Endoscope module and endoscope

Abstract

This application relates to the field of endoscope technology, specifically disclosing an endoscope module and an endoscope. The endoscope module includes: a lens assembly, comprising at least a first lens and a second lens arranged sequentially, with the ineffective areas of the first lens and the second lens bonded and fixed together by adhesive; a photosensitive chip disposed on one side of the lens assembly; a circuit board disposed on the side of the photosensitive chip away from the lens assembly and electrically connected to the photosensitive chip; a wire harness disposed on the side of the circuit board away from the photosensitive chip and electrically connected to the circuit board; a first adhesive bonded between the lens assembly and the photosensitive chip to fix the lens assembly and the photosensitive chip together, and the lens assembly and the photosensitive chip are coaxial; a second adhesive bonded between the photosensitive chip and the circuit board to fix the photosensitive chip and the circuit board together; and a light-shielding film disposed around the lens assembly, the first adhesive, and the photosensitive chip. The endoscope module of this application facilitates the miniaturization of endoscopes.

Description

Technical Field

[0001] This application relates to the field of endoscope technology, specifically to an endoscope module and an endoscope. Background Technology

[0002] An endoscope is a medical device that enters the body through natural cavities or minimally invasive incisions for observation, diagnosis, or surgical assistance. Its technology involves optical imaging, electronic sensing, mechanical transmission, and materials science, and it is widely used in minimally invasive clinical medicine. Because endoscopes need to penetrate deep into the body's narrow cavities, miniaturization has become an urgent need in the medical industry. However, limitations in its support structure and endoscope tube have made it difficult to further reduce the size of endoscopes. Utility Model Content

[0003] In view of the above, it is necessary to propose an endoscope module and endoscope to enable miniaturization of the endoscope.

[0004] This application provides an endoscope module, comprising: a lens assembly, including at least a first lens and a second lens arranged sequentially, wherein the ineffective areas of the first lens and the ineffective areas of the second lens are bonded and fixed together by adhesive; a photosensitive chip disposed on one side of the lens assembly; a circuit board disposed on the side of the photosensitive chip away from the lens assembly and electrically connected to the photosensitive chip; a wire harness disposed on the side of the circuit board away from the photosensitive chip and electrically connected to the circuit board; a first adhesive bonded between the lens assembly and the photosensitive chip to fix the lens assembly and the photosensitive chip together, wherein the lens assembly and the photosensitive chip are coaxial; a second adhesive bonded between the photosensitive chip and the circuit board to fix the photosensitive chip together; and a light-shielding film disposed around the lens assembly, the first adhesive, and the photosensitive chip.

[0005] The aforementioned endoscope module, by defining the first colloid to bond the lens assembly and the photosensitive chip, ensures a stable connection between the lens assembly and the photosensitive chip, guaranteeing structural strength and maintaining stable resolution of the photosensitive chip. Simultaneously, it reduces the length of the endoscope module along the optical axis, facilitating miniaturization and meeting the miniaturization requirements of medical applications. Furthermore, by placing a light-shielding film around the lens assembly, the first colloid, and the photosensitive chip, the film effectively blocks light, ensuring the imaging quality of the lens assembly and the photosensitive chip. This also reduces the size of the endoscope module perpendicular to the optical axis, further enhancing the endoscope's compactness. The module achieves miniaturization, meeting the miniaturization requirements of medical devices; by setting a second colloid, the side of the photosensitive chip away from the lens assembly is effectively sealed, improving the waterproof and dustproof performance of the endoscope module; by setting a circuit board and wiring harness, the endoscope module can be connected to an external processing module, which is beneficial for signal transmission; by defining the non-effective areas of the first and second lenses of the lens assembly and fixing them together with adhesive, the traditional lens barrel structure is eliminated, reducing the length of the endoscope module along the optical axis, which is conducive to miniaturization of the endoscope module and reducing raw material costs.

[0006] In some embodiments, the light-shielding film satisfies the following relationship: OD > 3, Tave < 0.1%, where OD is the optical density of the material used in the light-shielding film, and Tave is the average light transmittance of the material used in the light-shielding film.

[0007] The aforementioned endoscope module, by satisfying the above-mentioned relationship, ensures that the light transmittance of the light-shielding film is less than 0.1%, thereby ensuring the light-shielding effect of the light-shielding film.

[0008] In some embodiments, the material used for the light-shielding film is UV-curable ink.

[0009] The aforementioned endoscope module ensures the light-blocking effect of the light-blocking film by using ultraviolet-cured ink as the material of the light-blocking film.

[0010] In some embodiments, the thickness of the light-shielding film ranges from 14 μm to 50 μm.

[0011] The aforementioned endoscope module, by limiting the thickness range of the light-shielding film layer, reasonably controls the thickness of the film layer, ensuring the light-shielding effect while meeting the miniaturization requirements of the endoscope module. However, when the thickness of the light-shielding film layer is less than 14μm, the film layer is too thin and cannot guarantee the light-shielding effect; when the thickness of the light-shielding film layer is greater than 50μm, the film layer is too thick, which is not conducive to the miniaturization of the endoscope module.

[0012] In some embodiments, the wavelength range of the light blocked by the light-shielding film is 420nm to 680nm.

[0013] The aforementioned endoscope module, by limiting the wavelength range of light blocked by the light-blocking film, enables the light-blocking film to block light within a wider wavelength range, thereby increasing the applicability of the endoscope module.

[0014] In some embodiments, the endoscope module further includes an encapsulating adhesive that encapsulates a portion of the wiring harness and bonds the encapsulating adhesive to the side of the circuit board away from the photosensitive chip.

[0015] The aforementioned endoscope module uses encapsulating adhesive to seal the connection between the circuit board and the wiring harness, ensuring a secure connection between them.

[0016] In some embodiments, the endoscope module further includes a filter disposed between the lens assembly and the first adhesive. The filter is bonded and fixed to the non-effective area of ​​the lens assembly by adhesive. The side of the filter away from the lens assembly is bonded and fixed to the first adhesive. The light-shielding film is also disposed around the periphery of the filter.

[0017] The aforementioned endoscope module, by including a filter, can filter out specific light rays, such as infrared light, thereby ensuring the imaging quality of the endoscope module. At the same time, the filter is bonded and fixed to the non-effective area of ​​the lens assembly with adhesive, and the filter is connected to the photosensitive chip through a first adhesive, reducing the length of the endoscope module along the optical axis, which is beneficial for miniaturizing the endoscope module.

[0018] In some embodiments, the first colloid is an optical adhesive.

[0019] The aforementioned endoscope module, by defining the first adhesive as an optical adhesive, which has extremely high transparency, UV resistance, anti-yellowing, high adhesion and high temperature resistance, can prevent the first adhesive from generating bubbles and light scattering during the bonding process, thus ensuring the original color and transparency of the lens assembly and not affecting the imaging quality of the lens assembly.

[0020] In some embodiments, the second colloid is filled between the photosensitive chip and the circuit board.

[0021] The aforementioned endoscope module effectively seals the side of the photosensitive chip away from the lens assembly by defining a second colloid to fill between the photosensitive chip and the circuit board, thereby improving the waterproof and dustproof performance of the endoscope module.

[0022] This application also provides an endoscope, including the endoscope module as described in any of the above technical solutions.

[0023] The aforementioned endoscope, in its endoscope module, secures the lens assembly and photosensitive chip by defining a first adhesive bond, ensuring a stable connection between the lens assembly and the photosensitive chip, guaranteeing structural strength, and maintaining stable resolution of the photosensitive chip while reducing the length of the endoscope module along the optical axis. This facilitates miniaturization of the endoscope module and meets the miniaturization requirements of medical applications. Furthermore, by setting a light-shielding film around the lens assembly, photosensitive chip, and the first adhesive, the film effectively blocks light, ensuring the imaging quality of the lens assembly and photosensitive chip. This also reduces the size of the endoscope module perpendicular to the optical axis, further contributing to miniaturization and meeting the miniaturization requirements of medical applications. The second adhesive effectively seals the side of the photosensitive chip away from the lens assembly, improving the waterproof and dustproof performance of the endoscope module. Finally, the inclusion of a circuit board and wiring harness allows the endoscope module to connect with an external processing module, facilitating signal transmission. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the endoscope module provided in the embodiments of this application.

[0025] Figure 2 yes Figure 1 The endoscope module shown is a cross-sectional view along line II-II.

[0026] Explanation of key component symbols: Endoscope module 100, Lens assembly 10, First lens 11, Second lens 12, Third lens 13, Filter 14, Photosensitive chip 20, First colloid 30, Light-shielding film 40, Circuit board 50, Second colloid 60, Wire harness 70, Encapsulating adhesive 80, Optical axis 200. Detailed Implementation

[0027] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0028] In the description of this application, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, it should be noted that "a plurality of" means two or more, unless otherwise explicitly specified.

[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows communication between the two components; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0030] The following will describe some embodiments of this application in detail with reference to the accompanying drawings.

[0031] Please see Figure 1 and Figure 2 This application provides an endoscope module 100. The endoscope module 100 includes a lens assembly 10, a photosensitive chip 20, a circuit board 50, a wiring harness 70, a first colloid 30, a second colloid 60, and a light-shielding film 40. In this embodiment, the cross-section of the endoscope module 100 along the direction perpendicular to the optical axis 200 is approximately quadrilateral. It is understood that in other embodiments, the cross-section of the endoscope module 100 may also be circular or other shapes.

[0032] The lens assembly 10 includes at least a first lens 11 and a second lens 12 arranged sequentially. The ineffective areas of the first lens 11 and the second lens 12 are bonded together with adhesive. A photosensitive chip 20 is disposed on one side of the lens assembly 10 and performs functions such as data processing and calculation, sensing and detection, and graphics and image processing. A circuit board 50 is disposed on the side of the photosensitive chip 20 away from the lens assembly 10 and is electrically connected to the photosensitive chip 20. A wiring harness 70 is disposed on the side of the circuit board 50 away from the photosensitive chip 20 and is electrically connected to the circuit board 50. The wiring harness 70 is used to connect to an external processing module, such as a processing chip, to transmit signals, and the wiring harness 70 makes the signal data transmission more stable.

[0033] The first adhesive 30 is bonded between the lens assembly 10 and the photosensitive chip 20 to fix the lens assembly 10 and the photosensitive chip 20 together, and the lens assembly 10 and the photosensitive chip 20 are coaxial. It can be understood that the lens assembly 10 and the photosensitive chip 20 are optically fixed-height bonded using the first adhesive 30 to ensure coaxiality. This satisfies the requirement for stable resolution of the photosensitive chip 20 while also reducing the length of the endoscope module 100 along the optical axis 200.

[0034] The second colloid 60 is bonded between the photosensitive chip 20 and the circuit board 50 to fix the photosensitive chip 20 to the circuit board 50. A light-shielding film 40 is disposed around the lens assembly 10, the first colloid 30, and the photosensitive chip 20. The light-shielding film 40 can be disposed around the lens assembly 10, the first colloid 30, and the photosensitive chip 20 by inkjet printing or ink application to eliminate stray light from the outside. It can be understood that the first colloid 30 can also be disposed around the photosensitive chip 20. When the first colloid 30 is disposed around the photosensitive chip 20, it can also be understood that the light-shielding film 40 is disposed around the photosensitive chip 20.

[0035] In this embodiment, the endoscope module 100, by using a first colloid 30 to bond the lens assembly 10 and the photosensitive chip 20, ensures a stable connection between the lens assembly 10 and the photosensitive chip 20, guaranteeing structural strength and maintaining stable resolution of the photosensitive chip 20. Simultaneously, it reduces the length of the endoscope module 100 along the optical axis 200, facilitating miniaturization and meeting medical miniaturization requirements. Furthermore, by providing a light-shielding film 40 around the lens assembly 10, the first colloid 30, and the photosensitive chip 20, the light-shielding film 40 provides light protection, ensuring the imaging quality of the lens assembly 10 and the photosensitive chip 20, while also reducing the size of the endoscope module 100 along the direction perpendicular to the optical axis 200. This design facilitates the miniaturization of the endoscope module 100, meeting the miniaturization requirements of medical applications. By using a second adhesive 60, the side of the photosensitive chip 20 furthest from the lens assembly 10 is effectively sealed, improving the waterproof and dustproof performance of the endoscope module 100. The circuit board 50 and wiring harness 70 enable connection between the endoscope module 100 and an external processing module, facilitating signal transmission. By bonding the non-effective areas of the first lens 11 and the second lens 12 of the lens assembly 10 with adhesive, the traditional lens barrel structure is eliminated, reducing the length of the endoscope module 100 along the optical axis 200, thus enabling miniaturization and reducing raw material costs. The endoscope module 100 of this embodiment is small, lightweight, compact, highly practical, and has stable resolution, making it widely applicable in endoscopes.

[0036] In this embodiment, the lens assembly 10 further includes a third lens element 13. The third lens element 13 is disposed between the second lens element 12 and the first adhesive 30, and the ineffective area of ​​the third lens element 13 and the ineffective area of ​​the second lens element 12 are bonded and fixed together with adhesive. Thus, by providing the first lens element 11, the second lens element 12, and the third lens element 13, the imaging quality of the lens assembly 10 can be improved.

[0037] In this embodiment, the endoscope module 100 further includes a filter 14. The filter 14 is disposed between the lens assembly 10 and the first colloid 30. The filter 14 is bonded and fixed to the non-effective area of ​​the lens assembly 10 with adhesive. The side of the filter 14 away from the lens assembly 10 is bonded and fixed to the first colloid 30. A light-shielding film 40 is also disposed around the periphery of the filter 14. Specifically, in this embodiment, the filter 14 is disposed between the third lens 13 and the first colloid 30. The filter 14 is bonded and fixed to the non-effective area of ​​the third lens 13 with adhesive. The side of the filter 14 away from the third lens 13 is bonded and fixed to the first colloid 30. The filter 14 can be an infrared filter, an infrared cut-off filter, or other filters. Thus, by including a filter 14 in the endoscope module 100, the endoscope module 100 can filter out specific light rays, such as infrared light, or allow only infrared light to pass through, thereby ensuring the imaging quality of the endoscope module 100. Simultaneously, the filter 14 is bonded and fixed to the ineffective area of ​​the lens assembly 10 with adhesive, and the filter 14 is connected to the photosensitive chip 20 through a first adhesive 30. This reduces the length of the endoscope module 100 along the optical axis 200, facilitating miniaturization of the endoscope module 100. Understandably, when the lens assembly 10 includes more or fewer lenses, the ineffective area on the image side of the lens farther from the first lens 11 is the ineffective area of ​​the lens assembly 10.

[0038] Understandably, in other embodiments, the lens assembly 10 may also include only the first lens 11 and the second lens 12, and the endoscope module 100 may also include a filter 14, which is disposed between the second lens 12 and the first colloid 30. The filter 14 is bonded and fixed to the non-effective area of ​​the second lens 12 by adhesive, and the side of the filter 14 away from the second lens 12 is bonded and fixed to the first colloid 30.

[0039] Understandably, in other embodiments, the lens assembly 10 may also include only a first lens 11 and a second lens 12 arranged in sequence, with the non-effective area of ​​the second lens 12 bonded and fixed to the first colloid 30.

[0040] Understandably, in other embodiments, the lens assembly 10 may also include only a first lens 11, a second lens 12 and a third lens 13 arranged in sequence, with the ineffective area of ​​the third lens 13 and the ineffective area of ​​the second lens 12 bonded and fixed together by adhesive, and the ineffective area of ​​the third lens 13 on the side away from the second lens 12 bonded and fixed together with the first adhesive 30.

[0041] Understandably, in other embodiments, the lens assembly 10 may also include only a first lens 11, a second lens 12, a third lens 13 and a fourth lens arranged in sequence, wherein the ineffective area of ​​the third lens 13 is bonded and fixed to the ineffective areas of the second lens 12 and the fourth lens by adhesive, and the ineffective area of ​​the fourth lens on the side away from the third lens 13 is bonded and fixed to the first adhesive 30.

[0042] Understandably, in other embodiments, the lens assembly 10 may also include only a first lens 11, a second lens 12, a third lens 13, and a fourth lens arranged in sequence, and the endoscope module 100 may also include a filter 14. The ineffective area of ​​the third lens 13 is bonded and fixed to the ineffective areas of the second lens 12 and the fourth lens respectively by adhesive. The filter 14 is bonded and fixed to the ineffective area of ​​the fourth lens by adhesive. The side of the filter 14 away from the fourth lens is bonded and fixed to the first adhesive 30.

[0043] Understandably, in other embodiments, the lens assembly 10 may also include more lenses, with the non-functional areas of the lenses bonded together by adhesive. This eliminates the traditional lens barrel structure, reduces the length of the endoscope module 100 along the optical axis 200, and facilitates miniaturization of the endoscope module 100 while reducing raw material costs. This application does not impose specific limitations on this aspect; the specific design can be adjusted according to actual circumstances.

[0044] In this embodiment, the first colloid 30 can be an optical adhesive. Thus, by defining the first colloid 30 as an optical adhesive, which possesses properties such as extremely high transparency, UV resistance, anti-yellowing, high adhesion, and high temperature resistance, the formation of bubbles and light scattering during the bonding process of the first colloid 30 can be prevented, ensuring the original color and transparency of the lens assembly 10, thereby not affecting the imaging quality of the lens assembly.

[0045] In this embodiment, the light-shielding film 40 satisfies the following relationship: OD > 3, Tave < 0.1%, where OD is the optical density of the material used in the light-shielding film 40, and Tave is the average light transmittance of the material used in the light-shielding film 40. Thus, by satisfying the above relationship, the light-shielding film 40 ensures a light transmittance of less than 0.1%, thereby guaranteeing its light-shielding effect.

[0046] In this embodiment, the wavelength range of light blocked by the light-shielding film 40 is 420nm to 680nm. Thus, by limiting the wavelength range of light blocked by the light-shielding film 40, the light-shielding film 40 can block light in a wider wavelength range, thereby improving the applicability of the endoscope module 100.

[0047] In this embodiment, the material used for the light-shielding film 40 is preferably ultraviolet-curable ink. The ultraviolet-curable ink is applied to the periphery of the lens assembly 10, the photosensitive chip 20, and the first colloid 30 by inkjet printing or coating. Thus, by limiting the material of the light-shielding film 40 to ultraviolet-curable ink, the light-shielding effect of the light-shielding film 40 is ensured.

[0048] Understandably, in other embodiments, the light-shielding film 40 can also be disposed on the periphery of the lens assembly 10, the first colloid 30 and the photosensitive chip 20 by means of black chromium coating, or disposed on the periphery of the lens assembly 10, the first colloid 30 and the photosensitive chip 20 by other means, such as super black treatment.

[0049] In this embodiment, the thickness of the light-shielding film 40 ranges from 14μm to 50μm. For example, the thickness of the light-shielding film 40 can be 14μm, 15μm, 16μm, 17μm, 18μm, 19μm, 20μm, 21μm, 22μm, 23μm, 24μm, 25μm, 26μm, 27μm, 28μm, 29μm, 30μm, 31μm, 32μm, 33μm, 34μm, 35μm, 36μm, 37μm, 38μm, 39μm, 40μm, 41μm, 42μm, 43μm, 44μm, 45μm, 46μm, 47μm, 48μm, 49μm, 50μm, etc. Thus, by limiting the thickness range of the light-shielding film 40, the thickness of the film layer of the light-shielding film 40 is reasonably limited, ensuring the light-shielding effect of the light-shielding film 40 while satisfying the miniaturization of the endoscope module 100. However, when the thickness of the light-shielding film 40 is less than 14μm, the thickness of the film layer of the light-shielding film 40 is too thin, and the light-shielding effect of the light-shielding film 40 cannot be guaranteed; when the thickness of the film layer of the light-shielding film 40 is greater than 50μm, the thickness of the film layer of the light-shielding film 40 is too thick, which is not conducive to the miniaturization of the endoscope module 100.

[0050] In this embodiment, the second colloid 60 is filled between the photosensitive chip 20 and the circuit board 50. The second colloid 60 can be an underfill adhesive, preferably a one-component epoxy resin adhesive, and is filled between the photosensitive chip 20 and the circuit board 50 by heat curing or ultraviolet curing. Thus, by limiting the filling of the second colloid 60 between the photosensitive chip 20 and the circuit board 50, the second colloid 60 is ensured to fully fill the space between the photosensitive chip 20 and the circuit board 50, thereby effectively sealing the side of the photosensitive chip 20 away from the lens assembly 10 and improving the waterproof and dustproof performance of the endoscope module 100. By defining the second colloid 60 as a single-component epoxy resin adhesive, it is beneficial to reduce the stress caused by the difference in the coefficient of thermal expansion between the photosensitive chip 20 and the circuit board 50, and prevent the solder joints between the photosensitive chip 20 and the circuit board 50 from breaking; at the same time, it is beneficial to improve the drop resistance and vibration resistance of the endoscope module 100, and enhance the structural reliability of the endoscope module 100; in addition, it can also enhance the resistance of the photosensitive chip 20 and the circuit board 50 to high and low temperature cycles and moisture resistance, making them suitable for harsh environments.

[0051] In this embodiment, the endoscope module 100 further includes an encapsulating adhesive 80, which encapsulates a portion of the wiring harness 70 and bonds it to the side of the circuit board 50 furthest from the photosensitive chip 20. The encapsulating adhesive 80 can be UV adhesive, epoxy adhesive, etc., and serves to protect the wiring harness 70 and the circuit board 50, preventing dust and moisture from entering the endoscope module 100 and affecting image quality. It also ensures long-term stability between the circuit board 50 and the wiring harness 70, preventing loosening and resisting thermal shock. Thus, by using the encapsulating adhesive 80, the connection between the circuit board 50 and the wiring harness 70 is encapsulated, ensuring a secure connection between them.

[0052] This application embodiment also provides an endoscope (not shown). The endoscope includes an endoscope module 100 as described above. The endoscope can be a hysteroscope, laparoscope, cystoscope, uroscope, gastrointestinal endoscope, bronchoscope, etc. Understandably, the entire endoscope module 100 is encapsulated within the endoscope unit using a potting compound method, thereby preventing the light-shielding film 40 from contacting the human body and meeting medical biocompatibility requirements.

[0053] In this embodiment, the endoscope module 100 of the endoscope uses a first colloid 30 to bond the lens assembly 10 and the photosensitive chip 20, ensuring a stable connection between them and guaranteeing structural strength. This not only ensures stable resolution of the photosensitive chip 20 but also reduces the length of the endoscope module 100 along the optical axis 200, facilitating miniaturization and meeting medical miniaturization requirements. Furthermore, by providing a light-shielding film 40 around the lens assembly 10, the first colloid 30, and the photosensitive chip 20, the film effectively blocks light, ensuring the imaging quality of the lens assembly 10 and the photosensitive chip 20, while simultaneously reducing the length of the endoscope module 100 along the direction perpendicular to the optical axis 200. The small size of the endoscope module 100 facilitates its miniaturization, meeting the miniaturization requirements of medical applications. The second adhesive 60 effectively seals the side of the photosensitive chip 20 away from the lens assembly 10, improving the waterproof and dustproof performance of the endoscope module 100. The circuit board 50 and wiring harness 70 enable connection between the endoscope module 100 and external processing modules, facilitating signal transmission. By bonding the non-effective areas of the first lens 11 and the second lens 12 of the lens assembly 10 with adhesive, the traditional lens barrel structure is eliminated, reducing the length of the endoscope module 100 along the optical axis 200, thus enabling miniaturization and reducing raw material costs. The endoscope module 100 is small, lightweight, compact, highly practical, and has stable resolution, making it widely applicable in endoscopes.

[0054] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. An endoscope module, characterized in that, include: The lens assembly includes at least a first lens and a second lens arranged in sequence, wherein the ineffective areas of the first lens and the ineffective areas of the second lens are bonded and fixed together by adhesive. A photosensitive chip is disposed on one side of the lens assembly; A circuit board is disposed on the side of the photosensitive chip away from the lens assembly and is electrically connected to the photosensitive chip; A wire harness is disposed on the side of the circuit board away from the photosensitive chip and is electrically connected to the circuit board; A first colloid is bonded between the lens assembly and the photosensitive chip to fix the lens assembly and the photosensitive chip together, and the lens assembly and the photosensitive chip are coaxial. A second colloid is bonded between the photosensitive chip and the circuit board to fix the photosensitive chip and the circuit board in place; and A light-shielding film is disposed around the lens assembly, the first colloid, and the photosensitive chip.

2. The endoscope module as described in claim 1, characterized in that, The light-shielding film satisfies the following relationship: OD > 3, Tave < 0.1%, where OD is the optical density of the material used in the light-shielding film, and Tave is the average light transmittance of the material used in the light-shielding film.

3. The endoscope module as described in claim 2, characterized in that, The material used for the light-shielding film is UV-curable ink.

4. The endoscope module as described in claim 1, characterized in that, The thickness of the light-shielding film ranges from 14 μm to 50 μm.

5. The endoscope module as described in claim 1, characterized in that, The wavelength range of light blocked by the light-shielding film is 420nm~680nm.

6. The endoscope module as described in claim 1, characterized in that, The endoscope module also includes encapsulating adhesive, which encapsulates part of the wiring harness and is bonded to the side of the circuit board away from the photosensitive chip.

7. The endoscope module as described in claim 1, characterized in that, The endoscope module also includes a filter, which is disposed between the lens assembly and the first adhesive. The filter is bonded and fixed to the non-effective area of ​​the lens assembly with adhesive. The side of the filter away from the lens assembly is bonded and fixed to the first adhesive. The light-shielding film is also disposed around the filter.

8. The endoscope module as described in claim 1, characterized in that, The first colloid is an optical adhesive.

9. The endoscope module as described in claim 1, characterized in that, The second colloid is filled between the photosensitive chip and the circuit board.

10. An endoscope, characterized in that, Includes the endoscope module as described in any one of claims 1 to 9.

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