A rapid assembly and welding structure for optical devices

Abstract

This utility model discloses a rapid soldering structure suitable for optical modules and optical devices, including a single-row pin optical device TOSA, a single-row pin optical device ROSA, a PCB panel, a titanium alloy fixture, and an auxiliary fixture for machine mounting of optical devices. The upper surface of the auxiliary fixture for machine mounting of optical devices is provided with a device clearance groove; the PCB panel is provided with positioning holes; the titanium alloy fixture is provided with a cross-shaped positioning post, which forms an interference fit with the positioning holes of the PCB panel; the device clearance groove is a U-shaped groove for the optical ports of the single-row pin optical devices ROSA and TOSA to pass through. This application, through the above structure, eliminates the need for forming the pins of the optical devices, simplifies the assembly process, and reduces the risk of device failure due to pin forming.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and in particular to a rapid assembly and welding structure suitable for optical modules and optical devices. Background Technology

[0002] Optical modules generally consist of a structural housing, optical components, and a PCBA (Printed Circuit Board Assembly) circuit board. The connection between the optical components and the PCB is typically achieved through pin soldering or flexible board soldering. In optical modules with speeds of 10G and above, the optical transmitter assembly (TOSA) and optical receiver assembly (ROSA) are core components, and their soldering quality directly determines the module's optoelectronic performance and long-term reliability. Currently, the industry commonly uses a method of manually pre-forming the pins followed by manual or semi-automatic soldering, which has the following shortcomings: 1. The optical device pins need to be pre-formed by bending and cutting, which is a complicated process; 2. Poor consistency of the formed pins leads to uneven solder joint height and large fluctuations in yield. 3. The optical transmitter component TOSA and the optical receiver component ROSA cannot be produced on the same production line as other surface-mount devices on the PCB, which limits the production line cycle time; 4. Manual welding and multiple transfers bring additional labor costs and risks of static electricity / contamination. Utility Model Content

[0003] A brief overview of embodiments of the present invention is provided below to provide a basic understanding of certain aspects of the invention. It should be understood that this overview is not an exhaustive summary of the invention. It is not intended to identify key or essential parts of the invention, nor is it intended to limit the scope of the invention. Its purpose is merely to present certain concepts in a simplified form as a prelude to the more detailed description that follows.

[0004] To address the aforementioned problems in the prior art, this utility model provides a rapid welding structure suitable for optical modules and optical devices, which enables synchronous reflow welding of optical devices and PCB boards, simplifies the assembly process, and improves production efficiency.

[0005] Specifically, this utility model provides a rapid welding structure suitable for optical modules and optical devices, comprising: TOSA (Top-of-Side) single-pin optical device: used to convert electrical signals into optical signals; ROSA (Roll-off Optical Components): Used to convert optical signals into electrical signals; PCB panel: It is composed of multiple PCBs, each PCB is equipped with a pair of single-row pin optical devices TOSA and a single-row pin optical device ROSA; Titanium alloy fixtures: used to fix PCB panels; Optical component mounting auxiliary fixture: used to assist in the precise mounting of single-row pin optical components TOSA and ROSA; The upper surface of the optical device mounting auxiliary fixture is provided with multiple device clearance slots; the PCB panel is provided with positioning holes; the titanium alloy fixture is provided with cross-shaped positioning posts, which form a 0.05 mm interference fit with the positioning holes of the PCB panel; the device clearance slots are U-shaped slots, which respectively allow the optical ports of single-row pin optical devices ROSA and TOSA to pass through. Single-row pin optical devices TOSA and ROSA are arranged in pairs.

[0006] Furthermore, the optical device mounting auxiliary fixture is also provided with a chamfered guide structure for guiding the optical ports of single-row pin optical devices ROSA and TOSA into the device clearance slot.

[0007] Furthermore, the PCB panel is provided with a TOSA pad group, and the bottom surface of the pins of the single-row pin optical device TOSA is connected to the TOSA pad group through a 0.20–0.30 mm thick solder paste layer.

[0008] Furthermore, the PCB panel is equipped with ROSA pad groups, and the bottom surface of the pins of the single-row pin optical device ROSA is connected to the ROSA pad groups through a 0.20–0.30 mm thick solder paste layer. The structure of the single-row pin optical device ROSA is the same as that of the single-row pin optical device TOSA, with the optical port facing the same direction.

[0009] Furthermore, the titanium alloy fixture is also provided with an exhaust port, which is set through the titanium alloy fixture for hot air circulation.

[0010] Furthermore, the cross-shaped positioning post is composed of a cylindrical section and a cross rib section. The diameter of the cylindrical section is smaller than the positioning hole on the PCB panel, and the maximum outer diameter of the cross rib section is larger than the positioning hole on the PCB panel.

[0011] Furthermore, the PCB panel has multiple positioning holes on its edge, which are interference-fitted with the cross-shaped positioning posts of the titanium alloy fixture (the interference can be 0.05 mm); the central area of ​​the PCB panel is etched with TOSA pad groups and ROSA pad groups (pad groups).

[0012] This application adopts the above-mentioned solution. The PCB panel achieves precise positioning through an interference fit between the cross-shaped positioning posts of the titanium alloy fixture and their positioning holes. The upper surface of the optical component mounting auxiliary fixture is provided with a chamfered guide groove (chamfered structure guide), which has a clearance fit with the corresponding positioning holes of the titanium alloy fixture, enabling rapid assembly and disassembly. The optical components and electronic components on the PCB are simultaneously soldered via SMT reflow soldering. Compared with existing technologies, this solution has the following advantages: 1. No need to shape the pins of optical devices, simplifying the assembly process; 2. Enables synchronous reflow soldering of optical devices and PCB board components, improving production efficiency; 3. Reduce labor costs and decrease the risk of device failure due to pin molding. Attached Figure Description

[0013] This invention can be better understood by referring to the following description taken in conjunction with the accompanying drawings, in which the same or similar reference numerals are used throughout the drawings to denote the same or similar parts. These drawings, together with the following detailed description, are incorporated in and form part of this specification, and are used to further illustrate preferred embodiments of the invention and explain the principles and advantages of the invention. In the drawings: Figure 1 This is an assembly diagram of the rapid welding structure of this utility model; Figure 2 for Figure 1 Enlarged diagram of point A in the diagram. Detailed Implementation

[0014] Embodiments of the present invention will now be described with reference to the accompanying drawings. Elements and features described in one drawing or embodiment of the present invention may be combined with elements and features shown in one or more other drawings or embodiments. It should be noted that, for clarity, representations and descriptions of components and processes unrelated to the present invention and known to those skilled in the art have been omitted from the drawings and description.

[0015] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0016] Traditional optical module component soldering requires pre-forming the component pins and replacing them with flexible circuit board pins before soldering. Furthermore, traditional optical component soldering processes are complex, time-consuming, and labor-intensive, making automated component placement and soldering impossible. This application optimizes the optical component pin design, enabling direct soldering of optical components without the need for pin forming and other processing steps. Moreover, it allows for direct surface mount soldering while simultaneously soldering the component pins, significantly reducing assembly costs and improving production efficiency for optical modules.

[0017] See Figure 1 This embodiment provides a rapid soldering structure suitable for optical modules and optical devices, including a single-row pin optical device TOSA1, a single-row pin optical device ROSA2, a PCB panel 3, a titanium alloy fixture 4, and an auxiliary tooling for machine mounting of optical devices 5.

[0018] PCB panel 3 is composed of multiple PCBs and is used to carry optical devices and electronic components. Each row of pin optical devices TOSA1 converts electrical signals to optical signals, and each row of pin optical devices ROSA2 converts optical signals to electrical signals. TOSA1 and ROSA2 are paired, with each PCB having one pair of TOSA1 and ROSA2. A titanium alloy fixture 4 is used to fix PCB panel 3, ensuring no movement during soldering. An optical device placement auxiliary fixture 5 assists in the precise placement of the TOSA1 and ROSA2 pins; the fixture has a chamfered guide structure to ensure accurate placement of the optical devices.

[0019] See Figure 2 The upper surface of the optical component mounting auxiliary fixture 5 is provided with a component clearance groove 51, which is a U-shaped groove for the optical ports of single-row pin optical components ROSA and TOSA to pass through; the PCB panel 3 is provided with positioning holes.

[0020] See Figure 2 The optical component mounting auxiliary fixture 5 is also equipped with a chamfered guide structure 52 (chamfered guide groove) to guide the optical ports of single-row pin optical components ROSA and TOSA into the device clearance groove, ensuring a mounting accuracy of ±0.05 mm. At the same time, the lower surface of the optical component mounting auxiliary fixture is integrally formed with two positioning pins, which are clearance-fitted with the corresponding positioning holes on the titanium alloy fixture (e.g., clearance 0.02 mm), realizing quick disassembly and repositioning between the auxiliary fixture and the fixture.

[0021] The titanium alloy fixture 4 is equipped with a cross-shaped locating post, which forms a 0.05 mm interference fit with the locating holes of the PCB panel. The cross-shaped locating post can be composed of a cylindrical section and a cross-rib section. The diameter of the cylindrical section is smaller than that of the locating hole on the PCB panel, and the maximum outer diameter of the cross-rib section is larger than that of the locating hole on the PCB panel. Optionally, an exhaust port may be provided on the titanium alloy fixture 4, which is set through the titanium alloy fixture for hot air circulation.

[0022] Optionally, guide holes can be provided on the titanium alloy fixture 4, for example, one at each of the four corners, for SMT track positioning.

[0023] The PCB panel 3 achieves precise positioning through the interference fit between the cross-shaped positioning post of the titanium alloy fixture 4 and the positioning hole of the PCB panel 3; the optical components are guided by the chamfered structure of the machine placement auxiliary tooling to achieve precise placement; the single-row pin optical components ROSA and TOSA can be synchronously soldered with the electronic components on the PCB board through SMT reflow soldering.

[0024] PCB panel 3 features TOSA and ROSA pad groups. The bottom surface of the pins of the single-row optical device TOSA1 is connected to the TOSA pad group via a 0.20–0.30 mm thick solder paste layer. The bottom surface of the pins of the single-row optical device ROSA2 is connected to the ROSA pad group via a 0.20–0.30 mm thick solder paste layer. The optical ports of the single-row optical devices ROSA2 and TOSA1 face the same direction.

[0025] The PCB panel 3 has multiple positioning holes on its edge, which are 0.05 mm over the cross-shaped positioning posts of the titanium alloy fixture 4. The central area of ​​the PCB panel 3 is etched with TOSA and ROSA pad groups, with a center-to-center distance of 1.27 mm between the pads. The two outer pads extend 0.5 mm to the process edge as mechanical reinforcement pads.

[0026] In addition, the top of the housings of the single-row pin optical devices TOSA1 and ROSA2 are designed with a flat and clean surface, which can be directly picked up by the vacuum nozzle of the pick-and-place machine, enabling automatic picking and precise placement onto the PCB pads without manual clamping.

[0027] This application provides a structure suitable for the design of surface mount reflow soldering process for optical modules and optical devices, which can not only reduce the production cost of optical modules, but also improve the soldering efficiency of optical modules.

[0028] This embodiment utilizes the aforementioned structure to achieve a rapid assembly and soldering structure suitable for optical modules and optical devices. Through structural improvements and SMT reflow soldering, it achieves the goal of synchronous soldering of optical devices and other components with the PCB. In use, the PCB panel 3 is pressed into the cross-shaped positioning post of the titanium alloy fixture 4 through positioning holes, achieving zero wobble. The optical device mounting auxiliary fixture 5 is fastened above the titanium alloy fixture 4, with its device clearance slots aligned with the optical ports of the TOSA and ROSA components. After being picked up by the pick-and-place machine, the TOSA and ROSA components fall vertically onto the TOSA and ROSA pad groups on the PCB panel 3 along the chamfered guide structure, with the leads contacting the solder paste. The entire assembly (titanium alloy fixture + PCB panel + TOSA / ROSA components + optical device mounting auxiliary fixture) is placed in a reflow oven and synchronously soldered at 205°C for 7 minutes.

[0029] The above-mentioned solution simplifies the soldering of optical devices, enables automation, reduces labor costs, and eliminates the need for pin forming, thus avoiding the risk of pin failure caused by pin forming.

[0030] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, element, step, or component, but does not exclude the presence or addition of one or more other features, elements, steps, or components.

[0031] Although the present invention has been disclosed above through the description of specific embodiments, it should be understood that all the embodiments and examples described above are exemplary and not restrictive. Those skilled in the art can design various modifications, improvements, or equivalents to the present invention within the spirit and scope of the appended claims. These modifications, improvements, or equivalents should also be considered to be included within the protection scope of the present invention.

Claims

1. A rapid welding structure suitable for optical modules and optical devices, characterized in that: include: TOSA (Top-of-Side) single-pin optical device: used to convert electrical signals into optical signals; ROSA (Roll-off Optical Components): Used to convert optical signals into electrical signals; PCB panel: It is composed of multiple PCBs, each PCB is equipped with a pair of single-row pin optical devices TOSA and a single-row pin optical device ROSA; Titanium alloy fixtures: used to fix PCB panels; Optical component mounting auxiliary fixture: used to assist in the precise mounting of single-row pin optical components TOSA and ROSA; The upper surface of the optical device mounting auxiliary fixture is provided with multiple device clearance slots; the PCB panel is provided with positioning holes; the titanium alloy fixture is provided with cross-shaped positioning posts, which form an interference fit with the positioning holes of the PCB panel; the device clearance slots are U-shaped slots, which are respectively for the optical ports of single-row pin optical devices ROSA and TOSA to pass through.

2. The rapid welding structure for optical modules and optical devices according to claim 1, characterized in that: The optical device mounting auxiliary fixture is also equipped with a chamfered guide structure, which is used to guide the optical ports of single-row pin optical devices ROSA and TOSA into the device clearance slot.

3. The rapid welding structure for optical modules and optical devices according to claim 1, characterized in that: The titanium alloy fixture is also provided with an exhaust hole, which is set through the titanium alloy fixture.

4. The rapid welding structure for optical modules and optical devices according to claim 1, characterized in that: The PCB panel is equipped with a TOSA pad group, and the bottom surface of the pins of the single-row pin optical device TOSA is connected to the TOSA pad group through a 0.20–0.30 mm thick solder paste layer.

5. The rapid welding structure for optical modules and optical devices according to claim 4, characterized in that: The PCB panel is equipped with ROSA pad groups, and the bottom surface of the pins of the single-row pin optical device ROSA is connected to the ROSA pad groups through a 0.20–0.30 mm thick solder paste layer.

6. The rapid welding structure for optical modules and optical devices according to claim 5, characterized in that: The optical ports of the single-row pin optical device ROSA and the single-row pin optical device TOSA face the same direction.

7. The rapid welding structure for optical modules and optical devices according to claim 1, characterized in that: The cross-shaped positioning post is composed of a cylindrical section and a cross rib section. The diameter of the cylindrical section is smaller than the positioning hole on the PCB panel, and the maximum outer diameter of the cross rib section is larger than the positioning hole on the PCB panel.

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