Chip pad structure and vehicle-mounted high-computing-power circuit board
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- VICTORY GIANT TECH HUIZHOU CO LTD
- Filing Date
- 2025-08-07
- Publication Date
- 2026-08-07
AI Technical Summary
[0005]为了解决“传统的芯片焊接工艺焊接的车载AI算力卡不仅容易出现不可靠的问题，也会出现因为热膨胀系数（CTE）差异导致的翘曲变形
通过在焊盘上设置有多个焊接部，焊接部外环形设置有第一隔离部，焊盘设置有支撑区，支撑区于焊盘对称设置；并设置有第一支撑焊接部，设置在支撑区内，第一支撑焊接部高于焊接部，第一支撑焊接部设置有第一隔离部；第二支撑焊接部，设置在支撑区内，第二支撑焊接部高于焊接部；第二支撑焊接部设置有第一隔离部。以通过在支撑区内形成对称的两个支撑部进行支撑，以避免热膨胀系数差异导致的翘曲变形。
Smart Images
Figure CN224611296U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of chip welding technology, and in particular relates to a chip pad structure and a vehicle-mounted high-computing-power circuit board. Background Technology
[0002] BGA technology, or Ball Grid Array packaging, is an advanced integrated circuit packaging technology. It typically refers to a packaged chip with multiple solder balls on its bottom. These spherical solder points are arranged in an array on the bottom of the package and connected to pads on a printed circuit board (PCB) via reflow soldering, achieving electrical connection and mechanical fixation between the chip and the circuit board. Corresponding pads are located on the circuit board, and each pad usually contains copper foil for soldering to the solder balls on the bottom of the packaged chip.
[0003] In existing technologies, traditional chips typically have low power and average reliability, and only need to perform simple calculations. Therefore, existing technologies use a four-corner support method to support the chip.
[0004] However, with the improvement of chip computing power, when the AI computing power card is used in the vehicle, not only is the computing power and power of the chip very high, but the chip will also be used in a high vibration environment. This makes the vehicle AI computing power card welded by traditional chip welding process not only prone to unreliability problems, but also warping deformation due to the difference in coefficient of thermal expansion (CTE). Utility Model Content
[0005] To address the technical problem that "traditional chip soldering processes for automotive AI computing cards are prone to unreliability and warping due to differences in coefficients of thermal expansion (CTE)," this invention proposes a chip pad structure and an automotive high-computing-power circuit board.
[0006] The objective of this utility model is achieved through the following technical solution; In a first aspect, this utility model proposes a chip pad structure, comprising: The pad has multiple soldering parts arranged in an array within it, with conductive parts between the soldering parts, and a first isolation part arranged around the soldering parts. The pad also has a support area, which is symmetrically arranged with respect to the pad. A first support welding part is provided in the support area. The first support welding part is higher than the welding part. A second isolation part is provided around the first support welding part. The second support welding part is located within the support area. The second support welding part is higher than the welding part, and a third isolation part is provided around the second support welding part.
[0007] Multiple soldering portions are provided on the solder pads, with a first isolation portion arranged in a ring around the outer edge of each soldering portion. A support area is provided on the solder pad, symmetrically arranged with respect to the solder pad. A first supporting soldering portion is provided within the support area, higher than the soldering portion, and equipped with a first isolation portion. A second supporting soldering portion is also provided within the support area, higher than the soldering portion, and equipped with a first isolation portion. This design utilizes two symmetrical support portions within the support area to provide support, thus preventing warping deformation caused by differences in thermal expansion coefficients.
[0008] In some embodiments, the second isolation portion is provided with a first opening, and / or the third isolation portion is provided with a second opening, the second opening facing the center of the pad.
[0009] In some implementations, the size of the first opening and the second opening is 4mil to 8mil.
[0010] In some embodiments, the height of the first support weld and the second support weld is at least 0.5 mil higher than the weld.
[0011] In some embodiments, the surfaces of the first support weld portion and the second support weld portion are plated with a metal layer.
[0012] In some embodiments, the first support welding portion is provided with a first distance from the vertex of the nearest pad, the first distance being 0.2mil to 0.5mil of the distance from the vertex to the center of the pad.
[0013] In some embodiments, the distance between the second support weld and the first support is at least greater than 50 mil.
[0014] In some implementations, a second distance is provided between the support areas, which is greater than half the side length of the pad.
[0015] In some implementations, the width of the second and third isolation sections is 3mil to 4mil.
[0016] Secondly, this utility model also proposes an in-vehicle high-computing-power circuit board, including a chip pad structure as described in any of the first aspects.
[0017] The beneficial effects of this utility model's chip pad structure and automotive high-computing-power circuit board are: Multiple soldering portions are provided on the solder pads, with a first isolation portion arranged in a ring around the outer edge of each soldering portion. A support area is provided on the solder pad, symmetrically arranged with respect to the solder pad. A first supporting soldering portion is provided within the support area, higher than the soldering portion, and equipped with a first isolation portion. A second supporting soldering portion is also provided within the support area, higher than the soldering portion, and equipped with a first isolation portion. This design utilizes two symmetrical support portions within the support area to provide support, thus preventing warping deformation caused by differences in thermal expansion coefficients. Attached Figure Description
[0018] Figure 1 This is a bottom view of a chip pad structure according to the present invention; Figure 2 This is a side view of the support area of a chip pad structure according to the present invention; Figure 3 This is a top view of the support area of a chip pad structure according to the present invention.
[0019] Figure label: 1. Pad; 11. Support area; 12. Welding part; 121. First welding part; 122. Conductive part; 21. First supporting welded part; 211. Second isolation part; 212. First opening; 31. Second support welding part; 311. Third isolation part; 312. Second opening; X1, first distance; X2, second distance. Detailed implementation method: It should be noted that, in the absence of conflict, the embodiments and technical features in the embodiments of this utility model can be combined with each other. The detailed description in the specific embodiments should be understood as an explanation of the spirit of this utility model and should not be regarded as an improper limitation of this utility model.
[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the specific technical solutions of this utility model will be further described in detail below with reference to the accompanying drawings of the embodiments of this utility model. The following embodiments are used to illustrate this utility model, but are not intended to limit the scope of this utility model.
[0021] In the embodiments of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0022] Furthermore, in this embodiment of the invention, directional terms such as "upper," "lower," "left," and "right" are defined relative to the positions of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the position of the components in the accompanying drawings.
[0023] In the embodiments of this utility model, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.
[0024] In embodiments of this invention, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.
[0025] In this embodiment of the invention, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this embodiment of the invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant information in a specific manner.
[0026] Example 1: like Figure 1 As shown, this embodiment proposes a chip pad structure, including: The pad 1 has multiple soldering parts 12 arranged in an array within it. A conductive part 122 is arranged between the soldering parts 12. A first isolation part is arranged around the soldering parts 12. The pad 1 has a support area 11, which is symmetrically arranged with respect to the pad 1. A first support welding part 21 is disposed in the support area 11. The first support welding part 21 is higher than the welding part 12. A second isolation part 211 is provided around the first support welding part 21. The second support welding part 31 is disposed in the support area 11. The second support welding part 31 is higher than the welding part 12. A third isolation part 311 is disposed around the second support welding part 31.
[0027] Specifically, multiple soldering portions 12 are arrayed on the pad 1. Each soldering portion 12 protrudes from the circuit board surface to solder with the ball-shaped solder paste under the packaged chip. Each soldering portion 12 contains a conductive portion 122, typically a via, to enable communication between the chip and the inner layer circuitry of the circuit board. A first isolation portion, typically a solder resist material such as solder resist or solder mask ink, is provided around the periphery of each soldering portion 12. This isolation portion is usually annular and used for solder resisting between this pin and other pins. Multiple support areas 11 are provided on the pad 1. The number and arrangement of the support areas 11 are determined by the shape of the chip pad. If the chip pad is typically rectangular, then there can be four support areas 11. To prevent imbalance in the support, the support areas 11 are typically arranged symmetrically on the pad 1. A first support welding part 21 is provided within the support area 11, which is higher than the surrounding welding parts 12 to provide support. Simultaneously, a second isolation part 211 is provided around the first support welding part 21, whose function is the same as the first isolation part, blocking solder and preventing solder bridging between pins. A second support welding part 31 is provided within the support area 11, which is higher than the surrounding welding parts 12 to provide support. Simultaneously, a third isolation part 311 is provided around the second support welding part 31, whose function is the same as the first isolation part, blocking solder and preventing solder bridging between pins. The first support welding part 21 and the second support welding part 31 form a more stable support. There can be multiple first support welding parts 21 and second support welding parts 31, with at least one first support welding part 21 and one second support welding part 31 respectively located at both ends of the support area 11 to form local support for each other, thereby achieving overall support for the support area 11. By using the support area 11 with at least two protrusions, the effective support area of the computing card is increased, mechanical stress is dispersed, and the vibration and shock resistance of the computing card is improved, so that the computing card can still work stably in high vibration scenarios. At the same time, high computing cards are usually smaller than traditional chips. Therefore, the first support welding part 21 and the second support welding part 31 in the support area 11 can improve the bonding force between the computing card and the circuit board and the heat dissipation capacity.
[0028] Multiple soldering portions 12 are provided on the solder pad 1, with a first isolation portion arranged in a ring around the outer edge of each soldering portion 12. A support area 11 is provided on the solder pad 1, symmetrically arranged with respect to the solder pad 1. A first support soldering portion 21 is provided within the support area 11, higher than the soldering portions 12, and equipped with a first isolation portion. A second support soldering portion 31 is also provided within the support area 11, higher than the soldering portions 12, and equipped with a first isolation portion. By forming two symmetrical support portions within the support area 11, support is provided to avoid warping deformation caused by differences in thermal expansion coefficients.
[0029] Example 2: Please refer to this again. Figure 1 And further refer to, such as Figures 2-3 As shown, this embodiment further explains and optimizes the structure proposed in Embodiment 1: In some embodiments, the second isolation portion 211 is provided with a first opening 212, and / or the third isolation portion 311 is provided with a second opening 312, the second opening 312 facing the center of the pad 1.
[0030] Specifically, the second isolation portion 211 is provided with a first opening 212, which allows the first support soldering portion 21 to connect with the copper surface on the substrate, thereby increasing the bonding strength of the AI computing card to the substrate and increasing heat dissipation. Similarly, the second opening 312 allows the second support soldering portion 31 to connect with the copper surface on the substrate, increasing the bonding strength of the AI computing card to the substrate and increasing heat dissipation, thus preventing warping and deformation of the AI computing card due to differences in the coefficient of thermal expansion (CTE). The first opening 212 and the second opening 312 face the center of the solder pad 1 for a more aesthetically pleasing overall appearance. Furthermore, the central orientation of the first opening 212 and the second opening 312 in the multiple support areas 11 increases the bonding strength between the circuit board and the computing card. In some preferred embodiments, the first opening 212 is provided only in the second isolation portion 211, while the second opening 312 is not provided in the third isolation portion 311, to avoid solder bridging between the first support soldering portion 21 and the second support soldering portion 31 during soldering, which could result in large-area solder bridging at the bottom of the AI computing card. In other embodiments, the first opening 212 and the second opening 312 are oriented in completely opposite directions, which can avoid solder bridging to a certain extent. However, this method makes the process of manufacturing the circuit board more complex and difficult.
[0031] In some embodiments, the size of the first opening 212 and the second opening 312 is 4mil to 8mil. In some optimal cases, the first opening 212 and the second opening 312 are best selected to be 6mil. If the notch is too large, it will be very difficult to form the second isolation part 211 or the third isolation part 311 when plating the circuit board. If the first opening 212 and the second opening 312 are too small, the effect of increasing heat dissipation and bonding force will not be ideal, and ultimately the computing card chip will still warp due to the difference in the coefficient of thermal expansion.
[0032] In some embodiments, the first support welding portion 21 and the second support welding portion 31 are plated with a metal layer. Specifically, in order to increase the bonding strength of the weld, in some embodiments, the metal layer on the surface of the first support welding portion 21 and the second support welding portion 31 is also plated with gold with a minimum thickness of 30 μm and nickel with a minimum thickness of 196 μm.
[0033] In some embodiments, the height of the first support welded portion 21 and the second support welded portion 31 is at least 0.5 mil higher than the welded portion 12. Specifically, a height higher than 0.5 mil is necessary to provide support and further prevent warping deformation caused by differences in thermal expansion coefficients. In some more specific embodiments, the height should be less than 0.7 mil to avoid stress warping deformation caused by excessive height.
[0034] In some embodiments, the first support welding part 21 is provided with a first distance X1 from the vertex of the nearest pad 1, and the first distance X1 is 0.2mil to 0.5mil from the vertex to the center of the pad 1. Specifically, when the computing card is rectangular, the distance of each first support welding part 21 of the four support areas 11 from each vertex should be 0.2mil to 0.5mil from the vertex to the center. For example, in the case of a computing card with a specification of 790*790mil, one of the first welding support parts should be set at a position of 120*120mil.
[0035] In some embodiments, the distance between the second support weld 31 and the first support weld 21 is at least greater than 50 mil. Specifically, 50 mil is approximately the size of the two welds 12 to avoid them being too close to form an effective support surface, thereby failing to effectively distribute mechanical stress.
[0036] In some embodiments, a second distance X2 is provided between the support areas 11, and the second distance X2 is greater than the side length of the pad 1. Specifically, the second distance X2 is provided between the support areas 11, and the second distance X2 is greater than half the side length of the pad 1, so as to avoid the interval between the support areas 11 being too small, which would result in a smaller support effect and an inability to achieve balanced support, and to avoid excessive support on some areas causing chip warping in a high vibration environment.
[0037] In some embodiments, the width of the second isolation portion 211 and the third isolation portion 311 is 3mil to 4mil. The width of the second isolation portion 211 and the third isolation portion 311 is generally narrower than that of the other welding portions 12, in order to facilitate the formation of openings during production, thereby increasing heat dissipation and bonding strength through the openings.
[0038] Example 3: This embodiment also proposes an in-vehicle high-computing-power circuit board, including a chip pad structure as described in any one of Embodiment 1 and / or Embodiment 2.
[0039] In some preferred embodiments, the automotive high-performance circuit board is used in automotive scenarios such as domain controllers. The circuit board includes chip pads for soldering AI computing cards. The automotive high-performance circuit board may be equipped with shock-absorbing measures, such as shock-absorbing cotton or shock-absorbing brackets, to reduce significant vibrations during vehicle operation. These measures, along with the first support soldering part 21 and the second support soldering part 31 within the pad 1, provide support and shock absorption, preventing potential instability issues caused by low-amplitude vibrations. Simultaneously, heat dissipation holes may be provided around the pad 1 to further reduce overheating of the AI computing card during high-power operation, thereby reducing warping deformation caused by differences in thermal expansion coefficients.
[0040] The serial numbers of the utility model embodiments are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above are only preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent device or equivalent process transformation made based on the content of this utility model specification and drawings, or direct or indirect application in other related technical fields, are similarly included in the patent protection scope of this utility model.
Claims
1. A chip pad structure, characterized in that, include: The pad (1) has a plurality of soldering parts (12) arranged in an array within it. A conductive part (122) is arranged between the soldering parts (12). A first isolation part is arranged around the soldering part (12). The pad (1) has a support area (11) arranged symmetrically with respect to the pad (1). A first support welding part (21) is disposed in the support area (11). The first support welding part (21) is higher than the welding part (12). A second isolation part (211) is disposed around the first support welding part (21). The second support welding part (31) is disposed in the support area (11), the second support welding part (31) is higher than the welding part (12), and a third isolation part (311) is disposed around the second support welding part (31).
2. The chip pad structure according to claim 1, characterized in that, The second isolation portion (211) is provided with a first opening (212), and / or the third isolation portion (311) is provided with a second opening (312), the second opening (312) facing the center of the pad (1).
3. The chip pad structure according to claim 2, characterized in that, The size of the first opening (212) and the second opening (312) is 4mil to 8mil.
4. The chip pad structure according to claim 1, characterized in that, The height of the first support welded part (21) and the second support welded part (31) is at least 0.5 mil higher than that of the welded part (12).
5. The chip pad structure according to claim 1, characterized in that, The surfaces of the first support welding part (21) and the second support welding part (31) are plated with a metal layer.
6. The chip pad structure according to claim 1, characterized in that, The first support welding part (21) is provided with a first distance (X1) from the vertex of the nearest pad (1), and the first distance (X1) is 0.2mil to 0.5mil from the vertex to the center of the pad (1).
7. The chip pad structure according to claim 1, characterized in that, The distance between the second support weld (31) and the first support weld (21) is at least greater than 50 mil.
8. The chip pad structure according to claim 1, characterized in that, A second distance (X2) is provided between the support areas (11), and the second distance (X2) is greater than half the side length of the pad (1).
9. The chip pad structure according to claim 1, characterized in that, The width of the second isolation section (211) and the third isolation section (311) is 3mil to 4mil.
10. A vehicle-mounted high-computing-power circuit board, characterized in that, Includes the chip pad structure as described in any one of claims 1-9.