A compression fastener

Abstract

The utility model discloses a kind of compression fixing parts, the compression fixing part includes: stepped jack plate, compression spring piece and bottom plate, stepped jack plate two ends are respectively provided with at least three pin holes, and be configured as according to power semiconductor device pin interval setting is configured with fixed interval concave-convex shape;Wherein, the position and size of pin hole are simulated by the pin position and size of power semiconductor device;Bottom plate is strip sheet, bottom plate four corners are equipped with multiple through holes, and the projection of the stepped jack plate is matched to be used to form the recess of containing compression spring piece;Compression spring piece is strip-shaped;The technical scheme can reduce the process cost, ensure the heat dissipation effect of equipment and improve the power density of equipment.

Description

Technical Field

[0001] The embodiments disclosed in this utility model generally relate to the field of power semiconductor device mounting, and more specifically, to a clamping fastener. Background Technology

[0002] IGBT modules are panels composed of insulated-gate bipolar transistors. They are composite, fully controllable, voltage-driven power semiconductor devices composed of BJTs (bipolar junction transistors) and MOSFETs (magnifying glass transition transistors), combining the advantages of high input impedance of MOSFETs and low on-state voltage drop of GTRs. SiC MOSFETs are also a type of power semiconductor device. Both IGBTs and SiC MOSFETs can be used in the transmission and distribution fields of smart grids. Traditionally, IGBT modules and SiC MOSFET transistors are mounted between heat sinks and circuit boards by drilling holes in the circuit board that mate with the vias in the IGBT module (or SiC MOSFET transistor) package. However, this mounting method results in large circuit boards and correspondingly large heat sinks. This combination of multiple circuit boards leads to a large footprint for the entire device, hindering miniaturization and reducing power density and internal insulation distance. Summary of the Invention

[0003] The embodiments disclosed in this utility model provide a clamping and fixing member. The clamping and fixing member includes: Stepped socket plate 10, pressing spring 20 and base plate 30.

[0004] The stepped socket plate 10 has two pin groups 106 on one side; each pin group has at least three pin holes 105; the pin holes 105 correspond one-to-one with the pins of the semiconductor device; the pins of the semiconductor device are connected to the circuit board through the pin holes; the stepped socket plate 10 also has a first through hole 101; the stepped socket plate 10 also has a plurality of protrusions 102. The base plate 30 is a long strip of thin sheet. The edge of the base plate is provided with a plurality of second through holes 302. The plurality of second through holes 302 correspond one-to-one with the plurality of protrusions 102 of the stepped insertion plate. Each second through hole 302 engages with the corresponding protrusion 102 to fix the base plate 30 to the stepped insertion plate 10. The pressing spring 20 is strip-shaped and is placed between the stepped insertion plate 10 and the base plate 30. A third through hole 201 is provided in the middle of the pressing spring 20. The position of the third through hole 201 corresponds to the position of the first through hole 101 of the stepped insertion plate. Screws pass through the third through hole 201 and the first through hole 101 and are fixedly connected to the heat sink.

[0005] Specifically, it also includes: The elongated protrusion 103 is located on the first plane of the stepped socket plate 10; the elongated protrusion 103 contacts the power semiconductor and presses the semiconductor device onto the heat sink; The cavity 104 is located in the middle of the second plane of the stepped socket plate 10, and the first through hole 101 is located in the cavity 104; the pressing spring 20 is disposed in the cavity 104; the cavity 104 is used to accommodate the screw and / or the nut corresponding to the screw that passes through the third through hole 201 and the first through hole 101.

[0006] Specifically, it also includes: Any pin group 106 in the stepped socket plate 10 is composed of multiple bosses with different heights between adjacent bosses. The height difference between adjacent bosses is used to increase the creepage distance between the pins of the semiconductor device.

[0007] Specifically, the compression spring 20 is made of stainless steel.

[0008] Specifically, the compression spring 20 is provided with a built-in threaded hole.

[0009] This utility model discloses an assembly method for a clamping fastener, comprising the following steps: Step 1: The pressing spring 20 is installed in the cavity 104 of the stepped socket plate 10, the third through hole 201 of the pressing spring 20 corresponds to the first through hole 101 of the stepped socket plate 10, and the base plate 30 is installed on the stepped socket plate 10, so that the pressing spring 20 is located between the stepped socket plate 10 and the base plate 30. Step two, bending the pins of the semiconductor power device, including: the bending degree of the pins is 90±30°; Step 3: After bending the two leads, the leads of the semiconductor power device are passed through the two pin groups 106 on one side of the stepped socket plate 10, and the surface of the semiconductor device is aligned with the elongated protrusion 103 of the stepped socket plate 10. Step 4: Solder the semiconductor power devices assembled with the stepped socket board 10 onto the circuit board. Step 5: Press the circuit board 10, which has been soldered with semiconductor power devices and assembled with a stepped socket plate, onto one side of the heat sink, and align the first through hole 101 of the stepped socket plate 10 with the through hole of the heat sink. Step six: On the other side of the heat sink, screws are inserted through the through hole of the heat sink and the first through hole 101 of the stepped socket plate 10, and coupled and locked with the internal threaded hole of the pressing spring 20 between the stepped socket plate 10 and the base plate, thereby pressing the semiconductor power device mounted on the circuit board onto the heat sink.

[0010] This invention comprises three parts: a stepped socket plate 10, a pressing spring 20, and a base plate 30. The shape and other design of the stepped socket plate 10, along with the size of its pin holes 105, work together to ensure a more secure fit between the semiconductor power device and the heat sink and circuit board, while also guaranteeing overall heat dissipation and electrical safety. Applying the assembly method of the clamping fastener in this embodiment allows the fixing screws to be installed from the back of the heat sink, reducing the number of screw holes on the circuit board. This also ensures the semiconductor power device fits snugly against the heat sink, simplifies the positioning of the semiconductor power device and its pins, and streamlines the assembly process of power electronic equipment. This facilitates miniaturization, increases power density, and reduces overall cost.

[0011] It should be understood that the description in the utility model description section is not intended to limit the key or essential features of the embodiments of this disclosure, nor is it intended to restrict the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0012] The above and other features, advantages, and aspects of the various embodiments disclosed in this utility model will become more apparent from the accompanying drawings and the following detailed description. In the drawings, the same or similar reference numerals denote the same or similar elements, wherein: Figure 1 A schematic diagram of the structure of the clamping and fixing member provided in an embodiment of the present invention is shown; Figure 2 An exploded view of the structure of the clamping fastener provided in an embodiment of the present invention is shown; Figure 3 This diagram shows a side view of the structure after the IGBT module is installed using the clamping fastener. Figure 4 A partially enlarged structural schematic diagram of an embodiment of the air-cooled heat sink disclosed in this utility model is shown; Figure 5 A schematic diagram of the structure of a water-cooled radiator according to another embodiment of the present invention is shown; Figure 6 A schematic diagram of the leads of a semiconductor power device according to an embodiment of the present invention after bending is shown.

[0013] in, Figures 1 to 6 The correspondence between the reference numerals and component names in the attached drawings is as follows: 1. First assembly form; 2. Second assembly form; 10-step socket plate, 20-pressure spring sheet, 30-base plate; 101 First through hole in the stepped socket plate, 102 Protrusion in the stepped socket plate, 103 Long strip protrusion in the stepped socket plate, 104 Cavity in the stepped socket plate, 105 Pin hole in the stepped socket plate, 106 Pin assembly in the stepped socket plate. The third through hole in the 201 compression spring sheet; Multiple second through holes in the 302 base plate; 110 Pin 1, 120 Pin 2, 130 Pin 3, 140 Pin 4. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of the disclosed embodiments of this utility model clearer, the technical solutions of the disclosed embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments disclosed in this utility model, and not all of them. Based on the embodiments disclosed in this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0015] Furthermore, the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0016] The following reference Figures 1 to 6 The following describes the clamping and fixing member provided in the embodiments of this utility model.

[0017] like Figure 1-6 As shown, the clamping and fixing member provided according to the first aspect of the present invention includes: a stepped insertion plate 10, a pressing spring 20, and a base plate 30. Specifically, the stepped socket plate 10 has at least three pin holes 105 at each end, and is configured to have a concave-convex shape with a fixed interval according to the pin spacing of the power semiconductor device; wherein, the position and size of the pin holes 105 are simulated by the pin position and size of the power semiconductor device. The compression spring 20 is arc-shaped, and the arc shape is formed by the middle bend and the two end bends of the compression spring 20; The base plate 30 is strip-shaped, and the four corners of the base plate are provided with multiple tapered third through holes. The third through holes 302 cooperate with the protrusions 102 of the stepped insertion plate 10 to form a groove for accommodating the pressing spring sheet.

[0018] More specifically, according to the clamping fastener provided in the embodiments of this disclosure, the pin holes of the stepped socket plate can be simulated by the pin position and size of the power semiconductor device. This disclosure simulates the size, position and other dimensions of the stepped socket plate in this embodiment based on the pins of semiconductor power devices such as IGBTs, MOSFETs and IGCTs from mainstream component manufacturers.

[0019] Taking IGBTs as an example, IGBTs are mostly standard components, available in three-pin and four-pin versions. The distance between the center positions of the pins (i.e., pin spacing) is a standard value determined by national or industry standards. For further details, please refer to... Figure 6 The distance between the center lines of pin 110 and pin 120 is a fixed value, which is further defined as a standard value determined by functional requirements, application scenarios, and physical characteristics. Pin lengths and shapes vary depending on the manufacturer's design approach, and pin widths are designed according to different manufacturer requirements. Therefore, adapting to different pin widths requires designing different holes in the stepped insert plate 10.

[0020] Table 1 below shows the pin width of a certain manufacturer. The pin width is mostly 1.2mm. The maximum pin width of each manufacturer is selected, and the hole spacing of the stepped socket board 10 is designed to be 1.55~2mm, which is compatible with various types of power semiconductor devices. Table 1. Examples of pin widths from various manufacturers The pin holes 105 are at least three or four; since semiconductor power devices such as IGBTs and MOSFETs mostly have three to four pins, the two ends of the stepped socket plate 10 are set to have at least three pin holes 105; the pin holes 105 are elongated holes, which makes the processing technology simpler and the pins more secure.

[0021] The stepped socket plate 10 has pin holes 105 positioned in a series of interlocking protrusions 106 with fixed intervals. This stepped shape increases the creepage distance of each pin, ensuring the safety and normal operation of the device under various working conditions. The four corners of the base plate 30 of the clamping fastener mate with the head of the stepped socket plate 10 are fitted with tapered protrusions and through holes, making the base plate 30, stepped socket plate 10, and pressing spring 20 easier to install and ensuring a tight fit of the base plate, thus preventing the clamping fastener from easily falling off when installing power semiconductor devices. The pressing spring 20 is arc-shaped, formed by bending in the middle and at both ends. The base plate 30 mates with the grooves in the stepped socket plate 10, housing and fixing the pressing spring 20 in the middle of the stepped socket plate 10.

[0022] In some embodiments, see Figures 1-2 , Figure 1 This is a structural diagram of the clamping fastener; Figure 2 This is an exploded view of the clamping fastener. The stepped socket plate 10 includes a support portion, a clamping portion, and a socket portion. The support portion includes a central boss cavity 104 located in the middle of the stepped socket plate and a first pupil hole 101 for fixing the central boss. The clamping portion includes elongated protrusions 103 on both sides of the central boss cavity 104. After the power semiconductor device is bent, the clamping portion cooperates with the elongated protrusions 103 to clamp the power semiconductor device onto the heat sink. The socket portion includes at least two receiving area socket groups 106, and the receiving area socket group 106 includes at least three pin holes 105.

[0023] The central boss cavity 104 is rectangular, with rounded corners on all its edges. This design facilitates demolding and processing. The first through hole 101 of the fixing hole in the central boss cavity 104 is matched with the threaded hole of the second through hole 201 on the pressing spring 20, so that the semiconductor power device is pressed onto the circuit board under the action of the clamping fixing component. The elongated protrusions 103 on both sides of the central boss cavity 104, in conjunction with the package thickness of the semiconductor power device, press the pins of the semiconductor power device between the circuit board and the heat sink, ensuring the stability and safety of the overall structure. The receiving area socket group 106 is located at the tail end of the stepped socket plate 10. Taking two receiving area socket groups 106 as an example, the receiving area socket group 106 includes at least three pin holes 105. Preferably, it can be designed with four pin holes 105 to accommodate semiconductor power devices with three or four pins. By placing the receiving area socket group 106 at the tail end of the stepped socket plate 10, the semiconductor power device can be clamped and securely fixed after bending. It should be noted that the number of receiving area socket groups 106 is not limited to two. When the number of receiving area socket groups 106 is increased, the length of the stepped socket plate 10 and the number of central boss cavities 104 will also increase accordingly.

[0024] In some embodiments, see continue to see Figure 1 , Figure 2 , Figure 1 This is a structural diagram of the clamping fastener. Figure 2 This is an exploded view of the clamping fastener. The insertion section is located at the bottom of the stepped insertion plate. The clamping fastener has asymmetrically positioned receiving area insertion hole groups 106 on both sides. Each receiving area insertion hole group 106 has an elliptical protrusion, and each elliptical protrusion contains a pin hole 105 for fixing the pins of a power semiconductor device. The pin hole 105 is a through hole.

[0025] The socket portion is located at the bottom end of the stepped socket plate, meaning that the socket portion and the socket assembly in the receiving area of ​​the socket portion are also located at the tail end of the stepped socket plate. The socket assembly in the receiving area is configured as an elliptical protrusion with a pin hole. The elliptical protrusion is located on one side of the central protrusion of the stepped socket plate, and the height of the protrusion on this side is set as low as possible. The elliptical protrusion on the side where the base plate 30 is mounted on the stepped socket plate 10 is higher than the other side. For reference, the height of the central boss cavity 104 should be higher than the height of the receiving area on the central protrusion side of the stepped socket plate 10, and the height of the stepped socket plate 10 after mounting the base plate 30 should be lower than the height of the receiving area on the same side. During installation, the bent semiconductor power device needs to be mounted onto the clamping fastener. The above-mentioned setting of the receiving area and the height of the receiving area makes it easier to install the clamping fastener after mounting the semiconductor power device between the heat sink and the circuit board, further reducing the cost of the processing technology.

[0026] In some embodiments, see Figure 2 , Figure 2 This is an exploded view of the clamping fastener. The clamping spring 20 is made of stainless steel. Choosing a clamping spring 20 with this arc-shaped design and stainless steel material improves the mechanical strength of the spring while providing elastic deformation, and ensures that the clamping spring 20 does not undergo plastic deformation within the stress range, thus guaranteeing the stability of its function. Furthermore, it improves the corrosion resistance of the clamping spring 20 without requiring surface treatment. Preferably, the material of the clamping spring 20 can be 06Cr19Ni10. Choosing 304 stainless steel as the material of the clamping spring 20 can reduce manufacturing costs while ensuring functional integrity.

[0027] In some embodiments, see continue to see Figure 2 , Figure 2 The diagram shows an exploded view of the clamping fastener. The clamping spring 20 has a built-in threaded hole with at least three turns of thread. Further, the threaded hole can be a flap hole with three turns of thread. This design enhances the structural strength of the clamping spring 20, facilitates disassembly and maintenance of the clamping fastener, and reduces the manufacturing cost of the clamping spring.

[0028] In some embodiments, see Figure 3 , Figure 3 A side view of the structure after the IGBT module is installed in the clamping fastener. As shown in the figure, after the base plate and the stepped socket plate mate with the protrusion, the two longer sides of the rhomboid sheet are each 2mm longer. This arrangement can make the overall assembly stability of the clamping fastener higher and the base plate (i.e., the cover plate) fit more tightly with the circuit board.

[0029] In other embodiments, the assembly method using the clamping fastener includes: At least three pins of at least one semiconductor power device are passed through the clamping fastener of the first assembly configuration; wherein, the first assembly configuration refers to engaging the clamping spring 20 in the groove accommodating the clamping spring and mounting the base plate 30 on the stepped socket plate 10. Each pin of the semiconductor power device is reverse-fixed to the circuit board by a clamping fastener in a second assembly configuration; wherein, the second assembly configuration refers to bending the pin of the semiconductor power device and clamping and fixing the semiconductor power device by a heat sink and a clamping fastener.

[0030] The first assembly form is as follows Figure 1 As shown, the second assembly configuration is as follows: Figure 3As shown. The assembly method in this embodiment can optimize the installation process and optimize the power density of the device while ensuring the tightness of the installation on the circuit board, thereby facilitating the miniaturization of the device.

[0031] In some embodiments, see Figure 6 , Figure 6 A schematic diagram of the leads of a semiconductor power device according to an embodiment of the present disclosure after bending is shown. Figure 6 Schematic diagrams of three-pin and four-pin semiconductor power devices bent at 90° are shown respectively. The bending of the semiconductor power device leads includes: the bending angle of the leads is 90±3°; the bending position of the leads is located below the lead fins of the semiconductor power device. When the clamping fastener of the second assembly form is assembled to the circuit board, the side with the pins (i.e., leads) is soldered to the corresponding solder holes on the circuit board; the back of its second assembly form (i.e., the side with the central boss cavity 104 and the threaded hole) is connected to the heat sink through the threaded hole, and after ensuring a tight connection, the heat sink's heat dissipation effect is guaranteed.

[0032] In some embodiments, see Figure 4 and Figure 5 , Figure 4 This is a partially enlarged structural diagram of the air-cooled heat sink after the clamping fastener of the second assembly configuration is installed between the circuit board and the heat sink. Figure 5 This is a structural diagram of a water-cooled radiator after the clamping fastener of the second assembly form is installed between the circuit board and the radiator.

[0033] This disclosure defines a clamping fastener as consisting of three parts: a stepped socket plate 10, a pressing spring 20, and a base plate 30. The shape and other configuration of the stepped socket plate 10, along with the size of its pin holes 105, work together to ensure a more secure mounting of the semiconductor power device between the heat sink and the circuit board, thus guaranteeing the overall electrical safety of the device. The assembly method using the clamping fastener in this embodiment reduces the number of openings on the circuit board and allows the semiconductor power device to fit snugly against the heat sink during circuit board mounting (i.e., soldering), thereby facilitating device miniaturization and increasing power density.

[0034] In the description of this specification, the terms "connection," "installation," and "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0035] In the description of this specification, the terms "one embodiment," "some embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A clamping and fixing component, characterized in that, include: Stepped socket plate (10), pressing spring (20) and base plate (30); Two pin groups (106) are provided on one side of the stepped socket plate (10); each pin group is provided with at least three pin holes (105); the pin holes (105) correspond one-to-one with the pins of the semiconductor device; the pins of the semiconductor device are connected to the circuit board through the pin holes; the stepped socket plate (10) is also provided with a first through hole (101); the stepped socket plate (10) is also provided with a plurality of protrusions (102). The base plate (30) is a long strip of thin sheet. The edge of the base plate is provided with a plurality of second through holes (302). The plurality of second through holes (302) correspond one-to-one with the plurality of protrusions (102) of the stepped insertion plate. Each second through hole (302) engages with the corresponding protrusion (102) to fix the base plate (30) and the stepped insertion plate (10). The pressing spring (20) is strip-shaped and is placed between the stepped socket plate (10) and the base plate (30). A third through hole (201) is provided in the middle of the pressing spring (20), and the position of the third through hole (201) corresponds to the position of the first through hole (101) of the stepped socket plate. Screws pass through the third through hole (201) and the first through hole (101) and are fixedly connected to the heat sink.

2. The clamping and fixing member according to claim 1, characterized in that, The stepped socket plate (10) further includes: an elongated protrusion (103) and a cavity (104). The elongated protrusion (103) is located on the first plane of the stepped socket plate (10); the elongated protrusion (103) contacts the power semiconductor and presses the semiconductor device onto the heat sink; The cavity (104) is located in the middle of the second plane of the stepped socket plate (10), and the first through hole (101) is located in the cavity (104); the pressing spring (20) is disposed in the cavity (104); the cavity (104) is used to accommodate the screw and / or the nut corresponding to the screw that passes through the third through hole (201) and the first through hole (101).

3. The clamping and fixing member according to claim 1, characterized in that, For any pin group (106), the pin group consists of multiple bosses (106), with different heights between adjacent bosses. The height difference between adjacent bosses is used to increase the creepage distance between the pins of the semiconductor device.

4. The clamping and fixing member according to claim 1, characterized in that, The material of the compression spring (20) is stainless steel.

5. The clamping and fixing member according to claim 1, characterized in that, The compression spring (20) is provided with a built-in threaded hole.

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