A frame structure for dissipating heat through dual islands

Abstract

The utility model discloses a frame structure through double base island heat dissipation, including frame main part, and the inside of frame main part is by several matrix arrangement's frame unit composition, the frame unit includes frame border, is equipped with the first base island, the second base island and the third base island of opposite setting in frame border, the first base island, the second base island, the third base island are connected frame border through pin, and first base island, second base island and frame border between still are equipped with the connecting rib, the first base island, second base island back middle is equipped with the first heat dissipation area and the second heat dissipation area, and the first base island except first heat dissipation area area, the second base island except second heat dissipation area area, the third base island, connecting rib and frame border, its back all are half etching area, the utility model discloses the first heat dissipation area, second heat dissipation area bare to the outside of packaging structure, can directly with PCB board and is pasted and carries out heat exchange, reduces the accumulation of heat at the base island, accelerates heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor frame technology, and in particular to a frame structure that dissipates heat through a dual-base island. Background Technology

[0002] In the field of semiconductor devices, DFN (Dual Flat No-lead) frames are widely used in various electronic devices due to their small size, good heat dissipation, and excellent electrical performance. As semiconductor devices continue to develop towards higher performance and higher reliability, the requirements for DFN frames are also increasing.

[0003] Existing DFN frames present numerous problems in actual production and use. On the one hand, some DFN frames, due to unreasonable structural design and numerous weak points in the material, are prone to deformation during production, processing, assembly, and use, severely affecting product stability. On the other hand, some DFN frames have poorly designed pin connection structures and small molding areas, leading to a higher risk of internal chip delamination and compromising product reliability. Furthermore, many DFN frames have inadequate heat dissipation designs, resulting in low heat dissipation efficiency and failing to meet the heat dissipation requirements of high-performance semiconductor devices during long-term operation, thus affecting the overall performance and lifespan of the semiconductor devices. Utility Model Content

[0004] To address the aforementioned issues, this invention provides a frame structure with heat dissipation via dual-base islands, which improves heat dissipation efficiency and optimizes electrical performance.

[0005] Therefore, the technical solution of this utility model is: a frame structure for heat dissipation through dual base islands, including a frame body, the frame body being composed of a plurality of frame units arranged in a matrix; each frame unit includes a frame frame, within which a first base island, a second base island, and a third base island are arranged opposite to each other; the first base island, the second base island, and the third base island are connected to the frame frame via pins, and a connecting rib is provided between the first base island, the second base island, and the frame frame; a first heat dissipation area and a second heat dissipation area are provided in the middle of the back of the first base island and the second base island, and the back of the areas of the first base island except for the first heat dissipation area, the areas of the second base island except for the second heat dissipation area, the third base island, the connecting rib, and the frame frame are all semi-etched areas.

[0006] Based on the above scheme and as a preferred embodiment of the above scheme: the first heat dissipation area on the back of the first base island and the second heat dissipation area on the back of the second base island are protruding structures, flush with the pins, and both exposed on the outside of the package structure.

[0007] Based on the above scheme and as a preferred embodiment of the above scheme: the front of the first base island, the second base island and the third base island are silver-plated areas; the front of the first base island is the chip placement area, and the front of the second base island and the third base island are the first bonding wire area and the second bonding wire area, respectively.

[0008] Based on the above scheme and as a preferred embodiment of the above scheme: the left and right sides of the first base island, the right side of the second base island, and the left side of the bonding area are connected to the frame frame by pins, and the upper side of the first base island and the lower side of the second base island are connected to the frame frame by connecting ribs.

[0009] Based on the above scheme and as a preferred embodiment of the above scheme: the first base island is connected to the first pin and the second pin on the left side, and to the fifth pin and the sixth pin on the right side; the second base island fixed area is connected to the fourth pin, and the third base island is connected to the third pin.

[0010] Compared with the prior art, the beneficial effects of this utility model are: 1. A first heat dissipation area and a second heat dissipation area are respectively provided on the back of the first base island and the second base island. Both are flush with the pins and exposed on the outside of the package structure, which can directly contact the PCB board for heat exchange, reduce heat accumulation at the base island, accelerate heat dissipation, thereby reducing device performance fluctuations caused by excessive heat, reducing the risk of device failure caused by overheating, extending the device's service life, and ensuring stable operation during operation. This allows the frame structure to better meet the heat dissipation requirements of high-power devices, broadens the application range of the frame structure, and improves its practicality in related fields.

[0011] 2. Through the design of semi-etching and connecting ribs, the overall mechanical strength of the frame is significantly improved. The semi-etching process optimizes the stress distribution of the material, while the connecting ribs provide a stable connection between various parts of the frame, effectively solving the problems of weak materials and easy deformation in the traditional DFN frame production process, and ensuring the stability of product operation.

[0012] 3. The design of the pins and connecting ribs results in a larger molding area, which can more firmly fix the relevant components during production, processing, subsequent assembly, and use, effectively reducing the risk of internal chip delamination and greatly improving product reliability. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 for Figure 1 A magnified view of a portion of the image; Figure 3 This is a structural schematic diagram of multiple frame units of this utility model; Figure 4 This is a schematic diagram of the rear structure of the frame unit of this utility model; Figure 5 This is a front structural diagram of the frame unit of this utility model.

[0014] The components in the diagram are labeled as follows: Frame body 1, Frame unit 2, Frame border 21, First base island 22, First heat dissipation area 221, Chip placement area 222, Second base island 23, Second heat dissipation area 231, First bonding wire area 232, Third base island 24, Second bonding wire area 241, Etching area 25, First pin 31, Second pin 32, Third pin 33, Fourth pin 34, Fifth pin 35, Sixth pin 36, First connecting rib 41, Second connecting rib 42, Cutting line 5. Detailed Implementation

[0015] See the attached diagram. The heat dissipation frame structure via dual-base islands described in this embodiment includes a frame body 1, which is composed of several frame units 2 arranged in a matrix. The frame body 1 has dimensions of 258*78mm, with 28 rows and 107 columns, and a total of 2996 frame units 2. Each frame unit 2 is separated from adjacent frame units by cutting lines 5, forming independent frame units 2 after cutting.

[0016] The frame unit 2 includes a frame frame 21, a first base island 22, a second base island 23, a third base island 24, pins, and connecting ribs. The frame frame 21 is a square frame. Inside the frame frame 21 are the first base island 22 and the second base island 23 arranged opposite each other. The first base island 22 has a first heat dissipation area 221 in the middle, and the second base island 23 has a second heat dissipation area 231 in the middle. The front of the first base island 22, the second base island 23, and the third base island 24 is a silver-plated area (see...). Figure 5 The blue area), the front of the first base island 22 is the chip placement area 222, used for soldering chips and other components, and the front of the second base island 23 and the third base island 24 are the first bonding wire area 232 and the second bonding wire area 241, respectively. The interval between the first base island 22, the second base island 23, and the third base island 24 is the etching area 25 (i.e., the hollow structure); the intervals between adjacent pins and adjacent connecting ribs are also etching areas.

[0017] Viewed from the front, the first base island 22 is connected to the frame frame 21 on the left side via first pin 31 and second pin 32, and to the frame frame 21 on the right side via fifth pin 35 and sixth pin 36. The upper side of the first base island 22 is connected to the frame frame 21 via first connecting rib 41. The second base island 23 is connected to the frame frame 21 on the right side via fourth pin 34, and to the frame frame 21 below via second connecting rib 42. The third base island 24 is connected to the frame frame 21 on the left side via third pin 33.

[0018] The back surfaces of the first base island 22 (excluding the first heat dissipation area 221), the second base island 23 (excluding the second heat dissipation area 231), the third base island 24, the pins, and the frame border are all semi-etched areas (see...). Figure 4 (A red shaded area). This causes the first and second heat dissipation areas to protrude from the back of the first and second base islands, and both are flush with the pins. After being encapsulated with black epoxy resin, the first and second heat dissipation areas are exposed on the outside of the package structure, just like the pins. After the pins are soldered and fixed to the PCB board, the first and second heat dissipation areas are directly attached to the PCB board, transferring heat to the PCB board, reducing heat accumulation at the base islands, and accelerating heat dissipation.

[0019] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A frame structure for heat dissipation via a dual-base island, comprising a frame body, the interior of which is composed of a plurality of frame units arranged in a matrix; characterized in that: The frame unit includes a frame border, within which a first base island, a second base island, and a third base island are disposed opposite to each other; the first base island, the second base island, and the third base island are connected to the frame border via pins, and a connecting rib is provided between the first base island, the second base island, and the frame border; a first heat dissipation area and a second heat dissipation area are provided in the middle of the back side of the first base island and the second base island, and the back side of the first base island (excluding the first heat dissipation area), the second base island (excluding the second heat dissipation area), the third base island, the connecting rib, and the frame border are all semi-etched areas.

2. The frame structure for heat dissipation via dual-base islands as described in claim 1, characterized in that: The first heat dissipation area on the back of the first base island and the second heat dissipation area on the back of the second base island are protruding structures, flush with the pins, and exposed on the outside of the package structure.

3. The frame structure for heat dissipation via dual-base islands as described in claim 1, characterized in that: The front sides of the first base island, the second base island, and the third base island are silver-plated areas; the front side of the first base island is the chip placement area, and the front sides of the second base island and the third base island are the first bonding wire area and the second bonding wire area, respectively.

4. The frame structure for heat dissipation via dual-base islands as described in claim 1, characterized in that: The left and right sides of the first base island, the right side of the second base island, and the left side of the bonding area are connected to the frame frame by pins, and the upper side of the first base island and the lower side of the second base island are connected to the frame frame by connecting ribs.

5. The frame structure for heat dissipation via dual-base islands as described in claim 4, characterized in that: The first base island is connected to the first and second pins on the left side and to the fifth and sixth pins on the right side; the second base island is connected to the fourth pin in its fixed area and to the third pin in its third area.

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