semiconductor at the contact port, and a circulation structure is provided on the outer walls at both ends of the fixing box. The circulation structure includes a circulation pipe connected to the center of the outer walls on both sides of the fixing box, a heat dissipation pipe connected to the outer wall of the other end of the circulation pipe, a micro pump installed at one end of the circulation pipe, and a communication port opened in the fixing box at the circulation pipe.

[0006] Preferably, the outer wall between the heat-conducting sheet and the semiconductor is coated with silicone grease, and a fixing frame is installed on the bottom inner wall of the fixing box, with the bottom outer wall of the fixing frame in contact with the outer wall of the heat-conducting sheet.

[0007] Preferably, the semiconductor has snap-fit ​​grooves at both ends of its outer walls, and an elastic rod is provided on the outer wall of the semiconductor within the snap-fit ​​groove, with the other end of the elastic rod located on the top outer wall of the fixing box.

[0008] Preferably, a sealing plate is installed on the top outer wall of the fixing box, and the sealing plate has a matching protrusion hole at the heat-conducting plate, and a sealing ring is provided on the inner wall of the protrusion hole of the sealing plate.

[0009] Preferably, both ends of the heat dissipation pipe are connected to one end of the circulation pipe, and a support rod is snapped onto the outer wall of the circulation pipe.

[0010] Preferably, a fan is provided on the top outer wall of the semiconductor and the heat pipe.

[0011] Preferably, the fan and the micro pump are connected to the controller via wires, and the controller is connected to a power source via wires.

[0012] The beneficial effects of this utility model are as follows: Driven by a micro pump, the oil moves unidirectionally along the circulation pipe and the heat dissipation pipe. The oil circulates in the heat dissipation pipe and the circulation pipe, and the fan helps to dissipate the heat in the oil, which facilitates circulation and cooling and improves heat dissipation efficiency. One end of the elastic rod is inserted into the snap-fit ​​slot, and the other end is located at the top of the fixing box, further improving the tightness between the fixing box and the semiconductor. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of a ring-shaped heat sink for a semiconductor device proposed in this utility model. Figure 2 This is a schematic diagram of the unfolded structure of a ring-shaped heat sink structure for a semiconductor device proposed in this utility model. Figure 3 This is a schematic diagram of the fixing box structure of a ring heat sink structure for semiconductor devices proposed in this utility model; Figure 4 This is a schematic diagram of the circulation tube structure of a ring-shaped heat sink structure for semiconductor devices proposed in this utility model.

[0014] In the diagram: 1 Semiconductor, 2 Fixing box, 3 Contact port, 4 Heat-conducting plate, 5 Fixing frame, 6 Sealing plate, 7 Extrusion hole, 8 Circulation structure, 9 Card slot, 10 Elastic rod, 11 Circulation tube, 12 Connecting port, 13 Micro pump, 14 Heat sink, 15 Support rod, 16 Fan. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Example

[0016] Reference Figure 1-4 As shown, a ring-shaped heat sink structure for a semiconductor device includes a semiconductor 1. A fixing box 2 is bonded to the top outer wall of the semiconductor 1, and a contact port 3 is provided at the center of the fixing box 2. A heat-conducting sheet 4 is placed on the outer wall of the semiconductor 1 at the contact port 3, and a circulation structure 8 is provided on the outer walls of both ends of the fixing box 2. Silicon grease is applied to the outer wall between the heat-conducting sheet 4 and the semiconductor 1, and a fixing frame 5 is installed on the bottom inner wall of the fixing box 2, and the bottom outer wall of the fixing frame 5 is in contact with the outer wall of the heat-conducting sheet 4. Both ends of the outer walls of the semiconductor 1 are provided with snap-fit ​​grooves 9, and the outer wall of the semiconductor 1 is provided with an elastic rod 10 in the snap-fit ​​grooves 9. The other end of the outer wall of the elastic rod 10 is located on the top outer wall of the fixing box 2. The top outer wall of the fixed box 2 is equipped with a sealing plate 6, and the sealing plate 6 has a matching protrusion hole 7 at the heat conduction plate 4. The sealing plate 6 is provided with a sealing ring at the inner wall of the protrusion hole 7. The fixing box 2 wraps the heat-conducting plate 4 that guides the heat of the semiconductor 1, and uses oil to absorb the heat of the heat-conducting plate 4 and the semiconductor 1. Compared with planar heat dissipation, it increases the heat conduction area and improves the heat dissipation efficiency. One end of the elastic rod 10 is inserted into the snap-fit ​​groove and the other end is located on the top of the fixing box 2, which further improves the tightness between the fixing box 2 and the semiconductor 1; The fixing frame 5 is installed on the inner wall of the fixing box 2, which firmly fixes the heat-conducting sheet 4 in the fixing box 2 and the heat-conducting sheet 4 is attached to the semiconductor 1 by silicone grease. Example

[0017] Reference Figure 1-4 As shown, the circulation structure 8 includes a circulation pipe 11 connected to the center of the outer walls on both sides of the fixed box 2, a heat dissipation pipe 14 connected to the outer wall of the other end of the circulation pipe 11, a micro pump 13 installed at one end of the circulation pipe 11, and a communication port 12 opened in the fixed box 2 at the circulation pipe 11. The two ends of the heat dissipation pipe 14 are respectively connected to one end of the circulation pipe 11, and a support rod 15 is snapped onto the outer wall of the circulation pipe 11. A fan 16 is provided on the top outer wall of the semiconductor 1 and the heat sink 14; The fan 16 and the micro pump 13 are connected to the controller via wires, and the controller is connected to the power supply via wires. When the fan 16 starts, it drives the airflow to move along one end of the circulation pipe 11, the heat pipe 14 and the heat conduction plate 4, further assisting the oil and the heat conduction plate 4 in dissipating heat and improving the heat dissipation efficiency. Driven by the micro pump 13, the oil moves unidirectionally along the circulation pipe 11 and the heat dissipation pipe 14. The oil circulates in the heat dissipation pipe 14 and the circulation pipe 11, and the fan 16 dissipates the heat in the oil, which facilitates circulation and cooling and improves heat dissipation efficiency.

[0018] Working principle: During use, the fixing box 2 is glued to the outer wall of the semiconductor 1 with sealant, which improves the sealing between the fixing box 2 and the semiconductor 1 while fixing the installation. Silicon grease is applied to the outer wall of the semiconductor 1 through the contact port 3. The heat-conducting plate 4 is pressed at the contact port 3 to spread the silicone grease. The fixing frame 5 is installed on the inner wall of the fixing box 2 to firmly fix the heat-conducting plate 4 in the fixing box 2, and the heat-conducting plate 4 is attached to the semiconductor 1 through the silicone grease. The sealing plate 6 is installed in the fixing box 2 after being aligned with the heat-conducting plate 4 through the protrusion hole 7. One end of the elastic rod 10 is inserted into the snap-fit ​​groove 9 and the other end is located at the top of the fixing box 2 to further improve the tightness between the fixing box 2 and the semiconductor 1. Cooling oil is added to the inside of the fixing box 2. The oil moves unidirectionally along the circulation pipe 11 and the heat dissipation pipe 14 under the drive of the micro pump 13. The heat generated by the semiconductor 1 during operation is transferred to the oil through the heat-conducting plate 4. The oil circulates in the heat dissipation pipe 14 and the circulation pipe 11, and the fan 16 dissipates the heat in the oil, which facilitates circulation and cooling and improves the heat dissipation efficiency.

[0019] The exemplary embodiments of the present invention have been described in detail herein with reference to examples. However, those skilled in the art will understand that various modifications and alterations can be made to the specific embodiments described above without departing from the spirit of the present invention, and various combinations can be made to the various technical features and structures proposed in the present invention without exceeding the protection scope of the present invention, which is determined by the appended claims. The foregoing description of specific exemplary embodiments of the present invention is not intended to limit the present invention to the precise forms disclosed, and it is obvious that many changes and variations can be made based on the above teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the present invention and its practical applications, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the present invention, as well as various different choices and variations. The scope of the present invention is intended to be defined by the claims and their equivalents.

Claims

1. A ring-shaped heat sink structure for a semiconductor device, comprising a semiconductor (1), characterized in that, The top outer wall of the semiconductor (1) is attached to a fixing box (2), and a contact port (3) is provided at the center of the fixing box (2). A heat-conducting sheet (4) is placed on the outer wall of the semiconductor (1) at the contact port (3), and a circulation structure (8) is provided on the outer walls of both ends of the fixing box (2). The circulation structure (8) includes a circulation pipe (11) connected to the center of the outer walls on both sides of the fixed box (2), a heat dissipation pipe (14) connected to the outer wall of the other end of the circulation pipe (11), a micro pump (13) installed at one end of the circulation pipe (11), and a connecting port (12) opened in the fixed box (2) at the circulation pipe (11).

2. The annular heat sink structure for a semiconductor device according to claim 1, characterized in that, Silicon grease is applied to the outer wall between the heat-conducting sheet (4) and the semiconductor (1), and a fixing frame (5) is installed on the bottom inner wall of the fixing box (2), and the bottom outer wall of the fixing frame (5) is in contact with the outer wall of the heat-conducting sheet (4).

3. The annular heat sink structure for a semiconductor device according to claim 1, characterized in that, Both ends of the outer wall of the semiconductor (1) are provided with snap-fit ​​grooves (9), and the outer wall of the semiconductor (1) is provided with an elastic rod (10) in the snap-fit ​​groove (9), and the other end of the elastic rod (10) is located on the top outer wall of the fixing box (2).

4. The annular heat sink structure for a semiconductor device according to claim 1, characterized in that, The top outer wall of the fixed box (2) is equipped with a sealing plate (6), and the sealing plate (6) has a matching protrusion hole (7) at the heat-conducting plate (4), and the sealing plate (6) is provided with a sealing ring at the inner wall of the protrusion hole (7).

5. The annular heat sink structure for a semiconductor device according to claim 1, characterized in that, The two ends of the heat dissipation pipe (14) are respectively connected to one end of the circulation pipe (11), and the outer wall of the circulation pipe (11) is clamped with a support rod (15).

6. The annular heat sink structure for a semiconductor device according to claim 1, characterized in that, A fan (16) is provided on the top outer wall of the semiconductor (1) and the heat pipe (14).

7. The annular heat sink structure for a semiconductor device according to claim 6, characterized in that, The fan (16) and the micro pump (13) are connected to the controller via wires, and the controller is connected to the power supply via wires.

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