An integrated circuit chip pin shaping tool

CN224615000UActive Publication Date: 2026-08-11SHENZHEN ZHONGKE RUILONG INTEGRATED CIRCUIT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-01
Publication Date
2026-08-11

AI Technical Summary

Technical Problem

[0005]在集成电路芯片引脚的加工流程中,当前芯片引脚完成首次折弯后,受限于现有工具的结构设计,无法在同一工位直接对特定引脚进行二次折弯操作,需要再次固定以实现二次折弯,这样增加了工序转换时间导致集成电路芯片引脚折弯加工效率下降

Benefits of technology

[0014]本实用新型,第一钳柄与第二钳柄并拢时通过夹紧组件的设置可以将集成电路芯片的位置固定,与此同时可以通过定位胶块的挤压可以将集成电路芯片的引脚进行夹持固定;转动旋钮带动螺杆转动并通过螺套带动折弯架向下运动,折弯架向下运动时可以对引脚进行挤压,从而可以实现引脚的一次折弯;折弯架向下运动至最底部时,接着拉动拉杆带动折弯板转动,从而通过折弯板的转动实现引脚的第二次折弯;

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Abstract

This utility model belongs to the field of pin shaping, specifically relating to a pin shaping tool for integrated circuit chips. It includes a first clamp handle, a second clamp handle intersecting the first clamp handle, and a rotating shaft passing through the intersection of the first and second clamp handles. A set of clamping components is respectively installed on the side surfaces of the ends of the first and second clamp handles. A positioning rubber block is fitted onto the bottom surface of the end of the second clamp handle. A pin slot for placing chip pins is formed on the upper surface of the end of the first clamp handle, and a bending component is installed on the side surface of the end of the second clamp handle. In this utility model, when the first and second clamp handles are closed, the clamping components can fix the position of the integrated circuit chip. Simultaneously, the positioning rubber block can clamp and fix the pins of the integrated circuit chip. The bending component enables a first bending of the pins. When the bending frame moves downwards to the bottom, pulling the lever rotates the bending plate to achieve a second bending of the pins.
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Description

Technical Field

[0001] This utility model belongs to the field of pin shaping, specifically relating to a pin shaping tool for integrated circuit chips. Background Technology

[0002] Integrated circuit chip lead shaping tools are precision tools specifically designed to adjust and correct the shape, position, and spacing of integrated circuit chip leads. They aim to ensure that leads meet the technical requirements for soldering, mounting, or insertion, thereby improving the assembly quality and reliability of electronic components. Lead shaping pliers are one type of integrated circuit chip lead shaping tool.

[0003] Pin shaping pliers can bend a row of flat integrated circuit chip pins into 90° right angles with high forming accuracy, meeting the needs of integrated circuit chip pin shaping; and the ergonomically designed handles can effectively save effort and improve operating comfort. The handles can be made of high-carbon steel and other high-quality materials, making them lightweight, sturdy, and durable.

[0004] Among them, the integrated circuit pin shaping tool with application number CN202422083714.5 uses a limiting mechanism. When it is necessary to perform pin shaping operation on a transistor, firstly, one side and bottom of the transistor are pressed tightly against the surface of the sliding plate, while ensuring that the bottom edge of one side of the transistor pin is in close contact with the surface of the limiting plate. Then, by operating the first and second clamping heads with the handle, the pin is precisely shaped using the pressing block and the protrusion. In the entire shaping process, the three sides of the transistor can be stably pressed and limited, providing it with all-round support and fixation. This not only effectively avoids positional displacement during pin shaping, but also significantly improves the ease of use of the shaping clamp and further improves the accuracy of transistor pin shaping.

[0005] In the processing flow of integrated circuit chip pins, after the current chip pin has completed its first bend, due to the structural design of existing tools, it is not possible to perform a second bend operation on a specific pin directly at the same workstation. It is necessary to fix it again to achieve a second bend, which increases the process changeover time and leads to a decrease in the bending processing efficiency of integrated circuit chip pins.

[0006] In view of this, the present invention provides an integrated circuit chip pin shaping tool to solve the problem of not being able to perform secondary bending at the same workstation. Utility Model Content

[0007] To achieve the above objectives, this utility model provides the following technical solution: an integrated circuit chip pin shaping tool, comprising a first clamp handle, a second clamp handle intersecting the first clamp handle, and a rotating shaft passing through the intersection of the first and second clamp handles. A set of clamping components is respectively installed on the side surfaces of the ends of the first and second clamp handles. A positioning rubber block is fitted and connected to the bottom surface of the end of the second clamp handle. A pin slot for placing chip pins is opened on the upper surface of the end of the first clamp handle. A bending component is installed on the side surface of the end of the second clamp handle. A flipping component is fitted and installed on the side surface of the first clamp handle. A bending plate is connected to the end of the flipping component. A pull rod is connected to the bottom of the bending plate.

[0008] As a preferred embodiment of the integrated circuit chip pin shaping tool of this utility model, the clamping assembly includes a first horizontal plate, a first guide rod, a rubber plate, and a first spring strip. The side surfaces of the ends of the first and second clamping handles are respectively connected to a first horizontal plate. Two first guide rods pass through the surface of each first horizontal plate. The top of the first guide rod is connected to a rubber plate parallel to the first horizontal plate. The side surface of the rubber plate is connected to a first spring strip connected to the surface of the first horizontal plate.

[0009] As a preferred embodiment of the integrated circuit chip pin shaping tool of this utility model, the bending assembly includes a bending frame, a second guide rod, a screw sleeve, a screw, a bearing, and a knob. The side surface of the end of the second clamp handle is provided with a bending frame, and two second guide rods connected to the side surface of the second clamp handle pass through the surface of the bending frame.

[0010] As a preferred embodiment of the integrated circuit chip pin shaping tool of this utility model, a threaded sleeve is connected through the surface of the bending frame, a screw rod is connected through the inside of the threaded sleeve, the screw rod is connected through a bearing fitted inside the second clamp handle, and a knob is connected to the end of the screw rod.

[0011] As a preferred embodiment of the integrated circuit chip pin shaping tool of this utility model, the bottom corner of the bending frame near the second clamp handle is set to be arc-shaped.

[0012] As a preferred embodiment of the integrated circuit chip pin shaping tool of this utility model, the flipping assembly is symmetrically arranged on both sides of the bending plate. The flipping assembly includes a through hole, a horizontal shaft, and a second spring strip. The through hole is opened on the side surface of the end of the bending plate. The horizontal shaft, which is connected to the inner wall of the groove on the side surface of the bending plate, passes through the inside of the through hole. The second spring strip is connected between the inner wall of the groove on the side surface of the bending plate and the bending plate.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] In this invention, when the first and second clamping handles are closed, the position of the integrated circuit chip can be fixed by the clamping assembly. At the same time, the pins of the integrated circuit chip can be clamped and fixed by the squeezing of the positioning rubber block. Rotating the knob drives the screw to rotate and drives the bending frame to move downward through the screw sleeve. When the bending frame moves downward, it can squeeze the pin, thereby realizing the first bending of the pin. When the bending frame moves downward to the bottom, the pull rod is pulled to drive the bending plate to rotate, thereby realizing the second bending of the pin through the rotation of the bending plate.

[0015] This allows for the rapid clamping and fixing of integrated circuit chips, and the bending of pins according to actual needs. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the rear view structure of this utility model;

[0019] Figure 3 This is a cross-sectional view of the bending component connection structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the connection structure of the clamp handles of this utility model after they are closed;

[0021] Figure 5 This is a cross-sectional view of the bending plate connection structure of this utility model;

[0022] Figure 6 This is a schematic diagram of the bending plate structure of this utility model;

[0023] Figure 7 For the present utility model Figure 1 Schematic diagram of the structure at point A in the middle;

[0024] Figure 8 For the present utility model Figure 5 Schematic diagram of the structure at point B.

[0025] In the diagram: 1. First clamp handle; 2. Second clamp handle; 3. Rotating shaft; 4. Clamping assembly; 401. First horizontal plate; 402. First guide rod; 403. Rubber plate; 404. First spring strip; 5. Positioning rubber block; 6. Pin slot; 7. Bending assembly; 701. Bending frame; 702. Second guide rod; 703. Screw sleeve; 704. Screw; 705. Bearing; 706. Knob; 8. Flipping assembly; 801. Through hole; 802. Horizontal shaft; 803. Second spring strip; 9. Bending plate; 10. Pull rod. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] This utility model relates to a pin shaping tool for integrated circuit chips, such as... Figures 1-8 As shown, the device includes a first clamp handle 1, a second clamp handle 2 intersecting the first clamp handle 1, and a rotating shaft 3 passing through the intersection of the first clamp handle 1 and the second clamp handle 2. A set of clamping components 4 are respectively installed on the side surfaces of the ends of the first clamp handle 1 and the second clamp handle 2. A positioning rubber block 5 is fitted onto the bottom surface of the end of the second clamp handle 2. A pin slot 6 for placing chip pins is formed on the upper surface of the end of the first clamp handle 1. A bending component 7 is installed on the side surface of the end of the second clamp handle 2. A flipping component 8 is fitted onto the side surface of the first clamp handle 1. A bending plate 9 is connected to the end of the flipping component 8, and a pull rod 10 is connected to the bottom of the bending plate 9. By setting the flipping component 8, the bending plate 9 can be rotated by pulling the pull rod 10. When the bending plate 9 rotates, it can compress the integrated circuit chip pins for secondary bending.

[0028] The clamping assembly 4 includes a first horizontal plate 401, a first guide rod 402, a rubber plate 403, and a first spring strip 404. A first horizontal plate 401 is connected to the side surface of each end of the first clamp handle 1 and the second clamp handle 2. Two first guide rods 402 pass through the surface of each first horizontal plate 401. A rubber plate 403 parallel to the first horizontal plate 401 is connected to the top of each first guide rod 402. A first spring strip 404 connected to the surface of the first horizontal plate 401 is connected to the side surface of the rubber plate 403. When the first clamp handle 1 and the second clamp handle 2 are closed, they can be pressed into the pin slot 6 by the positioning rubber block 5, thereby squeezing the integrated circuit chip pins. During this process, the rubber plate 403 presses against the surface of the integrated circuit chip through the elastic force of the first spring strip 404, thus achieving the positioning of the integrated circuit chip.

[0029] Furthermore, the bending assembly 7 includes a bending frame 701, a second guide rod 702, a threaded sleeve 703, a screw 704, a bearing 705, and a knob 706. The bending frame 701 is provided on the side surface of the end of the second clamp handle 2, and two second guide rods 702 connected to the side surface of the second clamp handle 2 pass through the surface of the bending frame 701. When the bending frame 701 is subjected to force, it can slide on the surface of the second guide rods 702, which can limit the direction of movement of the bending frame 701 and maintain the stability of the movement of the bending frame 701.

[0030] Furthermore, a threaded sleeve 703 is connected through the surface of the bending frame 701, and a screw 704 is connected through the inside of the threaded sleeve 703. The screw 704 is connected through a bearing 705 that is fitted inside the second clamp handle 2, and a knob 706 is connected to the end of the screw 704. When the knob 706 is rotated, it can drive the screw 704 to rotate inside the bearing 705. When the screw 704 rotates, it drives the threaded sleeve 703 to move axially through the threaded connection. When the threaded sleeve 703 moves axially, it can drive the bending frame 701 to move axially.

[0031] Furthermore, the bottom corner of the bending frame 701 near the second clamp 2 is rounded. By making the corner of the bending frame 701 rounded, damage can be avoided when the corner of the bending frame 701 directly presses against the pins of the integrated circuit chip.

[0032] Furthermore, the flipping assembly 8 is symmetrically arranged on both sides of the bending plate 9. The flipping assembly 8 includes a through hole 801, a horizontal shaft 802, and a second spring strip 803. The through hole 801 is opened on the side surface of the end of the bending plate 9. The horizontal shaft 802, which is connected to the inner wall of the groove on the side surface of the bending plate 9, passes through the inside of the through hole 801. The second spring strip 803 is connected between the inner wall of the groove on the side surface of the bending plate 9 and the bending plate 9.

[0033] It should be noted that when the bending plate 9 moves downward to the bottom, the distance between the bottom side and the top of the bending plate 9 is the same as the thickness of the integrated circuit chip pin.

[0034] In use, firstly, place the integrated circuit chip on the surface of the adhesive plate 403 on the side surface of the first clamp 1, and place the pins of the integrated circuit chip on the surface of the pin slot 6. Then, hold the first clamp 1 and the second clamp 2 together. When the clamping end of the second clamp 2 moves the adhesive plate 403 to the upper surface of the integrated circuit chip, the first clamp 1 and the second clamp 2 continue to move together, causing the first horizontal plate 401 to move axially towards the adhesive plate 403 on the surface of the first guide rod 402. During this process, the first spring bar 404 can be used. When the clamping ends of the first clamp 1 and the second clamp 2 are completely closed, the elastic force of the first spring bar 404 can press the adhesive plate 403 onto the surface of the integrated circuit chip, thereby fixing the position of the integrated circuit chip. At the same time, the pins of the integrated circuit chip can be clamped and fixed by the squeezing of the positioning adhesive block 5.

[0035] Next, the knob 706 can be rotated. When the knob 706 is rotated, it can drive the screw 704 to rotate. When the screw 704 rotates, it can drive the bending frame 701 to move downward through the screw sleeve 703. When the bending frame 701 moves downward, it can squeeze the pin, thereby realizing the bending of the pin in one step.

[0036] When the bending frame 701 moves downward to the bottom, it can pull the pull rod 10. When the pull rod 10 is pulled, it can drive the bending plate 9 to rotate on the surface of the horizontal shaft 802 and pull the second spring strip 803 to deform. In this way, the pin can be bent for the second time by rotating the bending plate 9. After the pull rod 10 is released, the second spring strip 803 drives the bending plate 9 to reset by its own elastic force.

[0037] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An integrated circuit chip pin shaping tool, comprising a first clamp (1), a second clamp (2) intersecting the first clamp (1), and a rotating shaft (3) passing through the intersection of the first clamp (1) and the second clamp (2), characterized in that: A set of clamping components (4) is installed on the side surface of the end of the first clamp (1) and the second clamp (2), respectively. A positioning rubber block (5) is fitted and connected to the bottom surface of the end of the second clamp (2). A pin slot (6) for placing chip pins is opened on the upper surface of the end of the first clamp (1). A bending component (7) is installed on the side surface of the end of the second clamp (2). A flipping component (8) is fitted and installed on the side surface of the first clamp (1). A bending plate (9) is connected to the end of the flipping component (8). A pull rod (10) is connected to the bottom of the bending plate (9).

2. The integrated circuit chip pin shaping tool according to claim 1, characterized in that: The clamping assembly (4) includes a first horizontal plate (401), a first guide rod (402), a rubber plate (403), and a first spring strip (404). The side surfaces of the ends of the first clamp handle (1) and the second clamp handle (2) are respectively connected to a first horizontal plate (401). Two first guide rods (402) pass through the surface of each first horizontal plate (401). The top of the first guide rod (402) is connected to a rubber plate (403) parallel to the first horizontal plate (401). The side surface of the rubber plate (403) is connected to a first spring strip (404) connected to the surface of the first horizontal plate (401).

3. The integrated circuit chip pin shaping tool according to claim 1, characterized in that: The bending assembly (7) includes a bending frame (701), a second guide rod (702), a screw sleeve (703), a screw (704), a bearing (705), and a knob (706). The side surface of the end of the second clamp handle (2) is provided with a bending frame (701), and the surface of the bending frame (701) has two second guide rods (702) connected to the side surface of the second clamp handle (2).

4. The integrated circuit chip pin shaping tool according to claim 3, characterized in that: A threaded sleeve (703) is connected through the surface of the bending frame (701), and a screw (704) is connected through the inside of the threaded sleeve (703). The screw (704) is connected through a bearing (705) fitted inside the second clamp handle (2), and a knob (706) is connected to the end of the screw (704).

5. The integrated circuit chip pin shaping tool according to claim 4, characterized in that: The bottom corner of the bending frame (701) near the second clamp (2) is set to be arc-shaped.

6. The integrated circuit chip pin shaping tool according to claim 1, characterized in that: The flipping assembly (8) is symmetrically arranged on both sides of the bending plate (9). The flipping assembly (8) includes a through hole (801), a horizontal shaft (802), and a second spring strip (803). The through hole (801) is opened on the side surface of the end of the bending plate (9). The horizontal shaft (802) connected to the inner wall of the groove on the side surface of the bending plate (9) passes through the inside of the through hole (801). The second spring strip (803) is connected between the inner wall of the groove on the side surface of the bending plate (9) and the bending plate (9).

Citation Information

Patent Citations

  • Integrated circuit pin shaping tool

    CN222944390U