A material pressing device for a soldering platform

Abstract

This utility model discloses a material pressing device for a soldering platform, including a mounting platform. A first material pressing mechanism is snapped onto one side of the top of the mounting platform, and a second material pressing mechanism is snapped onto the other side of the top of the mounting platform. Both the first and second material pressing mechanisms include a material pressing support plate, a material pressing fixing plate, a lifting plate, a material pressing plate, and a telescopic cylinder. A material pressing fixing plate is fixedly installed on the top of one side of the material pressing support plate, a lifting plate is provided on one side of the material pressing fixing plate, and a telescopic cylinder is fixedly installed in the middle of one side of the material pressing support plate. The output end of the telescopic cylinder is fixedly connected to the bottom of the lifting plate, a material pressing plate is fixedly connected to the top of the lifting plate, and a first pressure plate head and a second pressure plate head are fixedly connected to one side of the bottom of the material pressing plate. This utility model, a material pressing device for a soldering platform, can position the product during the soldering process, reduce product movement and misalignment, reduce mis-soldering and missed soldering, and improve the product processing quality.

Description

Technical Field

[0001] This utility model relates to the field of soldering, specifically to a material pressing device for a soldering platform. Background Technology

[0002] Solder is an important industrial raw material for connecting electronic components in circuits. It is a low-melting-point solder, mainly referring to solder made of tin-based alloys. Solder is made by first melting and forming ingots, and then processing them into finished products under pressure. In soldering operations in industries such as electronics manufacturing, the workpiece to be soldered is usually placed on a soldering platform, and then soldering is performed on the workpiece using soldering equipment. However, in actual operation, due to the forces that may be generated during soldering, and the possibility of uneven surfaces on the workpiece itself, the workpiece is prone to movement or shaking on the soldering platform, which affects the accuracy and quality of the soldering, resulting in defects such as cold solder joints and missing solder joints, and reducing the product qualification rate. Utility Model Content

[0003] The purpose of this utility model is to provide a material pressing device for a soldering platform to solve the problem mentioned in the background art that, in actual operation, due to the force that may be generated during soldering and the unevenness of the workpiece surface, the workpiece may easily move or shake on the soldering platform, thereby affecting the accuracy and quality of soldering, resulting in defects such as cold solder joints and missing solder joints, and reducing the product qualification rate.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a material pressing device for a soldering platform, comprising a mounting platform, a first material pressing mechanism being snapped onto one side of the top of the mounting platform, and a second material pressing mechanism being snapped onto the other side of the top of the mounting platform. Both the first and second material pressing mechanisms include a material pressing support plate, a material pressing fixing plate, a lifting plate, a pressing plate, and a telescopic cylinder. A material pressing fixing plate is fixedly installed on the top of one side of the material pressing support plate, a lifting plate is provided on one side of the material pressing fixing plate, and a lifting plate is fixed in the middle of one side of the material pressing support plate. A telescopic cylinder is fixedly installed, with its output end fixedly connected to the bottom of the lifting plate. A pressure plate is fixedly connected to the top of the lifting plate, and a first pressure plate head and a second pressure plate head are fixedly connected to one side of the bottom of the pressure plate. When pressing material, the telescopic cylinder can be activated to retract and pull down the lifting plate. The lifting plate moves under the guiding sliding action of the guide groove and the guide slider. Then, the lifting plate pulls the pressure plate to move, and the positioning plate, the first pressure plate head, and the second pressure plate head on the pressure plate can press the product to perform pressing and limiting treatment.

[0005] As a preferred technical solution of this utility model, the first pressing mechanism and the second pressing mechanism are symmetrically arranged, and the bottom of the first pressing mechanism and the bottom of the second pressing mechanism are both provided with fixing feet. The symmetrical arrangement of the first pressing mechanism and the second pressing mechanism can limit and fix the product.

[0006] As a preferred technical solution of this utility model, the bottom of the pressing support plate is provided with a snap-fit ​​groove, and the top of the mounting platform is fixedly connected with a positioning block that matches the snap-fit ​​groove, and the positioning block snaps into the snap-fit ​​groove.

[0007] As a preferred technical solution of this utility model, the surface of the pressing plate is provided with a guide groove, and a guide slider matching the guide groove is fixedly connected to one side of the lifting plate. The guide slider is slidably connected to the guide groove. The guide groove and the guide slider are used to limit and guide the movement of the lifting plate. Activating the telescopic cylinder can retract and pull down the lifting plate. The lifting plate moves under the guiding sliding action of the guide groove and the guide slider. Then, the lifting plate pulls the pressing plate to move.

[0008] As a preferred technical solution of this utility model, a positioning plate is fixedly installed in the middle of the bottom end of the pressure plate, and the bottom of one side of the pressure plate is fixedly connected to the top of the lifting plate.

[0009] As a preferred technical solution of this utility model, the first pressure plate head and the second pressure plate head are symmetrically arranged, and one end of the first pressure plate head and one end of the second pressure plate head are fixedly installed with urethane rubber heads. The urethane rubber heads are used to press the product, and the use of rubber heads can reduce damage to the product.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] The first and second pressing mechanisms are mounted on the mounting platform and fixed with screws, so that the first and second pressing mechanisms are installed on both sides of the product conveyor. When pressing, the telescopic cylinder is activated to retract and pull down the lifting plate. The lifting plate moves under the guidance of the guide slide and the guide slider. Then, the lifting plate pulls the pressing plate to move, and the positioning plate, the first pressing plate head and the second pressing plate head on the pressing plate can press the product to perform pressing and limiting treatment. This can position the product during the product soldering process, reduce the product movement and misalignment, reduce missoldering and missing soldering, and improve the product processing quality. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model;

[0013] Figure 2 This is a structural diagram of the first pressing mechanism of this utility model;

[0014] Figure 3 This is an enlarged structural diagram of A of this utility model;

[0015] Figure 4 This is a structural diagram showing the connection between the mounting platform and the pressure support plate of this utility model.

[0016] In the diagram: 1. Mounting platform; 2. First pressing mechanism; 3. Second pressing mechanism; 4. Fixed foot; 5. Pressing support plate; 6. Pressing fixing plate; 7. Lifting plate; 8. Pressing plate; 9. First pressing plate head; 10. Second pressing plate head; 11. Positioning plate; 12. Guide groove; 13. Guide slider; 14. Polyurethane head; 15. Snap-fit ​​groove; 16. Positioning block; 17. Telescopic cylinder. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figure 1-4 This utility model provides a material pressing device for a soldering platform, including a mounting platform 1. A first material pressing mechanism 2 is snapped onto one side of the top of the mounting platform 1, and a second material pressing mechanism 3 is snapped onto the other side of the top of the mounting platform 1. Both the first material pressing mechanism 2 and the second material pressing mechanism 3 include a material pressing support plate 5, a material pressing fixing plate 6, a lifting plate 7, a material pressing plate 8, and a telescopic cylinder 17. A material pressing fixing plate 6 is fixedly installed on the top of one side of the material pressing support plate 5. A lifting plate 7 is provided on one side of the material pressing fixing plate 6. A telescopic cylinder 17 is fixedly installed in the middle of one side of the material pressing support plate 5. The output end of the telescopic cylinder 17 is fixedly connected to the bottom of the lifting plate 7. A material pressing plate 8 is fixedly connected to the top of the lifting plate 7. A first pressure plate head 9 and a second pressure plate head 10 are fixedly connected to one side of the bottom of the material pressing plate 8.

[0019] See Figure 1-4 The first pressing mechanism 2 and the second pressing mechanism 3 are symmetrically arranged, and the bottom of the first pressing mechanism 2 and the bottom of the second pressing mechanism 3 are both provided with fixed feet 4. The bottom of the pressing support plate 5 is provided with a snap-fit ​​groove 15. The top of the mounting platform 1 is fixedly connected with a positioning block 16 that matches the snap-fit ​​groove 15. The positioning block 16 snaps into the snap-fit ​​groove 15. The surface of the pressing fixing plate 6 is provided with a guide slide groove 12. One side of the lifting plate 7 is fixedly connected with a guide slider 13 that matches the guide slide groove 12. The guide slider 13 is slidably connected to the guide slide groove 12.

[0020] In this embodiment, the mounting platform 1 is a platform for soldering equipment. The first pressing mechanism 2 and the second pressing mechanism 3 are mounted on the mounting platform 1 and fixed with screws, so that the first pressing mechanism 2 and the second pressing mechanism 3 are installed on both sides of the product conveying position.

[0021] See Figure 1-4 A positioning plate 11 is fixedly installed in the middle of the bottom end of the pressure plate 8. The bottom of one side of the pressure plate 8 is fixedly connected to the top of the lifting plate 7. The first pressure plate head 9 and the second pressure plate head 10 are symmetrically arranged, and an urethane head 14 is fixedly installed at one end of the first pressure plate head 9 and one end of the second pressure plate head 10.

[0022] In this embodiment, during the pressing process, the lifting plate 7 can be retracted and pulled down by activating the telescopic cylinder 17. The lifting plate 7 moves under the guiding sliding action of the guide slide groove 12 and the guide slider 13. Then, the lifting plate 7 pulls the pressing plate 8 to move, and the product can be pressed down by the positioning plate 11, the first pressing plate head 9 and the second pressing plate head 10 on the pressing plate 8, thus performing pressing and limiting processing.

[0023] In practical use, the mounting platform 1 serves as the platform for the soldering equipment. The first pressing mechanism 2 and the second pressing mechanism 3 are installed on the mounting platform 1 and fixed with screws, so that the first pressing mechanism 2 and the second pressing mechanism 3 are installed on both sides of the product conveyor. When pressing, the telescopic cylinder 17 is activated to retract and pull down the lifting plate 7. The lifting plate 7 moves under the guiding sliding action of the guide groove 12 and the guide slider 13. Then, the lifting plate 7 pulls the pressing plate 8 to move, and the positioning plate 11, the first pressing plate head 9 and the second pressing plate head 10 on the pressing plate 8 can press the product to perform pressing and limiting treatment. This allows the product to be positioned during the soldering process, reducing the phenomenon of product movement and misalignment, reducing mis-soldering and missing soldering, and improving the processing quality of the product.

[0024] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A soldering device for a soldering platform, comprising a mounting platform (1), characterized in that: The first pressing mechanism (2) is snapped onto one side of the top of the mounting platform (1), and the second pressing mechanism (3) is snapped onto the other side of the top of the mounting platform (1). The first pressing mechanism (2) and the second pressing mechanism (3) both include a pressing support plate (5), a pressing fixing plate (6), a lifting plate (7), a pressing plate (8), and a telescopic cylinder (17). The pressing support plate (5) is fixedly installed on the top of one side of the pressing support plate (5). The pressing fixing plate (6) is provided on one side of the pressing fixing plate (6). The telescopic cylinder (17) is fixedly installed in the middle of one side of the pressing support plate (5). The output end of the telescopic cylinder (17) is fixedly connected to the bottom of the lifting plate (7). The pressing plate (8) is fixedly connected to the top of the lifting plate (7). The first pressing head (9) and the second pressing head (10) are fixedly connected to one side of the bottom of the pressing plate (8).

2. The material pressing device for a soldering platform according to claim 1, characterized in that: The first pressing mechanism (2) and the second pressing mechanism (3) are symmetrically arranged, and the bottom of the first pressing mechanism (2) and the bottom of the second pressing mechanism (3) are both provided with fixed feet (4).

3. The material pressing device for a soldering platform according to claim 1, characterized in that: The bottom of the pressure support plate (5) is provided with a snap-fit ​​groove (15), and the top of the mounting platform (1) is fixedly connected with a positioning block (16) that matches the snap-fit ​​groove (15). The positioning block (16) snaps into the snap-fit ​​groove (15).

4. The material pressing device for a soldering platform according to claim 1, characterized in that: The surface of the pressing plate (6) is provided with a guide groove (12), and a guide slider (13) matching the guide groove (12) is fixedly connected to one side of the lifting plate (7). The guide slider (13) is slidably connected to the guide groove (12).

5. The material pressing device for a soldering platform according to claim 1, characterized in that: A positioning plate (11) is fixedly installed in the middle of the bottom end of the pressure plate (8), and the bottom of one side of the pressure plate (8) is fixedly connected to the top of the lifting plate (7).

6. The material pressing device for a soldering platform according to claim 1, characterized in that: The first pressure plate head (9) and the second pressure plate head (10) are symmetrically arranged, and an urethane rubber head (14) is fixedly installed at one end of the first pressure plate head (9) and one end of the second pressure plate head (10).

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