A coil pin jet soldering device

Abstract

This utility model relates to a coil pin spray soldering device, which includes a solder outlet head with its opening facing downwards; a coil with its pins positioned below the solder outlet head; molten solder flows from the opening of the solder outlet head, and the molten solder is poured onto the coil pins and solidifies to form solder joints. Using a spray soldering method to complete the soldering of the coil pins avoids molten solder splashing and adhering to the winding (copper wire); furthermore, it prevents small solder lumps formed by the solidification of molten solder adhering to the winding (copper wire) from falling off during the use of the flameout protection valve and causing damage to the flameout protection valve.

Description

Technical Field

[0001] This utility model relates to coil pin soldering, specifically to a coil pin jet soldering device. Background Technology

[0002] A flameout protection valve has an internal coil that cannot be plastic-encapsulated, and its solder joints are close to the winding (copper wire). When the traditional immersion soldering method is used, molten solder will splash and stick to the winding (copper wire). Small tin blocks formed by the solidification of the molten solder on the winding (copper wire) may fall off during the use of the flameout protection valve, causing damage to the flameout protection valve. Utility Model Content

[0003] In view of the above problems, we propose to use a tin-spraying method to complete the soldering of the coil pins, so as to avoid molten solder splashing and sticking to the winding (copper wire), and based on this, we propose a coil pin spray soldering device.

[0004] The technical solution of this utility model: A coil pin jet soldering device includes a solder outlet with its opening facing downwards; a coil with its pins positioned below the opening of the solder outlet; molten solder (a stable small flow) flows from the opening of the solder outlet, and the molten solder is poured onto the coil pins and solidifies to form solder joints.

[0005] Further refining the above technical solution, the jet soldering device also includes a conveying mechanism, several material seats and / or material boxes, each material seat and / or material box is equipped with a conveying mechanism and is driven to move by the conveying mechanism; Several coils are mounted on various spools and / or inside spool boxes, with the coil leads exposed; the coils move with the coil spools, and their leads pass under the solder outlet. A preferred spool box design is used to enclose the coil winding (copper wire) inside the spool box when molten solder is poured onto the coil leads, preventing molten solder from falling onto the winding (copper wire).

[0006] Further refining the above technical solution, the lid of the material box is a sliding type, which facilitates the removal and placement of the coils.

[0007] To further refine the above technical solution, a handle is installed on the lid of the material box.

[0008] To further refine the above technical solution, a return spring is installed on the lid of the material box.

[0009] The advantages of this utility model are that it has a reasonable design and simple structure. It uses a tin-dip method to complete the soldering of the coil pins, which avoids the molten solder from splashing and sticking to the winding (copper wire). This also prevents small tin blocks formed by the solidification of the molten solder on the winding (copper wire) from falling off during the use of the flameout protection valve and causing damage to the flameout protection valve. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the coil pin jet soldering device.

[0011] Figure 2 This is a schematic diagram of the material box structure.

[0012] The diagram shows: 1. Solder tip; 2. Transport device; 3. Material box; 3-1. Cover of the material box; 3-2. Handle; 3-3. Return spring; 4. Frame. Detailed Implementation

[0013] like Figure 1-2 As shown, a coil pin jet soldering device includes a solder outlet 1, a conveying device 2, and several material boxes 3. The solder outlet 1 and the conveying device 2 are mounted on a frame 4, and each material box 3 is mounted on the conveying device 2. The solder tip should be facing downwards. The lid 3-1 of the material box is a push-pull type; a handle 3-2 is installed on the lid 3-1 of the material box; a return spring 3-3 is installed on the lid of the material box.

[0014] When the above-mentioned jet soldering device is used, each coil is installed into each material box 3, exposing the coil pins. The conveying device 2 drives each material box 3 to move, and each coil moves together with each material box 3, with its pins passing below the solder outlet 1. When the coil pins are placed below the solder outlet 1, the solder flows out from the solder outlet 1, pours onto the coil pins, and solidifies to form solder joints.

[0015] The above embodiments are only for illustrating the technical concept and features of the invention, and are intended to enable those skilled in the art to understand the content of the invention and implement it accordingly. They should not be construed as limiting the scope of protection of the invention. All equivalent changes or modifications made in accordance with the spirit and essence of the invention should be covered within the scope of protection of the invention.

Claims

1. A coil pin solder jetting device, characterized in that, The jet soldering device includes a solder outlet head, with the opening of the solder outlet head facing downwards; A coil with its leads positioned below a solder outlet; molten solder flows from the outlet and drips onto the coil leads, solidifying to form solder joints.

2. The coil pin jet soldering device according to claim 1, characterized in that, The jet soldering device also includes a conveying mechanism, several material seats and / or material boxes, each material seat and / or material box is equipped with a conveying mechanism and is driven to move by the conveying mechanism; Several coils are mounted on each material holder and / or inside the material box, with the coil leads exposed; the coils move with the coil holder, and their leads pass under the solder outlet.

3. The coil pin jet soldering device according to claim 2, characterized in that, The lid of the material box is a sliding type.

4. The coil pin jet soldering device according to claim 3, characterized in that, The lid of the material box is equipped with a handle.

5. The coil pin jet soldering device according to claim 3, characterized in that, A return spring is installed on the lid of the material box.

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