Aerosol generation device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-23
- Publication Date
- 2026-08-11
AI Technical Summary
[0004]本申请提供一种气溶胶产生装置,能解决加热腔的温度散出至外壳导致烫手的问题
[0014]本申请提供了一种气溶胶产生装置,气溶胶产生装置包括外壳、装配组件、加热件和热对流组件。外壳内设有安装腔,外壳上设置有散热孔,散热孔用于连通安装腔与外壳的外部;装配组件设置于安装腔内;装配组件内设有加热腔,加热腔用于容纳气溶胶基质;加热件设置于装配组件内,装配组件用于固定加热件,加热件用于加热气溶胶基质;热对流组件设置于装配组件的外侧面与安装腔的内侧面之间;热对流组件被配置为驱动装配组件的外侧面与外壳的内侧面之间的气体流动,以将装配组件的热量通过散热孔排出。本申请的气溶胶产生装置中,加热腔位于装配组件的内部,通过在装配组件的外侧面与安装腔的外侧面之间设置热对流组件,加热腔内的温度扩散至装配组件的外侧面,热对流能够驱动装配组件的外侧面与外壳的内侧面之间的气体流动,加速装配组件与外壳之间的气体与外壳外部的气体之间的热对流,加速装配组件的外侧的热量的排出,由此防止外壳热量过高导致烫手的问题。
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Figure CN224611844U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of aerosol generation technology, specifically to an aerosol generating device. Background Technology
[0002] An aerosol generating device is a device used to heat and atomize an aerosol matrix. Aerosol generating devices are usually equipped with a heating chamber. Users can insert the aerosol matrix into the heating chamber to heat the aerosol matrix, so that the aerosol matrix generates aerosols for users to inhale.
[0003] When the aerosol generating device heats the aerosol matrix, the heating chamber will have a high temperature. Some of the heat from the heating chamber will dissipate to the outer shell of the aerosol generating device, which may make the user's hand feel hot when holding the outer shell, resulting in a bad user experience. Utility Model Content
[0004] This application provides an aerosol generating device that can solve the problem of the temperature of the heating chamber dissipating to the outer shell and causing it to become too hot to touch.
[0005] To address the aforementioned technical problems, this application provides an aerosol generating device, comprising a housing, an assembly assembly, a heating element, and a heat convection assembly. The housing has an internal mounting cavity and heat dissipation holes for connecting the mounting cavity to the outside of the housing. The assembly assembly is disposed within the mounting cavity. The assembly assembly contains a heating cavity for containing the aerosol matrix. The heating element is disposed within the assembly assembly, which fixes the heating element and heats the aerosol matrix. The heat convection assembly is disposed between the outer surface of the assembly assembly and the inner surface of the mounting cavity. The heat convection assembly is configured to drive gas flow between the outer surface of the assembly assembly and the inner surface of the housing to dissipate heat from the assembly assembly through the heat dissipation holes.
[0006] In one embodiment, the heat dissipation holes are disposed opposite to the heat convection components.
[0007] In one embodiment, the heat convection component is disposed in contact with the outer surface of the assembly component.
[0008] In one embodiment, one end of the assembly component has a first socket, and the outer shell has a second socket. The second socket, the first socket, and the heating chamber are arranged in sequence opposite to each other. The first socket and the second socket are used to allow the aerosol matrix to be inserted into the heating chamber. The heat convection component is disposed on the outer side of the assembly component near the first socket, and the heat dissipation hole is disposed on the outer shell near the second socket.
[0009] In one embodiment, the assembly includes a heat-insulating sleeve with a receiving cavity inside, and a heating element disposed inside the receiving cavity;
[0010] The heat insulation sleeve has a first side and a second side opposite to each other along its radial direction. The aerosol generating device also includes a circuit board disposed within the mounting cavity, with the circuit board spaced apart from the first side of the heat insulation sleeve. A heat convection component is disposed on the second side of the heat insulation sleeve. The distance between the outer surface of the first side of the heat insulation sleeve and the inner surface of the mounting cavity is greater than the distance between the outer surface of the second side of the heat insulation sleeve and the inner surface of the mounting cavity.
[0011] In one embodiment, the thermal conductivity of the insulation sleeve is less than or equal to 1 W / (m·K).
[0012] In one embodiment, the aerosol generating device further includes a bracket and a power supply. The bracket is disposed in the mounting cavity and cooperates with the housing to divide the mounting cavity into a first assembly cavity, a second assembly cavity, and a third assembly cavity. The second assembly cavity and the third assembly cavity are arranged at intervals along the axial direction of the housing. The first assembly cavity is disposed at intervals on the same side of the second assembly cavity and the third assembly cavity. The circuit board is disposed in the first assembly cavity. The assembly components, heating elements, and heat convection components are disposed in the second assembly cavity. The power supply is disposed in the third assembly cavity.
[0013] In one embodiment, the heat convection component includes a fan.
[0014] This application provides an aerosol generating device, which includes a housing, an assembly assembly, a heating element, and a heat convection assembly. The housing has a mounting cavity and heat dissipation holes for connecting the mounting cavity to the outside of the housing. The assembly assembly is disposed within the mounting cavity. The assembly assembly has a heating cavity for containing the aerosol matrix. The heating element is disposed within the assembly assembly, which is used to fix the heating element and heat the aerosol matrix. The heat convection assembly is disposed between the outer surface of the assembly assembly and the inner surface of the mounting cavity. The heat convection assembly is configured to drive gas flow between the outer surface of the assembly assembly and the inner surface of the housing to dissipate heat from the assembly assembly through the heat dissipation holes. In the aerosol generating device of this application, the heating chamber is located inside the assembly assembly. By providing a heat convection component between the outer side of the assembly assembly and the outer side of the mounting cavity, the temperature inside the heating chamber diffuses to the outer side of the assembly assembly. The heat convection can drive the gas flow between the outer side of the assembly assembly and the inner side of the shell, accelerate the heat convection between the gas between the assembly assembly and the shell and the gas outside the shell, and accelerate the heat dissipation from the outside of the assembly assembly, thereby preventing the shell from getting too hot and causing burns. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the structure of an aerosol generating device provided in an embodiment of this application;
[0016] Figure 2 This is a cross-sectional view of an aerosol generating apparatus provided in an embodiment of this application;
[0017] Figure 3 An exploded view of an aerosol generating apparatus provided in an embodiment of this application;
[0018] Figure 4 This is a schematic diagram of the structure of a heat insulation sleeve provided in an embodiment of this application.
[0019] Reference numerals: outer shell 10, mounting cavity 11, heat dissipation hole 12, second socket 13, assembly component 20, heating cavity 21, first socket 22, heat insulation sleeve 23, accommodating cavity 231, first side 232, second side 233, heat insulation cavity 235, base 24, heating element 30, heat convection component 40, aerosol matrix 50, circuit board 70, bracket 80, first assembly cavity 81, second assembly cavity 82, third assembly cavity 83, power supply 90. Detailed Implementation
[0020] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.
[0021] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments, and the operational steps involved in each embodiment can also be rearranged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for clearly describing a particular embodiment and do not imply that they represent the necessary components and / or order.
[0022] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).
[0023] The terms "parallel" and "perpendicular," etc., are specific to the current technological level, not absolute mathematical definitions. Slight deviations are permissible; approximations of parallelism or perpendicularity are acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, with the angle between A and B ranging from 0° to 10°. Similarly, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, with the angle between A and B ranging from 80° to 100°. The directional terms used in the embodiments of this application, such as "upper," "inner," "outer," and "side," are merely for reference to the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.
[0024] Please refer to Figure 1-2 This application provides an aerosol generating device, which includes a housing 10, an assembly 20, a heating element 30, and a heat convection assembly 40.
[0025] The housing 10 has an installation cavity 11 inside and a heat dissipation hole 12 on the housing 10. The heat dissipation hole 12 is used to connect the installation cavity 11 with the outside of the housing 10 so that the gas in the installation cavity 11 can flow out of the housing 10 through the heat dissipation hole 12, and the gas outside the housing 10 can also enter the installation cavity 11 through the heat dissipation hole 12.
[0026] Assembly component 20 is disposed within mounting cavity 11, and assembly component 20 includes heating cavity 21 for containing aerosol matrix 50. Aerosol matrix 50 includes at least matrix segments, wherein the matrix segments are used to generate aerosols upon heating. In one embodiment, aerosol matrix 50 further includes a coating layer that surrounds the matrix segments. The matrix segments are primarily composed of tobacco, herbal or plant leaves, or medicinal materials. It is understood that the materials forming the matrix segments are not limited; the matrix segments can be formed from a single material or from a mixture of multiple materials in different proportions.
[0027] The wrapping layer can be formed of a wrapping material such as paper, thereby maintaining the shape of the substrate segment. The material for forming the wrapping layer is not limited to this; in other embodiments, the wrapping layer can also be formed of other materials such as aluminum foil to meet different requirements.
[0028] A heating element 30 is disposed within an assembly 20, which is used to fix the heating element 30. The heating element 30 is used to heat the aerosol matrix 50. The heating element 30 may define a heating cavity 21; for example, the heating element 30 may be a tubular structure. Alternatively, in other embodiments, the assembly 20 may define the heating cavity 21, and the assembly 20 may have a tubular structure, with the heating element 30 disposed within the heating cavity 21. In some embodiments, the heating element 30 may also be a needle-like structure. In some embodiments, the heating element 30 may be, but is not limited to, resistance heating, electromagnetic induction heating, infrared heating, microwave heating, or ultrasonic heating.
[0029] The heat convection component 40 is disposed between the outer side of the assembly component 20 and the inner side of the mounting cavity 11. The "side wall" or "side surface" as defined in this application can be a wall or surface that is approximately parallel to, nearly parallel to, or has an angle of less than 45 degrees with the axial direction of the heating cavity 21. Since the heating cavity 21 usually needs to insert a cylindrical or near-cylindrical aerosol matrix 50, the shape of the heating cavity 21 is basically adapted to the shape of the aerosol matrix 50. Therefore, the axial direction of the heating cavity 21 is a relatively definite direction, that is, the axis of a cylindrical, elliptical, near-cylindrical, or near-elliptical shape.
[0030] The heat convection assembly 40 is configured to drive gas flow between the outer surface of the assembly assembly 20 and the inner surface of the housing 10 to dissipate heat from the assembly assembly 20 through the heat dissipation holes 12. The heat convection assembly 40 generally refers to an electrically driven device that accelerates nearby gas flow when energized. For example, in some embodiments, the heat convection assembly 40 may include at least one of a centrifugal fan and a piezoelectric-driven airflow device. A centrifugal fan typically generates airflow by rotating fan blades driven by a motor. A piezoelectric-driven airflow device, for example, can utilize the inverse piezoelectric effect of a piezoelectric material (such as piezoelectric ceramics) to drive airflow through high-frequency vibration; common forms include piezoelectric fans or piezoelectric diaphragm pumps.
[0031] In the aerosol generating device of this application, the heating chamber 21 is located inside the assembly assembly 20. By providing a heat convection assembly 40 between the outer surface of the assembly assembly 20 and the outer surface of the mounting cavity 11, the temperature inside the heating chamber 21 diffuses to the outer surface of the assembly assembly 20. This heat convection drives the gas flow between the outer surface of the assembly assembly 20 and the inner surface of the outer shell 10, accelerating the heat convection between the gas between the assembly assembly 20 and the outer shell 10 and the gas outside the outer shell 10, thus accelerating the removal of heat from the outside of the assembly assembly 20 and preventing the outer shell 10 from becoming too hot and causing burns. It is understood that there is a certain gap between the outer surface of the assembly assembly 20 and the inner surface of the outer shell 10.
[0032] Furthermore, the heat convection component 40 of this application is disposed between the outer side of the assembly component 20 and the inner side of the outer shell 10. Compared to the bottom of the assembly component 20, the outer side of the assembly component 20 is usually the main heat distribution area of the assembly component 20. On the one hand, the heating element 30 may be configured to heat in a circumferential manner, making it easier to dissipate heat to the outer side of the assembly component 20. On the other hand, during the user's suction process, the aerosol usually flows from bottom to top along the axial direction of the aerosol matrix 50, and its heat is more easily diffused to the outer side of the assembly component 20 during the flow. Moreover, for a more compact structure, there may be a narrow gap between the outer side of the assembly component 20 and the inner side of the outer shell 10, resulting in a shorter heat transfer path between the sidewall of the assembly component 20 and the sidewall of the outer shell 10. This may cause the part of the outer shell 10 with a narrow gap from the assembly component 20 to overheat. Therefore, placing the heat convection component 40 between the outer side of the assembly component 20 and the inner side of the housing 10 has a better heat dissipation effect. In addition, the assembly component 20 is usually designed to be spaced apart from the housing 10. Placing the heat convection component 40 in the gap between the two utilizes the redundant space, without having to increase the width or height of the device, which is more conducive to a compact structural design.
[0033] In one embodiment, the heat dissipation hole 12 is positioned opposite to the heat convection component 40. This relative positioning generally means that the airflow path between them is roughly straight. Of course, the heat dissipation hole 12 can also be slightly offset from the heat convection component 40, but the offset should not be too large, and the airflow path should not be too long. By positioning the heat dissipation hole 12 opposite to the heat convection component 40, the airflow generated by the heat convection component 40 is directly aligned with the heat dissipation hole 12, forming the shortest path and minimizing airflow resistance. This results in a high flow velocity at the heat dissipation hole 12, allowing hot air to be quickly expelled and preventing backflow. If the distance between the heat dissipation hole 12 and the heat convection component 40 is too long, the airflow may need to bypass obstacles, resulting in a tortuous path that can easily generate local turbulence, reducing heat dissipation efficiency.
[0034] In one embodiment, such as Figure 2 As shown, the heat convection component 40 is disposed in close contact with the outer surface of the assembly component 20. Compared to a scheme where the heat convection component 40 is spaced apart from the outer surface of the assembly component 20, when the heat convection component 40 is disposed in close contact with the assembly component 20, the heat convection component 40 is closer to the outer surface of the assembly component 20, making it easier to drive airflow on the surface of the assembly component 20 and improving heat dissipation efficiency. In some embodiments, the heat convection component 40 can also be sandwiched between the assembly component 20 and the housing 10. Figure 3As shown, in some embodiments, a mounting groove can be provided on the outer wall of the heat convection assembly 40, and a part of the structure of the heat convection assembly 40 is disposed in the mounting groove. The mounting groove is used to limit the heat convection assembly 40 and prevent the heat convection assembly 40 from moving.
[0035] In one embodiment, such as Figure 2 As shown, one end of the assembly component 20 has a first socket 22, and the outer shell 10 has a second socket 13. The second socket 13, the first socket 22, and the heating chamber 21 are arranged in sequence opposite to each other. Specifically, the second socket 13, the first socket 22, and the heating chamber 21 are arranged in sequence along the axial direction of the heating chamber 21. The first socket 22 and the second socket 13 are used to allow the aerosol matrix 50 to be inserted into the heating chamber 21. The heat convection component 40 is disposed on the outer side of the assembly component 20 near the first socket 22, and the heat dissipation hole 12 is disposed on the outer shell 10 near the second socket 13. Since the aerosol moves from the bottom to the top (the side closer to the first socket 22 and the second socket 13) of the aerosol matrix 50, the heat on the side of the assembly 20 closer to the first socket 22 may be higher than that on the side farther from the first socket 22. Therefore, the heat convection component 40 can be placed on the side closer to the first socket 22, and the heat dissipation hole 12 can be placed on the side of the housing 10 closer to the second socket 13, so that the heat on the side of the assembly 20 closer to the first socket 22 can be more easily dissipated through the heat dissipation hole 12.
[0036] In one embodiment, such as Figures 2-4 As shown, the assembly assembly 20 includes a heat-insulating sleeve 23, within which a receiving cavity 231 is provided, and a heating element 30 is disposed within the receiving cavity 231. The heat-insulating sleeve 23 is typically configured to be made of a material with low thermal conductivity; for example, in one embodiment, the thermal conductivity of the heat-insulating sleeve 23 is less than or equal to 1 W / (m·K). This further isolates heat within the heat-insulating sleeve 23, further preventing heat dissipation from the assembly assembly 20 to the housing 10.
[0037] The heat insulation sleeve 23 has a first side 232 and a second side 233 opposite to each other along its radial direction. The aerosol generating device also includes a circuit board 70, which is disposed in the mounting cavity 11 and spaced apart from the first side 232 of the heat insulation sleeve 23. The heat convection assembly 40 is disposed on the second side 233 of the heat insulation sleeve 23. The distance between the outer surface of the first side 232 of the heat insulation sleeve 23 and the inner surface of the mounting cavity 11 is greater than the distance between the outer surface of the second side 233 of the heat insulation sleeve 23 and the inner surface of the mounting cavity 11. This allows the first side 232 of the heat insulation sleeve 23 to have more space to install the circuit board 70 and other electronic components. Since the second side 233 of the heat insulation sleeve 23 is closer to the housing than the first side 232, the heat convection assembly 40 needs to be disposed on the second side 233 of the heat insulation sleeve 23 for heat dissipation.
[0038] In one embodiment, such as Figure 2 and Figure 3 As shown, the aerosol generating device also includes a bracket 80 and a power supply 90. The bracket 80 is disposed within the mounting cavity 11 and, in conjunction with the outer casing 10, divides the mounting cavity 11 into a first assembly cavity 81, a second assembly cavity 82, and a third assembly cavity 83. The second assembly cavity 82 and the third assembly cavity 83 are spaced apart along the axial direction of the outer casing 10. The first assembly cavity 81 is spaced apart on the same side of the second assembly cavity 82 and the third assembly cavity 83. The circuit board 70 is disposed in the first assembly cavity 81, the assembly component 20, the heating element 30, and the heat convection component 40 are disposed in the second assembly cavity 82, and the power supply 90 is disposed in the third assembly cavity 83. This allows for a more modular design within the mounting cavity 11, reducing the likelihood of heat transfer between the three assembly cavities and preventing heat transfer from the assembly component 20 to the assembly cavity containing the power supply 90 or the circuit board 70. Therefore, both the bracket 80 and the outer casing 10 can be configured with materials with low thermal conductivity to further prevent heat transfer between the assembly cavities.
[0039] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.
Claims
1. An aerosol generating device, characterized in that, include: The housing has an internal mounting cavity and heat dissipation holes on its surface, which connect the mounting cavity to the outside of the housing. An assembly assembly is disposed within the mounting cavity; the assembly assembly includes a heating cavity for containing an aerosol matrix. A heating element is disposed within the assembly assembly, the assembly assembly being used to fix the heating element, and the heating element being used to heat the aerosol matrix; And a heat convection assembly disposed between the outer side of the assembly and the inner side of the mounting cavity; the heat convection assembly is configured to drive gas flow between the outer side of the assembly and the inner side of the housing to dissipate heat from the assembly through the heat dissipation holes.
2. The aerosol generating device according to claim 1, characterized in that, The heat dissipation holes are positioned opposite to the heat convection components.
3. The aerosol generating device according to claim 1, characterized in that, The heat convection component is disposed in close contact with the outer surface of the assembly component.
4. The aerosol generating device according to claim 1, characterized in that, One end of the assembly component has a first socket, and the outer shell has a second socket. The second socket, the first socket, and the heating cavity are arranged in sequence opposite to each other. The first socket and the second socket are used to allow the aerosol matrix to be inserted into the heating cavity. The heat convection component is disposed on the outer side of the assembly component near the first socket, and the heat dissipation hole is disposed on the outer shell near the second socket.
5. The aerosol generating device according to claim 1, characterized in that, The assembly includes a heat-insulating sleeve, the heat-insulating sleeve having a receiving cavity, and the heating element being disposed within the receiving cavity; The heat insulation sleeve has a first side and a second side opposite to each other in its radial direction. The aerosol generating device also includes a circuit board, which is disposed in the mounting cavity and spaced apart from the first side of the heat insulation sleeve. The heat convection component is disposed on the second side of the heat insulation sleeve. The distance between the outer surface of the first side of the heat insulation sleeve and the inner surface of the mounting cavity is greater than the distance between the outer surface of the second side of the heat insulation sleeve and the inner surface of the mounting cavity.
6. The aerosol generating apparatus according to claim 5, characterized in that, The thermal conductivity of the insulation sleeve is less than or equal to 1 W / (m·K).
7. The aerosol generating apparatus according to claim 5, characterized in that, The aerosol generating device further includes a bracket and a power supply. The bracket is disposed in the mounting cavity and cooperates with the outer shell to divide the mounting cavity into a first assembly cavity, a second assembly cavity, and a third assembly cavity. The second assembly cavity and the third assembly cavity are arranged at intervals along the axial direction of the outer shell. The first assembly cavity is spaced apart on the same side of the second assembly cavity and the third assembly cavity. The circuit board is disposed in the first assembly cavity. The assembly assembly, the heating element, and the heat convection assembly are disposed in the second assembly cavity. The power supply is disposed in the third assembly cavity.
8. The aerosol generating apparatus according to claim 1, characterized in that, The heat convection assembly includes a fan.