IPM module with heat dissipation mechanism and IPM module

Abstract

The utility model belongs to IPM module technical field especially relates to a kind of heat dissipation mechanism and IPM module for IPM module, and wherein the heat dissipation mechanism for IPM module, it is inside provided with IPM module body, the top surface of the shell is provided with heat dissipation component, the heat dissipation component is slidably provided with compression assembly, the compression assembly is configured to be connected with the shell, to compress the heat dissipation component, so that the heat dissipation component and the top surface of IPM module body are closely attached, to realize the heat dissipation component and the top surface of IPM module body closely attached facilitate heat dissipation, and by the way of convenient disassembly shell and heat dissipation component, facilitate the overhaul of IPM module body.

Description

Technical Field

[0001] This utility model belongs to the field of IPM module technology, and in particular relates to a heat dissipation mechanism for an IPM module and an IPM module. Background Technology

[0002] An IPM (Intelligent Power Module) is an advanced power switching device that combines the advantages of high current density, low saturation voltage, and high voltage withstand capability of a GTR (High Power Transistor) with the advantages of high input impedance, high switching frequency, and low drive power of a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). IPMs integrate logic, control, detection, and protection circuits, making them easy to use. They not only reduce system size and development time but also significantly enhance system reliability, aligning with the current development trend of power devices.

[0003] Existing IPM modules are usually hermetically sealed, resulting in poor internal heat dissipation. Overheating may occur during prolonged operation, leading to a decrease in response speed. Furthermore, disassembling the outer casing of the IPM module is difficult when it is damaged and requires repair, hindering heat dissipation and maintenance.

[0004] Therefore, due to the difficulty in dissipating internal heat caused by the sealed packaging of the IPM module, the temperature inside the IPM module rises, resulting in a decrease in response speed. Furthermore, the difficulty in disassembling the sealed packaging makes the IPM module difficult to repair. Therefore, it is necessary to design a heat dissipation mechanism for IPM modules and an IPM module.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content

[0006] This disclosure provides at least one heat dissipation mechanism for an IPM module and an IPM module.

[0007] In a first aspect, embodiments of this disclosure provide a heat dissipation mechanism for an IPM module, comprising: The housing contains the IPM module body. A heat dissipation component is provided on the top surface of the housing, and a pressing component is slidably disposed on the heat dissipation component. The pressing component is configured to engage with the housing to press the heat dissipation component tightly, so that the heat dissipation component is in close contact with the top surface of the IPM module body.

[0008] In one optional embodiment, the heat dissipation component includes: a heat-conducting plate; The bottom surface of the heat-conducting plate is provided with a protrusion, which is adapted to the top surface of the IPM module body. The heat-conducting plate is covered on the top surface of the housing so that the protrusion extends into the housing and contacts the top surface of the IPM module body; The top surface of the heat-conducting plate is provided with several heat exchange fins.

[0009] In one alternative embodiment, the top surface of the heat-conducting plate is provided with a receiving area; The top surface of the heat-conducting plate is also provided with a pair of guide ears, which extend from the edge of the heat-conducting plate.

[0010] In one alternative embodiment, the clamping assembly includes: a U-shaped frame; The shaped frame is fastened to the heat-conducting plate, and both ends of the shaped frame pass through corresponding guide ears, and the shaped frame and the guide ears are slidably connected. The inner top surface of the shaped frame is provided with a through groove, and a spring is provided in the through groove. Part of the spring is located in the receiving area so that the heat-conducting plate can be tightly attached to the top surface of the IPM module body by compressing the spring.

[0011] In one alternative embodiment, the end of the shaped frame is located outside the housing after passing through the guide ear and is close to the corresponding side wall of the housing.

[0012] In one optional embodiment, a limiting groove corresponding to the end of the C-shaped frame is provided on the side wall of the housing; A limiting block corresponding to and adapted to the limiting groove is provided on one side of the end of the C-shaped frame near the shell; When the limiting block extends into the corresponding limiting groove, the shaped bracket engages with the housing, causing the spring to be in a compressed state and tightly fitting the heat-conducting plate with the top surface of the IPM module body.

[0013] In one alternative embodiment, an operating part is provided on the side of the C-shaped frame away from the housing.

[0014] In one alternative embodiment, the ends of the gusseted frame are made of a resilient material.

[0015] In one optional embodiment, a sealing ring is provided between the bottom surface of the heat-conducting plate and the top surface of the housing.

[0016] Secondly, this disclosure also provides an IPM module, which is set in Within the aforementioned heat dissipation mechanism.

[0017] The beneficial effects of this utility model are that the heat dissipation mechanism for this IPM module includes: a housing, in which an IPM module body is disposed; a heat dissipation component is disposed on the top surface of the housing, and a pressing component is slidably disposed on the heat dissipation component. The pressing component is configured to engage with the housing to press the heat dissipation component tightly, so that the heat dissipation component is in close contact with the top surface of the IPM module body. This achieves a close fit between the heat dissipation component and the top surface of the IPM module body for heat dissipation, and the engaging method facilitates the disassembly of the housing and the heat dissipation component, making it convenient for the maintenance of the IPM module body.

[0018] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0019] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of a heat dissipation mechanism for an IPM module provided in an embodiment of the present disclosure; Figure 2 This is an exploded view of a heat dissipation mechanism for an IPM module provided in an embodiment of this disclosure.

[0022] In the picture: 1 housing, 11 limiting grooves; 2IPM module body; 3 Heat dissipation components, 31 heat conduction plate, 32 protrusion, 33 heat exchange fins, 34 receiving area, 35 guide ears; 4 clamping assembly, 41 U-shaped frame, 42 through groove, 43 spring, 44 limit block, 45 operating part; 5. Sealing rings. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0024] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0025] An IPM module is an advanced power switching device that combines the advantages of high current density, low saturation voltage, and high voltage withstand capability of a GTR (High Power Transistor) with the advantages of high input impedance, high switching frequency, and low drive power of a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). IPMs integrate logic, control, detection, and protection circuitry, making them easy to use. They not only reduce system size and development time but also significantly enhance system reliability, aligning with the current development trend of power devices.

[0026] Existing IPM modules are usually hermetically sealed, resulting in poor internal heat dissipation. Overheating may occur during prolonged operation, leading to a decrease in response speed. Furthermore, disassembling the outer casing of the IPM module is difficult when it is damaged and requires repair, hindering heat dissipation and maintenance.

[0027] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0028] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0029] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0030] like Figure 1 As shown, at least one disclosed embodiment provides a heat dissipation mechanism for an IPM module, comprising: a housing 1, wherein an IPM module body 2 is disposed inside; a heat dissipation component 3 is disposed on the top surface of the housing 1, and a pressing component 4 is slidably disposed on the heat dissipation component 3, the pressing component 4 being configured to snap into the housing 1 to press the heat dissipation component 3 tightly, thereby achieving a tight fit between the heat dissipation component 3 and the top surface of the IPM module body 2 for heat dissipation, and facilitating the disassembly of the housing 1 and the heat dissipation component 3 by snapping, thus facilitating the maintenance of the IPM module body 2.

[0031] like Figure 2 As shown, in one optional embodiment, the heat dissipation assembly 3 includes: a heat-conducting plate 31; a protrusion 32 is provided on the bottom surface of the heat-conducting plate 31, and the protrusion 32 is adapted to the top surface of the IPM module body 2; the heat-conducting plate 31 covers the top surface of the housing 1 so that the protrusion 32 extends into the housing 1 and contacts the top surface of the IPM module body 2; a plurality of heat exchange fins 33 are provided on the top surface of the heat-conducting plate 31.

[0032] In this embodiment, the pins of the IPM module body 2 extend out of the housing 1.

[0033] In this embodiment, the bump 32 is adapted to the top surface of the IPM module body 2, so that the contact area between the bump 32 and the IPM module body 2 is maximized, which can maximize the heat conduction efficiency. Through the large-area contact, heat is quickly conducted to the heat exchange fins 33, significantly improving the heat dissipation efficiency and overcoming the low heat dissipation efficiency caused by the small contact area in related technologies.

[0034] In this embodiment, components such as the heat conduction plate 31 and heat exchange fins 33 can be replaced independently, reducing maintenance costs and time.

[0035] like Figure 2 As shown, in an optional embodiment, the top surface of the heat-conducting plate 31 is provided with a receiving area 34; the top surface of the heat-conducting plate 31 is also provided with a pair of guide ears 35, which extend from the edge of the heat-conducting plate 31.

[0036] like Figure 2As shown, in an optional embodiment, the clamping assembly 4 includes: a C-shaped frame 41; the C-shaped frame 41 is fastened to the heat-conducting plate 31, and both ends of the C-shaped frame 41 pass through corresponding guide ears 35, and the C-shaped frame 41 and the guide ears 35 are slidably connected; a through groove 42 is provided on the inner top surface of the C-shaped frame 41, and a spring 43 is provided in the through groove 42, and part of the spring 43 is located in the receiving area 34, so that the heat-conducting plate 31 and the top surface of the IPM module body 2 are tightly fitted by compressing the spring 43.

[0037] In this embodiment, the spring 43 applies continuous pressure to the heat-conducting plate 31 to ensure that the protrusion 32 of the heat-conducting plate 31 fits tightly with the IPM module body 2, reducing thermal resistance and further optimizing heat conduction performance.

[0038] like Figure 2 As shown, in an optional embodiment, the end of the shaped frame 41 passes through the guide ear 35 and is located outside the housing 1, and close to the corresponding side wall of the housing 1.

[0039] In this embodiment, the guide ear 35 guides the sliding of the shaped bracket 41, ensuring the alignment and stability of the heat conduction plate 31 during installation, and avoiding poor contact or mechanical stress concentration caused by installation deviation.

[0040] like Figure 2 As shown, in one optional embodiment, a limiting groove 11 corresponding to the end of the C-shaped frame 41 is provided on the side wall of the housing 1; a limiting block 44 corresponding to and adapted to the limiting groove 11 is provided on the side of the end of the C-shaped frame 41 near the housing 1; when the limiting block 44 extends into the corresponding limiting groove 11, the C-shaped frame 41 is engaged with the housing 1, so that the spring 43 is in a compressed state and tightly fits the heat-conducting plate 31 with the top surface of the IPM module body 2.

[0041] In this embodiment, the limiting block 44 can be a triangle or the like.

[0042] In this embodiment, the limiting block 44 is embedded in the limiting groove 11 to form a mechanical lock, ensuring that the heat conduction plate 31 will not be displaced due to vibration or external force during operation, thereby improving the overall structural reliability.

[0043] In this embodiment, the limiting block 44 can be made of an elastic material. After the heat sink is placed on the top surface of the housing 1, when the U-shaped frame 41 is pressed down, the limiting block 44 can contact the outer wall of the housing 1 and deform so that the limiting block 44 can recover its deformation and be embedded in the limiting groove 11 after moving to the limiting groove 11, which facilitates the movement of the U-shaped frame 41 and the installation of the heat sink.

[0044] In this embodiment, when the limiting block 44 is embedded in the limiting groove 11, the spring 43 is in a compressed state. At this time, the limiting block 44 and the limiting groove 11 are engaged, which facilitates the disassembly and installation of the heat sink.

[0045] In this embodiment, the heat exchange fins 33 quickly dissipate heat through air cooling, adapting to the continuous operation requirements under high load or high temperature environments, and preventing the IPM module body 2 from experiencing performance degradation or damage due to overheating.

[0046] like Figure 2 As shown, in an optional embodiment, an operating part 45 is provided on the side of the C-shaped frame 41 away from the housing 1.

[0047] In this embodiment, components such as the heat-conducting plate 31 and heat exchange fins 33 can be produced in a standardized manner, reducing the cost of customized processing. At the same time, the modular structure facilitates batch assembly and reduces the overall manufacturing complexity.

[0048] In this embodiment, when maintenance is required, the operator can more easily pry the C-shaped frame 41 outward through the operating unit 45, so that the limiting block 44 is disengaged from the limiting groove 11, so that the heat conduction plate 31 can be quickly unlocked without complicated tools or destructive disassembly, which greatly simplifies the maintenance process and improves maintenance efficiency.

[0049] like Figure 2 As shown, in one optional embodiment, the end of the U-shaped frame 41 is made of an elastic material, which makes it easier for the operator to bend the U-shaped frame 41 so that the limiting block 44 disengages from the limiting groove 11.

[0050] like Figure 2 As shown, in an optional embodiment, a sealing ring 5 is provided between the bottom surface of the heat-conducting plate 31 and the top surface of the housing 1.

[0051] In this embodiment, the sealing ring 5 can be arranged around the protrusion 32. The sealing ring 5 can effectively prevent external pollutants such as dust and moisture from entering the housing 1, avoid short circuits or corrosion caused by environmental factors, and extend the service life of the IPM module body 2.

[0052] In this embodiment, the compressed spring 43 can cause the heat-conducting plate 31 to press tightly against the sealing ring 5, ensuring the sealing effect of the sealing ring 5.

[0053] In this embodiment, by optimizing the heat conduction path, enhancing structural stability, improving maintenance convenience and protection performance, the problems of low heat dissipation efficiency, difficult maintenance and poor environmental adaptability of existing IPM modules are comprehensively solved, significantly improving the reliability and service life of IPM modules, while reducing operation and maintenance costs, and making it suitable for the field of high power density electronic equipment.

[0054] In this embodiment, during installation, the heat-conducting plate 31 is first placed on the IPM module body 2, and then the C-shaped frame 41 is pressed down. Under the guidance of the guide ear 35, the C-shaped frame 41 drives the limiting block 44 to move downward. At the same time, the spring 43 squeezes the heat-conducting plate 31, so that the heat-conducting plate 31 squeezes the sealing ring 5 and fits tightly with the IPM module body 2. Then, under the elastic force of the end of the C-shaped frame 41, the limiting block 44 falls into the limiting groove 11, thereby locking the position of the C-shaped frame 41. During use, the heat of the IPM module body 2 is conducted to the heat exchange fins 33 for heat dissipation through the heat-conducting plate 31. When maintenance is required, the operating part 45 is pried outward to make the limiting block 44 disengage from the limiting groove 11. Then, under the action of the spring 43, the C-shaped frame 41 rises, thereby unlocking and allowing the heat-conducting plate 31 to be removed for maintenance.

[0055] At least one other disclosed embodiment also provides an IPM module disposed within the aforementioned heat dissipation mechanism.

[0056] In summary, the heat dissipation mechanism for this IPM module includes: a housing 1, inside which an IPM module body 2 is disposed; a heat dissipation component 3 is disposed on the top surface of the housing 1, and a pressing component 4 is slidably disposed on the heat dissipation component 3. The pressing component 4 is configured to engage with the housing 1 to press the heat dissipation component 3 tightly, so that the heat dissipation component 3 is in close contact with the top surface of the IPM module body 2. This achieves heat dissipation by ensuring close contact between the heat dissipation component 3 and the top surface of the IPM module body 2, and facilitates disassembly of the housing 1 and the heat dissipation component 3 through the snap-fit ​​method, thus facilitating the maintenance of the IPM module body 2.

[0057] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0058] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as the second element, component, region, layer, or segment.

[0059] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0060] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.

[0061] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A heat dissipation mechanism for an IPM module, characterized in that, include: The housing (1) contains the IPM module body (2). A heat dissipation component (3) is provided on the top surface of the housing (1), and a pressing component (4) is slidably provided on the heat dissipation component (3). The pressing component (4) is configured to engage with the housing (1) to press the heat dissipation component (3) so that the heat dissipation component (3) is tightly attached to the top surface of the IPM module body (2).

2. The heat dissipation mechanism for an IPM module as described in claim 1, characterized in that, The heat dissipation component (3) includes: a heat-conducting plate (31); The bottom surface of the heat-conducting plate (31) is provided with a protrusion (32), which is adapted to the top surface of the IPM module body (2); The heat-conducting plate (31) is covered on the top surface of the housing (1) so that the protrusion (32) extends into the housing (1) and contacts the top surface of the IPM module body (2); The top surface of the heat-conducting plate (31) is provided with several heat exchange fins (33).

3. The heat dissipation mechanism for the IPM module as described in claim 2, characterized in that, The top surface of the heat-conducting plate (31) is provided with a receiving area (34). The top surface of the heat-conducting plate (31) is also provided with a pair of guide ears (35), which extend from the edge of the heat-conducting plate (31).

4. The heat dissipation mechanism for an IPM module as described in claim 3, characterized in that, The clamping assembly (4) includes: a U-shaped frame (41); The shaped frame (41) is fastened to the heat-conducting plate (31), and the two ends of the shaped frame (41) pass through the corresponding guide ears (35) respectively, and the shaped frame (41) and the guide ears (35) are slidably connected; The inner top surface of the shaped frame (41) is provided with a through groove (42), and a spring (43) is provided in the through groove (42). Part of the spring (43) is located in the receiving area (34) so ​​that the heat-conducting plate (31) and the top surface of the IPM module body (2) can be tightly attached by compressing the spring (43).

5. The heat dissipation mechanism for an IPM module as described in claim 4, characterized in that, The end of the shaped frame (41) passes through the guide ear (35) and is located outside the housing (1), and close to the corresponding side wall of the housing (1).

6. The heat dissipation mechanism for an IPM module as described in claim 4, characterized in that, The side wall of the housing (1) is provided with a limiting groove (11) corresponding to the end of the bracket (41). The end of the shaped frame (41) near the shell (1) is provided with a limiting block (44) that corresponds to and is adapted to the limiting groove (11). When the limiting block (44) extends into the corresponding limiting groove (11), the shaped frame (41) engages with the housing (1), so that the spring (43) is in a compressed state and tightly fits the heat-conducting plate (31) with the top surface of the IPM module body (2).

7. The heat dissipation mechanism for an IPM module as described in claim 4, characterized in that, An operating part (45) is provided on the side of the end of the shaped frame (41) away from the shell (1).

8. The heat dissipation mechanism for an IPM module as described in claim 4, characterized in that, The ends of the mortise frame (41) are made of elastic material.

9. The heat dissipation mechanism for an IPM module as described in claim 2, characterized in that, A sealing ring (5) is provided between the bottom surface of the heat-conducting plate (31) and the top surface of the housing (1).

10. An IPM module, characterized in that, It is disposed within the heat dissipation mechanism as described in any one of claims 1-9.

Images