A heating pot and atomizing device

Abstract

This application provides a heating pot and an atomizing device. The heating pot includes a pot body and an atomizing core. The pot body has a storage cavity for storing the atomizing medium and an installation cavity adjacent to the storage cavity. The pot body has a bottom wall, a first side wall, and a second side wall. The bottom wall is a wall panel on the side of the installation cavity away from the storage cavity. The first side wall has an airflow inlet, and the second side wall has an airflow outlet. The atomizing core is disposed in the installation cavity and together with the inner wall of the pot body, forms the storage cavity. The atomizing core has an atomizing cavity inside, which has an air inlet and an air outlet. The air inlet is positioned directly opposite the airflow inlet, and the air outlet is positioned directly opposite the airflow outlet. The atomizing core has multiple pins for connecting to a power source, and the multiple pins extend from the airflow inlet and / or the airflow outlet to the outside of the pot body. This arrangement can reduce the waste of the atomizing medium and prevent the atomizing medium from leaking to the outside of the product.

Description

Technical Field

[0001] This application relates to the field of atomization technology, specifically to a heating pot and atomization equipment. Background Technology

[0002] In related technologies, the atomizing chamber is often formed by assembling a heating element and corresponding structural components. With this structure, the liquid on the heating element can easily leak onto the nearby structural components, and the aerosol in the atomizing chamber can easily condense onto the structural components, resulting in leakage or excessive condensate in the structural components, which leads to waste of the atomizing medium. At the same time, excessive condensate in the structural components can cause liquid to leak to the outside of the product, resulting in a poor user experience. Utility Model Content

[0003] In view of this, this application provides a heating pot that simultaneously possesses the functions of atomizing medium storage, transmission, heating and atomization, and residual liquid recovery. This significantly simplifies the structural design, improves product consistency, reduces atomizing medium waste, and prevents atomizing medium leakage to the outside of the product. Furthermore, this application also provides an atomizing device including the aforementioned heating pot.

[0004] To achieve the above objectives, this application provides the following technical solution:

[0005] A heating pot, comprising:

[0006] The pot body has an internal storage cavity for storing atomizing media and an installation cavity adjacent to the storage cavity; the pot body has a bottom wall, a first side wall and a second side wall, the bottom wall is a wall panel on the side of the installation cavity away from the storage cavity, the first side wall has an airflow inlet and the second side wall has an airflow outlet;

[0007] An atomizing core is disposed within the mounting cavity, and the atomizing core and the inner wall of the pot together form the storage cavity. An atomizing chamber is formed inside the atomizing core, having an air inlet and an air outlet, with the air inlet facing the airflow inlet and the air outlet facing the airflow outlet. The atomizing core has multiple pins for connecting to a power source, and these pins extend from the airflow inlet and / or the airflow outlet to the outer side of the pot body.

[0008] Optionally, the atomizing core and the pot body are an integral part.

[0009] Optionally, the difference between the coefficient of thermal expansion of the pot body and the coefficient of thermal expansion of the substrate of the atomizing core is N, and N ≤ 1.5 × 10⁻⁶. -6 / ℃.

[0010] The viscosity of the atomizing medium is η, and the thermal conductivity of the pot body is K1.

[0011] Furthermore, when η≥500mPa·s, K1≥15W / (m·K); when η<500mPa·s, K1<15W / (m·K).

[0012] Optionally, the atomizing core includes:

[0013] The substrate has through holes that are disposed throughout and used to form the atomizing cavity;

[0014] A heating element is disposed at least on the inner wall of the through hole near the storage cavity.

[0015] Optionally, the viscosity of the atomizing medium is η, and the thermal conductivity of the matrix is ​​K2;

[0016] Furthermore, when η≥500mPa·s, 0.5W / (m·K)≤K2≤5W / (m·K); when η<500mPa·s, K2≤0.5W / (m·K).

[0017] Optionally, the end face of the through hole is flush with and / or protrudes from the outer wall surface of the pot body.

[0018] Optionally, the surface of the atomizing core used to form the storage cavity is an oil-guiding surface, and the oil-guiding surface is a curved surface.

[0019] Optionally, the storage cavity and the mounting cavity are arranged in a first direction;

[0020] The section of the mounting cavity perpendicular to the first direction is the first section. In the first direction, the area of ​​the first section is negatively correlated with the distance from the first section to the storage cavity.

[0021] An atomizing device, comprising:

[0022] The heating pot is any one of the heating pots described above;

[0023] The power supply unit includes a power source, which is electrically connected to multiple pins in the heating pot.

[0024] When the heating pot provided in this application is in use, the airflow can enter the atomization chamber through the airflow inlet and mix with the aerosol in the atomization chamber. Then, the mixed gas can flow out of the atomization chamber through the airflow outlet. Furthermore, the air inlet of the atomizing chamber is positioned directly opposite the airflow inlet of the first sidewall, and the air outlet is positioned directly opposite the airflow outlet of the second sidewall. That is, the atomizing chamber in this embodiment is a horizontally arranged atomizing chamber. Based on this, even if the liquid on the heating element leaks during the use of the heating pot, it will drip onto the inner wall of the atomizing chamber, rather than leaking directly to the outside of the heating pot through the airflow inlet or outlet. As mentioned above, in this embodiment, the atomizing chamber is located inside the atomizing core. Therefore, the liquid dripping onto the inner wall of the atomizing chamber is actually dripping onto the substrate of the atomizing core, which allows the liquid dripping from the heating element to be reused under the action of the atomizing core. Similarly, since the atomizing chamber is located inside the atomizing core, even if the aerosol condenses, it will condense inside the atomizing core, thus allowing the condensate to be reused under the action of the atomizing core. In summary, the above arrangement of the atomizing chamber in this embodiment helps to reduce the accumulation of leaked liquid and condensate, thereby reducing the probability of the atomizing medium leaking to the outside of the heating pot.

[0025] Furthermore, the bottom wall of the heating pot in this application is a wall panel on the side of the mounting cavity away from the storage cavity; that is, the bottom wall is located on the side of the atomizing core away from the storage cavity. Moreover, multiple pins of the atomizing core extend from the airflow inlet and / or airflow outlet to the outside of the pot body. This design avoids the need for holes in the bottom wall of the pot body. Thus, the bottom wall acts as a second protective barrier to prevent the atomizing medium from leaking to the outside of the heating element. Even if leaked liquid and condensate are not reused in time, leakage will not occur due to the barrier effect of the bottom wall. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0027] Figure 1 A schematic diagram of a heating pot provided in an embodiment of this application;

[0028] Figure 2 A schematic diagram of another heating pot provided in an embodiment of this application;

[0029] Figure 3 A schematic diagram of another heating pot provided in an embodiment of this application;

[0030] Figure 4A schematic diagram of another heating pot provided in an embodiment of this application;

[0031] Figure 5 A schematic diagram of another heating pot provided in an embodiment of this application;

[0032] Figure 6 A schematic diagram of another heating pot provided in an embodiment of this application;

[0033] Figure 7 for Figure 1 A top view of the heating pot in the first embodiment;

[0034] Figure 8 for Figure 7 A cross-sectional view along the AA direction;

[0035] Figure 9 for Figure 7 A cross-sectional view along the BB direction;

[0036] Figure 10 for Figure 1 A top view of the heating pot in the second embodiment;

[0037] Figure 11 for Figure 10 A sectional view along the CC direction;

[0038] Figure 12 for Figure 1 Top view of the heating pot in the third embodiment;

[0039] Figure 13 for Figure 12 Cross-sectional view along the DD direction;

[0040] Figure 14 for Figure 1 Top view of the heating pot in the fourth embodiment;

[0041] Figure 15 for Figure 14 Cross-sectional view along the EE direction;

[0042] Figure 16 for Figure 1 Top view of the heating pot in the fifth embodiment;

[0043] Figure 17 for Figure 16 A cross-sectional view along the FF direction;

[0044] Figure 18 for Figure 2 A top view of the heating pot in the middle;

[0045] Figure 19 for Figure 18A cross-sectional view along the GG direction.

[0046] exist Figures 1-19 middle:

[0047] 100-Heating Pot;

[0048] 1-Pot body, 2-Atomizing core, 3-Storage chamber, 4-Atomizing chamber;

[0049] 101-Bottom wall, 102-First side wall, 103-Second side wall, 104-Liquid guide hole, 201-Base, 202-Heating element, 203-Pin, 204-Air outlet, 205-Air inlet;

[0050] 1021 - Airflow inlet, 1031 - Airflow outlet, 2011 - Oil guide surface. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0052] The heating pot in this application is suitable as an aerosol generating device for use as a nebulization equipment. This nebulization equipment includes, but is not limited to, electronic nebulizers; for example, it can also be a medical nebulizer, etc. The following description uses an electronic nebulizer as an example.

[0053] As an alternative to traditional tobacco products, electronic atomizing devices are essentially electronic atomizing products used to heat and atomize atomizing media to form an aerosol that can be inhaled by the user.

[0054] Electronic atomizing devices generally include a power supply unit and an aerosol generator.

[0055] The power supply unit is connected to the aerosol generator and is used to provide electrical energy to the aerosol generator.

[0056] The aerosol generator includes an atomizing medium storage unit and an atomizing core. Among them:

[0057] The atomizing medium storage unit is the part of an electronic atomizing device used to store the atomizing medium; in other words, the atomizing medium storage unit is the liquid storage structure of the electronic atomizing device. Of course, the liquid storage structure does not necessarily store atomizing media in a liquid state; it can also store atomizing media in a paste state.

[0058] An atomizing core is used to atomize stored atomizing media. For example, an atomizing core includes a substrate and a heating element. The substrate guides the atomizing media from the atomizing media storage unit to the heating element, which atomizes the atomizing media to form an aerosol.

[0059] When the electronic atomizing device is in use, the heating element in the atomizing core heats up rapidly, and the atomizing medium in the atomizing medium storage unit is guided to the area around the heating element by the action of the substrate, and instantly atomizes to form an aerosol; at the same time, the air intake enters the atomizing chamber through the air intake channel, mixes with the aerosol, and then enters the user's mouth through the air outlet channel.

[0060] In related technologies, the atomizing chamber is often formed by assembling a heating element and corresponding structural components. With this structure, the liquid on the heating element can easily leak onto the nearby structural components, and the aerosol in the atomizing chamber can easily condense onto the structural components, resulting in leakage or excessive condensate in the structural components, which leads to waste of the atomizing medium. At the same time, excessive condensate in the structural components can cause liquid to leak to the outside of the product, resulting in a poor user experience.

[0061] Based on the above problems, this application discloses a heating pot 100, which simultaneously has the functions of storing, transmitting, heating and atomizing the atomizing medium and recovering residual liquid; thereby effectively preventing leakage and recovering the liquid, and improving the utilization rate of the atomizing medium.

[0062] like Figures 1-19 As shown, the heating pot 100 in this embodiment includes a pot body 1 and an atomizing core 2.

[0063] The pot body 1 is the main body of the heating pot 100. In some embodiments, the pot body 1 is made of dense ceramic through a sintering process.

[0064] like Figures 1-19 As shown, the interior of the pot body 1 has an installation cavity and a storage cavity 3, wherein the installation cavity is used to install the atomizing core 2 and the storage cavity 3 is used to store the atomizing medium.

[0065] Furthermore, the pot body 1 has a bottom wall 101, a first side wall 102, and a second side wall 103. The bottom wall 101 is a wall panel on the side of the mounting cavity away from the storage cavity 3; the first side wall 102 has an airflow inlet 1021, and the second side wall 103 has an airflow outlet 1031.

[0066] The atomizing core 2 is a structure for heating and atomizing the atomizing medium; in some embodiments, the atomizing core 2 includes a substrate 201 and a heating element 202, wherein the substrate 201 is used to guide the atomizing medium to the heating element 202, and the heating element 202 is used to atomize the atomizing medium.

[0067] like Figures 1-19As shown, the atomizing core 2 is disposed in the above-mentioned mounting cavity, and the atomizing core 2 and the inner wall of the pot body 1 together enclose the storage cavity 3.

[0068] In an exemplary embodiment, the mounting cavity and the storage cavity 3 are connected through a liquid guiding hole 104. The atomizing core 2 blocks the liquid guiding hole 104. At this time, the portion of the atomizing core 2 used to block the liquid guiding hole 104, together with the inner wall of the pot body 1, forms the storage cavity 3. It is understood that when the viscosity of the atomizing medium is high, its fluidity is poor. In this case, such as... Figure 8 , Figure 9 , Figure 11 , Figure 13 , Figure 15 and Figure 19 As shown, to ensure the liquid guiding rate, the mounting cavity and storage cavity 3 can be set without any partition. In this case, the flow area of ​​the liquid guiding hole 104 is equal to the bottom surface area of ​​the mounting cavity or the top surface area of ​​the storage cavity 3. When the viscosity of the atomizing medium is high, its fluidity is high. For example... Figure 17 As shown, a partition can be set to separate the storage cavity 3 and the mounting cavity, and holes can be made in the partition to form liquid guiding holes 104. By controlling the aperture of the liquid guiding holes 104, the liquid supply speed and atomization power can be balanced, thereby improving the atomization efficiency.

[0069] Continue as Figure 9 , Figure 11 , Figure 13 , Figure 15 , Figure 17 and Figure 19 As shown, the atomizing core 2 has an atomizing chamber 4 inside. The atomizing chamber 4 has an air inlet 205 and an air outlet 204. The air inlet 205 is positioned directly opposite the airflow inlet 1021, and the air outlet 204 is positioned directly opposite the airflow outlet 1031.

[0070] In this configuration, when the heating pot 100 is in use, airflow enters the atomizing chamber 4 through the airflow inlet 1021 and mixes with the aerosol inside the atomizing chamber 4. The mixed gas then flows out of the atomizing chamber 4 through the airflow outlet 1031. Furthermore, the air inlet 205 of the atomizing chamber 4 is positioned directly opposite the airflow inlet 1021 of the first sidewall 102, and the air outlet 204 is positioned directly opposite the airflow outlet 1031 of the second sidewall 103. That is, the atomizing chamber 4 in this embodiment is a horizontally arranged atomizing chamber 4. Based on this, even if liquid leaks from the heating element 202 during use, it will drip onto the inner wall of the atomizing chamber 4 and will not leak directly to the outside of the heating pot 100 through the airflow inlet 1021 or the airflow outlet 1031. As mentioned above, in this embodiment, the atomizing chamber 4 is located in the atomizing chamber... Inside the atomizing core 2, the liquid dripping onto the inner wall of the atomizing chamber 4 is actually dripping onto the substrate 201 of the atomizing core 2. This allows the liquid dripping from the self-heating element 202 to be reused under the action of the atomizing core 2. Similarly, since the atomizing chamber 4 is located inside the atomizing core 2, even if the aerosol condenses, it will condense inside the atomizing core 2, thus allowing the condensate to be reused under the action of the atomizing core 2. In summary, the above arrangement of the atomizing chamber 4 in this embodiment helps to reduce the accumulation of leaked liquid and condensate, thereby reducing the probability of the atomizing medium leaking to the outside of the heating pot 100.

[0071] In addition, the atomizing core 2 has multiple pins 203, which are used for electrical connection between the heating element 202 and the power supply. When the heating pot is in use, the power supply can supply power to the heating pot so that the heating element 202 of the atomizing core 2 heats up when powered on.

[0072] As mentioned above, the bottom wall 101 of the pot body 1 is the wall plate on the side of the mounting cavity away from the storage cavity 3. That is to say, the bottom wall 101 is located on the side of the atomizing core 2 away from the storage cavity 3; based on this, as Figure 9 , Figure 11 , Figure 13 , Figure 15 , Figure 17 and Figure 19 As shown, multiple pins 203 of the atomizing core 2 extend from the airflow inlet 1021 and / or the airflow outlet 1031 to the outside of the pot body 1. This design avoids the need for holes in the bottom wall 101 of the pot body 1. Thus, the bottom wall 101 acts as a second protective barrier to prevent the atomizing medium from leaking to the outside of the heating element 202. Even if leaked liquid and condensate are not reused in time, leakage will not occur due to the barrier effect of the bottom wall 101.

[0073] The working principle of the heating pot 100 mentioned above is as follows:

[0074] When using a high-viscosity atomizing medium (including but not limited to atomizing media in paste form), the high-viscosity atomizing medium is filled into the storage cavity 3 of the heating pot 100. At this time, when the heating pot 100 atomizes the atomizing medium, the heating element 202 of the atomizing core 2 first connects to a low voltage to preheat the atomizing medium in the storage cavity 3. During this process, heat is transferred from the heating element 202 to the substrate 201 and then to the pot body 1. As the temperature rises, the fluidity of the atomizing medium in the atomizing cavity 4 increases. After reaching the preset preheating time, the atomizing medium can be transferred to the heating element 202 through the substrate 201. At this time, the voltage connected to the heating element 202 is increased so that it can atomize the atomizing medium.

[0075] When using a low-viscosity atomizing medium, preheating of the heating pot 100 is unnecessary. That is, after the low-viscosity atomizing medium is injected into the atomizing chamber 4 of the heating pot 100, the heating element 202 of the atomizing core 2 is directly connected to a high voltage to atomize the medium. It should be noted that the aforementioned low-viscosity atomizing medium refers to an atomizing medium that can be guided from the substrate 201 to the heating element 202 without preheating.

[0076] In some embodiments, the atomizing core 2 and the pot body 1 are an integral part.

[0077] In this way, the atomizing core 2 and the pot body 1 are tightly bonded without gaps, which ensures the stability and integrity of the heating pot 100 structure, and also ensures the tight bonding between the heating element 202 and the substrate 201, thereby improving the service life of the heating pot 100.

[0078] Furthermore, this configuration eliminates the need for additional assembly between the atomizing core 2 and the pot body 1, significantly reducing the number of structural components and thus improving the consistency of the heating pot 100. Additionally, this configuration eliminates the need for sealing materials such as silicone between the atomizing core 2 and the pot body 1, thereby ensuring the concentration of effective components in the atomizing medium and increasing the speed at which heat from the heating element 202 is transferred to the pot body 1, ultimately improving the preheating effect.

[0079] In an exemplary embodiment, the pot body 1 is made of dense ceramic, the substrate 201 is made of porous ceramic, and the heating element 202 is a metal wire or a metal sheet. Based on the above, the manufacturing process of the heating pot 100 is as follows:

[0080] First, a mold for making the pot body 1 is prepared (for ease of description, the mold will be referred to as the first mold below); then, a dense ceramic slurry is injected into the inside of the first mold, and after it is formed, it is sintered to obtain the pot body 1;

[0081] Then, the pot body 1 is used as the inner part of the mold for preparing the substrate 201 (for ease of description, the mold is referred to as the second mold below), and the heating element 202 is embedded inside the second mold. After that, porous ceramic slurry is injected into the second mold, and after molding, it is sintered to sinter the substrate 201 and the pot body 1 into one piece, and to sinter the heating element 202 inside or on the surface of the substrate 201.

[0082] In some embodiments, when the atomizing core 2 and the pot body 1 are integrally formed, the difference between the coefficient of thermal expansion of the pot body 1 and the coefficient of thermal expansion of the substrate 201 of the atomizing core 2 is N, and N ≤ 1.5 × 10⁻⁶. -6 / ℃. In this way, the expansion of the atomizing core 2 and the pot body 1 is similar during the sintering process, which can reduce the risk of cracking of the heating pot 100 during the preparation process.

[0083] In some embodiments, the viscosity of the atomizing medium is η, and when η≥500mPa·s, the atomizing medium has poor flowability. Without heating it, the atomizing medium cannot be guided through the substrate 201 of the atomizing core 2 to the heating element 202. That is to say, in this embodiment, when the viscosity of the atomizing medium is greater than or equal to 500mPa·s, it is a high-viscosity atomizing medium.

[0084] Furthermore, the thermal conductivity of the pot body 1 is K1, and when η≥500mPa·s, K1≥15W / (m·K). In this way, by making the pot body 1 have a high thermal conductivity, the heat generated by the heating element 202 can be transferred to various areas of the pot body 1 more quickly, and then transferred to the atomizing medium in the atomizing chamber 4 through the pot body 1, which is beneficial to improving the preheating effect and shortening the preheating time.

[0085] For example, when η≥500mPa·s, the material of the pot body 1 can be alumina ceramic or silicon carbide ceramic, etc.

[0086] Understandably, the higher the thermal conductivity of the pot body 1, the easier it is for the heat generated by the heating element 202 to dissipate through the pot body 1 during use. To address this, in a further embodiment, when η ≥ 500 mPa·s, the thermal conductivity of the pot body 1 is set to be positively correlated with the viscosity of the atomizing medium. This shortens the preheating time, improving the user experience, while simultaneously preventing excessively high thermal conductivity of the pot body 1, which could lead to significant heat loss during use.

[0087] Furthermore, when η < 500 mPa·s, K1 < 15 W / (m·K). It can be understood that in this embodiment, when η < 500 mPa·s, the atomizing medium has good fluidity and can be transferred to the heating element 202 through the substrate 201 without preheating. Based on this, by setting the pot body 1 to have a low thermal conductivity, heat loss can be reduced, thereby improving the atomization efficiency of the heating element 202.

[0088] For example, when η < 500 mPa·s, the material of the pot body 1 can be zirconia ceramic, etc.

[0089] As mentioned above, the atomizing core 2 includes a substrate 201 and a heating element 202.

[0090] In some embodiments, the substrate 201 of the atomizing core 2 has a through hole, which is used to form the atomizing chamber 4.

[0091] For example, such as Figures 1-6 As shown, the radial cross-section of the through hole can be circular, square, semi-circular, or irregular in shape; this application does not impose specific limitations on this. Adaptive designs can be implemented as needed during implementation.

[0092] Furthermore, the extension direction of the through hole is preferably parallel to the bottom wall 101. This better prevents leakage from concentrating at one end of the through hole, thereby further preventing the atomizing medium from leaking to the outside of the product and improving the utilization rate of the atomizing medium.

[0093] Of course, the extension direction of the through hole is parallel to the bottom wall 101, which is not a limitation of this application; in specific implementation, the extension direction of the through hole can also be set to have a certain angle with the bottom wall 101 as needed.

[0094] Furthermore, the heating element 202 is arranged at least on the inner wall of the aforementioned through hole near the storage cavity 3. In this way, the heating element 202 is provided on the inner wall of the atomizing cavity 4 near the storage cavity 3 (hereinafter referred to as the first inner wall for ease of description). It can be understood that among all the inner walls of the atomizing cavity 4, the transmission path between the first inner wall and the storage cavity 3 is the shortest. Therefore, in this embodiment, the heating element 202 is arranged at least on the first inner wall, which is beneficial to improving the atomization efficiency.

[0095] In some implementations, such as Figure 1 As shown, the radial cross-section of the atomizing cavity 4 is circular, and the heating element 202 is a spiral heating wire; as Figure 9As shown, the heating wire is arranged around the inner wall of the atomizing chamber 4, that is, in the radial direction of the atomizing chamber 4, the heating wire is arranged around the entire inner wall of the atomizing chamber 4. This helps to make the heating temperature more uniform. Furthermore, since the inner wall of the atomizing chamber 4 away from the storage chamber 3 is also provided with a heating element 202, the atomizing medium dripping to the bottom of the atomizing chamber 4 during use can be atomized in time, thereby reducing the risk of the atomizing medium accumulating at the bottom of the atomizing chamber 4 due to its high viscosity, which could lead to blockage of the atomizing channel.

[0096] In some implementations, such as Figure 1 As shown, the radial cross-section of the atomizing cavity 4 is circular, and the heating element 202 is an arc-shaped heating plate; unlike the previous embodiment, as... Figure 11 As shown, in this embodiment, only the upper half of the inner wall of the atomizing chamber 4 is provided with a heating element 202. In comparison, the heat dissipation area of ​​the heating element 202 in this embodiment is smaller. Under the premise of the same power, the heat dissipation speed of the heating element 202 is smaller, and the atomization efficiency is relatively higher.

[0097] It should be understood that the above is only an example of the arrangement of the heating element 202 with the radial cross-section of the atomizing cavity 4 being circular. However, this application is not limited to this. For example, the radial cross-section of the atomizing cavity 4 is square, the heating element 202 is a heating plate, and the heating plate is arranged on the entire inner wall of the atomizing cavity 4 in the radial direction; or, the radial cross-section of the atomizing cavity 4 is square, the heating element 202 is a heating plate, and the heating plate is arranged on the top wall and side wall of the heating cavity.

[0098] In some embodiments, the thermal conductivity of the substrate 201 is K2, and when η≥500mPa·s, 0.5W / (m·K)≤K2≤5W / (m·K). It is understood that if the thermal conductivity of the substrate 201 is too low, the heat generated by the heating element 202 will not easily be transferred to the pot body 1 through the substrate 201, resulting in poor preheating of the pot body 1. However, if the thermal conductivity of the substrate 201 is too high, the atomization energy generated by the heating element 202 will easily dissipate through the substrate 201, resulting in low atomization efficiency of the heating pot 100. In this embodiment, when the atomizing medium is a high-viscosity atomizing medium, the thermal conductivity of the substrate 201 is controlled to be greater than or equal to 0.5W / (m·K) and less than or equal to 5W / (m·K). In this way, both the preheating effect is ensured and the loss of atomization energy generated by the heating element 202 is reduced.

[0099] Furthermore, when η < 500 mPa·s, K2 ≤ 0.5 W / (m·K). This reduces energy loss and thus improves atomization efficiency.

[0100] In some embodiments, the end face of the through hole is flush with and / or protrudes from the outer wall surface of the pot body 1. This configuration significantly improves the connection between the portion of the substrate 201 used to form the through hole and the pot body 1.

[0101] In other embodiments, the end face of the through hole is located between the inner wall surface and the outer wall surface of the pot body 1.

[0102] In some embodiments, such as Figure 8 , Figure 9 , Figure 11 , Figure 13 , Figure 15 and Figure 17 As shown, the surface of the atomizing core 2 used to form the storage cavity 3 is an oil guiding surface 2011, and the oil guiding surface 2011 is a plane.

[0103] In other embodiments, such as Figure 19 As shown, the surface of the atomizing core 2 that forms the storage cavity 3 is an oil-guiding surface 2011, and this oil-guiding surface 2011 is curved. Compared with the previous embodiment, in this embodiment, by setting the oil-guiding surface 2011 as a curved surface, it is more advantageous to reduce the volume of the atomizing core 2 under the premise of the same oil-guiding surface area; at the same time, this setting method is also beneficial to shorten the oil supply path, thereby facilitating rapid liquid guiding, reducing heat loss, and improving atomization efficiency.

[0104] In some embodiments, the arrangement direction of the storage cavity 3 and the mounting cavity is a first direction; the cross section of the mounting cavity perpendicular to the first direction is a first cross section, and in the first direction, the area of ​​the first cross section is negatively correlated with the distance from the first cross section to the storage cavity 3.

[0105] In the above configuration, the upper part of the heating pot 100 (i.e., the part of the pot body 1 used to form the storage cavity 3) is larger, which is beneficial for increasing the size of the injection port used to fill the atomizing medium, thus making it easier to fill the atomizing medium. Simultaneously, this configuration helps to reduce the volume of the substrate 201 of the atomizing core 2. It is understood that the substrate 201 is made of porous ceramic material, and porous ceramic materials generally have low thermal conductivity. Therefore, if the volume of the substrate 201 is large, it will be difficult for the heat from the heating element 202 to be transferred to the pot body 1, thereby affecting the preheating effect of the heating pot 100. In other words, the above configuration of this application is beneficial for improving the preheating effect of the heating pot 100. Furthermore, the miniaturized substrate 201 allows for relatively concentrated heat during the atomization stage, thus improving atomization efficiency.

[0106] In exemplary embodiments, such as Figures 1-6 As shown, the portion of the pot body 1 used to form the storage cavity 3 can be cylindrical or cubic; the portion of the pot body 1 used to form the mounting cavity can be wedge-shaped or conical.

[0107] Furthermore, this application also provides an atomizing device, which includes a heating pot 100 and a power supply unit. The heating pot 100 is the same as the heating pot 100 in any of the above embodiments, and the power supply unit includes a power source, which is electrically connected to a plurality of pins 203 in the heating pot 100. It should be noted that since the atomizing device includes the aforementioned heating pot 100, the beneficial effects of the heating pot 100 on the atomizing device are detailed above and will not be repeated here.

[0108] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0109] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0110] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0111] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0112] It should be understood that the qualifiers “first,” “second,” “third,” “fourth,” “fifth,” and “sixth” used in the description of the embodiments of this application are only used to more clearly illustrate the technical solutions and are not intended to limit the scope of protection of this application.

[0113] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A heat pot, characterized by, include: The pot body has an internal storage cavity for storing the atomizing medium and an installation cavity adjacent to the storage cavity; The pot body has a bottom wall, a first side wall and a second side wall. The bottom wall is a wall panel on the side of the mounting cavity away from the storage cavity. The first side wall has an airflow inlet and the second side wall has an airflow outlet. An atomizing core is disposed within the mounting cavity, and the atomizing core and the inner wall of the pot together form the storage cavity; an atomizing chamber is formed inside the atomizing core, the atomizing chamber having an air inlet and an air outlet, the air inlet being directly opposite the airflow inlet and the air outlet being directly opposite the airflow outlet; the atomizing core has multiple pins for connecting to a power source, and the multiple pins extend from the airflow inlet and / or the airflow outlet to the outside of the pot body.

2. The heat pot according to claim 1, wherein The atomizing core and the pot body are an integral part.

3. The heat pot according to claim 2, wherein The difference between the thermal expansion coefficient of the pot body and the thermal expansion coefficient of the base of the atomizing core is N, and N≤1.5×10 -6 / ℃.

4. The heating pot according to any one of claims 1-3, characterized in that, The viscosity of the atomizing medium is η, and the thermal conductivity of the pot body is K1; Furthermore, when η≥500mPa·s, K1≥15W / (m·K); when η<500mPa·s, K1<15W / (m·K).

5. The heating pan according to any one of claims 1-3, characterized in that, The atomizing core includes: The substrate has through holes that are disposed throughout and used to form the atomizing cavity; A heating element is disposed at least on the inner wall of the through hole near the storage cavity.

6. The heating pot according to claim 5, characterized in that, The viscosity of the atomizing medium is η, and the thermal conductivity of the matrix is ​​K2; Furthermore, when η≥500mPa·s, 0.5W / (m·K)≤K2≤5W / (m·K); when η<500mPa·s, K2≤0.5W / (m·K).

7. The heating pot according to claim 5, characterized in that, The end face of the through hole is flush with and / or protrudes from the outer wall of the pot body.

8. The heating pan according to any one of claims 1-3, characterized in that, The surface of the atomizing core that forms the storage cavity is an oil-guiding surface, and the oil-guiding surface is curved.

9. The heating pot according to any one of claims 1-3, characterized in that, The storage cavity and the mounting cavity are arranged in a first direction; The section of the mounting cavity perpendicular to the first direction is the first section. In the first direction, the area of ​​the first section is negatively correlated with the distance from the first section to the storage cavity.

10. An atomizing device, characterized in that, include: The heating pot is the heating pot according to any one of claims 1-9; The power supply unit includes a power source, which is electrically connected to multiple pins in the heating pot.

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